TWI671570B - 具有微發光二極體前光之顯示器 - Google Patents
具有微發光二極體前光之顯示器 Download PDFInfo
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- TWI671570B TWI671570B TW105129078A TW105129078A TWI671570B TW I671570 B TWI671570 B TW I671570B TW 105129078 A TW105129078 A TW 105129078A TW 105129078 A TW105129078 A TW 105129078A TW I671570 B TWI671570 B TW I671570B
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- reflective display
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- reflective
- micro leds
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- 239000004020 conductor Substances 0.000 claims abstract description 54
- 239000000758 substrate Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 20
- 239000003086 colorant Substances 0.000 claims description 6
- 230000004044 response Effects 0.000 claims description 5
- 238000007639 printing Methods 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 81
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 238000005286 illumination Methods 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 239000011241 protective layer Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- HVYWMOMLDIMFJA-DPAQBDIFSA-N cholesterol Chemical compound C1C=C2C[C@@H](O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2 HVYWMOMLDIMFJA-DPAQBDIFSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- JAONJTDQXUSBGG-UHFFFAOYSA-N dialuminum;dizinc;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Al+3].[Al+3].[Zn+2].[Zn+2] JAONJTDQXUSBGG-UHFFFAOYSA-N 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 230000001939 inductive effect Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000010023 transfer printing Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 235000012000 cholesterol Nutrition 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- -1 elements Substances 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/13338—Input devices, e.g. touch panels
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/13306—Circuit arrangements or driving methods for the control of single liquid crystal cells
- G02F1/13318—Circuits comprising a photodetector
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133553—Reflecting elements
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133601—Illuminating devices for spatial active dimming
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133616—Front illuminating devices
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
- G02F2201/50—Protective arrangements
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2203/00—Function characteristic
- G02F2203/02—Function characteristic reflective
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/04—Structural and physical details of display devices
- G09G2300/0421—Structural details of the set of electrodes
- G09G2300/0426—Layout of electrodes and connections
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2354/00—Aspects of interface with display user
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Human Computer Interaction (AREA)
- Nonlinear Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
- Control Of El Displays (AREA)
- Control Of Indicators Other Than Cathode Ray Tubes (AREA)
Abstract
一種反射式顯示器,其包含在用於觀看電子顯示資訊之一顯示器觀看區域中或下方之一反射像素陣列。一層經定位於該顯示器觀看區域上或上方,透過該層觀看該顯示器觀看區域,且複數個微LED經定位於該顯示器觀看區域中該層上且經配置以發射光朝向該顯示器觀看區域。複數個導體經定位於該層上且該等導體經電連接至該等微LED。一控制器經連接至該等導體以控制該等微LED發射光而照明該顯示器觀看區域。
Description
本發明係關於用於反射式顯示器之前光照明且在某些實施例中係關於一種整合式觸控螢幕。
平板顯示器結合計算裝置、在可攜式裝置中且針對娛樂裝置(諸如電視機)廣泛使用。此等顯示器通常採用分佈於一顯示器基板上方之複數個像素來顯示影像、圖形或文字。已知光反射式及光發射式顯示器兩者。光發射式顯示器發射光且可用於一暗周圍環境中。相比而言,反射式顯示器通常無法在無入射環境光的情況下觀看。已知各種反射式顯示器,包含反射式液晶顯示器及電泳顯示器,且一般在低功率應用(諸如電子閱讀器)中找到。 在一些反射式顯示器中,一前光整合於反射式顯示器之邊緣周圍以照明顯示器使得其可在一原本暗環境中閱讀。舉例而言,美國專利第6,340,999號及第6,650,382號揭示一種在顯示器邊緣周圍具有擁有光源之一前光之LCD及一種用於將邊緣照明引導朝向顯示器之光導。美國專利申請公開案第2004/0080483號揭示一種在顯示器邊緣周圍具有亦擁有光源之一前光之觸控面板整合式反射型LCD及一種用於將邊緣照明引導朝向顯示器之光導。美國專利案第8,596,846號揭示一種具有使用雷射照明之一全像前光導之LCD。此等前光結構需要波導以在顯示器觀看表面上方提供均勻照明,從而增加裝置之成本及厚度,且不容易與觸控螢幕整合。再者,邊緣照明抑制一顯示器之一子集內之矩形區域之局部調光。 因此,仍需要減少顯示器中之層且容易與觸控螢幕整合之替代前光結構。
本發明包含一種反射式顯示器及一種用於(例如)在一暗環境中照明該反射式顯示器之一顯示區域之前光。該前光包含在該反射式顯示器與一觀看者之間的一層上或該層中之顯示區域中之複數個微發光二極體(微LED)。該等微LED電連接至該層中或該層上之導體,該等導體藉由一控制器驅動以控制微LED發射光且照明顯示區域。 在本發明之一進一步實施例中,一種觸控螢幕(諸如一電容式觸控螢幕)與前光整合使得額外層未併入至反射式顯示器中。在各種實施例中,該觸控螢幕獨立於前光或協同前光而操作。 先前技術前光通常具備圍繞一顯示區域之周邊定位之光發射器及將自邊緣光發射器發射之光均勻分佈於顯示區域上方之一光導板。光導板係昂貴的光學片,其等吸收一些光且增加非所要厚度及重量至裝置。相比而言,本發明提供反射式顯示器之一前光而無需一光導板或邊緣發射器且可與觸控螢幕整合使得較小(例如,小於20 µm)或無額外厚度或光吸收增加至反射式顯示器結構。此等優勢降低成本且改良系統之效能。 在一個態樣中,所揭示之技術包含一種反射式顯示器,其包含:一反射像素陣列,其在用於觀看電子顯示資訊之一反射式顯示器觀看區域中或下方;一層(例如,透明層),其經定位於該反射式顯示器觀看區域上或上方,該層包含:經定位於該反射式顯示器觀看區域之x-y邊界內該層中或該層上(例如,分佈於該反射式顯示器觀看區域上方)且經定向以發射光朝向該反射式顯示器觀看區域之複數個微LED及經定位於該層上或該層中且電連接至該等微LED之複數個導體;及一控制器,其經連接至該等導體以控制該等微LED發射光而照明該反射式顯示器觀看區域(例如,當環境光不足以觀看電子顯示資訊時)。 在某些實施例中,該層包含一顯示器蓋或基板。 在某些實施例中,該等微LED具有一發射面,且經定位於該層上或該層中,使得該等微LED之該發射面與該反射式顯示器觀看區域之表面之間存在一間隙。 在某些實施例中,該間隙係該層之一厚度。 在某些實施例中,該等微LED經定位於該層上。 在某些實施例中,該等微LED係無機微LED。 在某些實施例中,該顯示器包含該層與該反射式顯示器觀看區域之一表面之間的一間隙。 在某些實施例中,該顯示器包含將該層黏著至該反射式顯示器觀看區域之一表面之一光學透明黏著劑。 在某些實施例中,該等微LED之一或多者發射白光。 在某些實施例中,該複數個微LED包含發射紅光之紅色微LED、發射綠光之綠色微LED及發射藍光之藍色微LED。 在某些實施例中,該等紅色微LED經定位鄰近於綠色微LED、鄰近於藍色微LED或鄰近於綠色及藍色微LED兩者。 在某些實施例中,該複數個微LED經安置成包括紅色、綠色及藍色微LED之列,且鄰近列中之該等微LED在空間上偏移或鄰近列中之微LED之色彩在空間上偏移。 在某些實施例中,該複數個微LED經安置成各具有一個紅色、一個綠色及一個藍色微LED之群組且其中一群組內之該等微LED之間的距離小於該等微LED群組之間的距離。 在某些實施例中,該層具有鄰近於該反射式顯示器觀看區域之一第一側及與該第一側相對之一第二側,且該反射式顯示器包含具有形成在該第一側上、該第二側上或在該第一及該第二側兩者上之一電極圖案之一觸控感測器。 在某些實施例中,該控制器包括一控制電路,該控制電路提供電力至該等導體以自該等微LED發射光且單獨提供信號至該等電極以偵測該層或該反射式顯示器上或附近之觸碰。 在某些實施例中,該電極圖案包括與該等導體電分離之一電極陣列,其中該等導體及該等微LED安置於該等電極之間。 在某些實施例中,該第一側上之該電極圖案形成在一第一方向上延伸之一電分離第一電極陣列且該第二側上之該電極圖案形成在不同於該第一方向之一第二方向上延伸之一電分離第二電極陣列。 在某些實施例中,該控制器包括一控制電路,該控制電路在一第一時間段期間提供電力至該等導體以自該等微LED發射光且在不同於該第一時間段之一第二時間段期間提供信號至該等電極以偵測觸碰。 在某些實施例中,該等電極係該等導體。 在某些實施例中,該等電極形成於一平行電極陣列中且該等微LED連接至鄰近電極對。 在某些實施例中,該電極圖案形成在一第一方向上延伸之一電分離第一電極陣列及在不同於該第一方向之一第二方向上延伸之一電分離第二電極陣列,且各微LED連接至一第一電極及一第二電極。 在某些實施例中,該顯示器包含控制顯示於該反射式顯示器上之影像之一顯示控制器,其中該控制器包括一控制電路,該控制電路回應於顯示在該反射式顯示器上之該等影像而控制該等微LED以提供前光調光。 在某些實施例中,該控制器包括回應於環境照明控制該等微LED之一控制電路。 在某些實施例中,該顯示器包含塗佈於該等微LED及該層上方之一保護層。 在某些實施例中,各微LED具有小於500、250、100或50平方微米之一面積或一發光面積。 在某些實施例中,該等微LED在一個或兩個維度中隔開50微米或更大、100微米或更大、500微米或更大、1 mm或更大、2 mm或更大或5 mm或更大。 在某些實施例中,該顯示器包含分佈於該顯示器區域上方之一觸控控制器小晶片(chiplet)陣列,其等之各者電連接至一或多個電分離電極來偵測該一或多個電極上或鄰近於該一或多個電極(例如,在該反射式顯示器之一顯示螢幕上)之觸碰。 在某些實施例中,一導體穿過該觸控控制器小晶片。 在某些實施例中,該觸控控制器小晶片陣列包括10,000個或更多個觸控控制器小晶片、50,000個或更多個觸控控制器小晶片、100,000個或更多個觸控控制器小晶片、500,000個或更多個觸控控制器小晶片或1,000,000個或更多個觸控控制器小晶片。 在某些實施例中,觸控控制器小晶片經穿插於該等微LED之間。 在某些實施例中,觸控控制器小晶片經電連接至該等微LED。 在某些實施例中,該等微LED之各者具有從2 µm至5 µm、5 µm至10 µm、10 µm至20 µm或20 µm至50 µm之一寬度。 在某些實施例中,該等微LED之各者具有從2 µm至5 µm、自5 µm至10 µm、10 µm至20 µm或20 µm至50 µm之一長度。 在某些實施例中,該等微LED之各者具有從2 µm至5 µm、4 µm至10 µm、10 µm至20 µm或20 µm至50 µm之一高度。 在某些實施例中,該等微LED之該面積小於或等於該反射式顯示器觀看區域之四分之一、八分之一、十分之一、二十分之一、五十分之一、百分之一、五百分之一、千分之一、兩千分之一或萬分之一。 在某些實施例中,該層包括該控制器。 在某些實施例中,該控制器處在該層上或該層中。 在某些實施例中,該顯示器包含:一反射像素陣列,其在用於觀看電子顯示資訊之一反射式顯示器觀看區域中或下方;一層,其經定位於該反射式顯示器觀看區域上或上方之透明蓋上,該層包括:具有一第一側及一第二相對側之一透明蓋、定位於該反射式顯示器觀看區域之x-y邊界內該透明蓋中或該透明蓋上且經定向以發射光朝向該反射式顯示器觀看區域之複數個微LED及經定位於該透明蓋上或該透明蓋中且電連接至該等微LED之複數個導體,其中該反射像素陣列鄰近於該透明蓋之該第一側;及一控制器,其經連接至該等導體以控制該等微LED發射光而照明該反射式顯示器觀看區域。 在某些實施例中,該等微LED經定位於鄰近於該等反射像素之該第一側上。 在某些實施例中,該等微LED經定位於該第二側上。 在某些實施例中,該顯示器包含安置於該層上方之一保護層。 在另一態樣中,所揭示技術包含一種操作一反射式顯示器結構之方法,其包含:如本文描述般提供該反射式顯示器結構,其中該反射式顯示器包括與該等導體電分離之一電極陣列;藉由該控制器控制該等微LED發射光且控制該電極陣列偵測一觸碰。 在某些實施例中,該控制器在偵測到一觸碰的同時控制該等微LED發射光。 在某些實施例中,該控制器在一第一時間段期間控制該等微LED發射光且在不同於該第一時間段之一第二時間段期間使用該電極陣列偵測一觸碰。 本發明之實施例提供一種具有改良效能及減小之大小、重量及厚度之薄、單一基板、整合式前光及觸控螢幕系統。
優先權資訊
本申請案主張2015年9月9日申請且標題為「Display with Micro-LED Front Light」之美國專利申請案第14/849,242號之優先權,該案之全部內容以引用的方式併入本文中。 相關申請案之交叉參考 參考2015年6月29日申請之標題為「Small-Aperture-Ratio Display with Electrical Component」之共同讓與之美國專利申請案第14/754,573號、2015年7月9日申請之標題為「Active-Matrix Touchscreen」之共同讓與之美國專利申請案第14/795,831號、2015年8月10日申請之標題為「Compound Micro-Assembly Strategies and Devices」之共同讓與之美國專利申請案第14/822,868號及2015年6月18日申請且標題為「Micro Assembled LED Displays and Lighting Elements」之共同讓與之美國專利申請案第14/743,788號,該等案之全部內容以引用的方式併入本文中。 參考圖1之分解透視圖及圖2之示意圖,在本發明之一實施例中,一反射式顯示器10包含反射像素26之一陣列,其具有用於觀看電子顯示資訊之一顯示器觀看區域22。一層30經定位於顯示器觀看區域22上或上方,透過該層30觀看反射像素26之陣列。反射像素26之陣列可經形成於一顯示器基板20 (例如包含玻璃或塑膠)上。複數個微LED 40經定位於顯示器觀看區域22內層30上或層30中且經配置以發射光朝向顯示器觀看區域22。定位於顯示器觀看區域22內意謂複數個微LED 40係在反射式顯示器觀看區域22之x-y邊界內,其中x及y係平行於反射式顯示器觀看區域22之一表面且很大程度上正交於反射式顯示器10之一觀看方向之正交維度。微LED分佈於反射式顯示器觀看區域22上方,經定向以發射光朝向反射式顯示器觀看區域22,且可(例如以一陣列)規則地或不規則地配置於顯示器觀看區域22上方。複數個導體70 (圖2)經定位於層30上或層30中且(例如)透過微LED 40上之接觸墊42電連接至微LED 40。一控制器50 (例如)透過形成一匯流排62之導線60連接至導體70以(例如)在環境光不足以觀看電子顯示資訊時控制微LED 40發射光而照明顯示器觀看區域22。通常,微LED 40具有一發射面,光旨在透過該發射面發射。根據本發明,發射面經定向朝向顯示器觀看區域22。層30可包括控制器50或控制器50可在層30中或層30上。 根據本發明之各種實施例,本發明之反射式顯示器10可包含一反射式液晶顯示器、一半穿透半反射式液晶顯示器、一膽固醇式液晶顯示器、一電泳顯示器、一電子紙顯示器、一電子墨水顯示器、一電潤濕顯示器、一電致變色顯示器、一電流體顯示器、一雙穩態顯示器或一干涉調變器顯示器。如本文預期,一反射式顯示器10係在一些境況中至少部分依靠入射於顯示器觀看區域22上之環境照明來使一觀看者可觀看反射式顯示器10之顯示器觀看區域22中之顯示資訊之一顯示器。反射式顯示器10之顯示器觀看區域22係顯示一影像之至少部分之反射式顯示器10之任何部分。 一層30可係導體70可形成於其上或其中且微LED 40安置或形成於其上或其中之任何基板或塗層,例如玻璃或聚合物。層30可與顯示器觀看區域22或反射像素26分離且經層積或以其他方式黏著至顯示器觀看區域22之一表面。層30可包含一顯示器蓋或顯示器基板。 在一實施例中,微LED 40係無機發光二極體且導體70係透明金屬氧化物(諸如銦錫氧化物(ITO)或鋁鋅氧化物(AZO))之圖案化跡線。替代地,導體70由一微導線或微導線之一金屬網形成。微導線及微LED 40過小而無法輕易被一經設計觀看距離處之一觀看者觀察或解析,且經充分隔開使得金屬網或微LED 40層看似很大程度上透明,例如,大於80%、90%、95%或99%透明。藉由將LED稱為微LED 40,意謂微LED過小而無法被經設計觀看距離處之一觀看者觀察或解析。導體70可各僅包含一個微導電線或可包含複數個微導線(例如,以經電連接之菱形圖案形成之微導線)。 控制器50可係一積體電路且可透過(例如)配置成一匯流排62之導線60連接至微LED 40或反射像素26且可經定位於顯示器觀看區域22外部(圖1)。替代地,如在圖2中展示,控制器50可經定位於一顯示器基板或顯示器蓋上該顯示器觀看區域22外部。 在本發明之一實施例中,該等微LED 40之一或多者發射白光。在本發明之另一實施例中且如圖2中展示,複數個微LED 40包含發射紅光之紅色微LED 40R、發射綠光之綠色微LED 40G及發射藍光之藍色微LED 40B (統稱為微LED 40)。紅色微LED 40R、綠色微LED 40G及藍色微LED 40B可以各種方式之任一者配置(例如,如圖2中展示般配置成列),其中在一共同列中各紅色微LED 40R介於一綠色微LED 40G與一藍色微LED 40B之間(除在列邊緣處外)。如亦在圖2中展示,鄰近列中之微LED 40之不同色彩在空間上偏移,使得例如在一行中,一紅色微LED 40R在一藍色微LED 40B下面且在一綠色微LED 40G上面。在另一實施例(未展示)中,微LED 40之列在空間上偏移以形成一Z字形行。藉由在空間上偏移微LED 40或在一列或行中交替色彩,一觀看者更容易感知一白色且較不容易感知自微LED 40發射之個別色彩,從而改良觀看體驗及所顯示之彩色平面。 在一實施例中,足夠數量之微LED 40經配置於與顯示器觀看區域22相距一足夠距離處以在顯示器觀看區域上方提供一均勻照明(例如,一均勻白光照明)。在本發明之一替代實施例中,控制器50回應於(例如)藉由一顯示控制器(未展示)顯示在顯示器觀看區域22上之一影像而控制個別微LED 40、微LED 40之列或微LED 40之群組。在此實施例中,顯示控制器控制顯示於顯示器觀看區域22上之影像且組合地,控制器50中之一控制電路52控制微LED 40以僅在影像之區域(其中影像旨在反射光)中發射光且不在影像之黑色區域中發射光。因此,可使用本發明之前光提供局部列或行調光,藉此改良反射像素26之對比度。另外,當使用單獨的紅色、綠色及藍色微LED時,其等相對亮度可用於控制反射式顯示器之白點及色溫。 在典型投射式電容觸控板中,按(例如)一4 mm節距形成電極。來自微LED 40之光發射取決於微LED 40之光學結構且自發光微LED 40至照明表面(即,顯示器觀看區域22之一表面)之距離影響照明表面上之光均勻性。由於在一些實施例中需要一非常薄之反射式顯示器10及顯然來自前光之白光照明而在另一實施例中紅色、綠色及藍色微LED 40定位於一個紅色微LED 40R、一個綠色微LED 40G及一個藍色微LED 40B之群組中,故將各群組中之微LED 40定位成緊密接近且使群組分離大於各群組內之微LED 40之一距離。此配置使藉由各彩色微LED 40發射之不同色彩能夠提供一視覺上白光。 接著參考圖3至圖7,在一實施例中,層30包含具有一第一側及一第二相對側之一透明蓋且反射像素26鄰近於透明蓋之第一側使得第一側介於第二側與反射像素26之間。在一項實施例中,微LED 40處於透明蓋與反射像素26之間的第一側上。在另一實施例中,微LED 40處於第二側上使得透明蓋介於微LED 40與反射像素26之間。在此實施例中,一保護層38可安置於微LED 40上方以保護其等免受環境損害。 如在圖3至圖7中展示,微LED 40及層30在各種實施例中以各種對應方式配置。如在圖3中展示,反射式顯示器10之微LED 40定位於層30上層30與顯示器觀看區域之一表面之間且一空氣間隙可定位於微LED 40之發射面與顯示器觀看區域之一表面之間。微LED 40可具有小於50、20、10或5微米之一厚度。若空氣間隙(或一順應層)已在適當位置中,則在間隙比微LED 40厚之情況下將微LED 40定位於空氣間隙(或順應層)中不會增大裝置之厚度。替代地,若微LED 40定位於(例如)一顯示器蓋之內部上,則微LED 40之額外厚度可限於微LED 40之厚度。間隙可係層30之一厚度或層30厚度之一部分。此配置可避免捕獲藉由微LED 40發射之光98。替代地,微LED 40與顯示器觀看區域22之一表面接觸(圖4)且可包含形成於一層中之一光學透明黏著劑32來將微LED 40及層30黏著至顯示器觀看區域22之一表面以形成一更機械穩健固態結構(圖5)。較佳地,光學透明黏著劑與顯示器層或微LED或兩者指數匹配,以便放止對比度減小之反射。在此等組態中之微LED 40可係頂部發射型,即,其等在遠離基板(層30)之一方向上發射光,該等微LED 40附裝至該基板或其等建構於該基板上。如在圖6中展示,層30可介於微LED 40與反射式顯示器10之間。層30可如展示般與顯示器觀看區域22之一表面接觸或黏著至該表面,或可藉由一空隙間隙與顯示器觀看區域22之一表面分離(未展示)。層30可係或包含一顯示器蓋或顯示器基板。在一替代實施例中,顯示器觀看區域22之一表面係或形成層30 (圖7)且微LED 40直接安置於顯示器觀看區域之一表面上。如在圖6及圖7中展示,一保護層38可經塗佈於微LED 40上方。在此等組態中之微LED 40可係底部發射型,即,其等透過基板(層30)發射光,微LED 40附裝至該基板或其等建構於該基板上。 在所有此等實施例中,再次參考圖3,反射像素26之一層在一顯示控制器(未展示)之控制下形成一影像90。顯示控制器可係控制器50。當入射環境光92可用時,暗反射像素26吸收環境光94,且透明或彩色反射像素26從一反射器28 (諸如一金屬反射層)反射環境光96。當入射環境光92不可用時,微LED 40發射光98。反射像素26如其等對入射環境光92作出之回應般對發射光98作出回應,在反射像素26係暗的情況下吸收光98且在反射像素26係亮的情況下反射光98。在任一情況下,一觀看者99僅感知反射光(不論來自環境照明或從微LED 40發射)。較佳地,如展示,反射器28定位成非常靠近反射像素26以避免視差。 在本發明之實施例中,前光與一觸控螢幕整合而不添加額外光吸收層,使得反射式顯示器10包含一觸控感測器。如展示,例如在圖3中,層30具有鄰近於顯示器觀看區域22之一表面之一第一側34及與反射式顯示器12相對之一第二側36。在各種實施例中,電極之一圖案形成於第一側34上、第二側36上、或第一側34及第二側36兩者上。 參考圖8之示意圖,在本發明之反射式顯示器10之一實施例中,導體70及電極80經形成於顯示器觀看區域22上方之層30 (圖1)之一共同側上(例如,在朝向反射式顯示器10之一觀看者之一方向上)。共同側可係第一側34 (對應於圖3至圖5之任一者之橫截面)或第二側36 (對應於圖6)。如在圖8中展示,電極80經形成為與導體70電分離且絕緣之平行電極80之一陣列。在此實施例中,導體70及微LED 40經安置於電極80之間且可用來視覺上填入電極80之間的空間中,從而對顯示器觀看區域22提供一均勻外觀。電分離之微導線或金屬氧化物導體可經添加以用作一虛設電極82以對顯示器觀看區域22提供光學均勻性。微LED 40展示為並聯連接;在另一實施例中,微LED 40經串聯連接以減小跨顯示器觀看區域22之佈線寬度。 儘管在圖8中未展示,一電容式觸控螢幕可經形成具有在層30之相對側上且在不同於電極80延伸之方向之一方向上延伸之電極84之一電分離第二陣列。替代地,電極84之分離第二陣列處在與第一電極80相同之側上,(例如)使用跨接線86 (例如,其等可經微轉印印刷)以避免第一電極80及第二電極84之間的電短路,其中第一電極80及第二電極84交叉。在2015年6月18日申請且標題為「Micro Assembled LED Displays and Lighting Elements」之美國專利申請案第14/743,788號中揭示可在本文中使用之跨接線之實例。第一電極80及第二電極84之正交陣列可形成一投射式互電容觸控感測器。替代地,參考圖9,第一電極80及第二電極84之陣列可在與一共同層中形成交替菱形形狀,其中跨接線86在一個層中之該等菱形之間的電連接上方。在又一實施例中,電極80形成一自電容觸控螢幕。在此等實施例之任一者中,導體70及微LED 40經定位於電分離電極80之間。若一電極陣列經定位於層30之一觸碰側上,則一保護層或蓋可安置於該電極陣列上方以保護其等免受環境或觸碰用具(諸如手指)影響。 控制器50包含一控制電路52,控制電路52提供電力至導體70且至微LED 40以自LED 40發射光。控制電路52可單獨提供信號至電極80以偵測層30或顯示器觀看區域22之一表面上或附近之觸碰。藉由循序通電給電極80且感測第二電極(例如,圖9中之電極84)之各者之電容,可偵測觸碰。 在圖8及圖9之實施例中,導體70及微LED 40與電極80電分離。在一替代實施例中,導體70係電極80使得相同微導線或導電材料用來驅動微LED 40且形成一觸控螢幕。參考圖10,微LED 40經電連接至鄰近第一電極80 (其等亦係導體70)。如在圖10中展示,微LED 40之列可經組態於交替定向中(如使用箭頭指示),使得若每隔一個電極80保持接地及放置於剩餘電極80上之一電壓,則正向偏壓之微LED 40將經歷一電壓差,電流可流動通過微LED 40且微LED 40發射光。若微LED經反向偏壓,則電流不會流動。替代地,若電極80經循序通電以偵測觸碰,若微LED 40相對於經通電電極80而反向偏壓,則無電流流動通過微LED 40且可宛如微LED 40不存在般感測觸碰。替代地,若微LED 40相對於經通電電極80正向偏壓(如每隔一個電極80將發生),則電流可流動通過微LED 40 (取決於驅動信號)且可跨三個電極80 (經通電電極80及在經通電電極80之任一側上之相鄰電極80,其等藉由微LED 40連接至經通電電極80)感測觸碰。未通電電極80可係三態的且連接至一高阻抗以減小流動至相鄰電極80之電流。藉由比較任何觸碰與使用相鄰電極80偵測到之觸碰,可隔離經通電電極80之一觸碰信號。因此,圖10之結構可在一第一模式中且在一第一時間段中使用以藉由在交替電極80上提供一電壓偏壓而從微LED 40發射光且可在不同於第一時間段之一第二時間段在一第二模式中使用以藉由在電極80之一陣列之各電極80上循序提供一驅動信號且感測第二電極84上之電容而偵測觸碰。 參考圖11及圖12兩者,在本發明之一實施例中,電分離第一電極80之一陣列在一第一方向上延伸且電分離第二電極84之一陣列在不同於第一方向之一第二方向(例如,正交)上延伸。在第一電極80及第二電極84交叉的情況下,提供跨接線86以防止第一電極80與第二電極84之間的電短路(在圖11中未展示)。各微LED 40經連接至一第一電極80及一第二電極84。在一第一模式中且在一第一時間段期間,第一電極80及第二電極84經正向偏壓使得電流流動通過微LED 40,發射光,且微LED 40充當一前光。在一第二模式中且在不同於第一時間段之一第二時間段期間,第一電極80經循序驅動且第二電極84經感測以偵測一觸碰。選擇驅動信號使得微LED 40經反向偏壓,且無電流流動通過微LED 40且不發射光。替代地,微LED 40經正向偏壓且驅動信號亦引起微LED 40發射光。 根據本發明,使用觸控控制器小晶片44實現更高解析度或更大顯示器中之觸碰感測。 在本發明之一進一步實施例中,控制器50包含一控制電路52,控制電路52 (例如)使用一光感測器回應於環境照明而控制微LED 40,使得當存在較少環境照明或不存在環境照明時控制微LED 40發射光。自微LED 40發射之光可與環境照明成反比。 參考圖13,在本發明之另一實施例中,觸控控制器小晶片44之一陣列分佈於顯示器觀看區域22上方。各觸控控制器小晶片44經電連接至一或多個電分離之第一電極80及第二電極84以在(例如)反射式顯示器10之一顯示螢幕上偵測一或多個第一電極80及第二電極84上或鄰近於該一或多個第一電極80及第二電極84之觸碰。觸控控制器小晶片44透過導體70電連接至控制器50,該等導體70可與電連接至微LED 40之導體70電分離。導體70可包含多個微導線或電連接(諸如一匯流排)。其他電極配置在2015年7月9日申請且標題為「Active-Matrix Touchscreen」之共同讓與之美國專利申請案第14/795,831號中繪示且可用於實施本發明之一反射式顯示器10。在一實施例中,一導體70通過一微LED 40或觸控控制器小晶片44以促進對導體70或電極80佈線。觸控控制器小晶片44可係一小晶片,例如一小型未封裝積體電路(諸如一裸晶粒)。控制器50可單獨控制微LED 40及觸控控制器小晶片44。 參考圖14及圖15,本發明之反射式顯示器10之各種實施例可以不同方式操作。如在圖14中展示,在步驟100中提供一反射式顯示器10,其包含彼此電分離且與導體70電分離之電極(例如,第一電極80及第二電極84)之陣列。控制器50在步驟110中控制微LED 40發射光且同時在步驟120中亦控制第一電極80及第二電極84之陣列偵測一觸碰。使用圖8、圖9及圖13中繪示之配置來實施此一實施例。替代地,如在圖15中展示,在步驟200中提供一反射式顯示器10,其包含電連接至導體70之第一電極80及第二電極84之陣列。控制器50在步驟110中在一第一時間段期間控制微LED 40發射光且隨後在步驟120中在一第二不同時間段控制第一電極80及第二電極84之陣列偵測一觸碰。使用圖10、圖11及圖12中繪示之配置來實施此一實施例。 使用積體電路及印刷電路板方法、材料及程序來建構本發明。微LED 40及觸控控制器小晶片44可使用半導體材料、積體電路材料及程序以及微轉移材料及印刷程序製成。可用於第一電極80及第二電極84之導體70及微導線可使用運用金屬或金屬氧化物之光微影程序或使用包含導電墨水、壓印、印刷、電鍍或噴墨沈積之金屬網技術製成。控制器50可在一積體電路中製成且使用帶狀電纜、撓曲連接器及類似物連接至反射像素26或微LED 40,或控制器50可定位於一顯示器基板或蓋上。顯示器基板及蓋係可用的。微LED 40及觸控控制器小晶片44可使用印刷方法(諸如微轉印印刷)安置於層30上。 在本發明之各種實施例中,微LED 40使用積體電路程序形成於一半導體基板中。各微LED 40可具有小於500、250、100或50平方微米之一面積或一發光面積。該等微LED 40可在顯示器觀看區域22上方在一個或兩個維度中之每一維度中隔開50微米或更大、100微米或更大、500微米或更大、1 mm或更大、2 mm或更大或5 mm或更大。因為相較於顯示器觀看區域22,微LED 40具有一相對小之發射面積,故反射式顯示器10之填充因數可係非常低的,例如,顯示器觀看區域22上方之微LED 40之面積小於或等於顯示器觀看區域22其自身之四分之一、八分之一、十分之一、二十分之一、五十分之一、百分之一、五百分之一、千分之一、兩千分之一或萬分之一。顯示器可具有一小孔徑比,且在某些實施例中包含顯示器觀看區域22中之額外電子組件,如在2015年6月29日申請且標題為「Small-Aperture-Ratio Display with Electrical Component」之美國專利申請案第14/754,573號中所描述。 在某些實施例中,反射式顯示器10包含10,000個或更多個觸控控制器小晶片44、50,000個或更多個觸控控制器小晶片44、100,000個或更多個觸控控制器小晶片44、500,000個或更多個觸控控制器小晶片44或1,000,000個或更多個觸控控制器小晶片44。觸控控制器小晶片44可穿插於一列中之微LED 40之間或微LED 40之列之間,如在圖13中。在另一實施例(未展示)中,觸控控制器小晶片44經電連接至微LED 40 (例如)以提供電力、接地或控制信號。 微LED 40可具有各種不同大小或發射面積。舉例而言,微LED 40可具有從2 µm至5 µm、5 µm至10 µm、10 µm至20 µm或20 µm至50 µm之一寬度,從2 µm至5 µm、5 µm至10 µm、10 µm至20 µm或20 µm至50 µm之一長度或從2 µm至5 µm、4 µm至10 µm、10 µm至20 µm或20 µm至50 µm之一高度。 在一實施例中,觸控控制器小晶片44在一列方向或一行方向之任一者或兩者上(例如)至少連接至一個相鄰觸控控制器小晶片44。觸控控制器小晶片44可以一菊鍊、列及行、矩形子集連接或共同連接至一匯流排62 (如展示)。觸控控制器小晶片44可彼此通信或透過彼此通信且可與控制器50通信。在一實施例中,各觸控控制器小晶片44可獨立且同時偵測一觸碰且回應於所偵測觸碰將一觸碰信號傳輸至控制器50。儘管將一觸碰信號從一觸控控制器小晶片44傳輸至控制器50可包含將觸碰信號傳達至連接觸控控制器小晶片44之其他觸控控制器小晶片44或透過其他觸控控制器小晶片44傳達該信號,但此傳輸不暗示觸控控制器小晶片44並非獨立。觸控控制器小晶片44獨立操作,此係因為其等可獨立通電給第一電極80且從第二電極84接收感測器信號(或反之亦然)。 在本發明之各種實施例中,觸控控制器小晶片44控制一電容式觸控感測器、一光學觸控感測器、一聲學觸控感測器、一電感式觸控感測器、一壓電感測器或一電阻式觸控感測器。在一實施例中,觸控控制器小晶片44控制一電容式觸控感測器且包含一或多個電容器,其等之各者連接至觸控控制器小晶片44。在本發明之一項實施例中,觸控控制器小晶片44控制一自電容觸控感測器。在另一實施例中,觸控控制器小晶片44控制具有至少兩個電導體之一互電容觸控感測器,該等電導體如在圖13中展示般與第一電極80及第二電極84交錯,第一電極80及第二電極84兩者電連接至一共用觸控控制器小晶片44或連接至不同觸控控制器小晶片44,如展示。 本發明之元件可以多種方式建構。以一第一方式,微LED 40及觸控控制器小晶片44使用光微影方法形成於一源基板(例如一半導體基板)中或源基板上且接著使用微轉印印刷安置於一或多個基板(例如層30或顯示器觀看區域22之一表面)上。層30或顯示器觀看區域22之表面可係玻璃、塑膠或金屬。源晶圓可係具有遠高於形成於一玻璃、塑膠或金屬背板基板上之薄膜半導體層之一電路效能之一結晶半導體基板。觸控控制器小晶片44及微LED 40之任一者經形成於單獨半導體基板中,該等基板接著經個別定位且(例如)使用經光微影沈積及圖案化之金屬跡線互連於層30上。 層30可由聚合物、塑膠、樹脂、聚醯亞胺、PEN、PET、金屬、金屬箔、玻璃、半導體或藍寶石之一或多者構成或包含該一或多者。層30可具有大於或等於可見光之50%、80%、90%或95%之一透明度。層30可具有從5微米至10微米、10微米至50微米、50微米至100微米、100微米至200微米、200微米至500微米、500微米至0.5 mm、0.5 mm至1 mm、1 mm至5 mm、5 mm至10 mm或10 mm至20 mm之一厚度。 反射式顯示器10可使用微轉印技術形成。在2015年6月18日申請且標題為「Micro Assembled LED Displays and Lighting Elements」之美國專利申請案第14/743,788號中描述有助於理解及執行本發明之態樣之額外細節。在一額外實施例中,使用一多步驟轉印或組裝程序。藉由採用此一多步驟轉印或組裝程序,達成增大之良率且因此減小本發明之主動矩陣觸控螢幕5之成本。在2015年8月10日申請且標題為「Compound Micro-Assembly Strategies and Devices」之美國專利申請案第14/822,868號中提供複合微總成結構及方法之一論述。 在某些實施例中,觸控控制器小晶片44僅安置於層30上。因此,在一實施例中,觸控控制器小晶片44係在與微LED 40之一共同平面中或共同平面上且觸控螢幕不需要額外層。 在操作中,將外部電力及接地信號(未展示)提供至觸控控制器小晶片44之陣列。各觸控控制器小晶片44重複且獨立提供驅動信號至一對應第一電極80且據此回應而自第二電極84接收或偵測指示一觸碰或無觸碰之感測信號(或反之亦然)。感測信號經分析且接著與經儲存之感測信號比較以偵測指示一觸碰之改變(例如,表示電容或環境光之一電感測信號之改變)。若一實際意義改變傳達至控制器50。 熟習此項技術者應理解,術語「在……上方」、「在……之下」、「在……上面」、「在……下面」、「在……下方」及「在……上」係相對術語且可參考包含於本發明中之層、元件及基板之不同定向而互換。舉例而言,在一些實施例中,一第一層在一第二層上意謂一第一層直接在一第二層上且與第二層接觸。在其他實施例中,一第一層在一第二層上可包含其等之間的另一層。 已描述某些實施例,熟習此項技術者現將變得明白可使用併入本發明之概念之其他實施例。因此,本發明不應限於所描述實施例,而應僅限於隨附發明申請專利範圍之精神及範疇。 貫穿描述,在將設備及系統描述為具有、包含或包括特定組件的情況下或在將程序及方法描述為具有、包含或包括特定步驟的情況下,可預期,另外存在本質上由所敘述組件構成或由所敘述組件構成之所揭示技術之設備及系統,且存在本質上由所敘述處理步驟構成或由所敘述處理步驟構成之根據所揭示技術之程序及方法。 應理解,步驟之順序或用於執行特定動作之順序係無關緊要的,只要所揭示技術保持可操作即可。再者,在一些境況中,可同時進行兩個或兩個以上步驟或動作。已特定參考本發明之某些實施例詳細描述本發明,但將理解,可在本發明之精神及範疇內實現變動及修改。
10‧‧‧反射式顯示器
20‧‧‧顯示器基板
22‧‧‧顯示器觀看區域
26‧‧‧反射像素
28‧‧‧反射器
30‧‧‧層
32‧‧‧光學透明黏著劑
34‧‧‧第一側
36‧‧‧第二側
38‧‧‧保護層
40‧‧‧微發光二極體(LED)
40R‧‧‧紅色微發光二極體(LED)
40G‧‧‧綠色微發光二極體(LED)
40B‧‧‧藍色微發光二極體(LED)
42‧‧‧接觸墊
44‧‧‧觸控控制器小晶片
50‧‧‧控制器
52‧‧‧控制電路
60‧‧‧導線
62‧‧‧匯流排
70‧‧‧導體
80‧‧‧電極/第一電極
82‧‧‧虛設電極
84‧‧‧第二電極
86‧‧‧跨接線
90‧‧‧影像
92‧‧‧入射環境光
94‧‧‧經吸收環境光
96‧‧‧經反射環境光
98‧‧‧微發光二極體(LED)光
99‧‧‧觀看者
100‧‧‧提供反射式顯示器步驟
110‧‧‧控制微發光二極體(LED)發射光且控制電極偵測一觸碰步驟
120‧‧‧控制電極偵測一觸碰步驟
200‧‧‧提供反射式顯示器結構步驟
藉由結合隨附圖式參考以下描述將變得更明白且更好地理解本發明之前述及其他目標、態樣、特徵及優勢,其中: 圖1係本發明之一實施例之一分解透視圖; 圖2係本發明之一實施例之一示意圖; 圖3至圖7係本發明之各種實施例之橫截面; 圖8及圖9係包含與前光電分離之一觸控螢幕之本發明之實施例之示意圖; 圖10至圖12係包含電連接至前光之一觸控螢幕之本發明之其他實施例之示意圖; 圖13係包含與前光電分離之局部觸控螢幕感測器之本發明之實施例之一示意圖;及 圖14及圖15係繪示操作本發明之不同方法之流程圖。 當結合圖式時將從下文闡述之實施方式變得更明白本發明之特徵及優勢,其中相同元件符號貫穿全文識別對應元件。在圖式中,相同元件符號大體上指示相同、功能上類似及/或結構上類似之元件。該等圖未按比例繪製,此係由於圖中之各種元件之大小變動太大而不容許按比例描繪。
Claims (25)
- 一種反射式顯示器,其包括:一反射像素陣列,其在用於將被觀看之電子顯示資訊之一反射式顯示器觀看區域中或下方,其中該反射像素陣列中之各反射像素係可控制地吸收或反射光之一反射元件及該反射像素陣列係可操作以形成由一顯示控制器所控制之一影像;一層,其經定位於該反射式顯示器觀看區域上或上方,該層包括:複數個印刷無機微LED,其等經定位於該反射式顯示器觀看區域之x-y邊界內該層中或該層上,且經定向以發射光朝向該反射式顯示器觀看區域;及複數個導體,其等經定位於該層上或該層中且電連接至該複數個印刷無機微LED;及一控制器,其經連接至該複數個導體以控制該複數個印刷無機微LED發射光而照明該反射式顯示器觀看區域。
- 如請求項1之反射式顯示器,其中該層係一顯示器蓋或基板。
- 如請求項1之反射式顯示器,其中該複數個印刷無機微LED具有一發射面,且經定位於該層上或該層中使得該複數個印刷無機微LED之該發射面與該反射式顯示器觀看區域之表面之間存在一間隙。
- 如請求項1之反射式顯示器,其中該複數個印刷無機微LED之一或多者發射白光。
- 如請求項1之反射式顯示器,其中該複數個印刷無機微LED包括發射紅光之紅色微LED、發射綠光之綠色微LED及發射藍光之藍色微LED。
- 如請求項5之反射式顯示器,其中該等紅色微LED經定位鄰近於該等綠色微LED、鄰近於該等藍色微LED或鄰近於該等綠色及藍色微LED兩者。
- 如請求項5之反射式顯示器,其中該複數個印刷無機微LED經安置於包括該等紅色、綠色及藍色微LED之列中,且鄰近列中之該複數個印刷無機微LED之微LED在空間上偏移或鄰近列中之該複數個印刷無機微LED之該等微LED之色彩在空間上偏移。
- 如請求項6之反射式顯示器,其中該複數個印刷無機微LED經安置於各包括一個紅色、一個綠色及一個藍色微LED之兩個或多個群組中且其中一群組內之該複數個印刷無機微LED之微LED之間的距離小於該複數個印刷無機微LED之微LED群組之間的距離。
- 如請求項1之反射式顯示器,其中該層具有鄰近於該反射式顯示器觀看區域之一第一側及與該第一側相對之一第二側,且該反射式顯示器包括具有形成在該第一側上、該第二側上或該第一側及該第二側兩者上之一電極圖案之一觸控感測器。
- 如請求項9之反射式顯示器,其中該控制器包括一控制電路,該控制電路提供電力至該複數個導體以自該複數個印刷無機微LED發射光且單獨提供信號至該電極圖案之該等電極以偵測該層或該反射式顯示器上或附近之觸碰。
- 如請求項10之反射式顯示器,其中該電極圖案包括與該複數個導體電分離之一電極陣列,其中(i)該複數個導體及(ii)該複數個印刷無機微LED之至少一者安置於該複數個電極之兩者之間。
- 如請求項11之反射式顯示器,其中該觸控感測器包括該第一側及該第二側上之該電極圖案及該第一側上之該電極圖案形成在一第一方向上延伸之一電分離第一電極陣列且該第二側上之該電極圖案形成在一第二方向上延伸之一電分離第二電極陣列,其中該第二方向不同於該第一方向。
- 如請求項9之反射式顯示器,其中該控制器包括一控制電路,該控制電路在一第一時間段期間提供電力至該複數個導體以自該複數個印刷無機微LED發射光且在不同於該第一時間段之一第二時間段期間提供信號至該電極圖案以偵測觸碰。
- 如請求項9之反射式顯示器,其中該電極圖案包括該複數個導體,該電極圖案形成為一平行電極陣列且該複數個印刷無機微LED之各者連接至一對鄰近電極。
- 如請求項9之反射式顯示器,其中該電極圖案包括該複數個導體,該電極圖案形成在一第一方向上延伸之一電分離第一電極陣列及在不同於該第一方向之一第二方向上延伸之一電分離第二電極陣列,且各印刷無機微LED連接至一第一電極及一第二電極。
- 如請求項1之反射式顯示器,其包括分佈於該顯示器區域上方之一觸控控制器小晶片陣列,其等之各者電連接至一或多個電分離電極以偵測該一或多個電極上或鄰近於該一或多個電極之觸碰。
- 如請求項1之反射式顯示器,其中該層係一透明層。
- 如請求項17之反射式顯示器,其中該透明層具有有大於或等於可見光之50%之一透明度。
- 如請求項1之反射式顯示器,其包括該顯示控制器。
- 如請求項19之反射式顯示器,其中該控制器係該顯示控制器。
- 如請求項19之反射式顯示器,其中該控制器包括一控制電路,該控制電路回應於顯示在該反射式顯示器上之該影像而控制該複數個印刷無機微LED以提供前光調光。
- 一種用於操作一反射式顯示器之方法,其包括:提供該反射式顯示器,其中該反射式顯示器包括:一反射像素陣列,其在用於電子顯示資訊將被觀看之一反射式顯示器觀看區域中或下方,其中該反射像素陣列中之各反射像素係可控制地吸收或反射光之一反射元件及該反射像素陣列係可操作以形成由一顯示控制器所控制之一影像;一層,其經定位於該反射式顯示器觀看區域上或上方,該層包括:複數個印刷無機微LED,其等經定位於該反射式顯示器觀看區域之該等x-y邊界內之該層中或該層上,且經定向以發射光朝向該反射式顯示器觀看區域;及複數個導體,其等經定位於該層上或該層中且電連接至該複數個印刷無機微LED;一控制器,其經連接至該等導體以控制該複數個印刷無機微LED發射光而照明該反射式顯示器觀看區域;及與該複數個導體電分離之一電極陣列;及藉由該控制器控制該複數個印刷無機微LED發射光且控制該電極陣列偵測一觸碰。
- 如請求項22之方法,其中該控制器在偵測到一觸碰的同時控制該複數個印刷無機微LED發射光。
- 如請求項22之方法,其中該控制器在一第一時間段期間控制該複數個印刷無機微LED發射光且在不同於該第一時間段之一第二時間段期間使用該電極陣列偵測一觸碰。
- 如請求項22之方法,其中該反射式顯示器包括該顯示控制器。
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US14/822,868 US20160093600A1 (en) | 2014-09-25 | 2015-08-10 | Compound micro-assembly strategies and devices |
US14/849,242 US10133426B2 (en) | 2015-06-18 | 2015-09-09 | Display with micro-LED front light |
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Also Published As
Publication number | Publication date |
---|---|
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US10133426B2 (en) | 2018-11-20 |
US20170068362A1 (en) | 2017-03-09 |
US20170102797A1 (en) | 2017-04-13 |
WO2017042252A1 (en) | 2017-03-16 |
CN108140667B (zh) | 2022-07-15 |
US10289252B2 (en) | 2019-05-14 |
TWI693540B (zh) | 2020-05-11 |
CN108140667A (zh) | 2018-06-08 |
TW201719248A (zh) | 2017-06-01 |
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