JP5375607B2 - ウエハ接合方法、ウエハ接合装置およびウエハホルダ - Google Patents

ウエハ接合方法、ウエハ接合装置およびウエハホルダ Download PDF

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Publication number
JP5375607B2
JP5375607B2 JP2009520541A JP2009520541A JP5375607B2 JP 5375607 B2 JP5375607 B2 JP 5375607B2 JP 2009520541 A JP2009520541 A JP 2009520541A JP 2009520541 A JP2009520541 A JP 2009520541A JP 5375607 B2 JP5375607 B2 JP 5375607B2
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Japan
Prior art keywords
bonding
wafer
wafers
unit
wafer holder
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English (en)
Japanese (ja)
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JPWO2008156152A1 (ja
Inventor
栄裕 前田
和也 岡本
康明 田中
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Nikon Corp
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Nikon Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/16—Program controls
    • B25J9/1694—Program controls characterised by use of sensors other than normal servo-feedback from position, speed or acceleration sensors, perception control, multi-sensor controlled systems, sensor fusion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H10P72/0608—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Control Of Conveyors (AREA)
JP2009520541A 2007-06-21 2008-06-19 ウエハ接合方法、ウエハ接合装置およびウエハホルダ Active JP5375607B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009520541A JP5375607B2 (ja) 2007-06-21 2008-06-19 ウエハ接合方法、ウエハ接合装置およびウエハホルダ

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007164081 2007-06-21
JP2007164081 2007-06-21
PCT/JP2008/061267 WO2008156152A1 (ja) 2007-06-21 2008-06-19 搬送方法および搬送装置
JP2009520541A JP5375607B2 (ja) 2007-06-21 2008-06-19 ウエハ接合方法、ウエハ接合装置およびウエハホルダ

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013193139A Division JP5729440B2 (ja) 2007-06-21 2013-09-18 基板接合方法および基板接合装置

Publications (2)

Publication Number Publication Date
JPWO2008156152A1 JPWO2008156152A1 (ja) 2010-08-26
JP5375607B2 true JP5375607B2 (ja) 2013-12-25

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
JP2009520541A Active JP5375607B2 (ja) 2007-06-21 2008-06-19 ウエハ接合方法、ウエハ接合装置およびウエハホルダ
JP2013193139A Active JP5729440B2 (ja) 2007-06-21 2013-09-18 基板接合方法および基板接合装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2013193139A Active JP5729440B2 (ja) 2007-06-21 2013-09-18 基板接合方法および基板接合装置

Country Status (5)

Country Link
US (3) US8244399B2 (https=)
JP (2) JP5375607B2 (https=)
KR (2) KR20150067393A (https=)
TW (1) TWI533394B (https=)
WO (1) WO2008156152A1 (https=)

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DE102010048043A1 (de) 2010-10-15 2012-04-19 Ev Group Gmbh Vorrichtung und Verfahren zur Prozessierung von Wafern
JP5854375B2 (ja) * 2010-12-24 2016-02-09 ボンドテック株式会社 接合装置および接合方法
JP6031754B2 (ja) * 2011-12-12 2016-11-24 株式会社ニコン 基板重ね合わせ方法、積層半導体装置の製造方法、及び、基板重ね合わせ装置
JP5696076B2 (ja) * 2012-03-21 2015-04-08 株式会社東芝 半導体装置の検査装置及び半導体装置の検査方法
JP6105982B2 (ja) * 2012-09-21 2017-03-29 株式会社Ｓｃｒｅｅｎホールディングス スケジュール作成装置、基板処理装置、スケジュール作成プログラム、スケジュール作成方法、および基板処理方法
TWI625797B (zh) * 2012-10-26 2018-06-01 尼康股份有限公司 基板貼合裝置、基板位置配合裝置、基板貼合方法、及基板位置配合方法
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JP6305887B2 (ja) * 2014-09-16 2018-04-04 東芝メモリ株式会社 半導体装置の製造方法及び半導体製造装置
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JP6727048B2 (ja) * 2016-07-12 2020-07-22 東京エレクトロン株式会社 基板搬送装置および接合システム
JP6473116B2 (ja) * 2016-09-30 2019-02-20 ボンドテック株式会社 アライメント装置およびアライメント方法
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JP6574410B2 (ja) * 2016-12-07 2019-09-11 日本電信電話株式会社 半導体デバイスのウェハ接合方法
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NL1043633B1 (nl) * 2020-04-14 2021-10-26 Integrated Mech Solutions B V Inrichting en werkwijze voor het vervaardigen van voortbrengsels
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Also Published As

Publication number Publication date
TW200913120A (en) 2009-03-16
US20130274915A1 (en) 2013-10-17
JP2014057070A (ja) 2014-03-27
US8244399B2 (en) 2012-08-14
JP5729440B2 (ja) 2015-06-03
KR20100041751A (ko) 2010-04-22
US8489227B2 (en) 2013-07-16
US20100168908A1 (en) 2010-07-01
US20120330459A1 (en) 2012-12-27
KR20150067393A (ko) 2015-06-17
JPWO2008156152A1 (ja) 2010-08-26
WO2008156152A1 (ja) 2008-12-24
TWI533394B (zh) 2016-05-11

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