EP2929932B1 - Powder plasma treatment apparatus - Google Patents
Powder plasma treatment apparatus Download PDFInfo
- Publication number
- EP2929932B1 EP2929932B1 EP13862200.6A EP13862200A EP2929932B1 EP 2929932 B1 EP2929932 B1 EP 2929932B1 EP 13862200 A EP13862200 A EP 13862200A EP 2929932 B1 EP2929932 B1 EP 2929932B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- plasma
- surface discharge
- cylindrical surface
- discharge plasma
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000000843 powder Substances 0.000 title claims description 40
- 238000009832 plasma treatment Methods 0.000 title 1
- 238000000034 method Methods 0.000 description 14
- 239000007789 gas Substances 0.000 description 6
- -1 O2 or N2O Chemical compound 0.000 description 3
- 239000012495 reaction gas Substances 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910015844 BCl3 Inorganic materials 0.000 description 1
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 229910001634 calcium fluoride Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Inorganic materials [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 1
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000009700 powder processing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J19/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J19/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
- B01J19/087—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy
- B01J19/088—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2/00—Processes or devices for granulating materials, e.g. fertilisers in general; Rendering particulate materials free flowing in general, e.g. making them hydrophobic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32348—Dielectric barrier discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32568—Relative arrangement or disposition of electrodes; moving means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
- H05H1/2431—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes using cylindrical electrodes, e.g. rotary drums
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
- H05H1/2439—Surface discharges, e.g. air flow control
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/26—Plasma torches
- H05H1/32—Plasma torches using an arc
- H05H1/42—Plasma torches using an arc with provisions for introducing materials into the plasma, e.g. powder, liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
- B01J2219/0803—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy
- B01J2219/0805—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges
- B01J2219/0807—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges involving electrodes
- B01J2219/0824—Details relating to the shape of the electrodes
- B01J2219/0826—Details relating to the shape of the electrodes essentially linear
- B01J2219/083—Details relating to the shape of the electrodes essentially linear cylindrical
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
- B01J2219/0873—Materials to be treated
- B01J2219/0879—Solid
Definitions
- the present invention relates to a powder plasma processing apparatus, and more particularly, to a powder plasma processing apparatus that uniformly processes a powder using a cylindrical surface discharge plasma module.
- Plasma is an ionized gas.
- a gas consisting of atoms or molecules is excited using energy, plasma consisting of electrons, decomposed gases, photons, and the like is generated.
- This plasma is widely used for surface treatment of objects to be processed (e.g., a substrate or the like).
- Pulsed corona discharge and dielectric film discharge are well known as techniques of generating plasma.
- Pulsed corona discharge is a technique that uses a high-voltage pulse power supply to generate plasma
- dielectric film discharge is a technique in which a dielectric is formed on at least one of two electrodes and a power having a frequency of several Hz to several tens of Hz is applied to the two electrodes to generate plasma.
- a dielectric barrier discharge (DBD) technique is employed as the representative dielectric film discharge.
- DBD dielectric barrier discharge
- a plasma processing apparatus using the DBD technique when an object to be processed is disposed between plate electrodes and an inert gas is used to cause the dielectric film discharge to occur, plasma is generated and then brought into contact with a surface of the object to be processed, thereby processing the surface of the object to be processed.
- the object to be processed is disposed between the plate electrodes, although it is not difficult to process one surface or both surfaces when the object to be processed is a plate-like member, it is difficult to process an entire surface of the object to be processed when the object to be processed is a powder.
- a plasma processing apparatus for processing the object to be processed is thus required when the object to be processed is a powder.
- a plasma processing apparatus of the prior art for processing an object to be processed when the object to be processed is a powder is disclosed in an application filed with the title "Tubular plasma processing apparatus" as Korean application No. of 10-2012-0078234 by the present inventors. According to this literature, it is possible to perform surface treatment on a powder but difficult to perform uniform processing on the powder.
- US patent application publication no 2012/145041 discloses a powder plasma processing apparatus, with a rotary cylindrical discharge module having a plate like electrode layer serving as an external surface of the cylindrical surface discharge plasma module, provided with insulating layer and plasma generating tubular electrode.
- the present inventors have recognized the problems of the prior art and solved the problems of the conventional plasma processing apparatus through research. Further, the present inventors have developed a powder plasma processing apparatus that can provide a method of controlling a contact time between an object to be processed and plasma and efficiently performing uniform processing on a powder.
- the present invention is directed to a powder surface processing apparatus using plasma of a rotary cylindrical surface discharge plasma module.
- the apparatus comprises a plate-like electrode layer serving as an external surface of the rotary cylindrical surface discharge plasma module and an insulating layer disposed on an internal surface of the plate-like electrode layer.
- the apparatus has a plurality of plasma generating electrodes in the form of bars which are disposed on the insulating layer and arranged at intervals in the circumferential or longitudinal direction of the rotary cylindrical surface discharge plasma module, the plurality of plasma generating electrodes and the plate-like electrode layer being connected to a plasma power supply providing an alternating voltage. Powder injected into the rotary cylindrical surface discharge plasma module, and the surface of the powder is treated by the plasma generated around the plasma generating electrodes.
- a high voltage is applied to the plate-like electrode layer, and the plasma generating electrodes in form of bars are ground electrodes and according to another embodiment a high voltage is applied to the plasma generating electrodes in form of bards, and the plate-like electrode layer is a ground electrode.
- a plurality of the plasma generating electrodes are arranged on the insulating layer at intervals in the circumferential direction of the rotary cylindrical surface discharge plasma module, and extend in the longitudinal direction of the rotary cylindrical surface discharge plasma module.
- the apparatus includes a driving unit.
- the driving unit is configured to rotate the rotary surface discharge plasma module while the rotary cylindrical surface discharge plasma module is in a horizontal state.
- the specific method in which the rotary cylindrical surface discharge plasma module is rotated is not a characteristic of the present invention, and it will be recognized that various methods of rotating the rotary cylindrical surface discharge plasma module may be employed for the present invention.
- the driving unit includes a rotational speed control unit.
- the rotational speed control unit is configured to control the speed at which the driving unit rotatesthe rotary cylindrical surface discharge plasma module. It will be recognized that various methods of controlling the speed at which the driving unit rotates the rotary cylindrical surface discharge plasma module may be employed for the present invention.
- the powder surface processing apparatus of the present invention it is possible to perform uniform processing on the powder and to control the time that the powder spends in contact with the plasma, thereby allowing efficient powder processing to be performed.
- first, second, and the like may be used to describe various components, but these components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another component. For instance, a first component may be referred to as a second component, or similarly, a second component may be referred to as a first component, without departing from the scope of the present invention.
- FIG. 1 is a perspective view illustrating a rotary cylindrical surface discharge plasma module of a powder surface processing apparatus according to the present invention
- FIG. 2 is a side view of FIG. 1
- a rotary cylindrical surface discharge plasma module 110 is employed as the powder surface processing apparatus according to an embodiment of the present invention.
- the rotary cylindrical surface discharge plasma module 110 includes a plate-like electrode layer 111, an insulating layer 112, and plasma generating electrodes 113.
- the plate-like electrode layer 111 forms an outer surface of the rotary cylindrical surface discharge plasma module 110.
- the insulating layer 112 insulates the plate-like electrode layer 111 from the plasma generating electrodes 113, and the insulating layer 112 is formed at an inner surface side of the plate-like electrode layer 111.
- the insulating layer 112 may be formed of a material such as MgO, MgF 2 , LiF, CaF 2 , alumina, glass, ceramic, magnesium oxide, and so forth.
- a plurality of the plasma generating electrodes 113 are arranged on the insulating layer 112, and plasma is generated around the plasma generating electrodes 113.
- the plasma generating electrodes 113 are in the form of a bar and may protrude on the insulating layer 112.
- the arrangement of the plasma generating electrodes 113 may be such that they are arranged at intervals in the circumferential direction of the rotary cylindrical surface discharge plasma module 110, and the plasma generating electrodes 113 extend in the longitudinal direction of the rotary cylindrical surface discharge plasma module 110.
- the plasma generating electrodes 113 may be arranged at intervals in the longitudinal direction of the rotary cylindrical surface discharge plasma module 110, the plasma generating electrodes 113 extend in the circumferential direction of the rotary cylindrical surface discharge plasma module 110.
- a high voltage is applied to the plate-like electrode layer 111, and the plasma generating electrodes 113 are ground electrodes.
- the plate-like electrode layer 111 is a ground electrode, and a high voltage is applied to the plasma generating electrodes 113.
- an alternating voltage is applied from the plasma power supply 120 to the plasma generating electrodes 113 and the plate-like electrode layer 111, and a plasma reaction gas is injected, thereby generating the plasma around the plasma generating electrodes 113.
- a gas containing oxygen such as O 2 or N 2 O
- a gas containing fluorine such as CF 4 or SF 6
- a gas containing chlorine such as Cl 2 or BCl 3
- an inert gas such as Ar or N 2
- both sides of the rotary cylindrical surface discharge plasma module 110 in the longitudinal direction may be opened, and a powder may be supplied and withdrawn (collected) through the opened sides.
- the surface treatment is performed on the powder by means of the plasma while the rotary cylindrical surface discharge plasma module 110 rotates.
- the powder surface processing apparatus includes a driving unit for rotating the rotary cylindrical surface discharge plasma module 110.
- the driving unit may have a form for rotating the rotary cylindrical surface discharge plasma module 110, for example, driving means such as a driving motor may be connected to the rotary cylindrical surface discharge plasma module 110.
- the driving unit is not specifically limited as long as it can rotate the rotary cylindrical surface discharge plasma module 110.
- the driving unit includes a rotational speed control unit.
- the rotational speed control unit is configured to control the speed at which the rotary cylindrical surface discharge plasma module 110 is rotated.
- the rotational speed control unit may be in the form of a control box or a programmable logic controller (PLC).
- PLC programmable logic controller
- the rotational speed control unit is not specifically limited to this configuration.
- the powder is injected into the rotary cylindrical surface discharge plasma module 110.
- An alternating voltage is applied from the plasma power supply 120 to the plate-like electrode layer 111 and the plasma generating electrodes 113, and a reaction gas is injected, thereby generating the plasma around the plasma generating electrodes 113.
- the rotary cylindrical surface discharge plasma module 110 is rotated by the driving unit.
- the powder within the rotary cylindrical surface discharge plasma module 110 rises and falls in the rotational direction of the rotary cylindrical surface discharge plasma module 110. This procedure is repeated while the rotary cylindrical surface discharge plasma module 110 is rotated. In this case, the powder is in contact with the plasma.
- the rotational speed of the rotary cylindrical surface discharge plasma module 110 may be adjusted if necessary.
- the rotary cylindrical surface discharge plasma module 110 is cylindrical, and the powder is processed while the rotary cylindrical surface discharge plasma module 110 is rotated, thereby allowing the powder to be uniformly processed.
- the speed at which the rotary cylindrical surface discharge plasma module 110 is rotated is adjusted, the time that the powder spends in contact with the plasma can be controlled.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PL13862200T PL2929932T3 (pl) | 2012-12-10 | 2013-12-06 | Urządzenie do plazmowej obróbki proszku |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020120142764A KR101458411B1 (ko) | 2012-12-10 | 2012-12-10 | 분말 플라즈마 처리 장치 |
PCT/KR2013/011273 WO2014092395A1 (ko) | 2012-12-10 | 2013-12-06 | 분말 플라즈마 처리 장치 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP2929932A1 EP2929932A1 (en) | 2015-10-14 |
EP2929932A4 EP2929932A4 (en) | 2016-07-13 |
EP2929932B1 true EP2929932B1 (en) | 2018-04-04 |
Family
ID=50934621
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP13862200.6A Active EP2929932B1 (en) | 2012-12-10 | 2013-12-06 | Powder plasma treatment apparatus |
Country Status (8)
Country | Link |
---|---|
US (2) | US20150348760A1 (ja) |
EP (1) | EP2929932B1 (ja) |
JP (1) | JP5940215B2 (ja) |
KR (1) | KR101458411B1 (ja) |
CN (1) | CN104519993B (ja) |
HU (1) | HUE037466T2 (ja) |
PL (1) | PL2929932T3 (ja) |
WO (1) | WO2014092395A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6562273B2 (ja) * | 2015-10-16 | 2019-08-21 | 学校法人 中村産業学園 | プラズマ処理装置およびその方法 |
CN109302790A (zh) * | 2018-06-01 | 2019-02-01 | 苏州海唐智能装备有限公司 | 一种新型等离子体粉体改性装置 |
CN110572924B (zh) * | 2019-08-15 | 2021-12-03 | 大连理工大学 | 一种滚动果蔬表面微生物控制的等离子体系统 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58221203A (ja) * | 1982-06-18 | 1983-12-22 | Tdk Corp | 分散性を改良した磁性粉 |
JPS5919539A (ja) * | 1982-07-21 | 1984-02-01 | Kyocera Corp | 容量結合型グロ−放電分解装置 |
JPS5932940A (ja) * | 1982-08-16 | 1984-02-22 | Sankyo Dengiyou Kk | 活性化装置 |
JP3086956B2 (ja) * | 1990-08-29 | 2000-09-11 | 増田 佳子 | 沿面プラズマcvdによる微粒子の気相合成方法及び装置 |
JP2636174B2 (ja) * | 1994-07-22 | 1997-07-30 | 工業技術院長 | 放電反応利用化学蒸着法による粉末表面改質装置 |
KR20010068436A (ko) * | 2000-01-05 | 2001-07-23 | 황해웅 | 코로나 플라즈마를 이용한 휘발성 유기화합물 제거 및탈취장치 |
JP2004089753A (ja) * | 2002-08-29 | 2004-03-25 | Aisin Seiki Co Ltd | ガス分解装置 |
CN100349651C (zh) * | 2003-02-18 | 2007-11-21 | 夏普株式会社 | 通过正负两种离子的作用使抗原性物质失活的方法和装置 |
US7347979B2 (en) * | 2003-06-17 | 2008-03-25 | Nittetsu Mining Co., Ltd. | Gas processing method and gas processing apparatus utilizing oxidation catalyst and low-temperature plasma |
JP2007508135A (ja) * | 2003-10-15 | 2007-04-05 | ダウ・コーニング・アイルランド・リミテッド | 粒子の官能基化 |
JP2005135736A (ja) * | 2003-10-30 | 2005-05-26 | Nippon Spindle Mfg Co Ltd | 粉粒体用プラズマ処理装置 |
US7397013B2 (en) * | 2005-11-23 | 2008-07-08 | Heraeus Inc. | Plasma lineation electrode |
CN201006026Y (zh) * | 2007-03-12 | 2008-01-16 | 杭州朗索医用消毒剂有限公司 | 具有圆管状发射电极的等离子灭菌设备 |
US7935906B2 (en) * | 2007-04-17 | 2011-05-03 | Dynamic Connections, Llc | Separation and manipulation of a chiral object |
JP5089521B2 (ja) * | 2008-07-31 | 2012-12-05 | 学校法人 中村産業学園 | 粉体のプラズマ処理方法 |
EP2440323B1 (en) * | 2009-06-09 | 2019-08-28 | Haydale Graphene Industries plc | Methods and apparatus for particle processing with plasma |
JP5651323B2 (ja) * | 2009-11-09 | 2015-01-07 | 富士機械製造株式会社 | プラズマ処理装置およびプラズマ処理方法 |
JP2011249014A (ja) * | 2010-05-21 | 2011-12-08 | Mitsui Chemicals Inc | 表面処理装置 |
KR101792104B1 (ko) | 2010-12-31 | 2017-11-01 | 엘지디스플레이 주식회사 | 도광판 및 이를 구비한 액정표시소자 |
CN202205700U (zh) * | 2011-09-07 | 2012-04-25 | 苏州市奥普斯等离子体科技有限公司 | 一种颗粒状材料表面低温等离子体处理装置 |
-
2012
- 2012-12-10 KR KR1020120142764A patent/KR101458411B1/ko active IP Right Grant
-
2013
- 2013-12-06 JP JP2015520081A patent/JP5940215B2/ja active Active
- 2013-12-06 PL PL13862200T patent/PL2929932T3/pl unknown
- 2013-12-06 EP EP13862200.6A patent/EP2929932B1/en active Active
- 2013-12-06 CN CN201380032767.6A patent/CN104519993B/zh active Active
- 2013-12-06 WO PCT/KR2013/011273 patent/WO2014092395A1/ko active Application Filing
- 2013-12-06 US US14/409,399 patent/US20150348760A1/en not_active Abandoned
- 2013-12-06 HU HUE13862200A patent/HUE037466T2/hu unknown
-
2017
- 2017-09-28 US US15/719,128 patent/US10418227B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR20140074612A (ko) | 2014-06-18 |
US20180019105A1 (en) | 2018-01-18 |
PL2929932T3 (pl) | 2018-08-31 |
HUE037466T2 (hu) | 2018-08-28 |
WO2014092395A1 (ko) | 2014-06-19 |
KR101458411B1 (ko) | 2014-11-07 |
US20150348760A1 (en) | 2015-12-03 |
EP2929932A4 (en) | 2016-07-13 |
CN104519993A (zh) | 2015-04-15 |
EP2929932A1 (en) | 2015-10-14 |
JP2015527188A (ja) | 2015-09-17 |
CN104519993B (zh) | 2016-08-17 |
US10418227B2 (en) | 2019-09-17 |
JP5940215B2 (ja) | 2016-06-29 |
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