TWI560293B - - Google Patents
Info
- Publication number
- TWI560293B TWI560293B TW104124249A TW104124249A TWI560293B TW I560293 B TWI560293 B TW I560293B TW 104124249 A TW104124249 A TW 104124249A TW 104124249 A TW104124249 A TW 104124249A TW I560293 B TWI560293 B TW I560293B
- Authority
- TW
- Taiwan
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/16—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling the spray area
- B05B12/20—Masking elements, i.e. elements defining uncoated areas on an object to be coated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C21/00—Accessories or implements for use in connection with applying liquids or other fluent materials to surfaces, not provided for in groups B05C1/00 - B05C19/00
- B05C21/005—Masking devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
- B32B37/182—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only one or more of the layers being plastic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0008—Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
- B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
- B32B2310/0843—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2398/00—Unspecified macromolecular compounds
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012004484 | 2012-01-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201540855A TW201540855A (zh) | 2015-11-01 |
TWI560293B true TWI560293B (zh) | 2016-12-01 |
Family
ID=48781584
Family Applications (7)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107104773A TWI667138B (zh) | 2012-01-12 | 2013-01-11 | 蒸鍍遮罩、圖案之製造方法、有機半導體元件的製造方法 |
TW108121532A TWI687315B (zh) | 2012-01-12 | 2013-01-11 | 蒸鍍遮罩、圖案之製造方法、有機半導體元件的製造方法 |
TW102101284A TWI479041B (zh) | 2012-01-12 | 2013-01-11 | A method of manufacturing a vapor deposition mask, a method for producing a vapor deposition mask, and a method of manufacturing the organic semiconductor device |
TW105133715A TWI622662B (zh) | 2012-01-12 | 2013-01-11 | 蒸鍍遮罩準備體 |
TW104124249A TW201540855A (zh) | 2012-01-12 | 2013-01-11 | 蒸鍍遮罩裝置 |
TW103117887A TWI498434B (zh) | 2012-01-12 | 2013-01-11 | A method of manufacturing a vapor deposition mask, a method for producing a vapor deposition mask, and a method of manufacturing the organic semiconductor device |
TW109105195A TWI720818B (zh) | 2012-01-12 | 2013-01-11 | 蒸鍍遮罩、圖案之製造方法、有機半導體元件的製造方法 |
Family Applications Before (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107104773A TWI667138B (zh) | 2012-01-12 | 2013-01-11 | 蒸鍍遮罩、圖案之製造方法、有機半導體元件的製造方法 |
TW108121532A TWI687315B (zh) | 2012-01-12 | 2013-01-11 | 蒸鍍遮罩、圖案之製造方法、有機半導體元件的製造方法 |
TW102101284A TWI479041B (zh) | 2012-01-12 | 2013-01-11 | A method of manufacturing a vapor deposition mask, a method for producing a vapor deposition mask, and a method of manufacturing the organic semiconductor device |
TW105133715A TWI622662B (zh) | 2012-01-12 | 2013-01-11 | 蒸鍍遮罩準備體 |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103117887A TWI498434B (zh) | 2012-01-12 | 2013-01-11 | A method of manufacturing a vapor deposition mask, a method for producing a vapor deposition mask, and a method of manufacturing the organic semiconductor device |
TW109105195A TWI720818B (zh) | 2012-01-12 | 2013-01-11 | 蒸鍍遮罩、圖案之製造方法、有機半導體元件的製造方法 |
Country Status (6)
Country | Link |
---|---|
US (7) | US9108216B2 (zh) |
JP (7) | JP5288072B2 (zh) |
KR (6) | KR101972920B1 (zh) |
CN (9) | CN105331928B (zh) |
TW (7) | TWI667138B (zh) |
WO (1) | WO2013105642A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI689122B (zh) * | 2016-12-27 | 2020-03-21 | 創王光電股份有限公司 | 遮罩 |
Families Citing this family (101)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5895540B2 (ja) * | 2012-01-12 | 2016-03-30 | 大日本印刷株式会社 | 蒸着マスク |
KR102097574B1 (ko) * | 2012-01-12 | 2020-04-06 | 다이니폰 인사츠 가부시키가이샤 | 수지층이 형성된 금속 마스크의 제조 방법 |
TWI463024B (zh) | 2012-01-12 | 2014-12-01 | 大日本印刷股份有限公司 | A manufacturing method of the imposition-type deposition mask and a manufacturing method of the resulting stencil sheet and an organic semiconductor device |
KR101972920B1 (ko) | 2012-01-12 | 2019-08-23 | 다이니폰 인사츠 가부시키가이샤 | 수지판을 구비한 금속 마스크, 증착 마스크, 증착 마스크 장치의 제조 방법, 및 유기 반도체 소자의 제조 방법 |
JP5895539B2 (ja) * | 2012-01-12 | 2016-03-30 | 大日本印刷株式会社 | 蒸着マスク |
TWI665320B (zh) * | 2013-03-26 | 2019-07-11 | 日商大日本印刷股份有限公司 | 蒸鍍遮罩、蒸鍍遮罩之製造方法、及有機半導體元件之製造方法 |
KR102418817B1 (ko) * | 2013-04-12 | 2022-07-08 | 다이니폰 인사츠 가부시키가이샤 | 증착 마스크, 증착 마스크 준비체, 증착 마스크의 제조 방법 및 유기 반도체 소자의 제조 방법 |
CN107855641A (zh) * | 2013-04-12 | 2018-03-30 | 大日本印刷株式会社 | 蒸镀掩模、蒸镀掩模准备体、蒸镀掩模的制造方法、及有机半导体元件的制造方法 |
JP5455099B1 (ja) | 2013-09-13 | 2014-03-26 | 大日本印刷株式会社 | 金属板、金属板の製造方法、および金属板を用いてマスクを製造する方法 |
JP6168944B2 (ja) * | 2013-09-20 | 2017-07-26 | 株式会社ブイ・テクノロジー | 成膜マスク |
JP6394877B2 (ja) * | 2013-09-30 | 2018-09-26 | 大日本印刷株式会社 | 蒸着マスク、蒸着マスクの製造方法、蒸着マスク準備体、フレーム付き蒸着マスク、及び有機半導体素子の製造方法 |
JP6331312B2 (ja) * | 2013-09-30 | 2018-05-30 | 大日本印刷株式会社 | 蒸着マスクの製造方法、及び蒸着マスク準備体 |
JP2015067892A (ja) * | 2013-09-30 | 2015-04-13 | 大日本印刷株式会社 | 蒸着マスク、及び有機半導体素子の製造方法 |
JP2015074826A (ja) * | 2013-10-11 | 2015-04-20 | 株式会社ブイ・テクノロジー | 成膜マスク及びその製造方法 |
JP5516816B1 (ja) | 2013-10-15 | 2014-06-11 | 大日本印刷株式会社 | 金属板、金属板の製造方法、および金属板を用いて蒸着マスクを製造する方法 |
JP5780350B2 (ja) | 2013-11-14 | 2015-09-16 | 大日本印刷株式会社 | 蒸着マスク、フレーム付き蒸着マスク、及び有機半導体素子の製造方法 |
JP6409701B2 (ja) * | 2013-11-14 | 2018-10-24 | 大日本印刷株式会社 | 蒸着マスク、フレーム付き蒸着マスク、及び有機半導体素子の製造方法 |
JP6288497B2 (ja) * | 2013-12-13 | 2018-03-07 | 株式会社ブイ・テクノロジー | マスク及びその製造方法 |
JP6357312B2 (ja) | 2013-12-20 | 2018-07-11 | 株式会社ブイ・テクノロジー | 成膜マスクの製造方法及び成膜マスク |
KR102138625B1 (ko) * | 2013-12-23 | 2020-07-29 | 엘지디스플레이 주식회사 | 박막 형성 장치 |
JP5846287B1 (ja) | 2013-12-27 | 2016-01-20 | 大日本印刷株式会社 | フレーム付き蒸着マスクの製造方法、引張装置、有機半導体素子の製造装置及び有機半導体素子の製造方法 |
JP6240960B2 (ja) * | 2014-02-03 | 2017-12-06 | 株式会社ブイ・テクノロジー | 成膜マスクの製造方法及び成膜マスク |
JP2015148002A (ja) * | 2014-02-07 | 2015-08-20 | 大日本印刷株式会社 | 蒸着マスク、蒸着マスク準備体、及び有機半導体素子の製造方法 |
JP6347112B2 (ja) * | 2014-02-07 | 2018-06-27 | 大日本印刷株式会社 | 蒸着マスク、蒸着マスク準備体、蒸着マスクの製造方法、パターンの製造方法、フレーム付き蒸着マスク、及び有機半導体素子の製造方法 |
CN103882375B (zh) * | 2014-03-12 | 2016-03-09 | 京东方科技集团股份有限公司 | 一种掩膜板及其制作方法 |
JP6326885B2 (ja) * | 2014-03-19 | 2018-05-23 | 大日本印刷株式会社 | 蒸着マスク、蒸着マスク準備体、及び有機半導体素子の製造方法 |
JP6511908B2 (ja) * | 2014-03-31 | 2019-05-15 | 大日本印刷株式会社 | 蒸着マスクの引張方法、フレーム付き蒸着マスクの製造方法、有機半導体素子の製造方法、及び引張装置 |
CN103952666B (zh) * | 2014-04-22 | 2016-02-10 | 四川虹视显示技术有限公司 | 蒸镀掩膜板张紧方法 |
CN103981485B (zh) * | 2014-05-09 | 2016-07-06 | 合肥鑫晟光电科技有限公司 | 掩膜板及其制造方法 |
JP5641462B1 (ja) | 2014-05-13 | 2014-12-17 | 大日本印刷株式会社 | 金属板、金属板の製造方法、および金属板を用いてマスクを製造する方法 |
CN110306156A (zh) * | 2014-06-06 | 2019-10-08 | 大日本印刷株式会社 | 蒸镀掩模及其前体、以及有机半导体元件的制造方法 |
KR102330942B1 (ko) * | 2014-06-06 | 2021-11-26 | 다이니폰 인사츠 가부시키가이샤 | 증착 마스크, 프레임을 갖는 증착 마스크, 증착 마스크 준비체, 및 유기 반도체 소자의 제조 방법 |
JP6323266B2 (ja) * | 2014-09-03 | 2018-05-16 | 大日本印刷株式会社 | 蒸着マスクの検査方法 |
CN107075658B (zh) * | 2014-10-23 | 2019-02-19 | 夏普株式会社 | 蒸镀掩模的制造方法、蒸镀掩模、蒸镀装置、蒸镀方法 |
DE102014116076A1 (de) * | 2014-11-04 | 2016-05-04 | Osram Opto Semiconductors Gmbh | Verfahren zum Aufbringen eines Materials auf einer Oberfläche |
JP6375906B2 (ja) * | 2014-12-02 | 2018-08-22 | 大日本印刷株式会社 | 蒸着マスク、蒸着マスク準備体、フレーム付き蒸着マスク及び有機半導体素子の製造方法 |
WO2016117535A1 (ja) * | 2015-01-20 | 2016-07-28 | シャープ株式会社 | 蒸着マスク、製造方法 |
JP5994952B2 (ja) * | 2015-02-03 | 2016-09-21 | 大日本印刷株式会社 | 蒸着マスクの製造方法、蒸着マスク製造装置、レーザー用マスクおよび有機半導体素子の製造方法 |
DE202016008840U1 (de) | 2015-02-10 | 2020-02-11 | Dai Nippon Printing Co., Ltd. | Metallblech |
KR102025002B1 (ko) * | 2015-04-17 | 2019-09-24 | 다이니폰 인사츠 가부시키가이샤 | 증착 패턴의 형성 방법, 누름판 일체형의 압입 부재, 증착 장치 및 유기 반도체 소자의 제조 방법 |
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