DE69618162T2 - Herstellungsverfahren eines Reflektors - Google Patents

Herstellungsverfahren eines Reflektors

Info

Publication number
DE69618162T2
DE69618162T2 DE69618162T DE69618162T DE69618162T2 DE 69618162 T2 DE69618162 T2 DE 69618162T2 DE 69618162 T DE69618162 T DE 69618162T DE 69618162 T DE69618162 T DE 69618162T DE 69618162 T2 DE69618162 T2 DE 69618162T2
Authority
DE
Germany
Prior art keywords
reflector
manufacturing process
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69618162T
Other languages
English (en)
Other versions
DE69618162D1 (de
Inventor
Akira Yamashita
Koichi Furukawa
Teruaki Orikasa
Noriaki Goto
Shigeki Matsunaka
Yoshitaka Kawada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Space Technologies Ltd
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP7215595A external-priority patent/JP2983451B2/ja
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE69618162D1 publication Critical patent/DE69618162D1/de
Publication of DE69618162T2 publication Critical patent/DE69618162T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/14—Reflecting surfaces; Equivalent structures
    • H01Q15/141—Apparatus or processes specially adapted for manufacturing reflecting surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Electromagnetism (AREA)
  • General Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Laser Beam Processing (AREA)
  • Aerials With Secondary Devices (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • ing And Chemical Polishing (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
DE69618162T 1995-08-24 1996-08-21 Herstellungsverfahren eines Reflektors Expired - Lifetime DE69618162T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP21559495 1995-08-24
JP7215595A JP2983451B2 (ja) 1995-08-24 1995-08-24 リフレクタの製造方法

Publications (2)

Publication Number Publication Date
DE69618162D1 DE69618162D1 (de) 2002-01-31
DE69618162T2 true DE69618162T2 (de) 2002-08-14

Family

ID=26520950

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69618162T Expired - Lifetime DE69618162T2 (de) 1995-08-24 1996-08-21 Herstellungsverfahren eines Reflektors

Country Status (4)

Country Link
US (1) US5792520A (de)
EP (1) EP0787558B1 (de)
CA (1) CA2183926C (de)
DE (1) DE69618162T2 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6892441B2 (en) * 2001-04-23 2005-05-17 Appleton Papers Inc. Method for forming electrically conductive pathways
US6779246B2 (en) * 2001-04-23 2004-08-24 Appleton Papers Inc. Method and system for forming RF reflective pathways
WO2005027039A2 (en) * 2003-09-08 2005-03-24 Laser Projection Technologies, Inc. 3d projection with image recording
FR2882490B1 (fr) 2005-02-23 2009-04-24 Eads Space Transp Sas Soc Par Procede pour la realisation de motifs electriquement conducteurs sur une surface non developpable d'un substrat isolant, et dispositif obtenu
US8270177B2 (en) 2007-07-27 2012-09-18 Renesas Electronics Corporation Electronic device and method for manufacturing electronic device
CN105336855B (zh) 2012-01-12 2020-08-04 大日本印刷株式会社 蒸镀掩模装置准备体
CN105870326A (zh) * 2012-01-12 2016-08-17 大日本印刷株式会社 蒸镀掩模的制造方法及有机半导体元件的制造方法
JP5288074B2 (ja) 2012-01-12 2013-09-11 大日本印刷株式会社 多面付け蒸着マスクの製造方法及びこれにより得られる多面付け蒸着マスク並びに有機半導体素子の製造方法
CN103266323B (zh) * 2013-05-14 2015-08-12 广东工业大学 一种用于具有曲面结构的金属制品表面蚀刻加工方法
CN111864403B (zh) * 2020-06-30 2022-05-03 上海复合材料科技有限公司 一种高精度反射面成型方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6142438A (ja) * 1984-07-31 1986-02-28 Fuji Bolt Seisakusho:Kk タ−ンバツクル式異形鉄筋継手におけるスリ−ブの押抜縮径方法
JPS6211291A (ja) * 1985-07-09 1987-01-20 株式会社東芝 回路板の製造方法
FR2596230B1 (fr) * 1986-03-19 1988-07-08 Aerospatiale Procede pour la realisation de motifs electriquement conducteurs sur une surface non developpable d'un substrat isolant, outil pour la mise en oeuvre du procede et dispositif obtenu
FR2598339B1 (fr) * 1986-05-06 1990-12-14 Europ Agence Spatiale Antennes a reflecteurs paraboliques et leur procede d'obtention
IT1195120B (it) * 1986-08-04 1988-10-12 Cselt Centro Studi Lab Telecom Procedimento per la fabbricazione di strutture dicroiche d antenna
JP2712918B2 (ja) * 1991-08-30 1998-02-16 日産自動車株式会社 インペラーの成形装置
JPH0635140B2 (ja) * 1992-01-13 1994-05-11 株式会社テクノプラス 円盤状記録媒体の成形方法
IL105925A (en) * 1992-06-22 1997-01-10 Martin Marietta Corp Ablative process for printed circuit board technology
IL105923A0 (en) * 1992-06-26 1993-10-20 Martin Marietta Corp Direct laser imaging for threedimensional circuits and the like
JP2724077B2 (ja) * 1992-09-28 1998-03-09 ポリプラスチックス株式会社 成形品表面に導電回路を形成する方法
US5364493A (en) * 1993-05-06 1994-11-15 Litel Instruments Apparatus and process for the production of fine line metal traces
JP3153682B2 (ja) * 1993-08-26 2001-04-09 松下電工株式会社 回路板の製造方法

Also Published As

Publication number Publication date
EP0787558A1 (de) 1997-08-06
DE69618162D1 (de) 2002-01-31
CA2183926A1 (en) 1997-02-25
CA2183926C (en) 2000-04-11
US5792520A (en) 1998-08-11
EP0787558B1 (de) 2001-12-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: NEC TOSHIBA SPACE SYSTEMS, LTD., YOKOHAMA, KANAGAW