PL2929932T3 - Urządzenie do plazmowej obróbki proszku - Google Patents

Urządzenie do plazmowej obróbki proszku

Info

Publication number
PL2929932T3
PL2929932T3 PL13862200T PL13862200T PL2929932T3 PL 2929932 T3 PL2929932 T3 PL 2929932T3 PL 13862200 T PL13862200 T PL 13862200T PL 13862200 T PL13862200 T PL 13862200T PL 2929932 T3 PL2929932 T3 PL 2929932T3
Authority
PL
Poland
Prior art keywords
treatment apparatus
plasma treatment
powder plasma
powder
treatment
Prior art date
Application number
PL13862200T
Other languages
English (en)
Inventor
Dong Chan Seok
Yong Ho Jung
Hyun Young Jeong
Original Assignee
Korea Basic Science Institute
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Korea Basic Science Institute filed Critical Korea Basic Science Institute
Publication of PL2929932T3 publication Critical patent/PL2929932T3/pl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J19/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J19/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
    • B01J19/087—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy
    • B01J19/088—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2/00—Processes or devices for granulating materials, e.g. fertilisers in general; Rendering particulate materials free flowing in general, e.g. making them hydrophobic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32348—Dielectric barrier discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32568—Relative arrangement or disposition of electrodes; moving means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
    • H05H1/2431—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes using cylindrical electrodes, e.g. rotary drums
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
    • H05H1/2439—Surface discharges, e.g. air flow control
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/26—Plasma torches
    • H05H1/32—Plasma torches using an arc
    • H05H1/42—Plasma torches using an arc with provisions for introducing materials into the plasma, e.g. powder, liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
    • B01J2219/0803—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy
    • B01J2219/0805—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges
    • B01J2219/0807—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges involving electrodes
    • B01J2219/0824—Details relating to the shape of the electrodes
    • B01J2219/0826—Details relating to the shape of the electrodes essentially linear
    • B01J2219/083—Details relating to the shape of the electrodes essentially linear cylindrical
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
    • B01J2219/0873—Materials to be treated
    • B01J2219/0879—Solid
PL13862200T 2012-12-10 2013-12-06 Urządzenie do plazmowej obróbki proszku PL2929932T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020120142764A KR101458411B1 (ko) 2012-12-10 2012-12-10 분말 플라즈마 처리 장치
EP13862200.6A EP2929932B1 (en) 2012-12-10 2013-12-06 Powder plasma treatment apparatus
PCT/KR2013/011273 WO2014092395A1 (ko) 2012-12-10 2013-12-06 분말 플라즈마 처리 장치

Publications (1)

Publication Number Publication Date
PL2929932T3 true PL2929932T3 (pl) 2018-08-31

Family

ID=50934621

Family Applications (1)

Application Number Title Priority Date Filing Date
PL13862200T PL2929932T3 (pl) 2012-12-10 2013-12-06 Urządzenie do plazmowej obróbki proszku

Country Status (8)

Country Link
US (2) US20150348760A1 (pl)
EP (1) EP2929932B1 (pl)
JP (1) JP5940215B2 (pl)
KR (1) KR101458411B1 (pl)
CN (1) CN104519993B (pl)
HU (1) HUE037466T2 (pl)
PL (1) PL2929932T3 (pl)
WO (1) WO2014092395A1 (pl)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6562273B2 (ja) * 2015-10-16 2019-08-21 学校法人 中村産業学園 プラズマ処理装置およびその方法
CN109302790A (zh) * 2018-06-01 2019-02-01 苏州海唐智能装备有限公司 一种新型等离子体粉体改性装置
CN110572924B (zh) * 2019-08-15 2021-12-03 大连理工大学 一种滚动果蔬表面微生物控制的等离子体系统

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58221203A (ja) * 1982-06-18 1983-12-22 Tdk Corp 分散性を改良した磁性粉
JPS5919539A (ja) * 1982-07-21 1984-02-01 Kyocera Corp 容量結合型グロ−放電分解装置
JPS5932940A (ja) * 1982-08-16 1984-02-22 Sankyo Dengiyou Kk 活性化装置
JP3086956B2 (ja) * 1990-08-29 2000-09-11 増田 佳子 沿面プラズマｃｖｄによる微粒子の気相合成方法及び装置
JP2636174B2 (ja) * 1994-07-22 1997-07-30 工業技術院長 放電反応利用化学蒸着法による粉末表面改質装置
KR20010068436A (ko) * 2000-01-05 2001-07-23 황해웅 코로나 플라즈마를 이용한 휘발성 유기화합물 제거 및탈취장치
JP2004089753A (ja) * 2002-08-29 2004-03-25 Aisin Seiki Co Ltd ガス分解装置
CN100349651C (zh) * 2003-02-18 2007-11-21 夏普株式会社 通过正负两种离子的作用使抗原性物质失活的方法和装置
US7347979B2 (en) * 2003-06-17 2008-03-25 Nittetsu Mining Co., Ltd. Gas processing method and gas processing apparatus utilizing oxidation catalyst and low-temperature plasma
JP2007508135A (ja) * 2003-10-15 2007-04-05 ダウ・コーニング・アイルランド・リミテッド 粒子の官能基化
JP2005135736A (ja) * 2003-10-30 2005-05-26 Nippon Spindle Mfg Co Ltd 粉粒体用プラズマ処理装置
US7397013B2 (en) * 2005-11-23 2008-07-08 Heraeus Inc. Plasma lineation electrode
CN201006026Y (zh) * 2007-03-12 2008-01-16 杭州朗索医用消毒剂有限公司 具有圆管状发射电极的等离子灭菌设备
US7935906B2 (en) * 2007-04-17 2011-05-03 Dynamic Connections, Llc Separation and manipulation of a chiral object
JP5089521B2 (ja) * 2008-07-31 2012-12-05 学校法人 中村産業学園 粉体のプラズマ処理方法
EP2440323B1 (en) * 2009-06-09 2019-08-28 Haydale Graphene Industries plc Methods and apparatus for particle processing with plasma
JP5651323B2 (ja) * 2009-11-09 2015-01-07 富士機械製造株式会社 プラズマ処理装置およびプラズマ処理方法
JP2011249014A (ja) * 2010-05-21 2011-12-08 Mitsui Chemicals Inc 表面処理装置
KR101792104B1 (ko) 2010-12-31 2017-11-01 엘지디스플레이 주식회사 도광판 및 이를 구비한 액정표시소자
CN202205700U (zh) * 2011-09-07 2012-04-25 苏州市奥普斯等离子体科技有限公司 一种颗粒状材料表面低温等离子体处理装置

Also Published As

Publication number Publication date
KR20140074612A (ko) 2014-06-18
US20180019105A1 (en) 2018-01-18
HUE037466T2 (hu) 2018-08-28
WO2014092395A1 (ko) 2014-06-19
KR101458411B1 (ko) 2014-11-07
EP2929932B1 (en) 2018-04-04
US20150348760A1 (en) 2015-12-03
EP2929932A4 (en) 2016-07-13
CN104519993A (zh) 2015-04-15
EP2929932A1 (en) 2015-10-14
JP2015527188A (ja) 2015-09-17
CN104519993B (zh) 2016-08-17
US10418227B2 (en) 2019-09-17
JP5940215B2 (ja) 2016-06-29

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