TWI533394B - Conveying method and conveying device - Google Patents

Conveying method and conveying device Download PDF

Info

Publication number
TWI533394B
TWI533394B TW097122515A TW97122515A TWI533394B TW I533394 B TWI533394 B TW I533394B TW 097122515 A TW097122515 A TW 097122515A TW 97122515 A TW97122515 A TW 97122515A TW I533394 B TWI533394 B TW I533394B
Authority
TW
Taiwan
Prior art keywords
wafer
wafers
bonding
positional deviation
determining
Prior art date
Application number
TW097122515A
Other languages
English (en)
Chinese (zh)
Other versions
TW200913120A (en
Inventor
前田榮裕
岡本和也
田中康明
Original Assignee
尼康股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 尼康股份有限公司 filed Critical 尼康股份有限公司
Publication of TW200913120A publication Critical patent/TW200913120A/zh
Application granted granted Critical
Publication of TWI533394B publication Critical patent/TWI533394B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/16—Program controls
    • B25J9/1694—Program controls characterised by use of sensors other than normal servo-feedback from position, speed or acceleration sensors, perception control, multi-sensor controlled systems, sensor fusion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H10P72/0608—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Control Of Conveyors (AREA)
TW097122515A 2007-06-21 2008-06-17 Conveying method and conveying device TWI533394B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007164081 2007-06-21

Publications (2)

Publication Number Publication Date
TW200913120A TW200913120A (en) 2009-03-16
TWI533394B true TWI533394B (zh) 2016-05-11

Family

ID=40156310

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097122515A TWI533394B (zh) 2007-06-21 2008-06-17 Conveying method and conveying device

Country Status (5)

Country Link
US (3) US8244399B2 (https=)
JP (2) JP5375607B2 (https=)
KR (2) KR20150067393A (https=)
TW (1) TWI533394B (https=)
WO (1) WO2008156152A1 (https=)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120087774A1 (en) * 2006-01-27 2012-04-12 Camtek Ltd Diced Wafer Adaptor and a Method for Transferring a Diced Wafer
TWI478272B (zh) * 2007-08-15 2015-03-21 尼康股份有限公司 A positioning device, a bonding device, a laminated substrate manufacturing device, an exposure device, and a positioning method
JP5732631B2 (ja) 2009-09-18 2015-06-10 ボンドテック株式会社 接合装置および接合方法
JP5549339B2 (ja) * 2010-04-12 2014-07-16 株式会社ニコン 基板相対位置検出方法、積層デバイス製造方法および検出装置
DE102010048043A1 (de) 2010-10-15 2012-04-19 Ev Group Gmbh Vorrichtung und Verfahren zur Prozessierung von Wafern
JP5854375B2 (ja) * 2010-12-24 2016-02-09 ボンドテック株式会社 接合装置および接合方法
JP6031754B2 (ja) * 2011-12-12 2016-11-24 株式会社ニコン 基板重ね合わせ方法、積層半導体装置の製造方法、及び、基板重ね合わせ装置
JP5696076B2 (ja) * 2012-03-21 2015-04-08 株式会社東芝 半導体装置の検査装置及び半導体装置の検査方法
JP6105982B2 (ja) * 2012-09-21 2017-03-29 株式会社Ｓｃｒｅｅｎホールディングス スケジュール作成装置、基板処理装置、スケジュール作成プログラム、スケジュール作成方法、および基板処理方法
TWI625797B (zh) * 2012-10-26 2018-06-01 尼康股份有限公司 基板貼合裝置、基板位置配合裝置、基板貼合方法、及基板位置配合方法
ES2693512T3 (es) * 2013-07-29 2018-12-12 Siemens Aktiengesellschaft Dispositivo de agarre de pala
JP6363854B2 (ja) * 2014-03-11 2018-07-25 キヤノン株式会社 形成方法、および物品の製造方法
JP6305887B2 (ja) * 2014-09-16 2018-04-04 東芝メモリ株式会社 半導体装置の製造方法及び半導体製造装置
CN104362107B (zh) * 2014-10-23 2017-03-01 浙江中纳晶微电子科技有限公司 晶圆真空键合机及键合方法
US10825705B2 (en) * 2015-05-15 2020-11-03 Suss Microtec Lithography Gmbh Apparatus, system, and method for handling aligned wafer pairs
FR3039926A1 (fr) * 2015-08-04 2017-02-10 Commissariat Energie Atomique Procede d'assemblage de dispositifs electroniques
WO2017115684A1 (ja) * 2015-12-28 2017-07-06 株式会社ニコン 基板貼り合わせ装置および基板貼り合わせ方法
JP6670185B2 (ja) 2016-06-15 2020-03-18 東京応化工業株式会社 重ね合わせ装置、貼付装置、重ね合わせ方法および貼付方法
JP6727048B2 (ja) * 2016-07-12 2020-07-22 東京エレクトロン株式会社 基板搬送装置および接合システム
JP6473116B2 (ja) * 2016-09-30 2019-02-20 ボンドテック株式会社 アライメント装置およびアライメント方法
US10410892B2 (en) * 2016-11-18 2019-09-10 Taiwan Semiconductor Manufacturing Company Ltd. Method of semiconductor wafer bonding and system thereof
JP6574410B2 (ja) * 2016-12-07 2019-09-11 日本電信電話株式会社 半導体デバイスのウェハ接合方法
US10497667B2 (en) 2017-09-26 2019-12-03 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus for bond wave propagation control
EP3833164A1 (en) * 2019-12-05 2021-06-09 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Compensating misalignment of component carrier feature by modifying target design concerning correlated component carrier feature
NL1043633B1 (nl) * 2020-04-14 2021-10-26 Integrated Mech Solutions B V Inrichting en werkwijze voor het vervaardigen van voortbrengsels
JP7467285B2 (ja) * 2020-08-27 2024-04-15 東京エレクトロン株式会社 基板処理装置、及び基板処理方法
CN114793466A (zh) * 2021-10-25 2022-07-26 长江存储科技有限责任公司 晶圆键合设备及方法
US12431378B2 (en) * 2022-11-08 2025-09-30 Canon Kabushiki Kaisha Chip chuck and a method of using the same
KR20250153361A (ko) * 2024-04-17 2025-10-27 삼성디스플레이 주식회사 표시 장치의 제조 장치 및 표시 장치의 제조 방법

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5563798A (en) * 1994-04-05 1996-10-08 Applied Materials, Inc. Wafer positioning system
US6636313B2 (en) * 2002-01-12 2003-10-21 Taiwan Semiconductor Manufacturing Co. Ltd Method of measuring photoresist and bump misalignment
JP4028752B2 (ja) * 2002-04-24 2007-12-26 キヤノンアネルバ株式会社 統合型液晶ディスプレイパネル組立装置及び基板重ね合わせ装置
JP2003324055A (ja) * 2002-04-30 2003-11-14 Canon Inc 管理システム及び装置及び方法並びに露光装置及びその制御方法
US7243003B2 (en) * 2002-08-31 2007-07-10 Applied Materials, Inc. Substrate carrier handler that unloads substrate carriers directly from a moving conveyor
KR101015778B1 (ko) * 2003-06-03 2011-02-22 도쿄엘렉트론가부시키가이샤 기판 처리장치 및 기판 수수 위치의 조정 방법
JP4695014B2 (ja) * 2003-12-02 2011-06-08 ボンドテック株式会社 接合方法及びこの方法により作成されるデバイス並びに接合装置
WO2005054147A1 (ja) 2003-12-02 2005-06-16 Bondtech Inc. 接合方法及びこの方法により作成されるデバイス並びに接合装置
JP4626160B2 (ja) * 2004-03-04 2011-02-02 株式会社ニコン ウェハ重ね合わせ方法及びウェハ重ね合わせ装置
JP4821091B2 (ja) * 2004-04-08 2011-11-24 株式会社ニコン ウェハの接合装置
WO2006001282A1 (ja) * 2004-06-25 2006-01-05 Nikon Corporation 位置決め装置、位置決め方法、露光装置、露光方法、及びデバイスの製造方法
US7364922B2 (en) * 2005-01-24 2008-04-29 Tokyo Electron Limited Automated semiconductor wafer salvage during processing
JP4569956B2 (ja) * 2005-01-24 2010-10-27 東京エレクトロン株式会社 基板処理装置の復旧処理方法，基板処理装置，プログラム
JP2006278396A (ja) * 2005-03-28 2006-10-12 Tokyo Electron Ltd 処理装置及びプログラム
US20060249859A1 (en) * 2005-05-05 2006-11-09 Eiles Travis M Metrology system and method for stacked wafer alignment
JP2006332563A (ja) * 2005-05-30 2006-12-07 Nikon Corp ウェハ搬送装置、ウェハ積層体搬送装置及び積層型半導体装置製造方法
JP2007059640A (ja) * 2005-08-25 2007-03-08 Olympus Corp 外観検査装置
JP4892225B2 (ja) * 2005-10-28 2012-03-07 株式会社日立ハイテクノロジーズ 真空処理方法、真空搬送装置および半導体処理装置
US8057153B2 (en) * 2006-09-05 2011-11-15 Tokyo Electron Limited Substrate transfer device, substrate processing apparatus and substrate transfer method
KR20090046172A (ko) * 2007-11-05 2009-05-11 주식회사 동부하이텍 기판 본딩장치 및 기판 본딩방법

Also Published As

Publication number Publication date
TW200913120A (en) 2009-03-16
JP5375607B2 (ja) 2013-12-25
US20130274915A1 (en) 2013-10-17
JP2014057070A (ja) 2014-03-27
US8244399B2 (en) 2012-08-14
JP5729440B2 (ja) 2015-06-03
KR20100041751A (ko) 2010-04-22
US8489227B2 (en) 2013-07-16
US20100168908A1 (en) 2010-07-01
US20120330459A1 (en) 2012-12-27
KR20150067393A (ko) 2015-06-17
JPWO2008156152A1 (ja) 2010-08-26
WO2008156152A1 (ja) 2008-12-24

Similar Documents

Publication Publication Date Title
TWI533394B (zh) Conveying method and conveying device
JP5359873B2 (ja) 基板貼り合わせ方法、位置決め方法、積層基板製造装置、位置決め装置及び露光装置
JP2022177168A (ja) 基板貼り合わせ装置および基板貼り合わせ方法
JP4626160B2 (ja) ウェハ重ね合わせ方法及びウェハ重ね合わせ装置
KR20170128445A (ko) 반도체 장치의 제조 방법, 반도체 실장 장치 및 반도체 장치의 제조 방법으로 제조된 메모리 디바이스
KR20220031757A (ko) 위치 맞춤 방법 및 위치 맞춤 장치
JP5549339B2 (ja) 基板相対位置検出方法、積層デバイス製造方法および検出装置
JP5370903B2 (ja) 基板貼り合わせ方法
JP5943030B2 (ja) 基板重ね合わせ装置、基板重ね合わせ方法、及びデバイスの製造方法
TWI782171B (zh) 基板處理裝置
JP5454310B2 (ja) 基板貼り合わせ装置および基板貼り合わせ方法
JP2009016416A (ja) 可撓性回路基板の製造方法および製造装置
JP4821707B2 (ja) シート材貼り合わせ装置
JP5531508B2 (ja) 基板重ね合わせ装置、基板重ね合わせ方法、及びデバイスの製造方法
JP2006100656A (ja) ウェハ積層時の重ね合わせ方法
JP5626710B2 (ja) 基板貼り合わせ方法及び基板貼り合わせ装置
JP4245386B2 (ja) 基板の貼合わせ装置及び基板の貼合わせ方法
JP5454239B2 (ja) 基板貼り合せ装置、基板貼り合せ方法、積層半導体装置製造方法及び積層半導体装置
JP5454252B2 (ja) 基板貼り合せ装置、基板貼り合せ方法、積層半導体装置製造方法及び積層半導体装置
JP5724182B2 (ja) 基板処理装置および積層半導体装置製造方法
TW200800574A (en) Laminating method and apparatus
JP2014045199A (ja) 接合装置、接合方法
JP2007276319A (ja) 基板プレス用補助プレート、配線基板ユニットの製造装置及び配線基板ユニットの製造方法。
JP2003062913A (ja) 基板ラミネート装置