TWI743321B - Separation device and separation method - Google Patents
Separation device and separation method Download PDFInfo
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- TWI743321B TWI743321B TW107106713A TW107106713A TWI743321B TW I743321 B TWI743321 B TW I743321B TW 107106713 A TW107106713 A TW 107106713A TW 107106713 A TW107106713 A TW 107106713A TW I743321 B TWI743321 B TW I743321B
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- 238000000926 separation method Methods 0.000 title claims abstract description 41
- 239000000853 adhesive Substances 0.000 claims abstract description 104
- 230000001070 adhesive effect Effects 0.000 claims abstract description 104
- 238000000034 method Methods 0.000 claims description 13
- 238000005259 measurement Methods 0.000 claims description 3
- 239000013256 coordination polymer Substances 0.000 abstract description 48
- 238000001514 detection method Methods 0.000 description 12
- 239000010410 layer Substances 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 235000012431 wafers Nutrition 0.000 description 7
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- -1 for example Substances 0.000 description 1
- 230000005291 magnetic effect Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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Abstract
本發明之課題係提供一種不會使黏接片斷裂、且可以擴大被黏貼在該黏接片的被黏接體的相互間隔之離間裝置及離間方法。 本發明之解決手段,係構成在一方之面(AS1)與另一方之面(AS2)之至少一方、保持被黏貼複數被黏接體(CP)或被分割而成複數的被黏接體(CP)之黏接片(AS)的端部之複數保持手段(20),與使保持黏接片(AS)的端部之保持手段(20)相對移動、對黏接片(AS)賦予張力使被黏接體(CP)的相互間隔擴大之離間手段(30);離間手段(30),係邊反覆進行依照在擴大被黏接體(CP)的相互間隔之擴張方向使保持手段(20)相對移動之第1移動、及在擴張方向的相反方向之反擴張方向使保持手段(20)相對移動之第2移動之往復移動,邊擴大被黏接體(CP)的相互間隔。The subject of the present invention is to provide a separation device and a separation method that does not break the adhesive sheet and can expand the mutual spacing of the adherends adhered to the adhesive sheet. The solution of the present invention is to constitute at least one of the one side (AS1) and the other side (AS2), maintain the adhered body (CP) or be divided into plural adhered bodies ( The plural holding means (20) of the end of the adhesive sheet (AS) of CP) move relative to the holding means (20) that holds the end of the adhesive sheet (AS) to apply tension to the adhesive sheet (AS) Separation means (30) to expand the mutual spacing of adhered bodies (CP); Separation means (30), which is repeatedly carried out by tying the edges, in accordance with the expanding direction of the expansion of the mutual spacing of adherends (CP) to maintain means (20) ) The first movement of the relative movement and the reciprocating movement of the second movement of the relative movement of the holding means (20) in the opposite direction of the expansion direction opposite to the expansion direction, while expanding the mutual spacing of the adherends (CP).
Description
本發明係有關離間裝置及離間方法。The present invention relates to a separation device and a separation method.
從前,已知將黏貼在黏接片的被黏接體的相互間隔擴大之離間裝置(例如,參照專利文獻1)。 [先前技術文獻] [專利文獻]Conventionally, there has been known a separation device that expands the mutual distance between the adherends to be adhered to the adhesive sheet (for example, refer to Patent Document 1). [Prior Technical Documents] [Patent Documents]
[專利文獻1] 日本特開2007-103649號公報[Patent Document 1] JP 2007-103649 A
[發明所欲解決之課題][The problem to be solved by the invention]
然而,在如專利文獻1記載之類的從前的離間裝置,由於對第1片13(黏接片)、僅在擴大晶片C(被黏接體)的相互間隔之方向施加力以擴張該被黏接體的相互間隔,而在對黏接片的一部分(例如,黏接片之與第1環狀框架12的邊界部、或黏接片之接觸到展開表(expand table)3的角部之部分等)或全部施加的應力增大時,有該黏接片斷裂、無法擴大被黏接體的相互間隔之不便情形。However, in the conventional separation device such as described in Patent Document 1, since the first sheet 13 (adhesive sheet) is applied only in the direction of expanding the distance between the chips C (adhesive body), the substrate is expanded. The mutual spacing of the adhesive bodies, and in a part of the adhesive sheet (for example, the boundary part of the adhesive sheet and the first ring frame 12, or the corner of the adhesive sheet contacting the expand table 3) When the applied stress increases, the adhesive sheet breaks and the distance between the adherends cannot be enlarged.
本發明之目的係提供一種不會使黏接片斷裂、且可以擴大被黏貼在該黏接片的被黏接體的相互間隔之離間裝置及離間方法。 [供解決課題之手段]The object of the present invention is to provide a separation device and a separation method that does not break the adhesive sheet and can expand the mutual separation of the adhered bodies adhered to the adhesive sheet. [Means for problem solving]
本發明係採用申請專利範圍所記載之構成。 [發明之效果]The present invention adopts the composition described in the scope of the patent application. [Effects of Invention]
根據本發明,藉由反覆進行往復移動,可以一面緩和對黏接片的一部分或全部施加的應力、一面擴大被黏接體的相互間隔,不會使黏接片斷裂、且可以擴大被黏貼在該黏接片的被黏接體的相互間隔。 此外,如具備應力測定手段,則可以形成對黏接片的一部分或全部施加之應力不會超過使黏接片斷裂之應力,確實地不會使黏接片斷裂,且可以擴大被黏貼在該黏接片的被黏接體的相互間隔。 再者,藉由離間手段從對黏接片施加的應力達指定的下限值起進行往擴張方向的相對移動,可以確實地緩和應力之後將被黏接體的相互間隔擴大。 此外,如具備檢知手段,則可以將被黏接體的相互間隔擴大直到所期望的間隔。According to the present invention, by repeatedly performing reciprocating movement, it is possible to relax the stress applied to a part or all of the adhesive sheet while expanding the distance between the adhered bodies, without breaking the adhesive sheet, and expanding the adhesive sheet. The distance between the adherends of the adhesive sheet. In addition, if a stress measuring means is provided, it can be formed that the stress applied to a part or all of the adhesive sheet will not exceed the stress that causes the adhesive sheet to break, and the adhesive sheet will not be broken surely, and the adhesive sheet can be expanded. The distance between the bonded bodies of the bonding sheet. Furthermore, by means of a separation method, the relative movement in the expansion direction from the stress applied to the adhesive sheet reaches the specified lower limit, so that the mutual distance between the adherends can be enlarged after the stress is reliably relieved. In addition, if the detection means is provided, the mutual interval of the adherends can be expanded to the desired interval.
以下,根據圖式說明本發明之實施形態。 又,本實施形態之X軸、Y軸、Z軸係具有每個都正交的關係,X軸及Y軸係設為指定平面內之軸,Z軸則設為正交於前述指定平面之軸。再者,於本實施形態,係以從與Y軸平行的箭頭BD方向來看之場合作為基準,未舉出基準的圖而顯示方向之場合,設定「上」為Z軸的箭頭方向而「下」為其逆方向,「左」為X軸的箭頭方向而「右」為其逆方向,「前」為Y軸的箭頭方向而「後」為其逆方向。Hereinafter, embodiments of the present invention will be described based on the drawings. In addition, the X-axis, Y-axis, and Z-axis systems of this embodiment have a relationship of being orthogonal to each other. The X-axis and Y-axis systems are set to be the axes in the designated plane, and the Z-axis is set to be perpendicular to the aforementioned designated plane. axis. In addition, in this embodiment, when viewed from the direction of the arrow BD parallel to the Y axis as a reference, when the direction is displayed without citing the reference diagram, set "up" as the arrow direction of the Z axis and " "Down" is the reverse direction, "Left" is the X-axis arrow direction and "Right" is the reverse direction, "Front" is the Y-axis arrow direction and "Back" is the reverse direction.
本發明之離間裝置10,係具備:在一方之面AS1保持被黏貼複數被黏接體CP之黏接片AS的端部之複數保持手段20,使保持黏接片AS的端部之保持手段20相對移動、對黏接片AS賦予張力使被黏接體CP的相互間隔擴大之離間手段30,可以檢知被黏接體CP的相互間隔或各被黏接體CP的全體的集合形狀等之攝影機或投影機等攝影手段、光學感測器或音波感測器等各種感測器等之檢知手段40,與可以測定施加到黏接片AS的應力之應力測定手段50。The separating
保持手段20,係具備被支撐在離間手段30之作為驅動機器之回動馬達21、與被支撐在其輸出軸21A之上保持構件22。The
離間手段30,係具備作為驅動機器之線性馬達31,與被支撐在其滑件31A、於上面側支撐回動馬達21之下保持構件32。The
應力測定手段50,係具備使用紅外線攝影機、X光、雷射、光纖等之應力測定器51。The stress measuring means 50 is provided with a stress measuring
說明上述之離間裝置10的動作。 首先,對於各構件於圖1,2(A)中實線所示的初期位置待機之離間裝置10,在該離間裝置10之使用者(以下,簡稱「使用者」)透過操作面板或個人電腦等未圖示的操作手段,將施加到黏接片AS而該黏接片AS都不會斷裂之應力的上限值、與施加到從上限值被解放的黏接片AS之應力的下限值加以輸入之後,輸入自動運轉開始之訊號。之後,在作業者、或者驅動機器或輸送帶等未圖示之搬送手段將被黏貼複數被黏接體CP的黏接片AS載置於下保持構件32上時,保持手段20則驅動各回動馬達21,如圖2(A)中二點虛線所示,以上保持構件22與下保持構件32保持黏接片AS的端部。The operation of the
其次,離間手段30驅動各線性馬達31,如圖2(B)所示,使保持手段20相互離間,對黏接片AS賦予張力並進行往擴大被黏接體CP的相互間隔之擴張方向之相對移動。此時,雖對黏接片AS邊賦予應力邊延伸,而當該應力超過指定值時會導致斷裂。於是,本實施形態之離間手段30,係構成邊反覆進行依照在擴大被黏接體CP的相互間隔之擴張方向使保持手段20相對移動之第1移動、及在擴張方向的相反方向之反擴張方向使保持手段20相對移動之第2移動之往復移動(以下,將該移動簡稱「往復移動」),邊擴大被黏接體CP的相互間隔。亦即,離間手段30,在第1移動中,當應力測定手段50檢知施加到黏接片AS的應力達到先前已輸入的上限值時,如圖2(C)所示進行第2移動。然後,離間手段30,在第2移動中,當應力測定手段50檢知施加到黏接片AS的應力達到先前已輸入的下限值時,如圖2(D)所示進行第1移動。之後,離間手段30,反覆進行往復移動,當檢知手段40檢知被黏接體CP的相互間隔或各被黏接體CP之全體的集合形狀等、成為指定的間隔或指定的全體的集合形狀時,則停止驅動各線性馬達31。Next, the separating means 30 drives each
又,在進行上述作法將被黏接體CP的相互間隔擴大時,各被黏接體CP,有因黏接片AS的變形等,而使相互間隔未擴大到指定的間隔之情形。於是,以檢知手段40之檢知結果為基礎,離間手段30驅動各線性馬達31,以各被黏接體CP的相互間隔成為指定間隔之方式,使各保持手段20個別地移動。又,此時,離間手段30也可以反覆進行往復移動。In addition, when the mutual distance between the adherends CP is expanded by the above-mentioned method, the mutual distance between the adherends CP may not be expanded to a predetermined distance due to deformation of the adhesive sheet AS or the like. Then, based on the detection result of the detection means 40, the separation means 30 drives each
然後,利用拾取裝置或搬送裝置等未圖示之被黏接體取出手段,將所有的被黏接體CP或者指定量的被黏接體CP從黏接片AS拆卸時,離間手段30驅動各線性馬達31,使各個滑件31A復歸到初期位置後,保持手段20驅動回動馬達21,使上保持構件22復歸到初期位置。其次,作業者、或者未圖示的搬送手段,將殘留在下保持構件32上的黏接片AS摘除,以下反覆進行上述同樣的動作。Then, when all the adhered objects CP or a specified amount of adhered objects CP are removed from the adhesive sheet AS by means of unillustrated adhered object removal means such as a pickup device or a conveying device, the separating means 30 drives each line After the
根據以上之類的離間裝置10,藉由反覆進行往復移動,可以一面緩和對黏接片AS的一部分或全部施加的應力、一面擴大被黏接體CP的相互間隔,不會使黏接片AS斷裂、且可以擴大被黏貼在該黏接片AS的被黏接體CP的相互間隔。According to the
本發明之手段及程序,只要可以實現針對該等手段及程序說明之動作、功能或程序則並未限定,更不以前述實施形態所示之單一實施形態的構成物或程序為任何限定。例如,保持手段,只要可以將在一方之面與另一方之面之至少一方被黏貼複數黏接體之黏接片的端部保持者,對照於申請案當初的技術常識、在其技術範圍內者則並未限定(其他的手段及程序亦同)。The methods and programs of the present invention are not limited as long as they can implement the actions, functions, or programs described for the methods and programs, and are not limited in any way by the structure or program of a single embodiment shown in the foregoing embodiments. For example, the holding means, as long as it can hold the end of the adhesive sheet to which the plural adhesive bodies are pasted on at least one of one side and the other side, compare it to the technical common sense at the beginning of the application and within its technical scope It is not limited (other methods and procedures are the same).
本發明之離間裝置,也可以如圖3(A)所示,作成具備:保持手段20,於黏接片AS之比起被黏貼複數的被黏接體CP的被黏接體黏接領域CE更加外側之、保持手段20保持的被保持領域HE的內側抵接在該黏接片AS之抵接手段60,使保持黏接片AS的端部之保持手段20及抵接手段60相對移動、使被黏接體CP的相互間隔擴大之離間手段30A,檢知手段40,與應力測定手段50之離間裝置10A。 又,在離間裝置10A,以與離間裝置10同等的構成具有同等的功能者,附上與該離間裝置10相同圖號並省略其構成說明、簡略化動作說明。The separating device of the present invention can also be made as shown in FIG. 3(A), which is equipped with: holding
離間手段30A,係具備被支撐在底板BP上之作為驅動機器之直動馬達33,與被支撐在其輸出軸33A、於上面側支撐回動馬達21之下保持構件34。 抵接手段60,係具備被支撐在底板BP上之圓筒狀的抵接構件61。The separating means 30A is provided with a
此類之離間裝置10A,與離間裝置10同樣作法,在將被黏貼複數被黏接體CP的黏接片AS載置於下保持構件34上時,保持手段20則驅動回動馬達21,如圖3(A)中二點虛線所示,以上保持構件22與下保持構件34保持黏接片AS的端部。又,在黏接片AS的端部,如圖3所示,黏貼環狀的框架RF,但沒有該框架RF亦可。其次,離間手段30A驅動直動馬達33,如圖3(B)所示,使保持手段20下降並使保持手段20及抵接手段60相對移動,對黏接片AS賦予張力並將被黏接體CP的相互間隔擴大。此時,離間手段30,也與離間裝置10同樣作法,反覆進行往復移動,當檢知手段40檢知被黏接體CP的相互間隔或各被黏接體CP之全體的集合形狀等、成為指定的間隔或指定的全體的集合形狀時,則停止驅動各直動馬達33。然後,在利用未圖示的被黏接體取出手段,將被黏接體CP從黏接片AS拆卸時,各手段驅動各自的驅動機器,使各構件復歸到初期位置後,將殘留在下保持構件34上的黏接片AS拆卸,以下反覆進行上述同樣的動作。This type of
即使利用此類之離間裝置10A,也能得到與離間裝置10同樣的效果。Even if such a separating
保持手段20,可以是在另一方之面AS2、或一方之面AS1及另一方之面AS2雙方之面保持被黏貼複數被黏接體CP之黏接片AS的端部之構成,抑或以機械式夾頭或夾持筒等抓持手段、庫侖力、接著劑、黏著劑、磁力、白努利(Bernoulli)吸附、驅動機器等保持黏接片AS的端部之構成。 保持手段20,離間裝置10之場合,例如,可以形成以往右方移動的該保持手段20作成1體、往左方移動的該保持手段20作成1體之2體之構成,例如,抑或以形成往右方、左方及其他方向移動的3體以上之構成。 保持手段20,離間裝置10A之場合,可以是1體或2體以上。The
離間手段30、30A並非複數而是單數亦可,該場合,例如,離間裝置10,係作成以1體的線性馬達的2個滑件,分別1體一體支撐保持手段20,將被黏接體CP的相互間隔擴大之構成,抑或將被黏接體CP的相互間隔僅於1軸方向(例如,X軸方向或Y軸方向等)擴大之構成。 離間手段30,可以是將相互間隔朝3軸以上的方向(例如,X軸方向、Y軸方向及其他軸方向)擴大之構成,例如,可以作成使朝X軸方向移動之複數保持手段20分別朝Y軸方向移動之構成(使朝Y軸方向移動之複數保持手段20分別朝X軸方向移動之構成),將被黏接體CP的相互間隔擴大,抑或無法動作使被黏接體CP的相互間隔成為指定間隔之構成,或者,無法動作使各被黏接體CP的全體的集合形狀、成為指定的間隔或指定的全體的集合形狀之構成。 離間手段30A,亦可藉由停止或移動保持手段20、且移動抵接手段60,而使保持手段20及抵接手段60相對移動,對黏接片AS賦予張力而將被黏接體CP的相互間隔擴大。 離間手段30、30A,例如,可以或先將第1移動的速度及第2移動的速度設為相同速度,調整第1移動及第2移動之時間(使用者透過未圖示的操作手段而輸入至離間裝置10、10A),或先將第1移動的時間及第2移動的時間設成相同時間,調整第1移動的速度及第2移動的速度(使用者透過未圖示的操作手段輸入至離間裝置10、10A),形成反覆進行往復移動使第1移動的距離比起第2移動的距離更大;第1移動及第2移動之距離、時間及速度可以是任何數值,使用者可以任意決定。 離間手段30、30A,亦可作業者操作按鈕或桿等,來驅動線性馬達31、直動馬達33,該場合,例如,亦可以或是構成將依照應力測定手段50的檢知結果顯示於監視器或檢出器等顯示器,當被顯示於該顯示器的檢知結果達到上限值時,作業者操作按鈕或桿等進行第2移動,當被顯示於同顯示器的檢知結果達到下限值時,則作業者操作按鈕或桿等進行第1移動;或是構成將依照檢知手段40之檢知結果顯示於顯示器,作業者則驅動線性馬達31、直動馬達33使顯示於該顯示器之檢知結果成為指定值。The separating means 30 and 30A may not be plural but singular. In this case, for example, the separating
檢知手段40,也可以是作業者的目視,例如,離間裝置10之場合,可以構成作業者利用目視,操作按鈕或桿等使被黏接體CP的相互間隔成為指定間隔,或者,使各被黏接體CP全體的集合形狀相對於基礎全體的集合形狀成為相似關係,而驅動線性馬達31,抑或本發明之離間裝置10、10A並不具備。The detection means 40 may also be the operator’s visual inspection. For example, in the case of the separating
應力測定手段50,可以是被內藏或設置在線性馬達31、直動馬達33之轉矩感測器,抑或設置在線性馬達31的滑件31A與下保持構件32之間的測力器或壓力感測器等、或設置在直動馬達33的輸出軸33A與下保持構件34之間的測力器或壓力感測器等,只要是可以測定施加到黏接片AS的應力者任何皆可,抑或本發明之離間裝置10、10A並不具備。The stress measuring means 50 can be a torque sensor built-in or installed in the
抵接手段60,除了角筒狀或橢圓筒狀等,亦可採用圓柱、角柱、橢圓柱等其他形狀之抵接構件61。The abutting means 60 can also be cylindrical, prismatic, elliptical, or other shapes of abutting
離間裝置10、10A,亦可在將被黏接體CP自黏接片AS拆卸之前段,進行該黏接片AS的黏接力降低之黏接力降低處理,該場合,例如,作為黏接片AS,採用在基材片之一方之面、層積利用作為指定的能量之紫外線、X光、紅外線等而使其黏接力降低之接著劑層,具備對此類之黏接片AS賦予紫外線、X光、紅外線等指定的能量之賦予能量手段即可。 施加到黏接片AS的應力之上限值或下限值為任何數值皆可,使用者可以任意決定。The separating
本發明之黏接片AS及被黏接體CP之材質、種類別、形狀等並未特別限定。例如,黏接片AS或被黏接體CP,可以是圓形、橢圓形、三角形或四角形等多角形,其他形狀亦可;黏接片AS也可以是感壓黏接性、感熱黏接性等黏接形態之物。再者,黏接片AS,例如,可以是只有接著劑層的單層者、在基材與接著劑層之間具有中間層者、在基材的上面具有蓋層等3層以上者,進而,可以將基材從接著劑層剝離之所謂雙面黏接片之類者亦可,這樣的雙面黏接片,可以是具有單層或複層的中間層者、或沒有中間層之單層或複層者。此外,作為被黏接體CP,例如,可以是食品、樹脂容器、矽半導體晶圓或化合物半導體晶圓等之半導體晶圓,半導體晶片、電路基板、光碟等資訊記錄基板、玻璃板、鋼板、陶器、木板或樹脂等單體物,抑或該等2個以上所形成之複合物,能以任意形態的構件或物品等作為對象。又,黏接片AS,也可以換成功能性的、用途性的讀法,例如,資訊記載用標籤、裝飾用標籤、保護片、切割膠帶、裸晶貼膜、晶粒黏著膠帶、記錄層形成樹脂片等任意片、薄膜、膠帶等。 被黏接體CP,可以是預先在黏接片AS上複數存在者,抑或在利用離間手段30、30A、其他機構或人手等賦予外力之時點而被分割成複數,在黏接片AS上複數存在之類的被分割而成為複數者。作為此類之被分割而成為複數之被黏接體CP,例如,對半導體晶圓或基板等照射雷射,先在該半導體晶圓或基板等形成線狀或格子狀等脆弱的脆弱層,或在對黏接片AS賦予張力、或在對半導體晶圓或基板等直接或間接地賦予外力之時點而個片化,成為複數被黏接體CP者,或例如,以切割刃切入樹脂或玻璃板等,先在該樹脂或玻璃板等形成沒有貫通於線狀或格子狀等的表背之切入或排孔等之切斷預定線,或在對黏接片AS賦予張力、或在對樹脂或玻璃板等直接或間接地賦予外力之時點加以個片化,形成複數被黏接體CP等,並無任何限定。The material, type, shape, etc. of the adhesive sheet AS and the adherend CP of the present invention are not particularly limited. For example, the adhesive sheet AS or the adhered body CP can be a polygonal shape such as a circle, an ellipse, a triangle or a quadrangle, and other shapes are also possible; the adhesive sheet AS can also be pressure-sensitive adhesive or heat-sensitive adhesive. And other bonding forms. In addition, the adhesive sheet AS may be, for example, a single layer having only an adhesive layer, an intermediate layer between the base material and the adhesive layer, and three or more layers such as a cap layer on the base material. , The so-called double-sided adhesive sheet that can peel the substrate from the adhesive layer can also be used. Such double-sided adhesive sheet may have a single-layer or multi-layer intermediate layer, or a single-sided adhesive sheet without an intermediate layer. Layered or multi-layered. In addition, as the adherend CP, for example, semiconductor wafers such as food, resin containers, silicon semiconductor wafers or compound semiconductor wafers, semiconductor wafers, circuit boards, optical discs and other information recording substrates, glass plates, steel plates, Monomers such as pottery, wooden boards, or resins, or composites formed by two or more of these, can be objects of any form of members or objects. In addition, the adhesive sheet AS can also be replaced with a functional and practical reading method, such as information recording labels, decorative labels, protective sheets, dicing tape, bare die film, die adhesive tape, recording layer formation Any sheets such as resin sheets, films, tapes, etc. The adhered body CP may be a plural number on the adhesive sheet AS in advance, or it may be divided into plural numbers when external force is applied by means of separation means 30, 30A, other mechanisms or human hands, etc., and plural on the adhesive sheet AS Existence and the like are divided and become plural. As this type of adherend CP that is divided into plurals, for example, a semiconductor wafer or substrate is irradiated with a laser, and a fragile layer such as a line or a grid is formed on the semiconductor wafer or substrate. Or when tension is applied to the adhesive sheet AS, or when an external force is applied directly or indirectly to a semiconductor wafer or substrate, etc., they are formed into multiple pieces of the adherend CP, or, for example, a cutting blade cuts into the resin or For glass plates, etc., firstly form a cut line that does not penetrate through the front and back of the linear or grid-shaped front and back of the resin or glass plate or the like, or apply tension to the adhesive sheet AS, or apply tension to the adhesive sheet AS. There are no limitations on the timing when external force is directly or indirectly applied to the resin or glass plate, etc., to be sliced to form a plurality of adherends CP and the like.
前述實施形態之驅動機器,可以採用回動馬達、直動馬達、線性馬達、單軸機器手臂、多關節機器手臂等之電動機器、空氣壓缸、油壓缸、無桿汽缸及回轉式汽缸等致動器等之外,也可以採用直接或間接地組合該等之驅動機器。The drive machine of the foregoing embodiment can use electric machines, pneumatic cylinders, hydraulic cylinders, rodless cylinders, rotary cylinders, etc., such as reversing motors, linear motors, linear motors, single-axis robotic arms, multi-joint robotic arms, etc. In addition to actuators, etc., a direct or indirect combination of these driving machines can also be used.
10、10A‧‧‧離間裝置20‧‧‧保持手段30、30A‧‧‧離間手段40‧‧‧檢知手段50‧‧‧應力測定手段60‧‧‧抵接手段AS‧‧‧黏接片AS1‧‧‧一方之面AS2‧‧‧另一方之面CE‧‧‧被黏接體黏接領域CP‧‧‧被黏接體HE‧‧‧被保持領域10、10A‧‧‧
圖1係關於本發明之實施形態之離間裝置之平面圖。 圖2(A)~(D)係關於本發明之實施形態之離間裝置之動作說明圖。 圖3(A)、(B)係本發明之其他例之說明圖。Fig. 1 is a plan view of a separating device related to an embodiment of the present invention. Figures 2 (A) to (D) are diagrams for explaining the operation of the separation device in the embodiment of the present invention. Figures 3 (A) and (B) are explanatory diagrams of other examples of the present invention.
10‧‧‧離間裝置 10‧‧‧Separation device
20‧‧‧保持手段 20‧‧‧Keep the means
21‧‧‧回動馬達 21‧‧‧Reversing motor
21A‧‧‧輸出軸 21A‧‧‧Output shaft
22‧‧‧上保持構件 22‧‧‧Upper holding member
30‧‧‧離間手段 30‧‧‧Means of separation
31‧‧‧線性馬達 31‧‧‧Linear Motor
31A‧‧‧滑件 31A‧‧‧Slide
32‧‧‧下保持構件 32‧‧‧Lower holding member
CP‧‧‧被黏接體 CP‧‧‧Bonded body
AS‧‧‧黏接片 AS‧‧‧Adhesive sheet
AS1‧‧‧一方之面 AS1‧‧‧One Side
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