WO2014092395A1 - 분말 플라즈마 처리 장치 - Google Patents
분말 플라즈마 처리 장치 Download PDFInfo
- Publication number
- WO2014092395A1 WO2014092395A1 PCT/KR2013/011273 KR2013011273W WO2014092395A1 WO 2014092395 A1 WO2014092395 A1 WO 2014092395A1 KR 2013011273 W KR2013011273 W KR 2013011273W WO 2014092395 A1 WO2014092395 A1 WO 2014092395A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- plasma
- surface discharge
- powder
- module
- processing apparatus
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J19/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J19/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
- B01J19/087—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy
- B01J19/088—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2/00—Processes or devices for granulating materials, e.g. fertilisers in general; Rendering particulate materials free flowing in general, e.g. making them hydrophobic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32348—Dielectric barrier discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32568—Relative arrangement or disposition of electrodes; moving means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
- H05H1/2439—Surface discharges, e.g. air flow control
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/26—Plasma torches
- H05H1/32—Plasma torches using an arc
- H05H1/42—Plasma torches using an arc with provisions for introducing materials into the plasma, e.g. powder, liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
- B01J2219/0803—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy
- B01J2219/0805—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges
- B01J2219/0807—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges involving electrodes
- B01J2219/0824—Details relating to the shape of the electrodes
- B01J2219/0826—Details relating to the shape of the electrodes essentially linear
- B01J2219/083—Details relating to the shape of the electrodes essentially linear cylindrical
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
- B01J2219/0873—Materials to be treated
- B01J2219/0879—Solid
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
- H05H1/2431—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes using cylindrical electrodes, e.g. rotary drums
Definitions
- the present invention relates to a powder plasma processing apparatus, and relates to a powder plasma processing apparatus for uniformly treating powder using a cylindrical surface discharge module.
- Plasma refers to an ionized gas, and excitation using energy to a gas composed of atoms or molecules forms a plasma composed of electrons, ions, decomposed gases, photons, and the like.
- Such plasma is widely used for the surface treatment of a to-be-processed object (for example, a board
- Pulsed corona discharge is a technique for generating plasma using a high voltage pulse power supply, and dielectric film discharge forms a dielectric on at least one of the two electrodes and applies a power source having a frequency of several tens of Hz to several MHz to the two electrodes. It is a technique to generate.
- DBD Dynamic Barrier Discharge
- Such a plasma processing apparatus has no particular difficulty in treating one surface or both surfaces in the case of a plate-like member such as a substrate because the object to be disposed is disposed between the flat electrode causing the discharge, but when the object to be treated is a powder, Difficult to handle the entire area. Therefore, when the object to be processed is a powder, a plasma processing apparatus for treating the object to be processed is required.
- the present inventors have recognized the problems of the prior arts, and after the study, by introducing the following configuration, solved the problems of the conventional plasma processing apparatus, furthermore, the contact time with the plasma to be treated is controlled, uniform
- a powder plasma processing apparatus has been developed which can provide an efficient method for powder processing.
- the present invention relates to a powder plasma processing apparatus of a cylindrical surface discharge plasma module, wherein an outer surface of the cylindrical surface discharge plasma module is a substrate type electrode layer, an insulating layer is provided on an inner surface side of the substrate type electrode layer, and a plasma generating electrode is positioned on the insulating layer.
- the cylindrical surface discharge plasma module is rotated, an alternating voltage is applied to the plasma generating electrode and the substrate-type electrode, and plasma is generated around the plasma generating electrode, and the powder for plasma treatment is the cylindrical surface discharge plasma.
- a powder plasma processing apparatus is provided, which is processed by the plasma in a module.
- the plasma generating electrodes are arranged on the insulating layer at intervals along the circumferential direction of the surface discharge plasma module, and extend along the length direction of the surface discharge plasma module.
- the plasma generating electrode is arranged in a plurality of intervals along the longitudinal direction of the surface discharge plasma module on the insulating layer, and extends along the circumferential direction of the surface discharge plasma module.
- a high voltage is applied to the substrate type electrode layer, and the plasma generating electrode is a ground electrode.
- a high voltage is applied to the plasma generating electrode, and the substrate type electrode layer is a ground electrode.
- the apparatus includes a drive unit.
- the driving unit is configured to rotate the cylindrical surface discharge plasma module in a state in which the cylindrical surface discharge plasma module is placed horizontally.
- the specific manner for rotating the cylindrical surface discharge plasma module is not a feature of the present invention, and it will be appreciated that various ways in which the cylindrical surface discharge plasma module can be rotated may be used in the present invention.
- the drive unit includes a rotation speed control unit.
- the rotational speed control unit is configured to control the speed at which the driving unit rotates the cylindrical surface discharge plasma module. It will be appreciated that various ways in which the drive can control the speed at which the cylindrical surface discharge plasma module is rotated can be used in the present invention.
- the powder can be treated uniformly, and the powder is treated in an efficient manner by controlling the time for which the powder is in contact with the plasma.
- FIG. 1 is a perspective view showing a surface discharge plasma module of the powder plasma processing apparatus according to the present invention.
- FIG. 2 is a side view of FIG. 1;
- Figure 3 is a perspective view showing another example of the form in which the ground electrode of the powder plasma processing apparatus according to the present invention are arranged.
- first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.
- the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.
- FIG. 1 is a perspective view showing a surface discharge plasma module of the powder plasma processing apparatus according to the present invention
- Figure 2 is a side view of FIG.
- the powder plasma processing apparatus is a cylindrical surface discharge plasma module 110 is used.
- the surface discharge plasma module 110 includes a substrate type electrode layer 111, an insulating layer 112, and a plasma generating electrode 113.
- the substrate type electrode layer 111 forms an outer surface of the cylindrical surface discharge plasma module 110.
- the insulating layer 112 insulates the substrate type electrode layer 111 and the plasma generating electrode 113 from each other, and the insulating layer 112 is formed on the inner surface side of the substrate type electrode layer 111.
- MgO, MgF 2, LiF, CaF 2, alumina, glass, ceramic, magnesium oxide, or the like may be used as a material of the insulating layer 112.
- a plurality of plasma generating electrodes 113 are arranged on the insulating layer 112, and plasma is generated around the plasma generating electrodes 113.
- the plasma generating electrode 113 may have a bar shape and may protrude from the insulating layer 112.
- the arrangement of the plasma generating electrodes 113 may be, for example, a form in which a plurality of the plasma generating electrodes 113 are arranged at intervals along the circumferential direction of the cylindrical surface discharge plasma module 110, and the plasma generating electrodes 113 are surface discharged. It may have a form extending in the longitudinal direction of the plasma module 110.
- the plasma generating electrode 113 may have a shape in which a plurality of plasma generating electrodes 113 are arranged at intervals along the length direction of the cylindrical surface discharge plasma module 110.
- the discharge plasma module 110 may extend in a circumferential direction.
- a high voltage is applied to the substrate-type electrode layer 111, the plasma generating electrode 113 is a ground electrode.
- the substrate type electrode layer 111 is a ground electrode, and a high voltage is applied to the plasma generating electrode 113.
- the surface discharge plasma module 110 generates a plurality of plasmas by applying an alternating voltage to the plurality of plasma generating electrodes 113 and the substrate type electrode layer 111 from the plasma power supply device 120 and injecting a plasma reaction gas. Plasma is generated around the electrode 113.
- the plasma reaction gas is, for example, a gas containing an oxygen component such as O 2 , N 2 O, a gas containing a fluorine component such as CF 4 , SF 6 , a gas containing a chlorine component such as Cl 2 , BCl 3 , Ar Or inert gases such as N 2 may be used alone or in combination.
- the surface discharge plasma module 110 may be open at both sides in the longitudinal direction, it may be possible to supply and withdraw (recover) the powder through the opening. Then, the surface discharge plasma module 110 is rotated, the surface treatment of the powder by the plasma is made.
- the present invention includes a driving unit for the rotation of the surface discharge plasma module 110.
- the driving unit may rotate the surface discharge plasma module 110, for example, a power means such as a driving motor may be connected to the surface discharge plasma module 110.
- the driving unit is sufficient if the shape capable of rotating the surface discharge plasma module 110 is not particularly limited thereto.
- the drive unit includes a rotation speed control unit.
- the rotational speed control unit is configured to control the speed at which the driving unit rotates the cylindrical surface discharge plasma module 110.
- the rotational speed controller may be in the form of a control box or in the form of a programmable logic controller (PLC).
- PLC programmable logic controller
- the powder is introduced into the surface discharge plasma module 110.
- An alternating voltage is applied from the plasma power supply 120 to the substrate type electrode layer 111 and the plurality of plasma generating electrodes 113, and a reaction gas is injected to generate plasma around the plasma generating electrodes 113.
- the surface discharge plasma module 110 is rotated by the driver.
- the powders inside the surface discharge plasma module 110 are lifted and dropped along the rotation direction of the rotated surface discharge plasma module 110. This process is repeated while the surface discharge plasma module 110 is rotated. At this time, the powders are in contact with the plasma.
- the rotational speed of the surface discharge plasma module 110 is adjusted.
- the surface discharge plasma module 110 is formed in a cylindrical shape, and the powder is uniformly processed while rotating the cylindrical surface discharge plasma module 110. Can be processed.
- the speed at which the cylindrical surface discharge plasma module is rotated is controlled, the time for which the powder contacts the plasma can be controlled.
- insulating layer 113 plasma generating electrode
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Toxicology (AREA)
- General Health & Medical Sciences (AREA)
- Health & Medical Sciences (AREA)
- Plasma Technology (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Abstract
Description
Claims (7)
- 원통형 면방전 플라즈마 모듈의 분말 플라즈마 처리 장치로서,상기 원통형 면방전 플라즈마 모듈의 외면은 기판형 전극층이고,상기 기판형 전극층의 내면 측으로 절연층이 있고,상기 절연층 위에 플라즈마 발생 전극이 위치하며,상기 원통형 면방전 플라즈마 모듈은 회전하고,상기 플라즈마 발생 전극과 상기 기판형 전극층에 교류 전압이 인가되어, 상기 플라즈마 발생 전극 주위에 플라즈마가 발생되고,플라즈마 처리를 위한 분말은 상기 원통형 면방전 플라즈마 모듈 내에서 상기 플라즈마에 의해 처리되는,분말 플라즈마 처리 장치.
- 제1항에 있어서,상기 기판형 전극층에는 고전압이 인가되고,상기 플라즈마 발생 전극은 접지 전극인,분말 플라즈마 처리 장치.
- 제1항에 있어서,상기 플라즈마 발생 전극에는 고전압이 인가되고,상기 기판형 전극층은 접지 전극인,분말 플라즈마 처리 장치.
- 제1항에 있어서,상기 플라즈마 발생 전극은 상기 절연층 위에서, 상기 면방전 플라즈마 모듈의 원주 방향을 따라 간격을 이뤄 다수 배열되고, 상기 면방전 플라즈마 모듈의 길이 방향을 따라 연장되어 있는,분말 플라즈마 처리 장치.
- 제1항에 있어서,상기 플라즈마 발생 전극은 상기 절연층 위에서, 상기 면방전 플라즈마 모듈의 길이 방향을 따라 간격을 이뤄 다수 배열되고, 상기 면방전 플라즈마 모듈의 원주 방향을 따라 연장되어 있는,분말 플라즈마 처리 장치.
- 제1항 내지 제5항 중 어느 한 항에 있어서,구동부를 포함하고,상기 구동부는 상기 원통형 면방전 플라즈마 모듈이 수평으로 놓인 상태로 상기 원통형 면방전 플라즈마 모듈을 회전시키도록 구성되는,분말 플라즈마 처리 장치.
- 제6항에 있어서,상기 구동부는 회전속도 제어부를 포함하고,상기 회전속도 제어부는 상기 구동부가 상기 원통형 면방전 플라즈마 모듈을 회전시키는 속도를 제어하도록 구성되는,분말 플라즈마 처리 장치.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP13862200.6A EP2929932B1 (en) | 2012-12-10 | 2013-12-06 | Powder plasma treatment apparatus |
PL13862200T PL2929932T3 (pl) | 2012-12-10 | 2013-12-06 | Urządzenie do plazmowej obróbki proszku |
JP2015520081A JP5940215B2 (ja) | 2012-12-10 | 2013-12-06 | 粉末プラズマ処理装置 |
CN201380032767.6A CN104519993B (zh) | 2012-12-10 | 2013-12-06 | 粉末等离子处理装置 |
US14/409,399 US20150348760A1 (en) | 2012-12-10 | 2013-12-06 | Plasma equipment for treating powder |
US15/719,128 US10418227B2 (en) | 2012-12-10 | 2017-09-28 | Plasma equipment for treating powder |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2012-0142764 | 2012-12-10 | ||
KR1020120142764A KR101458411B1 (ko) | 2012-12-10 | 2012-12-10 | 분말 플라즈마 처리 장치 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/409,399 A-371-Of-International US20150348760A1 (en) | 2012-12-10 | 2013-12-06 | Plasma equipment for treating powder |
US15/719,128 Division US10418227B2 (en) | 2012-12-10 | 2017-09-28 | Plasma equipment for treating powder |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2014092395A1 true WO2014092395A1 (ko) | 2014-06-19 |
Family
ID=50934621
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2013/011273 WO2014092395A1 (ko) | 2012-12-10 | 2013-12-06 | 분말 플라즈마 처리 장치 |
Country Status (8)
Country | Link |
---|---|
US (2) | US20150348760A1 (ko) |
EP (1) | EP2929932B1 (ko) |
JP (1) | JP5940215B2 (ko) |
KR (1) | KR101458411B1 (ko) |
CN (1) | CN104519993B (ko) |
HU (1) | HUE037466T2 (ko) |
PL (1) | PL2929932T3 (ko) |
WO (1) | WO2014092395A1 (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6562273B2 (ja) * | 2015-10-16 | 2019-08-21 | 学校法人 中村産業学園 | プラズマ処理装置およびその方法 |
CN109302790A (zh) * | 2018-06-01 | 2019-02-01 | 苏州海唐智能装备有限公司 | 一种新型等离子体粉体改性装置 |
CN110572924B (zh) * | 2019-08-15 | 2021-12-03 | 大连理工大学 | 一种滚动果蔬表面微生物控制的等离子体系统 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5919539A (ja) * | 1982-07-21 | 1984-02-01 | Kyocera Corp | 容量結合型グロ−放電分解装置 |
US20080056928A1 (en) * | 2003-10-15 | 2008-03-06 | Timothy Rex Bunce | Functionalisation of Particles |
US7397013B2 (en) * | 2005-11-23 | 2008-07-08 | Heraeus Inc. | Plasma lineation electrode |
US20120145041A1 (en) * | 2009-06-09 | 2012-06-14 | Innovative Carbon Limited | Methods and apparatus for particle processing |
KR20120078234A (ko) | 2010-12-31 | 2012-07-10 | 엘지디스플레이 주식회사 | 도광판 및 이를 구비한 액정표시소자 |
JP5089521B2 (ja) * | 2008-07-31 | 2012-12-05 | 学校法人 中村産業学園 | 粉体のプラズマ処理方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58221203A (ja) * | 1982-06-18 | 1983-12-22 | Tdk Corp | 分散性を改良した磁性粉 |
JPS5932940A (ja) * | 1982-08-16 | 1984-02-22 | Sankyo Dengiyou Kk | 活性化装置 |
JP3086956B2 (ja) * | 1990-08-29 | 2000-09-11 | 増田 佳子 | 沿面プラズマcvdによる微粒子の気相合成方法及び装置 |
JP2636174B2 (ja) * | 1994-07-22 | 1997-07-30 | 工業技術院長 | 放電反応利用化学蒸着法による粉末表面改質装置 |
KR20010068436A (ko) * | 2000-01-05 | 2001-07-23 | 황해웅 | 코로나 플라즈마를 이용한 휘발성 유기화합물 제거 및탈취장치 |
JP2004089753A (ja) * | 2002-08-29 | 2004-03-25 | Aisin Seiki Co Ltd | ガス分解装置 |
CN100349651C (zh) * | 2003-02-18 | 2007-11-21 | 夏普株式会社 | 通过正负两种离子的作用使抗原性物质失活的方法和装置 |
JPWO2004112940A1 (ja) * | 2003-06-17 | 2006-07-27 | 日鉄鉱業株式会社 | 酸化触媒と低温プラズマとを利用する気体処理方法及び気体処理装置 |
JP2005135736A (ja) * | 2003-10-30 | 2005-05-26 | Nippon Spindle Mfg Co Ltd | 粉粒体用プラズマ処理装置 |
CN201006026Y (zh) * | 2007-03-12 | 2008-01-16 | 杭州朗索医用消毒剂有限公司 | 具有圆管状发射电极的等离子灭菌设备 |
US7935906B2 (en) * | 2007-04-17 | 2011-05-03 | Dynamic Connections, Llc | Separation and manipulation of a chiral object |
JP5651323B2 (ja) * | 2009-11-09 | 2015-01-07 | 富士機械製造株式会社 | プラズマ処理装置およびプラズマ処理方法 |
JP2011249014A (ja) * | 2010-05-21 | 2011-12-08 | Mitsui Chemicals Inc | 表面処理装置 |
CN202205700U (zh) * | 2011-09-07 | 2012-04-25 | 苏州市奥普斯等离子体科技有限公司 | 一种颗粒状材料表面低温等离子体处理装置 |
-
2012
- 2012-12-10 KR KR1020120142764A patent/KR101458411B1/ko active IP Right Grant
-
2013
- 2013-12-06 US US14/409,399 patent/US20150348760A1/en not_active Abandoned
- 2013-12-06 WO PCT/KR2013/011273 patent/WO2014092395A1/ko active Application Filing
- 2013-12-06 CN CN201380032767.6A patent/CN104519993B/zh active Active
- 2013-12-06 EP EP13862200.6A patent/EP2929932B1/en active Active
- 2013-12-06 JP JP2015520081A patent/JP5940215B2/ja active Active
- 2013-12-06 PL PL13862200T patent/PL2929932T3/pl unknown
- 2013-12-06 HU HUE13862200A patent/HUE037466T2/hu unknown
-
2017
- 2017-09-28 US US15/719,128 patent/US10418227B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5919539A (ja) * | 1982-07-21 | 1984-02-01 | Kyocera Corp | 容量結合型グロ−放電分解装置 |
US20080056928A1 (en) * | 2003-10-15 | 2008-03-06 | Timothy Rex Bunce | Functionalisation of Particles |
US7397013B2 (en) * | 2005-11-23 | 2008-07-08 | Heraeus Inc. | Plasma lineation electrode |
JP5089521B2 (ja) * | 2008-07-31 | 2012-12-05 | 学校法人 中村産業学園 | 粉体のプラズマ処理方法 |
US20120145041A1 (en) * | 2009-06-09 | 2012-06-14 | Innovative Carbon Limited | Methods and apparatus for particle processing |
KR20120078234A (ko) | 2010-12-31 | 2012-07-10 | 엘지디스플레이 주식회사 | 도광판 및 이를 구비한 액정표시소자 |
Non-Patent Citations (1)
Title |
---|
See also references of EP2929932A4 |
Also Published As
Publication number | Publication date |
---|---|
EP2929932A4 (en) | 2016-07-13 |
US20180019105A1 (en) | 2018-01-18 |
JP5940215B2 (ja) | 2016-06-29 |
CN104519993B (zh) | 2016-08-17 |
HUE037466T2 (hu) | 2018-08-28 |
CN104519993A (zh) | 2015-04-15 |
EP2929932A1 (en) | 2015-10-14 |
EP2929932B1 (en) | 2018-04-04 |
KR101458411B1 (ko) | 2014-11-07 |
US20150348760A1 (en) | 2015-12-03 |
JP2015527188A (ja) | 2015-09-17 |
US10418227B2 (en) | 2019-09-17 |
KR20140074612A (ko) | 2014-06-18 |
PL2929932T3 (pl) | 2018-08-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2014092394A1 (ko) | 분말 플라즈마 처리 장치 | |
WO2014092395A1 (ko) | 분말 플라즈마 처리 장치 | |
KR101942139B1 (ko) | 분말 플라즈마 처리 장치 | |
EP1073091A3 (en) | Electrode for plasma generation, plasma treatment apparatus using the electrode, and plasma treatment with the apparatus | |
WO2004107394A3 (ja) | プラズマ処理装置、プラズマ生成用の反応器の製造方法、及びプラズマ処理方法 | |
JP2008547166A5 (ko) | ||
CN101534869A (zh) | 扩散式等离子体处理和材料加工 | |
KR20070022527A (ko) | 불용방전 방지를 위한 전극 구조를 갖는 대기압 플라즈마발생장치 | |
US11523490B2 (en) | Plasma device, plasma generation method | |
BRPI0307889B8 (pt) | processo de limpeza contínua de um material revestido por uma substância orgânica e dispositivo para realização do processo | |
JP2002058995A (ja) | プラズマ処理装置及びプラズマ処理方法 | |
JP2009064618A (ja) | プラズマプロセス装置 | |
WO2011030966A1 (ko) | 웨이퍼 에지 식각장치 및 그 방법 | |
KR20020085149A (ko) | 상온/상압에서의 플라즈마 건식세정장치 | |
KR101557147B1 (ko) | 플라즈마 전극 | |
KR20140095228A (ko) | 용량성 결합 플라즈마의 방식의 플라즈마 발생 장치 | |
KR20190026150A (ko) | 원통형 회전반응기를 이용한 플라즈마 수처리 장치 | |
CN104576443B (zh) | 用于从衬底去除静电的设备和方法 | |
WO2017111534A1 (ko) | 수표면에서 플라즈마를 생성하는 액체 처리장치 | |
RU2170283C2 (ru) | Способ очистки поверхности металлических изделий | |
WO2013162267A1 (ko) | 폴 타입 안테나가 포함된 이온빔 소스의 위치제어를 이용한 이온 처리 장치 | |
JP2008078461A (ja) | 半導体製造装置に搭載可能な除電装置 | |
KR20140099726A (ko) | 표면 처리를 위한 유전체 장벽 방전 반응기 | |
JP2019155294A (ja) | 水処理装置 | |
CN110677970A (zh) | 基于混合型等离子体结构的平板式等离子体发生装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 13862200 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2015520081 Country of ref document: JP Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 14409399 Country of ref document: US |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2013862200 Country of ref document: EP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |