US20140130940A1 - Solder Paste - Google Patents

Solder Paste Download PDF

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Publication number
US20140130940A1
US20140130940A1 US14/125,916 US201214125916A US2014130940A1 US 20140130940 A1 US20140130940 A1 US 20140130940A1 US 201214125916 A US201214125916 A US 201214125916A US 2014130940 A1 US2014130940 A1 US 2014130940A1
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United States
Prior art keywords
solder paste
squeegee
printing
film
solder
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
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US14/125,916
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English (en)
Inventor
Sakie Okada
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Senju Metal Industry Co Ltd
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Senju Metal Industry Co Ltd
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Publication date
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Assigned to SENJU METAL INDUSTRY CO., LTD. reassignment SENJU METAL INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OKADA, SAKIE
Publication of US20140130940A1 publication Critical patent/US20140130940A1/en
Abandoned legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/12—Stencil printing; Silk-screen printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/082—Flux dispensers; Apparatus for applying flux
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/26—Printing on other surfaces than ordinary paper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/085—Using vacuum or low pressure

Definitions

  • the present invention relates to solder paste obtained by mixing a flux with solder powders and it particularly relates to solder paste that can be filled in minute apertures to form solder bumps.
  • a first step in SMT process that is used for assembling an electronic substrate starts from supplying on the substrate an appropriate quantity of the solder paste formed by mixing a flux with solder powders. There is a method referred to as a screen printing one of the methods of supplying the solder paste on the substrate.
  • FIGS. 10A , 10 B, 10 C, 10 D, 10 E and 10 F are motion illustration diagrams showing an example of a conventional screen printing.
  • a screen 104 made of a steel plate in which apertures 103 are formed with them being aligned with electrodes 102 of a substrate 101 and the substrate 101 are closely contacted to each other, as shown in FIG. 10B .
  • the solder paste S is put on the screen 104 , as shown in FIG. 10C , and sliding a squeegee 105 toward a direction of an arrow F with it closely contacting the screen 104 , the solder paste S is filled in the apertures 103 as shown in FIG. 10D .
  • the solder paste S is filled in only the apertures 103 of the screen 104 , as shown in FIG. 10E .
  • the solder paste S filled in the apertures 103 of the screen 104 is transferred to a side of the substrate 101 .
  • the screen printing has been popularized as a method of allowing the solder paste to be accurately supplied at a lowest price when consecutively producing the substrates of same type. It also has maintained its position as the method of allowing the solder paste to be supplied to a portion to be soldered which has been extremely minimized and/or narrowed connection with miniaturization of the substrate and pitch narrowing of the electrodes.
  • the supply of the solder paste is performed in its first step and then, a component mounting steps and then a soldering step by heating follow. If any faults occur in supplying the solder paste, these faults in supplying it cannot be covered even when the following component mounting step and the following soldering step by heating are performed under best conditions.
  • the supply of the solder paste is the most important step in the SMT process.
  • any optimization of viscosity of the solder paste and a size of the solder powder, any optimization of a printing condition and/or the like have been studied in the past and a printing process, though not quite satisfactory, is being fixed.
  • FIGS. 11A , 11 B, 11 C, 11 D, 11 E and 11 F are motion illustration diagrams showing an example of a conventional film method.
  • a film 106 is attached onto the substrate 101 and as shown in FIG. 11B , apertures 107 are formed in the film 106 by removing therefrom portions to which the solder paste should be supplied using etch.
  • solder paste S is filled in the apertures 107 as shown in FIG. 11C .
  • the solder paste S is filled in only the apertures 107 of the film 106 .
  • the substrate 101 is put into a reflow furnace while the film 106 is attached thereto and as shown in FIG. 10E , solder bumps 108 are formed. Thereafter, as shown in FIG. 11F , the film 106 is removed from the substrate 101 using a parting agent.
  • the solder paste may remain in the apertures of the screen when separating the screen from the substrate in a case where the pitch narrowing of the electrodes advances and the apertures formed in the screen is made extremely small so that it will remove from the substrate. This fails in filling an inadequate amount of solder.
  • the film method in contrast, by removing the film after the solder paste is fused and the solder bumps are formed, the solder bumps are formed on a side of the electrodes of the substrate so that an amount of the solder is fixed.
  • FIGS. 12A , 12 B and 12 C are illustration diagrams showing conventional problems.
  • the screen printing is illustrated.
  • a ratio of a thickness L2 of the screen 104 to a diameter L1 of the aperture 103 formed in the screen 104 is referred as an aspect ratio (L2/L1).
  • L2/L1 a ratio of a thickness L2 of the screen 104 to a diameter L1 of the aperture 103 formed in the screen 104
  • the present invention solves such problems and has an object to provide solder paste that can be filled in minute apertures.
  • the inventors have also found out such a fact that in the printing while environments in which the substrate on which the solder paste is printed is put are switched to one under atmospheric pressure and one under the decompression pressure, it is possible to fill the solder paste in the minute apertures due to viscosity of the solder paste. Further, they have found out such a fact that controlling volatilization of solvent in the flux constituting the solder paste under the decompression pressure allows a variation in the viscosity of the solder paste to be suppressed.
  • This invention relates to solder paste that is printed on the substrate through a mask member in which aperture is formed and that is supplied to the aperture of the mask member under decompression pressure and has a viscosity so that it is filled in the aperture under atmospheric pressure.
  • the solder paste has a viscosity of 50 through 150 Pa ⁇ s and a thixotropic ratio of 0.3 through 0.5. Further, the solder paste is obtained by mixing a flux containing solvent having a boiling point such that volatilization thereof is suppressible under the decompression pressure and solder powders. It is preferable that in the flux, the solvent having the boiling point of 240° C. or more is used and the solvent is octanediol.
  • the solder paste is supplied to the mask member in which the aperture is formed and the solder paste is printed on a substrate under predetermined decompression pressure. After the printing under the decompression pressure, the environments in which the substrate is put are switched to the atmospheric pressure so that the solder paste is filled in the aperture under atmospheric pressure. In the printing under the decompression pressure, a solder paste coat having a predetermined thickness is formed on the mask member and when the environments in which the substrate is put are switched to the atmospheric pressure, the solder paste is filled in the aperture under atmospheric pressure utilizing the solder paste coat on the mask member.
  • the excessive solder paste on the mask member is scraped off, the substrate is heated to fuse the solder paste so that solder bumps are formed.
  • the mask member is then removed from the substrate.
  • the excessive solder paste on the mask member is scraped off and the mask member is separated from the substrate. Electronic components and the like are then mounted and the substrate is heated so that the soldering is performed.
  • the solder paste according to the invention has a viscosity such that it can be filled in the minute aperture under atmospheric pressure, in addition to the pressure by a pressing member, so that after the solder paste is printed on the substrate under the predetermined decompression pressure to supply the solder paste to the aperture in the mask member, the substrate is put under atmospheric pressure and even if there is a space in the aperture, the solder paste can be filled in the aperture under atmospheric pressure.
  • the film method it is possible to suppress a variation in the heights of the solder bumps and it is possible to suppress the missing bump in which no solder bump is formed.
  • FIG. 1 is a configuration diagram showing an example of a solder printing machine according to an embodiment of the present invention.
  • FIG. 2 is a functional block diagram showing an example of a control function of the solder printing machine according to the embodiment.
  • FIG. 3A is a motion illustration diagram showing an example of a printing method of solder paste according to the embodiment.
  • FIG. 3B is a motion illustration diagram showing the example of the printing method of solder paste according to the embodiment.
  • FIG. 3C is a motion illustration diagram showing the example of the printing method of solder paste according to the embodiment.
  • FIG. 3D is a motion illustration diagram showing the example of the printing method of solder paste according to the embodiment.
  • FIG. 3E is a motion illustration diagram showing the example of the printing method of solder paste according to the embodiment.
  • FIG. 4 is a graph showing a relationship between a leaving time and a loss in weight under vacuum condition.
  • FIG. 5 is a graph showing a relationship between a viscosity of each of the solder pastes and the height of each of the solder bumps.
  • FIG. 6 is a graph showing a relationship between a viscosity of each of the solder pastes and the height of each of the solder bumps.
  • FIG. 7 is a microphotograph showing a solder bump's forming state as an executed example.
  • FIG. 8 is a microphotograph showing a solder bump's forming state as an executed example.
  • FIG. 9 is a microphotograph showing a state in which no solder bump is formed as a comparison example.
  • FIG. 10A is a motion illustration diagram showing an example of a conventional screen printing.
  • FIG. 10B is a motion illustration diagram showing the example of the conventional screen printing.
  • FIG. 10C is a motion illustration diagram showing the example of the conventional screen printing.
  • FIG. 10D is a motion illustration diagram showing the example of the conventional screen printing.
  • FIG. 10E is a motion illustration diagram showing the example of the conventional screen printing.
  • FIG. 10F is a motion illustration diagram showing the example of the conventional screen printing.
  • FIG. 11A is a motion illustration diagram showing an example of a conventional film method.
  • FIG. 11B is a motion illustration diagram showing the example of the conventional film method.
  • FIG. 11C is a motion illustration diagram showing the example of the conventional film method.
  • FIG. 11D is a motion illustration diagram showing the example of the conventional film method.
  • FIG. 11E is a motion illustration diagram showing the example of the conventional film method.
  • FIG. 11F is a motion illustration diagram showing the example of the conventional film method.
  • FIG. 12A is a schematic diagram showing a conventional problem.
  • FIG. 12B is a schematic diagram showing the conventional problem.
  • FIG. 12C is a schematic diagram showing the conventional problem.
  • Solder paste according to the embodiment is printed on a substrate by a screen method using a screen as mask member or a film method using a film as the mask member.
  • the printing by the screen method or the film method is performed under a predetermined decompression condition, in this embodiment, vacuum condition.
  • solder paste according to the embodiment is produced so that the flux containing solvent having a constituent such that volatilization thereof is suppressible under vacuum condition is mixed with solder powders. Further, the solder paste according to this embodiment has a viscosity so that it is pushed into the apertures in the screen or the film by pressure force of a squeegee and it is pushed into the apertures under atmospheric pressure when it is opened from the vacuum condition to the atmospheric pressure.
  • a degree of volatilization of a material is dependent on vapor pressure of the material. Vapor pressure of a material at a temperature is uniquely fixed and at a boiling point that is a temperature while the vapor pressure is equal to an external pressure, the volatilization of the material becomes maximum.
  • the volatilization of material under vacuum condition has, generally, such a tendency that the volatilization of material having higher boiling point is more suppressible than that of material having lower boiling point.
  • the flux containing a solvent, the boiling point of which is more than a predetermined temperature is used.
  • the solvent the boiling point of which is of 240° C. or more
  • octanediol the boiling point of which is 243.2° C.
  • the viscosity of the solder paste it is preferable that in order to allow the solder paste to be filled in the apertures of the screen or the film by the pressure force of the squeegee and the atmospheric pressure, particularly, in order to allow the solder paste to be filled in even the minute apertures, its viscosity is lowered. Further, it is preferable that a thixotropic ratio is lower, in which stress is small against displacement. In this embodiment, it is preferable that the solder paste has a viscosity of about 50 through 150 Pa ⁇ s and the thixotropic ratio of about 0.3 through 0.5.
  • FIG. 1 is a configuration diagram showing an example of a solder printing machine according to the embodiment and shows a case where it is applied to the film method using the film as the mask member.
  • the solder printing machine 1 A according to the embodiment is provided with a printing mechanism 2 that prints solder paste S on a substrate 11 , a substrate-supporting mechanism 3 that supports the substrate 11 on which the printing mechanism 2 prints the solder paste S, and a printing room 4 housing the printing mechanism 2 and the substrate-supporting mechanism 3 .
  • a film 12 to be attached to the substrate 11 is used.
  • the film 12 has photosensitivity such that it is cured by irradiating thereto light having a predetermined wavelength range, in this embodiment, ultraviolet (UV) rays.
  • UV ultraviolet
  • the film 12 is attached to a surface thereof on which the solder paste S is printed and the ultraviolet rays are irradiated to any positions other than positions of electrodes on which the solder paste S is printed.
  • portions of the film 12 to which the ultraviolet rays are irradiated are cured and positions on which the solder paste S is not printed are covered by the film 12 . Further, on the substrate 11 , portions of the film 12 to which the ultraviolet rays are not irradiated are removed by chemicals or the like so that any apertures 13 having predetermined dimensions are formed with them being aligned to positions of electrodes or the like to which the solder paste S is printed.
  • the printing mechanism 2 is provided with a first squeegee 20 a and a second squeegee 20 b , which move toward predetermined printing directions along the substrate 11 to which the film 12 is attached and perform the filling and scraping of the solder paste S.
  • the printing mechanism 2 is also provided with a squeegee portion 21 on which the first squeegee 20 a and the second squeegee 20 b are proved and a squeegee-moving mechanism 22 that moves the first squeegee 20 a and the second squeegee 20 b toward the predetermined printing directions.
  • the first squeegee 20 a and the second squeegee 20 b are plate members made of single material such as rubber, resin or metal or plate members made of a combination of their materials such as a portion thereof contacting the film 12 is made of rubber and other portion thereof is made of metal.
  • the printing mechanism 2 is configured so that a moving direction of the squeegee portion 21 moved by the squeegee-moving mechanism 22 is guided by a guide member 22 a and the squeegee portion 21 can reciprocate along the substrate 11 to which the film 12 is attached.
  • the first squeegee 20 a and the second squeegee 20 b move toward a first printing direction FA along the substrate 11 on which the film 12 is attached and a second printing direction FB that is an opposite direction to the first printing direction FA.
  • the printing mechanism 2 is configured so that the squeegee portion 21 is provided with a first squeegee-elevator 23 a that elevates the first squeegee 20 a and a second squeegee-elevator 23 b that elevates the second squeegee 20 b.
  • the printing mechanism 2 is also configured so that the first squeegee 20 a moves along a raising or lowering direction UA by means of the first squeegee-elevator 23 a and the first squeegee 20 a moves to a direction such that it contacts the substrate 11 to which the film 12 is attached or it is away from the substrate 11 .
  • the printing mechanism 2 is configured so that by limiting an amount of movement of the first squeegee 20 a along the raising or lowering direction UA, an interval H of a lower end of the first squeegee 20 a and the film 12 , an attack angle that is an angle of the first squeegee 20 a against the film 12 , the pressure force by the first squeegee 20 a against the film 12 and the like are adaptable.
  • the second squeegee 20 b is also configured so as to be similar thereto and the second squeegee 20 b moves along a raising or lowering direction UB by means of the second squeegee-elevator 23 b and the second squeegee 20 b moves to a direction such that it contacts the substrate 11 to which the film 12 is attached or it is away from the substrate 11 .
  • the printing mechanism 2 is configured so that by limiting an amount of movement of the second squeegee 20 b along the raising or lowering direction UB, an interval H of a lower end of the second squeegee 20 b and the film 12 , an attack angle that is an angle of the second squeegee 20 b against the film 12 , the pressure force by the second squeegee 20 b against the film 12 and the like are adaptable.
  • the squeegee portion 21 is provided with the first squeegee-elevator 23 a and the second squeegee-elevator 23 b so that the first squeegee 20 a and the second squeegee 20 b independently move to the raising and lowering directions and move toward the predetermined printing directions while their positions along the raising or lowering direction are kept at their set positions.
  • the substrate-supporting mechanism 3 is provided with a stage 30 mounting the substrate 11 to which the film 12 is attached, and a stage-moving mechanism 31 that moves the stage 30 .
  • the stage 30 is provided with a clamp mechanism 32 removably holding the substrate 11 with an optional dimension, to which the film 12 is attached.
  • the stage-moving mechanism 31 is provided with a mechanism for vertically and horizontally moving the stage 30 and allows the substrate 11 to which the film 12 to be aligned.
  • the printing room 4 is configured to have a space housing the above-mentioned printing mechanism 2 and substrate-supporting mechanism 3 and is provided with a vacuum pump 40 and a valve 41 .
  • the printing room 4 keeps its airtightness by closing the valve 41 and becomes a desired vacuum condition by exhausting air using the vacuum pump 40 .
  • the printing room 4 is opened from the vacuum condition to the atmospheric pressure by opening the valve 41 .
  • FIG. 2 is a functional block diagram showing an example of a control function of the solder printing machine according to the embodiment.
  • the solder printing machine 1 A is provided with a control unit 100 constituted of a microcomputer and the like.
  • the control unit 100 is an example of control means and carries out any programs stored in a storage unit 100 a to perform a series of processes for printing the solder paste on the substrate based on setting by a manipulation unit 100 b.
  • the control unit 100 controls the vacuum pump 40 and the valve 41 following steps previously set by the programs for carrying out a series of processes of printing the solder paste S on the substrate 11 and switches the printing room 4 shown in FIG. 1 to either the vacuum condition or the condition opened to the atmospheric pressure.
  • the control unit 100 also controls the squeegee-moving mechanism 22 to allow the first squeegee 20 a and the second squeegee 20 b to move to the first printing direction FA and the second printing direction FB. Further, the control unit 100 controls the first squeegee-elevator 23 a to allow the first squeegee 20 a to move toward the raising or lowering direction UA and controls the second squeegee-elevator 23 b to allow the second squeegee 20 b to move toward the raising or lowering direction UB. The control unit 100 additionally controls the stage-moving mechanism 31 to allow the stage 30 to move vertically or horizontally.
  • the control unit 100 fills the solder paste S in the apertures 13 of the film 12 attached to the substrate 11 following the printing directional movement of the first squeegee 20 a or the second squeegee 20 b . Moreover, it forms a coat of the solder paste S on the film 12 by the printing directional movement of the first squeegee 20 a or the second squeegee 20 b when filling the solder paste S in the apertures 13 of the film 12 .
  • control unit 100 sets so as to have a predetermined gap between the lower end of the first squeegee 20 a or the second squeegee 20 h and the film 12 .
  • control unit 100 sets the interval H between the lower end of the first squeegee 20 a and the film 12 to have a predetermined gap such that it is possible to fill the solder paste S in the apertures 13 of the film 12 and form the coat of solder paste S on the film 12 by the movement of the first squeegee 20 a to the first printing direction FA.
  • control unit 100 sets the interval H between the lower end of the second squeegee 20 b and the film 12 to have a predetermined gap such that it is possible to fill the solder paste S in the apertures 13 of the film 12 and form the coat of solder paste S on the film 12 by the movement of the second squeegee 20 b to the second printing direction FB.
  • the control unit 100 allows the solder paste S forming the coat on the film 12 to be filled in the apertures 13 of the film 12 under atmospheric pressure. It also scrapes the coat of the solder paste S on the film 12 off by movement of the first squeegee 20 b or the second squeegee 20 b to their printing directions.
  • the control unit 100 sets the first squeegee 20 a or the second squeegee 20 b to be pressed onto the film 12 .
  • the attack angle and the pressing force of the first squeegee 20 a against the film 12 and the like are set so that it is possible to scrape the coat of the solder paste S on the film 12 off by means of the movement of first squeegee 20 a to the first printing direction FA.
  • the attack angle and the pressing force of the second squeegee 20 b against the film 12 and the like are set so that it is possible to scrape the coat of the solder paste S on the film 12 off by means of the movement of second squeegee 20 b to the second printing direction FB.
  • the control unit 100 allows one of the first squeegee 20 a and the second squeegee 20 b to fill the solder paste S in the apertures 13 of the film 12 and to form the coat of solder paste S on the film 12 . It also allows the other of the first squeegee 20 a and the second squeegee 20 b to scrape the coat of solder paste S on the film 12 off.
  • the control unit 100 sets so as to have a predetermined gap between the lower end of the first squeegee 20 a and the film 12 and retracts the second squeegee 20 b upward.
  • the solder paste S is filled in the apertures 13 of the film 12 and the coat of the solder paste S is formed on the film 12 .
  • the control unit 100 sets the second squeegee 20 b to be pressed onto the film 12 and retracts the first squeegee 20 a upward.
  • the second squeegee 20 b moved to the second printing direction FB the coat of the solder paste S on the film 12 is scraped off.
  • FIGS. 3A , 3 B, 3 C, 3 D and 3 E are motion illustration diagrams showing an example of a printing method of solder paste according to the embodiment. The following will describe a printing operation of the solder paste S in the solder printing machine according to the embodiment with reference to respective drawings.
  • the film 12 is attached to a surface thereof, on which the solder paste S is printed, and covers the positions of the electrodes or the like on which the solder paste S is printed.
  • the ultraviolet rays are irradiated thereto.
  • portions of the film 12 to which the ultraviolet rays are irradiated cure and any positions on which the solder paste S is not printed are covered by the film 12 .
  • portions of the film 12 to which the ultraviolet rays are not irradiated are removed by chemicals or the like so that any apertures 13 having predetermined dimensions are formed with them being aligned to positions of the electrodes 14 or the like to which the solder paste S is printed.
  • the substrate 11 to which the film 12 is attached is set on the stage 30 .
  • the control unit 100 controls the stage-moving mechanism 31 to move the stage 30 vertically or horizontally so that the substrate 11 to which the film 12 is aligned thereto.
  • the control unit 100 controls the first squeegee-elevator 23 a to elevate the first squeegee 20 a toward the raising or lowering direction UA so that a predetermined gap is formed between the film 12 attached to the substrate 11 and the first squeegee 20 a.
  • the control unit 100 sets the interval H between the lower end of the first squeegee 20 a and the film 12 to have a predetermined gap such that it is possible to fill the solder paste S in the apertures 13 of the film 12 and form the coat of solder paste S on the film 12 by the movement of the first squeegee 20 a to the first printing direction FA.
  • the interval H between the lower end of the first squeegee 20 a and the film 12 is set to about 1 mm. It is to be noted that in the step of making the printing room 4 vacuum condition, the second squeegee 20 b is retracted upward.
  • the control unit 100 closes the valve 41 to keep the printing room 4 airtight and activates the vacuum pump 40 to exhaust air from the inside of the printing room 4 so that the inside of the printing room 4 becomes predetermined vacuum condition.
  • the control unit 100 controls the squeegee-moving mechanism 22 to maintain the gap between the film 12 attached to the substrate 11 and the first squeegee 20 a and allows the first squeegee 20 a to move toward the first printing direction FA.
  • This enables the solder paste S supplied on the film 12 to be filled in the apertures 13 of the film 12 and enables the coat of the solder paste S to be formed on the film 12 .
  • the coat of the solder paste S on the film 12 has a thickness of about 1 mm.
  • the pressing of the squeegee may keep a gap 15 between the solder paste S and a bottom of the aperture 13 , as shown in FIG. 3C , so that no solder paste S contact the electrode 14 on the bottom of the aperture 13 .
  • the control unit 100 opens the valve 41 to open the printing room 4 from the vacuum condition to the atmospheric pressure.
  • the control unit 100 controls the second squeegee-elevator 23 b to move the second squeegee 20 b toward the raising or lowering direction UB in the step of making the printing room 4 the condition opened to the atmospheric pressure so that the second squeegee 20 b becomes pressed on the film 12 attached to the substrate 11 .
  • control unit 100 sets the attack angle and the pressing force by the second squeegee 20 b against the film 12 and the like to a value such that the coat of the solder paste S on the film 12 can be scraped off by the movement of the second squeegee 20 b to the second printing direction FB. It is to be noted that in the step of making the printing room 4 the condition opened to the atmospheric pressure, the first squeegee 20 a is retracted upward.
  • the control unit 100 controls the squeegee-moving mechanism 22 to maintain the situation where the second squeegee 20 b is closely contacted with the film 12 attached to the substrate 11 and allows the second squeegee 20 b to move toward the second printing direction FB. This enables the excessive coat of the solder paste S remained on the film 12 to be scraped off, as shown in FIG. 3E .
  • the substrate in which the solder paste S is filled in the apertures 13 of the film 12 is heated in the reflow furnace and the solder paste S is fused so that solder bumps are formed.
  • the film 12 is removed off. This enables the solder bumps to be formed on the electrodes 14 on the substrate 11 .
  • the printing step of the solder paste S it is possible to fill the solder paste S in the apertures 13 of the film 12 certainly so that the solder bumps can be certainly formed on the electrodes 14 and the like of the substrate 11 .
  • the screen is separated from the substrate and only the substrate is heated in the reflow furnace.
  • the pitch narrowing of the electrodes advances and the apertures formed in the screen become minute, even if the solder paste is certainly filled in the apertures, the solder paste may remain in the apertures of the screen when separating the screen from the substrate so that it is separated from the substrate.
  • the substrate 11 while the film 12 is attached thereto is heated in the reflow furnace.
  • the solder paste S is then fused by heating the substrate 11 to form the solder bumps, the film 12 is removed off.
  • the solder bumps remain on a side of the electrodes 14 of the substrate 11 , which prevents attaching them to a side of the film 12 from separating them from the electrodes 14 .
  • the coat of the solder paste S is formed on the film 12 in the step of making the printing room 4 vacuum condition.
  • the solder paste S can be printed while the first squeegee 20 a closely contacts the film 12 .
  • solder paste S is printed while the first squeegee 20 a closely contacts the film 12 under vacuum condition, if any gap is formed between the solder paste S and the bottom of the aperture, this gap 15 becomes negative pressure when opening the printing room 4 to the atmospheric pressure.
  • the solder paste S filled in the apertures 13 is then pushed down to the apertures 13 under atmospheric pressure.
  • a shortage of the solder paste S by pushing it down to the apertures 13 under atmospheric pressure is supplied by scraping operation by the second squeegee 20 b under atmospheric pressure.
  • the solder paste S according to this embodiment is printed on the substrate 11 while the printing room 4 of the solder printing machine 1 A is made vacuum condition, as described above.
  • the solder paste S since the solder paste S is exposed to any decompression environment as compared with the atmospheric pressure, it is necessary that a flux in the solder paste does not volatilize under the decompression pressure and it has a viscosity such that the solder paste S is filled in the apertures 13 during a short period of time when the printing room 4 is opened from the decompression condition to the atmospheric pressure.
  • the flux to be used in the solder paste S is made of solid contents and solvents.
  • solvent contents volatilize under vacuum condition
  • viscosity variation occurs in the solder paste S during the printing while the printing room 4 is under vacuum condition, which causes its print performance to be unstable. Accordingly, in order to select the solvent that is hard to volatilize during the printing under vacuum condition, degrees of volatilization of the solvents in vacuum were verified.
  • Solvents each of about 10 cc were put in laboratory dishes and the weights of the put solvents were measured. They were leaved under vacuum condition of 5 Pa and loss parts thereof in weight were measured for every one hour when they returned to the atmospheric pressure. Three species of solvents, which have different boiling points as shown in the following Table 1, were selected and losses in weight were measured on the basis of the species of the solvents.
  • FIG. 4 is a graph showing a relationship between a leaving time and a loss in weight under vacuum condition. As shown in FIG. 4 , it was found that the degrees of losses in weight of the solvents were different from each other based on their boiling points as well as the solvent having lower boiling point was lost in more weight and there was less volatilization in the solvent having higher boiling point under vacuum condition.
  • solder pastes were prepared by mixing each of the fluxes A through C shown in Table 2 and solder powders (Its composition: Sn-3Ag-0.5Cu, Powder size: 6 ⁇ m or less) so that the flux is 12% by mass %. Viscosity and thixotropic ratio of each of these solder pastes were measured.
  • silicon wafers of the specification shown in the following Table 5 were prepared, the solder pastes having the three species of viscosities shown in Table 4 were filled in the apertures, in the apertures, the solder was fused on a hot plate at 250° C. and solder bumps were formed. Thereafter, residue of the flux was washed out by cleaning liquid of hydrocarbon system and heights of the bumps were measured by an ultrasonic microscope. Numbers of measured points were 30 points.
  • the above-mentioned solder printing machine as shown in FIG. 1 , which was switched between the vacuum condition and the condition opened to the atmospheric pressure, was used.
  • the printing room 4 became under vacuum condition.
  • the predetermined gap in this example, about 1 mm, was formed between the squeegee and a surface to be printed and the printing was performed.
  • the solder paste was filled in the apertures by the pressure force of the squeegee and the coat of the solder paste was formed.
  • the printing room is opened from the vacuum condition to the atmospheric pressure and the solder paste was filled in the apertures under atmospheric pressure and the excessive solder paste was scraped off while the squeegee closely contacted the space to be printed.
  • the same solder printing machine was used and the printing was performed under atmospheric pressure without any printing under vacuum condition. They were compared.
  • FIGS. 5 and 6 are graphs each showing a relationship between a viscosity of each of the solder pastes and the height of each of the solder bumps.
  • FIG. 5 shows a case where the aspect ratio of the aperture is 1.3 and
  • FIG. 6 shows a case where the aspect ratio of the aperture is 1.67.
  • FIGS. 7 and 8 are microphotographs each showing a solder bump's forming state as the executed examples.
  • FIG. 7 shows a bump's forming state where the aspect ratio is 1.3
  • FIG. 8 shows a bump's forming state where the aspect ratio is 1.67.
  • FIG. 9 is a microphotograph showing a state in which no solder bump is formed as a comparison example.
  • an upper limit of each arrow shows the maximum value (max) of the heights of bumps and a lower limit of each arrow shows the minimum value (mim) of the heights of bumps.
  • Averages of the heights of bumps are plotted in the graphs. From the measured results of the heights of bumps, when the aspect ratio is increased, the heights of bumps become zero. In other words, it has been understood that a frequency of occurrence of the missing bump E in which no solder bump is formed, as shown in FIG. 9 , is increased.
  • the heights of the bumps become higher and stable in the printing while the vacuum condition and the condition opened to the atmospheric pressure are switched. This means that the solder paste is stably filled in the apertures in the printing while the vacuum condition and the condition opened to the atmospheric pressure are switched.
  • the viscosity of the solder paste when the printing is performed while the vacuum condition and the condition opened to the atmospheric pressure are switched, it is understood that in the solder paste having the viscosity A and the solder paste having the viscosity B, shown in Table 4, the bumps become larger in heights stably as shown in FIGS. 7 and 8 in spite of dimensions of the aspect ratios. In contrast, in the solder paste having the viscosity C, when the aspect ratio is increased, the bumps become smaller in heights.
  • any stable bumps can be formed.
  • the solvent contained in the flux is octanediol having the boiling point of 240° C. or more and the solder paste has a viscosity of 50 through 150 Pa ⁇ s and a thixotropic ratio of 0.3 through 0.5, it is possible to fill the solder paste certainly in the apertures of the film in spite of dimensions of the aspect ratios. It is understood that this enables the solder bumps to be certainly formed on the electrodes of the substrate even when the apertures are minute, enables a variation in the heights of solder bumps to be controlled and enables the missing bumps to be prevented.
  • solder paste according to the invention is applicable to a manufacture of electronic components in which a plurality of solder bumps is formed with narrow pitch.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Screen Printers (AREA)
  • Printing Methods (AREA)
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KR20140028075A (ko) 2014-03-07
EP2719497B1 (en) 2017-07-26
US20170157691A1 (en) 2017-06-08
JP2016032838A (ja) 2016-03-10
JPWO2012173059A1 (ja) 2015-02-23
CN106985564B (zh) 2019-03-08
EP2719497A4 (en) 2015-03-25
JP6016857B2 (ja) 2016-10-26
CN103635285A (zh) 2014-03-12
JP2014210291A (ja) 2014-11-13
CN106985564A (zh) 2017-07-28
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US10322462B2 (en) 2019-06-18
WO2012173059A1 (ja) 2012-12-20

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