TWI770524B - 用於拋光半導體晶圓的設備和方法 - Google Patents

用於拋光半導體晶圓的設備和方法 Download PDF

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TWI770524B
TWI770524B TW109118910A TW109118910A TWI770524B TW I770524 B TWI770524 B TW I770524B TW 109118910 A TW109118910 A TW 109118910A TW 109118910 A TW109118910 A TW 109118910A TW I770524 B TWI770524 B TW I770524B
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polished
polishing
semiconductor wafers
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強尼 法蘭克
路德溫格 藍平卻特
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德商世創電子材料公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
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    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
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    • B24—GRINDING; POLISHING
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    • B24—GRINDING; POLISHING
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    • B24—GRINDING; POLISHING
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    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
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Abstract

拋光晶圓的設備和方法。該設備包含： 拋光機，用於同時雙面拋光晶圓； 承載件，具有接收晶圓的凹進部； 高架安裝的傳送系統，用於傳輸含有待拋光晶圓的盒； 垂直傳送系統，用於從高架安裝的傳送系統取出所傳輸的盒以及從盒中提出待拋光晶圓； 自主移動到拋光機並具操縱器的機器人，用於從晶圓升降器取出待拋光晶圓、將待拋光晶圓插入凹進部，以及在拋光操作結束時，將經拋光晶圓從凹進部提出； x/y線性單元，具有晶圓夾持器，用於從機器人的操縱器中取出經拋光晶圓，並存放到濕式傳送容器內；以及 無人駕駛傳送工具，用於輸送濕式傳送容器。

Description

用於拋光半導體晶圓的設備和方法
本發明的主題是用於拋光半導體晶圓的設備，該設備包含用於半導體晶圓的同時雙面拋光的至少二個拋光機，且該設備具有高度自動化的特徵。此外，本發明還關於一種用於拋光半導體晶圓的方法，其中使用該設備來執行該方法。
用於半導體晶圓的同時雙面拋光的拋光機（在本說明書中也稱為DSP拋光機）係包含上拋光板及下拋光板，每個拋光板襯有拋光墊。當半導體晶圓位於承載件的凹進部中時，半導體晶圓在存在拋光漿料的情況下在拋光板之間被拋光。
已經提出了將待拋光的半導體晶圓插入承載件的凹進部內以及從承載件中的凹進部移出經拋光的半導體晶圓的自動化。在這方面例如可提及EP 0 931 623 A1、DE 100 07 389 A1和DE 102 28 441 A1、JP 2005-243 996 A、JP 2005-294378 A、US 6 361 418 B1和US 2017 0 323 814 A1。
儘管有這些提案，仍需要持續改進，特別是對於效果包括降低成本和節省時間的改進。
此一目的係藉由一種用於拋光半導體晶圓的設備來實現，該設備包含： 至少二個拋光機，用於半導體晶圓的同時雙面拋光； 一或多個承載件，其位於拋光機之相應的下拋光板的拋光墊上，且具有用於接收半導體晶圓的凹進部； 高架安裝的傳送系統（overhead-mounted transport system），用於傳輸含有待拋光的半導體晶圓的盒（cassette）； 分配給各該拋光機的垂直傳送系統，用於從高架安裝的傳送系統取出所傳輸的盒，且垂直傳送系統包含集成的晶圓升降器，用於將待拋光的半導體晶圓從盒中提出； 自主移動到該至少二個拋光機並具有操縱器的機器人，操縱器用於從晶圓升降器中取出待拋光的半導體晶圓，用於將待拋光的半導體晶圓插入其中一個凹進部，以及用於在拋光操作結束時，將經拋光的半導體晶圓從凹進部中提出； 分配給各該拋光機中的x/y線性單元，x/y線性單元具有晶圓夾持器，晶圓夾持器用於從自主移動的機器人的操縱器中取出經拋光的半導體晶圓，並將經拋光的半導體晶圓存放到具有集成的晶圓接收器的濕式傳送容器內；以及 無人駕駛傳送工具，用於將濕式傳送容器輸送到用於經拋光的半導體晶圓的清潔單元。
本發明的另一個主題是一種用於拋光半導體晶圓的方法，包含： 提供至少二個拋光機，用於對半導體晶圓同時雙面拋光； 藉由高架安裝的傳送系統將待拋光的半導體晶圓傳輸到盒中； 藉由垂直傳送系統的晶圓升降器將中心的待拋光的半導體晶圓從盒中提出； 藉由自主移動的機器人的操縱器從高架安裝的傳送系統的晶圓升降器或從對中站取出其中一個待拋光的半導體晶圓； 藉由自主移動的機器人的操縱器將待拋光的半導體晶圓插入該至少二個拋光機的承載件的凹進部內； 藉由自主移動的機器人的操縱器從承載件的其中一個凹進部移出經拋光的半導體晶圓； 藉由x/y線性單元的晶圓夾持器從自主移動的機器人的操縱器取出經拋光的半導體晶圓； 藉由晶圓夾持器將經拋光的半導體晶圓存放到濕式傳送容器的晶圓接收器內； 將濕式傳送容器從x/y線性單元轉移到無人駕駛傳送工具上；以及 藉由無人駕駛傳送工具將濕式傳送容器傳送到用於經拋光的半導體晶圓的清潔單元。
本發明從待拋光的半導體晶圓的傳輸直到拋光之後之半導體晶圓至清潔單元的傳送，允許完全自動、節省空間及節省成本的操作設計。半導體晶圓較佳是單晶矽半導體晶圓，更佳係具有至少200毫米之直徑者。
本發明所提供的包括藉由自主移動的機器人使用於同時雙面拋光半導體晶圓的至少二個拋光機裝載及卸載半導體晶圓。較佳地，根據拋光操作的持續時間來最佳化分配DSP拋光機的數量給自主移動的機器人。較佳提供至少3至10個、更佳至少3至6個由同一自主移動的機器人致動的DSP拋光機。該解決方案節省了如果為每個拋光機配備單獨的機器人時會產生的成本。相應地，空間需求也較小。自主移動的機器人從垂直傳送系統的晶圓升降器（晶圓提出）或從對中站取出待拋光的半導體晶圓。每個DSP拋光機都分配有一個此類垂直傳送系統。待拋光的半導體晶圓係堆疊在盒中，高架安裝的傳送系統（高架提升傳送（overhead hoist transport），OHT）將其輸送到DSP拋光機以裝載該DSP拋光機。所使用的盒可以是敞開或關閉的，例如被稱為FOUP的盒。如果待拋光的半導體晶圓係垂直站立地堆疊在其中，則較佳為敞開的盒，即沒有前門的盒。由於其構造，一旦敞開的盒被OHT放下至垂直傳送系統的盒接收器上，並被垂直傳送系統放下到晶圓升降器直到終端位置，這種敞開的盒能直接取得半導體晶圓。在終端位置，待拋光的半導體晶圓立於晶圓升降器的晶圓接收器的凹槽中，並由垂直傳送系統的引導件的凹槽橫向地支撐。藉由該佈置，垂直傳送系統具有固有的對中功能（centring function），這意即待拋光的半導體晶圓係以對中狀態（centred state）直立位於晶圓升降機上。這樣做的意義在於，已經可以將待拋光的半導體晶圓以如下方式傳送至自主移動的機器人上：自主移動的機器人的操縱器能夠在其自身無預先確定晶圓中心的情況下或者不需要任何對中站（centring station）的情況下在中心處吸取半導體晶圓，在對中站中待拋光的半導體晶圓則必須在被轉移到自主移動的機器人之前被對中。不存在獨立的對中站亦可以節省成本和節省空間，且加快了裝載過程，因為不需要自主移動的機器人的操縱器以多個步驟（首先從盒，然後進入對中站並且隨後進入承載件的凹進部內）來傳送半導體晶圓。
儘管如此，無意排除提供對中站，例如對中環，待拋光的半導體晶圓被垂直傳送系統的晶圓升降器存放在對中站內。提供這種站特別有用，特別是當待拋光的半導體晶圓在FOUP中從高架安裝的傳送系統水平輸送時。在那種情況下，其中一個待拋光的半導體晶圓係藉由垂直傳送系統的晶圓升降器而從FOUP移出，且在藉由自主移動的機器人的操縱器以對中狀態接收之前，首先被存放在對中站中。
自主移動的機器人被設計為無人駕駛傳送工具（自動引導傳送工具（automated guided vehicle，AGV））或被安裝在AGV上並控制AGV的移動。自主移動的機器人較佳在輪上行進。它包含臂，具有連接到該臂之端部的用於半導體晶圓的操縱器，且還包含光學識別系統，較佳為攝像機。該攝像機被用於識別拋光機的承載件上的標記，較佳識別承載件之表面上的標記。基於標記的位置，機器人計算凹進部的中心位置。為此沒有提供其他攝像機。操縱器較佳包含用於在半導體晶圓的二個側面之一個上吸取半導體晶圓的裝置。該操縱器從垂直傳送系統的晶圓升降器或從對中站獲取對中狀態之待拋光的半導體晶圓。
然後，自主移動的機器人開始裝載處於待裝載狀態的DSP拋光機。藉由攝像機，自主移動的機器人確定待裝載的DSP拋光機的承載件中的閒置之凹進部的中心位置，並將待拋光的半導體晶圓放入閒置之凹進部內。從藉由垂直傳送系統的晶圓升降器將待拋光的半導體晶圓提起直到藉由自主移動的操縱器將待拋光的半導體晶圓插入DSP拋光機的承載件中的閒置之凹進部內的過程，係重複直到DSP拋光機裝載了預定數量的待拋光的半導體晶圓。該過程通常在結束時，為用於接收半導體晶圓而存在之拋光機的承載件中的凹進部中已經裝滿待拋光的半導體晶圓。裝載結束後，由來自自主移動的機器人的信號而開始拋光，其中使上拋光板相對於下拋光板下降並關閉。在這些半導體晶圓的拋光期間，自主移動的機器人向另一個拋光機裝載待拋光的半導體晶圓，或者從另一個拋光機中卸載經拋光的半導體晶圓。
特別佳的是，對提供在至少一個拋光機上之設備的部分半導體晶圓進行拋光，同時自主移動的機器人則從垂直傳送系統的晶圓升降機或從對中站取出這些半導體晶圓中的其他部分中的一者，或將其插入其中一個凹進部或從其中一個凹進部移出。
對於卸載過程，每個拋光機都被分配了x/y線性單元，這使得可在三個空間方向的至少二個方向上傳送經拋光的半導體晶圓。x/y線性單元包含具有末端執行器的晶圓夾持器，該末端執行器在邊緣處夾持拋光的半導體晶圓而不會造成損壞。拋光操作結束後，經拋光的半導體晶圓被自主移動的機器人的操縱器從承載件中的凹進部接連地吸走，被轉移到x/y線性單元的晶圓夾持器，且隨後被分揀到具有集成的晶圓接收器的濕式傳送容器內。為此，具有末端執行器的晶圓夾持器具有非常窄的設計，較佳地，使得其裝配到具有不大於5毫米之寬度的狹槽內。濕式傳送容器的晶圓接收器具有多個狹槽，經拋光的半導體晶圓可被垂直定位地存放在每個狹槽內。在藉由自主移動的機器人的臂上的操縱器從承載件中的凹進部移出經拋光的半導體晶圓之後，x/y線性單元的晶圓夾持器利用其末端執行器從自主移動的機器人獲取經拋光的半導體晶圓。因為從這一刻起，對於拋光的半導體晶圓的責任係從自主移動的機器人除去，所以卸載過程的持續時間少於如果機器人持續具有責任的情況。
接下來，x/y線性單元藉由晶圓夾持器將經拋光的半導體晶圓傳送到充滿液體的濕式傳送容器上方，並將半導體晶圓從上方推入濕式傳送容器的晶圓接收器的閒置之狹槽內。在藉由末端執行器釋放經拋光的半導體晶圓並且晶圓夾持器後退之後，半導體晶圓係垂直地立在濕式傳送容器的晶圓接收器中且被濕式傳送容器中的液體包圍。濕式傳送容器之至少與液體接觸的表面較佳係由耐鹼性且耐含酸介質的化學抗性材料構成。
為了防止在經拋光的半導體晶圓的表面上發生化學反應或物理變化，在拋光操作之後，較佳在自主移動的機器人向另一個DSP拋光機裝載待拋光的半導體晶圓或者從另一個DSP拋光機上卸載經拋光的半導體晶圓之前，藉由自主移動的機器人從DSP拋光機卸載所有經拋光的半導體晶圓。
從承載件中的凹進部卸載經拋光的半導體晶圓係類似於裝載待拋光的半導體晶圓般地進行。經拋光的半導體晶圓係於經拋光的上側面上利用自主移動的機器人的臂上的操縱器而被吸住，並從凹進部提出。機器人的記憶體有用地含有關於承載件中載有半導體晶圓的凹進部的資訊，尤其是半導體晶圓的中心位置的資訊。
濕式傳送容器（較佳可自動地填充和排空液體）與包含於其中之經拋光的半導體晶圓係例如藉由帶、輥筒、或線性運輸件自動地轉移至AGV，且利用自動導航藉由AGV在空間中自主地和自由地移動到用於經拋光的半導體晶圓的清潔單元，在該清潔單元中，該濕式傳送容器被自動移交且較佳經由安裝在濕式傳送容器的端面上的適配器而連接。此AGV的操作並不需要附隨的機器人。較佳地，將同一AGV分配給多個DSP拋光機，以收集和提供濕式傳送容器；例如，將一個AGV用於多達十個DSP拋光機，更佳是將一個AGV用於由自主移動的機器人負責的DSP拋光機。
下面參考附圖進一步解釋本發明。
第1圖中所示的根據本發明的用於拋光半導體晶圓的設備1，其應作為實例來理解，其中包含三個DSP拋光機2，該拋光機2的下拋光板3以平面視圖繪示。位於下拋光板上的是承載件4，該承載件4具有用於半導體晶圓6的凹進部5。設置在左側的DSP拋光機係在工作中，且承載件4中的所有凹進部5都裝有待拋光的半導體晶圓6。未示出這個DSP拋光機之閉合的上拋光板以及另二個DSP拋光機之打開的上拋光板。中間DSP拋光機2係部分裝載有待拋光的半導體晶圓6，而設置在右側的DSP拋光機2處於未裝載狀態。
為了裝載和卸載，將單個自主移動的機器人7分配給DSP拋光機2。在第1圖的圖式中，自主移動的機器人7正忙於將待拋光的半導體晶圓6放置到中間DSP拋光機2的承載件4中的剩餘閒置之凹進部5內。為此，安裝在機器人的臂上的操縱器從垂直傳送系統13或從對中站20取出待拋光的半導體晶圓6。藉由OHT 8，將在盒中的、待拋光的半導體晶圓6輸送至垂直傳送系統13，該盒較佳是敞開構造的且包含垂直站立的待拋光的半導體晶圓。自主移動的機器人7將從垂直傳送系統13的晶圓升降器或從對中站20取出的半導體晶圓6輸送到中間DSP拋光機2，並將其放入該中間DSP拋光機2的承載件4中的其中一個閒置的凹進部5內。重複該過程，直到中間DSP拋光機2完全裝載有待拋光的半導體晶圓6。
分配給每個DSP拋光機2的是第1圖中未示出的x/y線性單元9。第2圖示出設置在右側的DSP拋光機2以及分配給它的x/y線性單元9。已經在該拋光機2上拋光的半導體晶圓6被自主移動的機器人7的操縱器從承載件4中的凹進部5提出、從x/y線性單元9取出並存放在濕式傳送容器10的晶圓接收器內。根據第2圖中的圖式，具有經拋光的半導體晶圓6的濕式傳送容器10已經從x/y線性單元9輸送到AGV 11上，並藉由AGV 11輸送到用於經拋光的半導體晶圓6的清潔單元12。同時，自主移動的機器人7正忙於將待拋光的半導體晶圓6放入中間DSP拋光機2的承載件4中的剩餘閒置之凹進部5內。
分配給每個DSP拋光機的是垂直傳送系統13，例如，第3圖中所示之較佳的垂直傳送系統13。該垂直傳送系統13包含盒接收器14，在盒接收器14上藉由OHT 8放下所輸送之敞開的盒，該盒具有待拋光的半導體晶圓。藉由滑架（carriage），可將盒接收器14從OHT之區域中的高度垂直地升起和下降到DSP拋光機的下拋光板之區域中的高度。垂直傳送系統13還包含具有限定位置的晶圓升降器15以及用於橫向支撐待拋光的半導體晶圓的引導件16。當所放下之在盒接收器14上的敞開的盒（未示出）被下降到終端位置時，容納於敞開的盒中的待拋光的半導體晶圓被晶圓升降器15從敞開的盒中提出，且此後，藉由晶圓升降器15的限定位置而以對中狀態位於晶圓升降器15的杆19的凹槽中，並由引導件16橫向支撐。引導件16同樣具有用於接收待拋光的半導體晶圓之邊緣的凹槽。在該對中狀態下，待拋光的半導體晶圓經由在一個側面的中心被吸住而被自主移動的機器人的操縱器接連地取出。晶圓升降器15較佳裝備有至少一個測量單元，該測量單元確定所輸送的半導體晶圓的數量，驗證該數量的合理性，並將該資訊作為控制信號發送給自主移動的機器人。垂直傳送系統13還具有用於垂直移動的獨立作用的控制部，該控制部確保無級可調的移動輪廓，特別是速度。垂直傳送系統的結構設計還使得隨後能將垂直傳送系統13安裝到DSP拋光機上，而無需進行DSP拋光機的大量修改。
作為對此的替代，盒接收器可配置成能夠接收FOUP，且晶圓升降器可額外具有FOUP開啟器。
還為每個DSP拋光機分配了x/y線性單元，例如，第4圖中所示的x/y線性單元9。x/y線性單元9包含具有末端執行器18的晶圓夾持器17，該末端執行器18用於從自驅動的（self-driving）機器人的操縱器取出經拋光的半導體晶圓。末端執行器18在其邊緣處固持半導體晶圓。
以上例示性實施例的描述應被理解為是例示性的。因此，做出的揭露首先使得技術人員能夠理解本發明和相關的優點，其次，在技術人員的理解範圍內，還包括對所描述之結構和方法的明顯變更和修改。因此，所有此類變更和修改以及等同方案都將涵蓋於申請專利範圍的保護範圍內。
1:用於拋光半導體晶圓的設備 2:DSP拋光機 3:下拋光板 4:承載件 5:凹進部 6:半導體晶圓 7:自主移動的機器人 8:OHT 9:x/y線性單位 10:濕式傳送容器 11:AGV 12:清潔單元 13:垂直傳送系統 14:盒接收器 15:晶圓升降器 16:引導件 17:晶圓夾持器 18:末端執行器 19:杆 20:對中站
第1圖示出本發明的一方案。 第2圖示出本發明的另一方案。 第3圖示出根據本發明的設備的垂直傳送系統。 第4圖示出根據本發明的設備的x/y線性單元。
1:用於拋光半導體晶圓的設備
2:DSP拋光機
3:下拋光板
4:承載件
5:凹進部
6:半導體晶圓
7:自主移動的機器人
8:OHT
13:垂直傳送系統
20:對中站

Claims (6)

  1. 一種用於拋光半導體晶圓的設備，包含：至少二個拋光機，用於半導體晶圓的同時雙面拋光；一或多個承載件，其位於拋光機之相應的下拋光板的拋光墊上，且具有用於接收半導體晶圓的凹進部；高架安裝的傳送系統(overhead-mounted transport system)，用於傳輸含有待拋光的半導體晶圓的盒(cassette)；分配給各該拋光機的垂直傳送系統，用於從高架安裝的傳送系統取出所傳輸的盒，且垂直傳送系統包含集成的晶圓升降器，用於將待拋光的半導體晶圓從盒中提出；自主移動到該至少二個拋光機並具有操縱器的自主移動的機器人，操縱器用於從晶圓升降器中取出待拋光的半導體晶圓，用於將待拋光的半導體晶圓插入其中一個凹進部，以及用於在拋光操作結束時，將經拋光的半導體晶圓從凹進部中提出；分配給各該拋光機的x/y線性單元，x/y線性單元具有晶圓夾持器，晶圓夾持器用於從自主移動的機器人的操縱器中取出經拋光的半導體晶圓，並將經拋光的半導體晶圓存放到具有集成的晶圓接收器的濕式傳送容器內；以及無人駕駛傳送工具，用於將濕式傳送容器輸送到用於經拋光的半導體晶圓的清潔單元。
  2. 如請求項1所述的設備，其中該盒是敞開的。
  3. 如請求項1或2所述的設備，其具有3至10個拋光機。
  4. 如請求項1或2所述的設備，其中晶圓夾持器具有末端執行器， 末端執行器在晶圓邊緣處固持半導體晶圓且浸入在濕式傳送容器的晶圓接收器的狹槽之間。
  5. 一種用於拋光半導體晶圓的方法，包含：提供至少二個拋光機，用於對半導體晶圓同時雙面拋光；藉由高架安裝的傳送系統將待拋光的半導體晶圓傳輸到盒中；藉由垂直傳送系統的晶圓升降器將待拋光的半導體晶圓從該盒中提出；藉由自主移動的機器人的操縱器從垂直傳送系統的晶圓升降器或從對中站取出其中一個待拋光的半導體晶圓；藉由自主移動的機器人的操縱器將待拋光的半導體晶圓插入該至少二個拋光機的承載件的凹進部內；藉由自主移動的機器人的操縱器從承載件的其中一個凹進部移出經拋光的半導體晶圓；藉由x/y線性單元的晶圓夾持器從自主移動的機器人的操縱器取出經拋光的半導體晶圓；藉由晶圓夾持器將經拋光的半導體晶圓存放到濕式傳送容器的晶圓接收器內；將濕式傳送容器從x/y線性單元轉移到無人駕駛傳送工具上；以及藉由無人駕駛傳送工具將濕式傳送容器傳送到用於經拋光的半導體晶圓的清潔單元。
  6. 如請求項5所述的方法，包含將部分在拋光機之至少一者上的半導 體晶圓拋光，同時自主移動的機器人取出其他部分的半導體晶圓中的一者，將其插入其中一個凹進部或從其中一個凹進部移出。
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