KR101022959B1 - 기판처리장치 - Google Patents
기판처리장치 Download PDFInfo
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- KR101022959B1 KR101022959B1 KR1020080068941A KR20080068941A KR101022959B1 KR 101022959 B1 KR101022959 B1 KR 101022959B1 KR 1020080068941 A KR1020080068941 A KR 1020080068941A KR 20080068941 A KR20080068941 A KR 20080068941A KR 101022959 B1 KR101022959 B1 KR 101022959B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Liquid Crystal (AREA)
- Manufacturing Optical Record Carriers (AREA)
Abstract
Description
Claims (5)
- 복수매의 기판을 수납하는 수납기에 수납된 기판을 1매씩 처리하는 매엽식(枚葉式)의 기판처리장치로서,장치 외부와의 사이에서 상기 수납기를 주고 받기 위해서 상기 수납기를 재치(載置)하는 복수의 제1 재치부와,소정의 위치에 고정 설치되어, 상기 수납기로부터 기판을 꺼냄과 아울러, 상기 수납기에 기판을 격납하는 제1 기판이재(移載)수단과,상기 제1 기판이재수단의 연직(鉛直)방향을 따른 선회축을 중심으로 하는 원주 위에 배치된 복수의 제2 재치부와,상기 복수의 제1 재치부 중 어느 하나에 재치된 상기 수납기를, 상기 복수의 제2 재치부 중 어느 하나까지 반송하는 수납기반송수단과,기판을 1매씩 처리하는 복수의 기판처리유닛과,소정의 위치에 고정 설치되어, 상기 복수의 기판처리유닛 중 어느 하나에 기판을 건냄과 아울러, 상기 복수의 기판처리유닛 중 어느 하나로부터 처리가 끝난 기판을 받는 제2 기판이재수단,을 구비하며,상기 제1 기판이재수단은 수평방향을 따라 이동하지 않고, 상기 복수의 제2 재치부 중 어느 하나에 재치된 상기 수납기로부터 기판을 꺼내 소정의 기판주고받기위치에 적층배치된 복수의 기판재치부 중 어느 하나에 이재함과 아울러 상기 복수의 기판재치부 중 어느 하나로부터 받은 기판을 상기 수납기에 격납하고,상기 제2 기판이재수단은, 수평방향을 따라 이동하지 않고, 상기 복수의 기판재치부 중 어느 하나에 재치된 기판을 꺼내, 상기 복수의 기판처리유닛 중 어느 하나로 건냄과 아울러, 상기 복수의 기판처리유닛 중 어느 하나로부터 처리가 끝난 기판을 받아 상기 복수의 기판재치부 중 어느 하나에 이재하는 것을 특징으로 하는 기판처리장치.
- 제1항에 있어서,상기 복수의 제2 재치부의 각각과 상기 기판주고받기위치가 상기 제1 기판이재수단으로부터 보아, 서로 이루는 각도가 90도가 되도록 하는 배치로 되는 것을 특징으로 하는 기판처리장치.
- 제1항 또는 제2항에 있어서,상기 제2 재치부를 2개 구비하는 것을 특징으로 하는 기판처리장치.
- 제1항 또는 제2항에 있어서,,상기 복수의 제2 재치부의 각각에 재치된 상기 수납기에 대한 평균적인 액세스(acess) 높이와, 상기 기판주고받기위치에 적층배치된 복수의 기판재치부에 대한 평균적인 액세스 높이가 동일한 것을 특징으로 하는 기판처리장치.
- 제1항 또는 제2항에 있어서,상기 복수의 기판처리유닛이, 기판을 세정하는 세정처리부를 포함하는 것을 특징으로 하는 기판처리장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2007-00250855 | 2007-09-27 | ||
JP2007250855A JP4989398B2 (ja) | 2007-09-27 | 2007-09-27 | 基板処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20090032946A KR20090032946A (ko) | 2009-04-01 |
KR101022959B1 true KR101022959B1 (ko) | 2011-03-16 |
Family
ID=40508578
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080068941A KR101022959B1 (ko) | 2007-09-27 | 2008-07-16 | 기판처리장치 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20090087285A1 (ko) |
JP (1) | JP4989398B2 (ko) |
KR (1) | KR101022959B1 (ko) |
CN (1) | CN101399180B (ko) |
TW (1) | TWI462213B (ko) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5338335B2 (ja) * | 2008-08-13 | 2013-11-13 | 東京エレクトロン株式会社 | 搬送容器の開閉装置及びプローブ装置 |
WO2010041562A1 (ja) * | 2008-10-07 | 2010-04-15 | 川崎重工業株式会社 | 基板搬送ロボットおよびシステム |
CN102502253B (zh) * | 2011-11-18 | 2014-09-10 | 北京七星华创电子股份有限公司 | 晶圆状物件的输送系统 |
JP2013193060A (ja) * | 2012-03-22 | 2013-09-30 | Sharp Corp | 除塵装置および除塵方法 |
JP6145334B2 (ja) * | 2013-06-28 | 2017-06-07 | 株式会社荏原製作所 | 基板処理装置 |
EP3341831A1 (en) * | 2015-07-13 | 2018-07-04 | Brooks Automation, Inc. | On the fly automatic wafer centering method and apparatus |
KR102587203B1 (ko) | 2015-07-13 | 2023-10-10 | 브룩스 오토메이션 인코퍼레이티드 | 온 더 플라이 자동 웨이퍼 센터링 방법 및 장치 |
CN105575862B (zh) * | 2015-12-24 | 2018-06-12 | 北京中电科电子装备有限公司 | 一种foup装载门装置 |
JP6493339B2 (ja) * | 2016-08-26 | 2019-04-03 | 村田機械株式会社 | 搬送容器、及び収容物の移載方法 |
US11211266B2 (en) * | 2016-09-21 | 2021-12-28 | Texas Instruments Incorporated | Universal load port for ultraviolet radiation semiconductor wafer processing machine |
US10840121B2 (en) | 2016-10-31 | 2020-11-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and apparatus for unpacking semiconductor wafer container |
CN115020308B (zh) * | 2022-08-08 | 2022-11-22 | 上海果纳半导体技术有限公司武汉分公司 | 晶圆传输装置、设备平台系统及其晶圆传输方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0936198A (ja) * | 1995-07-19 | 1997-02-07 | Hitachi Ltd | 真空処理装置およびそれを用いた半導体製造ライン |
US20030091410A1 (en) * | 2001-11-13 | 2003-05-15 | Larson Robert E. | Reduced footprint tool for automated processing of microelectronic substrates |
KR100598917B1 (ko) * | 2005-08-19 | 2006-07-10 | 세메스 주식회사 | 매엽식 기판 세정 장치 및 방법 |
KR100833286B1 (ko) | 2006-12-29 | 2008-05-28 | 세크론 주식회사 | 웨이퍼 공급장치 및 이를 이용한 웨이퍼 공급방법 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100310249B1 (ko) * | 1995-08-05 | 2001-12-17 | 엔도 마코토 | 기판처리장치 |
JP3667527B2 (ja) * | 1998-05-20 | 2005-07-06 | 大日本スクリーン製造株式会社 | 基板処理装置 |
US6976822B2 (en) * | 2002-07-16 | 2005-12-20 | Semitool, Inc. | End-effectors and transfer devices for handling microelectronic workpieces |
JP2005093653A (ja) * | 2003-09-17 | 2005-04-07 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2005311169A (ja) * | 2004-04-23 | 2005-11-04 | Tokyo Electron Ltd | 基板搬送処理装置及び基板搬送処理方法 |
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2007
- 2007-09-27 JP JP2007250855A patent/JP4989398B2/ja active Active
-
2008
- 2008-07-09 TW TW097125936A patent/TWI462213B/zh active
- 2008-07-16 KR KR1020080068941A patent/KR101022959B1/ko active IP Right Grant
- 2008-08-15 CN CN2008102109357A patent/CN101399180B/zh active Active
- 2008-09-12 US US12/209,242 patent/US20090087285A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0936198A (ja) * | 1995-07-19 | 1997-02-07 | Hitachi Ltd | 真空処理装置およびそれを用いた半導体製造ライン |
US20030091410A1 (en) * | 2001-11-13 | 2003-05-15 | Larson Robert E. | Reduced footprint tool for automated processing of microelectronic substrates |
KR100598917B1 (ko) * | 2005-08-19 | 2006-07-10 | 세메스 주식회사 | 매엽식 기판 세정 장치 및 방법 |
KR100833286B1 (ko) | 2006-12-29 | 2008-05-28 | 세크론 주식회사 | 웨이퍼 공급장치 및 이를 이용한 웨이퍼 공급방법 |
Also Published As
Publication number | Publication date |
---|---|
CN101399180B (zh) | 2012-05-23 |
JP4989398B2 (ja) | 2012-08-01 |
KR20090032946A (ko) | 2009-04-01 |
TW200926335A (en) | 2009-06-16 |
TWI462213B (zh) | 2014-11-21 |
JP2009081362A (ja) | 2009-04-16 |
US20090087285A1 (en) | 2009-04-02 |
CN101399180A (zh) | 2009-04-01 |
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