TWI743321B - 離間裝置及離間方法 - Google Patents
離間裝置及離間方法 Download PDFInfo
- Publication number
- TWI743321B TWI743321B TW107106713A TW107106713A TWI743321B TW I743321 B TWI743321 B TW I743321B TW 107106713 A TW107106713 A TW 107106713A TW 107106713 A TW107106713 A TW 107106713A TW I743321 B TWI743321 B TW I743321B
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- 238000000926 separation method Methods 0.000 title claims abstract description 41
- 239000000853 adhesive Substances 0.000 claims abstract description 104
- 230000001070 adhesive effect Effects 0.000 claims abstract description 104
- 238000000034 method Methods 0.000 claims description 13
- 238000005259 measurement Methods 0.000 claims description 3
- 239000013256 coordination polymer Substances 0.000 abstract description 48
- 238000001514 detection method Methods 0.000 description 12
- 239000010410 layer Substances 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 235000012431 wafers Nutrition 0.000 description 7
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- -1 for example Substances 0.000 description 1
- 230000005291 magnetic effect Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017093948A JP6880433B2 (ja) | 2017-05-10 | 2017-05-10 | 離間装置および離間方法 |
JP2017-093948 | 2017-05-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201901854A TW201901854A (zh) | 2019-01-01 |
TWI743321B true TWI743321B (zh) | 2021-10-21 |
Family
ID=64326114
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107106713A TWI743321B (zh) | 2017-05-10 | 2018-03-01 | 離間裝置及離間方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6880433B2 (ja) |
KR (1) | KR102469388B1 (ja) |
CN (1) | CN108878282B (ja) |
TW (1) | TWI743321B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7483561B2 (ja) | 2020-08-26 | 2024-05-15 | 株式会社ディスコ | エキスパンド方法及びエキスパンド装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010119506A1 (ja) * | 2009-04-14 | 2010-10-21 | パイオニア株式会社 | 電子部品の分離装置及び方法 |
WO2014104189A1 (ja) * | 2012-12-26 | 2014-07-03 | 日立化成株式会社 | エキスパンド方法、半導体装置の製造方法、及び半導体装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4793981B2 (ja) * | 2005-10-04 | 2011-10-12 | リンテック株式会社 | エキスパンド装置の制御方法とその制御装置 |
JP2009094126A (ja) * | 2007-10-04 | 2009-04-30 | Furukawa Electric Co Ltd:The | チップのピックアップ方法 |
JP2015177060A (ja) * | 2014-03-14 | 2015-10-05 | 株式会社東芝 | 半導体製造装置および半導体装置の製造方法 |
JP2015204362A (ja) * | 2014-04-14 | 2015-11-16 | 株式会社ディスコ | チップ間隔維持方法 |
JP2016021513A (ja) * | 2014-07-15 | 2016-02-04 | 三菱電機株式会社 | 半導体ウエハエキスパンド装置及び方法 |
JP6386866B2 (ja) * | 2014-10-10 | 2018-09-05 | リンテック株式会社 | 離間装置および離間方法 |
JP6408366B2 (ja) * | 2014-12-05 | 2018-10-17 | リンテック株式会社 | 離間装置および離間方法 |
JP6401608B2 (ja) * | 2014-12-26 | 2018-10-10 | リンテック株式会社 | 離間装置および離間方法 |
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2017
- 2017-05-10 JP JP2017093948A patent/JP6880433B2/ja active Active
-
2018
- 2018-03-01 TW TW107106713A patent/TWI743321B/zh active
- 2018-03-22 CN CN201810238950.6A patent/CN108878282B/zh active Active
- 2018-03-23 KR KR1020180033702A patent/KR102469388B1/ko active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010119506A1 (ja) * | 2009-04-14 | 2010-10-21 | パイオニア株式会社 | 電子部品の分離装置及び方法 |
WO2014104189A1 (ja) * | 2012-12-26 | 2014-07-03 | 日立化成株式会社 | エキスパンド方法、半導体装置の製造方法、及び半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20180123962A (ko) | 2018-11-20 |
CN108878282A (zh) | 2018-11-23 |
KR102469388B1 (ko) | 2022-11-21 |
CN108878282B (zh) | 2023-08-11 |
JP6880433B2 (ja) | 2021-06-02 |
JP2018190885A (ja) | 2018-11-29 |
TW201901854A (zh) | 2019-01-01 |
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