US20150348760A1 - Plasma equipment for treating powder - Google Patents

Plasma equipment for treating powder Download PDF

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Publication number
US20150348760A1
US20150348760A1 US14/409,399 US201314409399A US2015348760A1 US 20150348760 A1 US20150348760 A1 US 20150348760A1 US 201314409399 A US201314409399 A US 201314409399A US 2015348760 A1 US2015348760 A1 US 2015348760A1
Authority
US
United States
Prior art keywords
plasma
surface discharge
powder
module
discharge plasma
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US14/409,399
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English (en)
Inventor
Dong Chan Seok
Yong Ho Jung
Hyun Young Jeong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Korea Basic Science Institute KBSI
Original Assignee
Korea Basic Science Institute KBSI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Korea Basic Science Institute KBSI filed Critical Korea Basic Science Institute KBSI
Assigned to KOREA BASIC SCIENCE INSTITUTE reassignment KOREA BASIC SCIENCE INSTITUTE ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: JEONG, HYUN YOUNG, JUNG, YONG HO, SEOK, DONG CHAN
Publication of US20150348760A1 publication Critical patent/US20150348760A1/en
Priority to US15/719,128 priority Critical patent/US10418227B2/en
Abandoned legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J19/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J19/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
    • B01J19/087—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy
    • B01J19/088—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2/00—Processes or devices for granulating materials, e.g. fertilisers in general; Rendering particulate materials free flowing in general, e.g. making them hydrophobic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32348—Dielectric barrier discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32568—Relative arrangement or disposition of electrodes; moving means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
    • H05H1/2439—Surface discharges, e.g. air flow control
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/26—Plasma torches
    • H05H1/32—Plasma torches using an arc
    • H05H1/42—Plasma torches using an arc with provisions for introducing materials into the plasma, e.g. powder, liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
    • B01J2219/0803—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy
    • B01J2219/0805—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges
    • B01J2219/0807—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges involving electrodes
    • B01J2219/0824—Details relating to the shape of the electrodes
    • B01J2219/0826—Details relating to the shape of the electrodes essentially linear
    • B01J2219/083—Details relating to the shape of the electrodes essentially linear cylindrical
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
    • B01J2219/0873—Materials to be treated
    • B01J2219/0879—Solid
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
    • H05H1/2431—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes using cylindrical electrodes, e.g. rotary drums

Definitions

  • the present invention relates to a powder plasma processing apparatus, and more particularly, to a powder plasma processing apparatus that uniformly processes a powder using a circular surface discharge plasma module.
  • Plasma is an ionized gas.
  • a gas consisting of atoms or molecules is excited using energy, plasma consisting of electrons, decomposed gases, photons, and the like is generated.
  • This plasma is widely used for surface treatment of objects to be processed (e.g., a substrate or the like).
  • Pulsed corona discharge and dielectric film discharge are well known as techniques of generating plasma.
  • Pulsed corona discharge is a technique that uses a high-voltage pulse power supply to generate plasma
  • dielectric film discharge is a technique in which a dielectric is formed on at least one of two electrodes and a power having a frequency of several Hz to several tens of Hz is applied to the two electrodes to generate plasma.
  • a dielectric barrier discharge (DBD) technique is employed as the representative dielectric film discharge.
  • DBD dielectric barrier discharge
  • a plasma processing apparatus using the DBD technique when an object to be processed is disposed between plate electrodes and an inert gas is used to cause the dielectric film discharge to occur, plasma is generated and then brought into contact with a surface of the object to be processed, thereby processing the surface of the object to be processed.
  • the object to be processed is disposed between the plate electrodes, although it is not difficult to process one surface or both surfaces when the object to be processed is a plate-like member, it is difficult to process an entire surface of the object to be processed when the object to be processed is a powder.
  • a plasma processing apparatus for processing the object to be processed is thus required when the object to be processed is a powder.
  • a plasma processing apparatus of the prior art for processing an object to be processed when the object to be processed is a powder is disclosed in an application filed with the title “Tubular plasma processing apparatus” as Korean application No. of 10-2012-0078234 by the present inventors. According to this literature, it is possible to perform surface treatment on a powder but difficult to perform uniform processing on the powder.
  • the present inventors have recognized the problems of the prior art and solved the problems of the conventional plasma processing apparatus through research. Further, the present inventors have developed a powder plasma processing apparatus that can provide a method of controlling a contact time between an object to be processed and plasma and efficiently performing uniform processing on a powder.
  • the present invention is directed to a powder plasma processing apparatus of a circular surface discharge plasma module, the apparatus including: a plate-like electrode layer serving as an external surface of the circular surface discharge plasma module; an insulating layer disposed on an internal surface of the plate-like electrode layer; and a plasma generating electrode disposed on the insulating layer, wherein the circular surface discharge plasma module rotates, an alternating voltage is applied to the plasma generating electrode and the plate-like electrode layer to generate a plasma around the plasma generating electrode, and a powder for plasma processing is processed by the plasma within the circular surface discharge plasma module.
  • a plurality of the plasma generating electrodes are arranged on the insulating layer at intervals in the circumferential direction of the surface discharge plasma module, and extend in the longitudinal direction of the surface discharge plasma module.
  • a plurality of the plasma generating electrodes are arranged on the insulating layer at intervals in the longitudinal direction of the surface discharge plasma module, and extend in the circumferential direction of the surface discharge plasma module.
  • a high voltage is applied to the plate-like electrode layer, and the plasma generating electrode is a ground electrode.
  • a high voltage is applied to the plasma generating electrode, and the plate-like electrode layer is a ground electrode.
  • the apparatus includes a driving unit.
  • the driving unit is configured to rotate the circular surface discharge plasma module while the circular surface discharge plasma module is in a horizontal state.
  • the specific method in which the circular surface discharge plasma module is rotated is not a characteristic of the present invention, and it will be recognized that various methods of rotating the circular surface discharge plasma module may be employed for the present invention.
  • the driving unit includes a rotational speed control unit.
  • the rotational speed control unit is configured to control the speed at which the driving unit rotates the circular surface discharge plasma module. It will be recognized that various methods of controlling the speed at which the driving unit rotates the circular surface discharge plasma module may be employed for the present invention.
  • the powder plasma processing apparatus of the present invention it is possible to perform uniform processing on the powder and to control the time that the powder spends in contact with the plasma, thereby allowing efficient powder processing to be performed.
  • FIG. 1 is a perspective view illustrating a surface discharge plasma module of a powder plasma processing apparatus according to the present invention
  • FIG. 2 is a side view of FIG. 1 ;
  • FIG. 3 is a perspective view illustrating another example of the arrangement in which ground electrodes of the powder plasma processing apparatus according to the present invention are arranged
  • first, second, and the like may be used to describe various components, but these components should not be limited by the tenrms. The terms are used only for the purpose of distinguishing one component from another component. For instance, a first component may be referred to as a second component, or similarly, a second component may be referred to as a first component, without departing from the scope of the present invention.
  • FIG. 1 is a perspective view illustrating a surface discharge plasma module of a powder plasma processing apparatus according to the present invention
  • FIG. 2 is a side view of FIG. 1
  • a circular surface discharge plasma module 110 is employed as the powder plasma processing apparatus according to an embodiment of the present invention.
  • the surface discharge plasma module 110 includes a plate-like electrode layer 111 , an insulating layer 112 , and plasma generating electrodes 113 .
  • the plate-like electrode layer 111 forms an outer surface of the circular surface discharge plasma module 110 .
  • the insulating layer 112 insulates the plate-like electrode layer 111 from the plasma generating electrodes 113 , and the insulating layer 112 is formed at an inner surface side of the plate-like electrode layer 111 .
  • the insulating layer 112 may be formed of a material such as MgO, MgF 2 , LiF, CaF 2 , alumina, glass, ceramic, magnesium oxide, and so forth.
  • a plurality of the plasma generating electrodes 113 are arranged on the insulating layer 112 , and plasma is generated around the plasma generating electrodes 113 .
  • the plasma generating electrodes 113 may be in the form of a bar and may protrude on the insulating layer 112 .
  • the arrangement of the plasma generating electrodes 113 may be such that they are arranged at intervals in the circumferential direction of the circular surface discharge plasma module 110 or the plasma generating electrodes 113 may extend in the longitudinal direction of the surface discharge plasma module 110 .
  • the plasma generating electrodes 113 may be arranged at intervals in the longitudinal direction of the circular surface discharge plasma module 110 or the plasma generating electrodes 113 may extend in the circumferential direction of the circular surface discharge plasma module 110 .
  • a high voltage is applied to the plate-like electrode layer 111 , and the plasma generating electrodes 113 are ground electrodes.
  • the plate-like electrode layer 111 is a ground electrode, and a high voltage is applied to the plasma generating electrodes 113 .
  • an alternating voltage is applied from the plasma power supply 120 to the plasma generating electrodes 113 and the plate-like electrode layer 111 , and a plasma reaction gas is injected, thereby generating the plasma around the plasma generating electrodes 113 .
  • a gas containing oxygen such as O 2 or N 2 O
  • a gas containing fluorine such as CF 4 or SF 6
  • a gas containing chlorine such as Cl 2 or BCl 3
  • an inert gas such as Ar or N 2
  • both sides of the surface discharge plasma module 110 in the longitudinal direction may be opened, and a powder may be supplied and withdrawn (collected) through the opened sides.
  • the surface treatment is performed on the powder by means of the plasma while the surface discharge plasma module 110 rotates.
  • the present invention includes a driving unit for rotating the surface discharge plasma module 110 .
  • the driving unit may have a form for rotating the surface discharge plasma module 110 , for example, driving means such as a driving motor may be connected to the surface discharge plasma module 110 .
  • the driving unit is not specifically limited as long as it can rotate the surface discharge plasma module 110 .
  • the driving unit includes a rotational speed control unit.
  • the rotational speed control unit is configured to control the speed at which the circular surface discharge plasma module 110 is rotated.
  • the rotational speed control unit may be in the form of a control box or a programmable logic controller (PLC).
  • PLC programmable logic controller
  • the rotational speed control unit is not specifically limited to this configuration.
  • the powder is injected into the surface discharge plasma module 110 .
  • An alternating voltage is applied from the plasma power supply 120 to the plate-like electrode layer 111 and the plasma generating electrodes 113 , and a reaction gas is injected, thereby generating the plasma around the plasma generating electrodes 113 .
  • the surface discharge plasma module 110 is rotated by the driving unit.
  • the powder within the surface discharge plasma module 110 rises and falls in the rotational direction of the rotating surface discharge plasma module 110 . This procedure is repeated while the surface discharge plasma module 110 is rotated. In this case, the powder is in contact with the plasma.
  • the rotational speed of the surface discharge plasma module 110 may be adjusted if necessary.
  • the surface discharge plasma module 110 is circular, and the powder is processed while the surface discharge plasma module 110 is rotated, thereby allowing the powder to be uniformly processed.
  • the speed at which the circular surface discharge plasma module is rotated is adjusted, the time that the powder spends in contact with the plasma can be controlled.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Toxicology (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Plasma Technology (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
US14/409,399 2012-12-10 2013-12-06 Plasma equipment for treating powder Abandoned US20150348760A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US15/719,128 US10418227B2 (en) 2012-12-10 2017-09-28 Plasma equipment for treating powder

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP10-2012-0142764 2012-12-10
KR1020120142764A KR101458411B1 (ko) 2012-12-10 2012-12-10 분말 플라즈마 처리 장치
PCT/KR2013/011273 WO2014092395A1 (ko) 2012-12-10 2013-12-06 분말 플라즈마 처리 장치

Related Parent Applications (1)

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PCT/KR2013/011273 A-371-Of-International WO2014092395A1 (ko) 2012-12-10 2013-12-06 분말 플라즈마 처리 장치

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US14/409,399 Abandoned US20150348760A1 (en) 2012-12-10 2013-12-06 Plasma equipment for treating powder
US15/719,128 Active 2034-05-23 US10418227B2 (en) 2012-12-10 2017-09-28 Plasma equipment for treating powder

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US (2) US20150348760A1 (ja)
EP (1) EP2929932B1 (ja)
JP (1) JP5940215B2 (ja)
KR (1) KR101458411B1 (ja)
CN (1) CN104519993B (ja)
HU (1) HUE037466T2 (ja)
PL (1) PL2929932T3 (ja)
WO (1) WO2014092395A1 (ja)

Cited By (1)

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CN110572924A (zh) * 2019-08-15 2019-12-13 大连理工大学 一种滚动果蔬表面微生物控制的等离子体系统

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Also Published As

Publication number Publication date
EP2929932A4 (en) 2016-07-13
US20180019105A1 (en) 2018-01-18
WO2014092395A1 (ko) 2014-06-19
JP5940215B2 (ja) 2016-06-29
CN104519993B (zh) 2016-08-17
HUE037466T2 (hu) 2018-08-28
CN104519993A (zh) 2015-04-15
EP2929932A1 (en) 2015-10-14
EP2929932B1 (en) 2018-04-04
KR101458411B1 (ko) 2014-11-07
JP2015527188A (ja) 2015-09-17
US10418227B2 (en) 2019-09-17
KR20140074612A (ko) 2014-06-18
PL2929932T3 (pl) 2018-08-31

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