CN112207698A - 用于抛光半导体晶圆的设备和方法 - Google Patents

用于抛光半导体晶圆的设备和方法 Download PDF

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CN112207698A
CN112207698A CN202010537259.5A CN202010537259A CN112207698A CN 112207698 A CN112207698 A CN 112207698A CN 202010537259 A CN202010537259 A CN 202010537259A CN 112207698 A CN112207698 A CN 112207698A
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wafer
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J·弗兰克
L·兰普雷希特
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Silicon Electronics Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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Abstract

用于抛光半导体晶圆的设备和方法。设备包括至少两个抛光机，用于晶圆的同时双面抛光；承载件，其位于抛光机下抛光板的抛光垫上并且有接收晶圆的凹进部；高架传送系统，传输包含待抛光的晶圆的盒；分配给每个抛光机的竖直传送系统，其从高架传送系统取出盒，并且竖直传送系统包括晶圆升降器，将待抛光的晶圆从盒提出；自主移动到抛光机并有操纵器的机器人，操纵器从升降器取出晶圆，将晶圆插入凹进部，并且在抛光操作结束时将已抛光的晶圆从凹进部提出；分配给每个抛光机的x/y线性单元有晶圆夹持器，夹持器从机器人的操纵器中取出晶圆，并将晶圆放到有接收器的湿式传送容器内；和无人驾驶传送工具，将传送容器输送到已抛光的晶圆的清洁单元。

Description

用于抛光半导体晶圆的设备和方法
技术领域
本发明的主题是用于抛光半导体晶圆的设备，该设备包括用于半导体晶圆的同时双面抛光的至少两个抛光机，并且该设备具有高度自动化的特征。此外，本发明还涉及一种用于抛光半导体晶圆的方法，其中使用该设备来执行该方法。
背景技术
用于半导体晶圆的同时双面抛光的抛光机，在本说明书中也称为DSP抛光机，包括上、下抛光板，每个抛光板衬有抛光垫。当半导体晶圆位于承载件的凹进部中时，在存在抛光浆料的情况下在抛光板之间抛光半导体晶圆。
已经提出了使待抛光的半导体晶圆插入承载件的凹进部内以及从承载件中的凹进部移除已抛光的半导体晶圆自动化。在这方面例如可以提及EP 0 931 623 A1、DE 10007 389 A1和DE 102 28 441 A1、JP 2005-243 996 A、JP 2005-294378 A、US 6 361 418B1和US 2017 0 323 814 A1。
尽管有这些建议，但仍然需要改进，特别是对于那些效果包括降低成本和节省时间的改进。
发明内容
该目的通过一种用于抛光半导体晶圆的设备来实现，该设备包括：
至少两个抛光机，用于半导体晶圆的同时双面抛光；
一个或多个承载件，其位于抛光机的相应的下抛光板的抛光垫上并且具有用于接收半导体晶圆的凹进部；
高架安装的传送系统，用于传输包含待抛光的半导体晶圆的盒；
分配给抛光机中的每个的竖直传送系统，该竖直传送系统用于从高架安装的传送系统取出传输的盒，并且该竖直传送系统包括集成的晶圆升降器，用于将待抛光的半导体晶圆从该盒中提出；
自主移动到至少两个抛光机并具有操纵器的机器人，该操纵器用于从晶圆升降器中取出待抛光的半导体晶圆，将待抛光的半导体晶圆插入凹进部中的一个，并且在抛光操作结束时，用于将已抛光的半导体晶圆从凹进部中提出；
分配给抛光机中的每个的x/y线性单元，该x/y线性单元具有晶圆夹持器，该晶圆夹持器用于从该自主移动机器人的操纵器中取出已抛光的半导体晶圆，并将已抛光的半导体晶圆存放到具有集成晶圆接收器的湿式传送容器内；和
无人驾驶传送工具，用于将湿式传送容器输送到用于已抛光的半导体晶圆的清洁单元。
本发明的另一个主题是一种用于抛光半导体晶圆的方法，包括：
提供至少两个抛光机，用于对半导体晶圆同时双面抛光；
借助于高架安装的传送系统将待抛光的半导体晶圆输送到盒中；
借助于竖直传送系统的晶圆升降器将对中的待抛光的半导体晶圆提出盒；
通过自主移动机器人的操纵器从高架安装的传送系统的晶圆升降器或对中站取出待抛光的半导体晶圆中的一个；
通过自主移动机器人的操纵器将待抛光的半导体晶圆插入至少两个抛光机的承载件的凹进部内；
借助于自主移动机器人的操纵器从承载件的凹进部中的一个移除已抛光的半导体晶圆；
通过x/y线性单元的晶圆夹持器从自主移动机器人的操纵器取出已抛光的半导体晶圆；
通过晶圆夹持器将已抛光的半导体晶圆存放到湿式传送容器的晶圆接收器内；
将湿式传送容器从x/y线性单元转移到无人驾驶传送工具上；和
借助于无人驾驶传送工具将湿式传送容器传送到用于已抛光的半导体晶圆的清洁单元。
本发明允许从待抛光的半导体晶圆的输送直到抛光之后的半导体晶圆至清洁单元的传送的操作的完全自动、节省空间和节省成本的设计。半导体晶圆优选是单晶硅半导体晶圆，更优选地，具有至少200mm的直径的那些。
本发明所提供的包括使用于半导体晶圆的同时双面抛光的至少两个抛光机由自主移动的机器人装载半导体晶圆和卸载。优选地，根据抛光操作的持续时间来优化分配给自主移动机器人的DSP抛光机的数量。优选地提供至少3至10个，更优选地至少3至6个，由同一自主移动机器人致动的DSP抛光机。该解决方案节省了如果为每个抛光机配备单独的机器人会产生的成本。相应地，空间需求也较小。自主移动的机器人从竖直传送系统的晶圆升降器(晶圆提出)或从对中站取出待抛光的半导体晶圆。每个DSP抛光机都分配有一个这样的竖直传送系统。待抛光的半导体晶圆被堆叠在盒中，高架传送系统(高架提升传送，OHT)将其输送到DSP抛光机以装载该DSP抛光机。所使用的盒可以是敞开的或关闭的，例如被称为FOUP的盒。如果待抛光的半导体晶圆被竖直立着地堆叠在其中，则敞开的盒是没有前门的盒，是优选的。由于其构造，一旦该敞开的盒已被OHT放下在竖直传送系统的盒接收器上并且已被竖直传送系统放下到晶圆升降器直到终端位置，这种敞开的盒能直接接触半导体晶圆。在终端位置，待抛光的半导体晶圆立于晶圆升降器的晶圆接收器的凹槽中，并由竖直传送系统的引导件的凹槽横向地支撑。通过该布置，竖直传送系统具有固有的对中功能，这意味着待抛光的半导体晶圆以对中状态直立位于晶圆升降机上。这样做的意义在于，已经可以将待抛光的半导体晶圆转移到自主移动的机器人上，从而自主移动的机器人的操纵器能够在其自身不预先确定晶圆中心的情况下或者没有任何需要对中站的情况下在中心吸到半导体晶圆，在该对中站中待抛光的半导体晶圆在被转移到自主移动的机器人之前必须被居中。不需要独立的对中站同样是节省成本和节省空间的，并加快了装载过程，因为不需要自主移动机器人的操纵器以多个步骤(首先从盒，然后进入对中站并且随后进入承载件的凹进部内)来传送半导体晶圆。
尽管如此，无意排除提供对中站，例如对中环，待抛光的半导体晶圆被竖直传送系统的晶圆升降器存放在对中站内。提供这种站特别有用，特别是当待抛光的半导体晶圆在FOUP中被从高架安装的传送系统水平地输送时。在那种情况下，在被自主移动的机器人的操纵器以对中状态接收之前，待抛光的半导体晶圆之一通过竖直传送系统的晶圆升降器被从FOUP移除，并且被首先存放在对中站中。
自主移动的机器人被设计为无人驾驶传送工具(自动引导传送工具，AGV)或被安装在AGV上并控制AGV的运动。自主移动的机器人优选地在轮上行进。它包括臂，具有连接到所述臂的端部的用于半导体晶圆的操纵器，并且还包括光学识别系统，优选地是摄像机。该摄像机被用于识别抛光机的承载件上的标记，优选地识别承载件的表面上的标记。基于标记的放置，机器人计算凹进部的中心的位置。为此没有提供其他摄像机。操纵器优选地包括用于在半导体晶圆的两个侧面之一上抽吸半导体晶圆的装置。该操纵器从竖直传送系统的晶圆升降器或从对中站获取处于对中状态的待抛光的半导体晶圆。
自主移动的机器人然后开始装载处于待装载状态的DSP抛光机。借助摄像机，自主移动的机器人确定待装载的DSP抛光机的承载件中的空闲凹进部的中心的位置，并将待抛光的半导体晶圆放入空闲凹进部内。从通过竖直传送系统的晶圆升降器将待抛光的半导体晶圆提起直到通过自主移动的操纵器将待抛光的半导体晶圆插入DSP抛光机的承载件中的空闲凹进部内的过程被重复，直到DSP抛光机装载了预期数量的待抛光的半导体晶圆。该过程通常在结束时，存在于抛光机的承载件中的用于接收半导体晶圆的凹进部中已经装满待抛光的半导体晶圆。装载结束后，通过来自自主移动机器人的信号开始抛光，使上抛光板相对于下抛光板下降并关闭。在这些半导体晶圆的抛光期间，自主移动的机器人向另一个抛光机装载待抛光的半导体晶圆，或者从另一个抛光机中卸载已抛光的半导体晶圆。
特别优选的是，对提供给在至少一个抛光机上的设备的半导体晶圆中的一些进行抛光，同时自主移动的机器人则从竖直传送系统的晶圆升降机或从对中站取出这些半导体晶圆中的另一些半导体晶圆之一，或将其插入凹进部之一或从凹进部之一移除。
对于卸载过程，每个抛光机都被分配了x/y线性单元，这允许在三个空间方向的至少两个方向上传送已抛光的半导体晶圆。x/y线性单元包括具有末端执行器的晶圆夹持器，该末端执行器在边缘处夹持已抛光的半导体晶圆而不会造成损坏。抛光操作结束后，已抛光的半导体晶圆被自主移动机器人的操纵器从承载件中的凹进部接连地吸走，被转移到x/y线性单元的晶圆夹持器，并且被随后分拣到具有集成晶圆接收器的湿式传送容器内。为此，具有末端执行器的晶圆夹持器具有非常窄的设计，优选地，使得其装配到具有不大于5mm的宽度的槽内。湿式传送容器的晶圆接收器具有多个狭槽，已抛光的半导体晶圆可以被竖直定位地存放在每个狭槽内。在通过自主移动机器人的臂上的操纵器从承载件中的凹进部移除已抛光的半导体晶圆之后，x/y线性单元的晶圆夹持器利用其末端执行器从自主移动机器人获取已抛光的半导体晶圆。因为从这一刻起，对于已抛光的半导体晶圆的责任被从自主移动的机器人取走，卸载过程的持续时间少于如果机器人继续具有责任的情况。
接下来，x/y线性单元借助于晶圆夹持器将已抛光的半导体晶圆传送到充满液体的湿式传送容器上方，并将半导体晶圆从上方推入湿式传送容器的晶圆接收器的空闲狭槽内。在通过末端执行器释放已抛光的半导体晶圆并且晶圆夹持器后退之后，半导体晶圆竖直地立在湿式传送容器的晶圆接收器中并被湿式传送容器中的液体包围。湿式传送容器的至少与液体接触的表面优选地由耐碱性和耐含酸的介质两者的化学抗性材料构成。
为了防止在已抛光的半导体晶圆的表面上发生化学反应或物理变化，在抛光操作之后，在自主移动的机器人向另一个DSP抛光机装载待抛光的半导体晶圆或者从另一个DSP抛光机上卸载已抛光的半导体晶圆之前，优选地，自主移动的机器人从DSP抛光机卸载所有已抛光的半导体晶圆。
从承载件中的凹进部卸载已抛光的半导体晶圆类似于装载待抛光的半导体晶圆。于已抛光的上侧面上，利用自主移动机器人的臂上的操纵器吸住已抛光的半导体晶圆，并将其从凹进部提出。机器人的存储器有用地包含关于载有半导体晶圆的承载件中的那些凹进部的信息，尤其是半导体晶圆的中心的位置的信息。
湿式传送容器(优选地可以自动地填充和排空液体)与其中包含已抛光的半导体晶圆例如借助于带、辊子或线性运输件被自动地转移至AGV，并且被利用自动导航的AGV在空间中自主地和自由地移动到用于已抛光的半导体晶圆的清洁单元，在该清洁单元中，该湿式传送容器被自动移交并且优选地经由安装在湿式传送容器的端面上的适配器被连接。该AGV的操作不需要随附的机器人。优选地，将同一AGV分配给多个DSP抛光机，以收集和提供湿式传送容器；例如，一个AGV用于多达十个DSP抛光机，更优选地是一个AGV用于由该自主移动机器人负责的那些DSP抛光机。
下面参考附图进一步解释本发明。
附图说明
图1示出了本发明的一方面。
图2示出了本发明的另一方面。
图3示出了根据本发明的设备的竖直传送系统。
图4示出了根据本发明的设备的x/y线性单元。
附图标记列表
1 用于抛光半导体晶圆的设备
2 DSP抛光机
3 下抛光板
4 承载件
5 凹进部
6 半导体晶圆
7 自主移动机器人
8 OHT
9 x/y线性单位
10 湿式传送容器
11 AGV
12 清洁单元
13 竖直传送系统
14 盒接收器
15 晶圆升降器
16 引导件
17 晶圆夹持器
18 末端执行器
19 杆
20 对中站。
具体实施方式
作为实例来理解的、图1中所示的根据本发明的用于抛光半导体晶圆的设备1包括三个DSP抛光机2，该抛光机2的下抛光板3在平面视图中绘示。位于下抛光板上的是承载件4，该承载件4具有用于半导体晶圆6的凹进部5。设置在左侧的DSP抛光机在工作，并且承载件4中的所有凹进部5都装有待抛光的半导体晶圆6。未示出这个DSP抛光机的闭合的上抛光板和另两个DSP抛光机的打开的上抛光板。中间DSP抛光机2具有待抛光的半导体晶圆6的部分装载，而设置在右侧的DSP抛光机2处于未装载状态。
为了装载和卸载，将单个自主移动的机器人7分配给DSP抛光机2。在图1的图示中，自主移动的机器人7正忙于将待抛光的半导体晶圆6放置到中间DSP抛光机2的承载件4中的剩余空闲凹进部5内。为此，安装在机器人的臂上的操纵器从竖直传送系统13或从对中站20取待抛光的半导体晶圆6。通过OHT 8，将在盒中的、待抛光的半导体晶圆6输送至竖直传送系统13，该盒优选地是敞开构造的并且其包含竖直立着的待抛光的半导体晶圆。自主移动机器人7将从竖直传送系统13的晶圆升降器或从对中站20取出的半导体晶圆6输送到中间DSP抛光机2，并且将其放入该中间DSP抛光机2的承载件4中的空闲凹进部5中的一个内。重复该过程，直到中间DSP抛光机2完全装载待抛光的半导体晶圆6。
分配给每个DSP抛光机2的是图1中未示出的x/y线性单元9。图2示出了设置在右侧的DSP抛光机2以及分配给它的x/y线性单元9。已经在该抛光机2上被抛光的半导体晶圆6被自主移动机器人7的操纵器从承载件4中的凹进部5提出、从x/y线性单元9取出并存放在湿式传送容器10的晶圆接收器内。根据图2中的图示，具有已抛光的半导体晶圆6的湿式传送容器10已经被从x/y线性单元9输送到AGV 11上，并且通过AGV 11被输送到用于已抛光的半导体晶圆6的清洁单元12。同时，自主移动机器人7正忙于将待抛光的半导体晶圆6放入中间DSP抛光机2的承载件4中的剩余空闲凹进部5内。
分配给每个DSP抛光机的是竖直传送系统13-例如，图3中所示的优选的竖直传送系统13。该竖直传送系统13包括盒接收器14，在盒接收器14上由OHT 8放下输送的、敞开的盒，该盒具有待抛光的半导体晶圆。借助于滑架，可以将盒接收器14从OHT的区域中的高度竖直地升起和下降到DSP抛光机的下抛光板的区域中的高度。竖直传送系统13还包括具有限定位置的晶圆升降器15和用于横向支撑待抛光的半导体晶圆的引导件16。当放下在盒接收器14上的敞开的盒(未示出)被下降到终端位置时，容纳在敞开的盒中的待抛光的半导体晶圆被晶圆升降器15从敞开的盒中提出，并且此后，借助于晶圆升降器15的限定位置而处于晶圆升降器15的杆19的凹槽中的居中状态，并且被引导件16横向支撑。引导件16同样具有用于接收待抛光的半导体晶圆的边缘的凹槽。在该居中状态下，待抛光的半导体晶圆通过被吸住一个侧面的中央而被自主移动的机器人的操纵器接连地取出。晶圆升降器15优选地装备有至少一个测量单元，该测量单元确定所输送的半导体晶圆的数量，验证该数量的合理性，并将该信息作为控制信号发送给自主移动的机器人。竖直传送系统13还具有用于竖直移动的独立起作用的控制部，该控制部确保无级可调的移动轮廓，特别是速度。竖直传送系统的结构设计还使得能随后将竖直传送系统13安装到DSP抛光机上，而无需进行DSP抛光机的大量修改。
作为对此的替代，盒接收器可以被配置成能够接收FOUP，并且晶圆升降器可以另外具有FOUP开启器。
还为DSP抛光机中的每个分配了x/y线性单元-例如，图4中所示的x/y线性单元9。x/y线性单元9包括具有末端执行器18的晶圆夹持器17，该末端执行器18用于从自驱动机器人的操纵器取出已抛光的半导体晶圆。末端执行器18在其边缘处保持半导体晶圆。
示例性实施例的以上描述应被理解为是示例性的。因此，做出的公开首先使得技术人员能够理解本发明和相关的优点，其次，在技术人员的理解范围内，还包括对所描述的结构和方法的明显变更和修改。因此，所有这样的变更和修改以及等同方式都将被权利要求的保护范围所覆盖。

Claims (6)

1.用于抛光半导体晶圆的设备，包括：
至少两个抛光机，用于半导体晶圆的同时双面抛光；
一个或多个承载件，其位于该抛光机的相应的下抛光板的抛光垫上并且具有用于接收半导体晶圆的凹进部；
高架安装的传送系统，用于传输包含待抛光的半导体晶圆的盒；
分配给该抛光机中的每个的竖直传送系统，该竖直传送系统用于从该高架安装的传送系统取出传输的盒，并且该竖直传送系统包括集成的晶圆升降器，用于将待抛光的半导体晶圆从该盒中提出；
自主移动到该至少两个抛光机并具有操纵器的机器人，该操纵器用于从该晶圆升降器中取出该待抛光的半导体晶圆，将该待抛光的半导体晶圆插入该凹进部中的一个，并且在抛光操作结束时，用于将已抛光的半导体晶圆从该凹进部中提出；
分配给该抛光机中的每个的x/y线性单元，该x/y线性单元具有晶圆夹持器，该晶圆夹持器用于从该自主移动的机器人的该操纵器中取出该已抛光的半导体晶圆，并将该已抛光的半导体晶圆存放到具有集成的晶圆接收器的湿式传送容器内；和
无人驾驶传送工具，用于将该湿式传送容器输送到用于已抛光的半导体晶圆的清洁单元。
2.根据权利要求1所述的设备，其特征在于，该盒是敞开的。
3.根据权利要求1或权利要求2所述的设备，其特征在于，具有3至10个抛光机。
4.根据权利要求1至3中任一项所述的设备，其特征在于，该晶圆夹持器具有末端执行器，该末端执行器在晶圆边缘处保持该半导体晶圆并且下降在该湿式传送容器的该晶圆接收器的狭槽之间。
5.用于抛光半导体晶圆的方法，包括：
提供至少两个抛光机，用于对半导体晶圆同时双面抛光；
借助于高架安装的传送系统将待抛光的半导体晶圆输送到盒中；
借助于竖直传送系统的晶圆升降器将待抛光的半导体晶圆提出该盒；
通过自主移动的机器人的操纵器从该竖直传送系统的该晶圆升降器或从对中站取出该待抛光的半导体晶圆中的一个；
通过该自主移动的机器人的该操纵器将该待抛光的半导体晶圆插入该至少两个抛光机的承载件的凹进部内；
借助于该自主移动的机器人的该操纵器从该承载件的该凹进部中的一个移除已抛光的半导体晶圆；
通过x/y线性单元的晶圆夹持器从该自主移动的机器人的该操纵器取出该已抛光的半导体晶圆；
通过该晶圆夹持器将该已抛光的半导体晶圆存放到湿式传送容器的晶圆接收器内；
将该湿式传送容器从该x/y线性单元转移到无人驾驶传送工具上；和
借助于该无人驾驶传送工具将该湿式传送容器传送到用于已抛光的半导体晶圆的清洁单元。
6.根据权利要求5所述的方法，包括在该抛光机中的至少一个上抛光该半导体晶圆中的一些，同时该自主移动的机器人取出该半导体晶圆中的另一些半导体晶圆之一，将其插入该凹进部之一或从该凹进部之一移除。
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