FR2882490B1 - Procede pour la realisation de motifs electriquement conducteurs sur une surface non developpable d'un substrat isolant, et dispositif obtenu - Google Patents
Procede pour la realisation de motifs electriquement conducteurs sur une surface non developpable d'un substrat isolant, et dispositif obtenuInfo
- Publication number
- FR2882490B1 FR2882490B1 FR0501815A FR0501815A FR2882490B1 FR 2882490 B1 FR2882490 B1 FR 2882490B1 FR 0501815 A FR0501815 A FR 0501815A FR 0501815 A FR0501815 A FR 0501815A FR 2882490 B1 FR2882490 B1 FR 2882490B1
- Authority
- FR
- France
- Prior art keywords
- electrically conductive
- insulating substrate
- conductive patterns
- device obtained
- developable surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
- H01Q15/14—Reflecting surfaces; Equivalent structures
- H01Q15/141—Apparatus or processes specially adapted for manufacturing reflecting surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09018—Rigid curved substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0501815A FR2882490B1 (fr) | 2005-02-23 | 2005-02-23 | Procede pour la realisation de motifs electriquement conducteurs sur une surface non developpable d'un substrat isolant, et dispositif obtenu |
US11/815,447 US7721426B2 (en) | 2005-02-23 | 2006-02-20 | Method of producing electrically conductive patterns on a substrate |
EP06709341A EP1852002A1 (fr) | 2005-02-23 | 2006-02-20 | Procede pour la realisation de motifs electriquement conducteurs sur une surface non developpable d'un substrat isolant, et dispositif obtenu |
PCT/FR2006/000373 WO2006090050A1 (fr) | 2005-02-23 | 2006-02-20 | Procede pour la realisation de motifs electriquement conducteurs sur une surface non developpable d'un substrat isolant, et dispositif obtenu |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0501815A FR2882490B1 (fr) | 2005-02-23 | 2005-02-23 | Procede pour la realisation de motifs electriquement conducteurs sur une surface non developpable d'un substrat isolant, et dispositif obtenu |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2882490A1 FR2882490A1 (fr) | 2006-08-25 |
FR2882490B1 true FR2882490B1 (fr) | 2009-04-24 |
Family
ID=35115937
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0501815A Expired - Fee Related FR2882490B1 (fr) | 2005-02-23 | 2005-02-23 | Procede pour la realisation de motifs electriquement conducteurs sur une surface non developpable d'un substrat isolant, et dispositif obtenu |
Country Status (4)
Country | Link |
---|---|
US (1) | US7721426B2 (fr) |
EP (1) | EP1852002A1 (fr) |
FR (1) | FR2882490B1 (fr) |
WO (1) | WO2006090050A1 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8868809B2 (en) * | 2009-11-30 | 2014-10-21 | Lsi Corporation | Interrupt queuing in a media controller architecture |
US10516216B2 (en) | 2018-01-12 | 2019-12-24 | Eagle Technology, Llc | Deployable reflector antenna system |
US10707552B2 (en) | 2018-08-21 | 2020-07-07 | Eagle Technology, Llc | Folded rib truss structure for reflector antenna with zero over stretch |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3264402A (en) * | 1962-09-24 | 1966-08-02 | North American Aviation Inc | Multilayer printed-wiring boards |
GB8531830D0 (en) * | 1985-12-30 | 1986-02-05 | Davies H J | Photo fabrication |
FR2596230B1 (fr) | 1986-03-19 | 1988-07-08 | Aerospatiale | Procede pour la realisation de motifs electriquement conducteurs sur une surface non developpable d'un substrat isolant, outil pour la mise en oeuvre du procede et dispositif obtenu |
IT1195120B (it) * | 1986-08-04 | 1988-10-12 | Cselt Centro Studi Lab Telecom | Procedimento per la fabbricazione di strutture dicroiche d antenna |
US4842677A (en) * | 1988-02-05 | 1989-06-27 | General Electric Company | Excimer laser patterning of a novel resist using masked and maskless process steps |
JP3361556B2 (ja) * | 1992-09-25 | 2003-01-07 | 日本メクトロン株式会社 | 回路配線パタ−ンの形成法 |
US5364493A (en) * | 1993-05-06 | 1994-11-15 | Litel Instruments | Apparatus and process for the production of fine line metal traces |
DE69418698T2 (de) * | 1994-04-14 | 1999-10-07 | Hewlett Packard Gmbh | Verfahren zur Herstellung von Leiterplatten |
EP0787558B1 (fr) * | 1995-08-24 | 2001-12-19 | Kabushiki Kaisha Toshiba | Méthode de fabrication d'un réflecteur |
-
2005
- 2005-02-23 FR FR0501815A patent/FR2882490B1/fr not_active Expired - Fee Related
-
2006
- 2006-02-20 WO PCT/FR2006/000373 patent/WO2006090050A1/fr active Application Filing
- 2006-02-20 EP EP06709341A patent/EP1852002A1/fr not_active Withdrawn
- 2006-02-20 US US11/815,447 patent/US7721426B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
WO2006090050A1 (fr) | 2006-08-31 |
US20080210456A1 (en) | 2008-09-04 |
US7721426B2 (en) | 2010-05-25 |
FR2882490A1 (fr) | 2006-08-25 |
EP1852002A1 (fr) | 2007-11-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 11 |
|
PLFP | Fee payment |
Year of fee payment: 12 |
|
PLFP | Fee payment |
Year of fee payment: 13 |
|
ST | Notification of lapse |
Effective date: 20181031 |