TWI525732B - 電子零件搬送裝置及包帶單元 - Google Patents

電子零件搬送裝置及包帶單元 Download PDF

Info

Publication number
TWI525732B
TWI525732B TW101103881A TW101103881A TWI525732B TW I525732 B TWI525732 B TW I525732B TW 101103881 A TW101103881 A TW 101103881A TW 101103881 A TW101103881 A TW 101103881A TW I525732 B TWI525732 B TW I525732B
Authority
TW
Taiwan
Prior art keywords
electronic component
indentation
belt
image
transport
Prior art date
Application number
TW101103881A
Other languages
English (en)
Chinese (zh)
Other versions
TW201246425A (en
Inventor
白石一成
的場隆行
Original Assignee
上野精機股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 上野精機股份有限公司 filed Critical 上野精機股份有限公司
Publication of TW201246425A publication Critical patent/TW201246425A/zh
Application granted granted Critical
Publication of TWI525732B publication Critical patent/TWI525732B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B15/00—Attaching articles to cards, sheets, strings, webs, or other carriers
    • B65B15/04—Attaching a series of articles, e.g. small electrical components, to a continuous web
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers
TW101103881A 2011-02-09 2012-02-07 電子零件搬送裝置及包帶單元 TWI525732B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2011/000716 WO2012107956A1 (fr) 2011-02-09 2011-02-09 Appareil de transfert de composant électronique et unité de conditionnement en bande alvéolée

Publications (2)

Publication Number Publication Date
TW201246425A TW201246425A (en) 2012-11-16
TWI525732B true TWI525732B (zh) 2016-03-11

Family

ID=46638202

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101103881A TWI525732B (zh) 2011-02-09 2012-02-07 電子零件搬送裝置及包帶單元

Country Status (5)

Country Link
JP (1) JP5674060B2 (fr)
CN (1) CN103339031B (fr)
HK (1) HK1185850A1 (fr)
TW (1) TWI525732B (fr)
WO (1) WO2012107956A1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014087485A1 (fr) * 2012-12-04 2014-06-12 上野精機株式会社 Dispositif d'acheminement de composant électronique et unité à enrubanner
JP5544461B1 (ja) * 2013-01-15 2014-07-09 上野精機株式会社 姿勢補正装置、電子部品搬送装置、及び電子部品移載装置
TWI494576B (zh) * 2013-12-03 2015-08-01 Tohoku Seiki Ind Co Ltd IC processor
WO2015151276A1 (fr) * 2014-04-04 2015-10-08 上野精機株式会社 Unité de boîtier et dispositif de transport de composants électroniques
JP5835825B1 (ja) * 2014-11-19 2015-12-24 上野精機株式会社 キャリアテープ走行装置及び電子部品搬送装置
US11477928B2 (en) 2017-06-06 2022-10-18 Yamaha Hatsudoki Kabushiki Kaisha Component mounting device
TWI644837B (zh) * 2017-11-14 2018-12-21 陳子忠 Parallel method for packaging electronic components and coating adhesive on carrier tape and mechanism thereof
JP7016761B2 (ja) * 2018-04-11 2022-02-07 ワイエイシイガーター株式会社 テープ送り装置
JP7359594B2 (ja) 2019-08-23 2023-10-11 太陽誘電株式会社 テーピング装置およびテーピング方法
CN111891792B (zh) * 2020-08-25 2022-05-13 重庆鼎佳绝缘材料有限公司 泡棉用异步贴片机

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5969939A (ja) * 1982-10-15 1984-04-20 Toshiba Corp ワイヤボンデイング方法およびその装置
JPH07263517A (ja) * 1994-03-24 1995-10-13 Hitachi Electron Eng Co Ltd Ｉｃソケットの位置決め装置
JP2000100858A (ja) * 1998-09-18 2000-04-07 Shibaura Mechatronics Corp 部品実装装置およびその装置における撮像オフセットの校正方法
JP2002347710A (ja) * 2001-05-28 2002-12-04 Yayoi Kk キャリアテープ及びその走行駆動装置
JP2003095211A (ja) * 2001-09-18 2003-04-03 Shin Etsu Polymer Co Ltd エンボスキャリアテープ、その製造方法及び製造装置
JP4202102B2 (ja) * 2002-12-03 2008-12-24 上野精機株式会社 半導体装置のテーピング装置
JP2004288715A (ja) * 2003-03-19 2004-10-14 Nec Machinery Corp ダイボンダ
JP2006244559A (ja) * 2005-03-01 2006-09-14 Ricoh Co Ltd プリントコイル基板の取り付け位置調整方法および、その装置
KR100992655B1 (ko) * 2005-08-04 2010-11-05 우에노 세이끼 가부시키가이샤 전자 부품 제조 장치, 전자 부품 제조 장치의 제어 방법 및 제어 프로그램을 기록한 컴퓨터로 판독가능한 기록 매체
JP4848160B2 (ja) * 2005-09-08 2011-12-28 株式会社 東京ウエルズ 外観検査装置
JP2007179389A (ja) * 2005-12-28 2007-07-12 Nikon Corp 撮影装置
JP5233009B2 (ja) * 2007-11-12 2013-07-10 日東工業株式会社 チップ装填手段
JP2009154889A (ja) * 2007-12-25 2009-07-16 Canon Machinery Inc 部品供給装置及びテーピング装置
JP2011011748A (ja) * 2009-06-30 2011-01-20 Tesetsuku:Kk テーピング装置

Also Published As

Publication number Publication date
HK1185850A1 (zh) 2014-02-28
JP5674060B2 (ja) 2015-02-25
TW201246425A (en) 2012-11-16
CN103339031A (zh) 2013-10-02
WO2012107956A1 (fr) 2012-08-16
CN103339031B (zh) 2016-01-20
JPWO2012107956A1 (ja) 2014-07-03

Similar Documents

Publication Publication Date Title
TWI525732B (zh) 電子零件搬送裝置及包帶單元
JP5183220B2 (ja) 部品分類装置および前記装置を用いた電子部品特性検査分類装置
TWI571188B (zh) 編帶單元及電子零件檢查裝置
WO2015083414A1 (fr) Appareil de transport de composant électronique
CN104422699B (zh) 外观检查装置
JP2009154889A (ja) 部品供給装置及びテーピング装置
TW201036032A (en) Method and device for filling carrier tapes with electronic components
JP5765864B2 (ja) 電子部品搬送装置及びテーピングユニット
JP6301635B2 (ja) 基板検査方法
WO2015151276A1 (fr) Unité de boîtier et dispositif de transport de composants électroniques
JP2018098333A (ja) 電子部品搬送装置
JP2008285179A (ja) テーピング装置及びその制御方法
JP2004182293A (ja) 半導体装置のテーピング装置
KR101360111B1 (ko) 부품분류장치 및 이 장치를 이용한 전자부품 특성검사분류장치
KR20150109132A (ko) 반도체 패키지 핸들러
JP4713776B2 (ja) 電気部品供給システム
JP5787397B2 (ja) 電子部品実装装置および電子部品実装方法
JP5761772B1 (ja) 電子部品搬送装置
JPWO2017064777A1 (ja) 部品実装装置
TWM521802U (zh) 封裝晶片檢測裝置及其晶片轉向模組
JP6056059B2 (ja) 部品実装装置、位置補正方法、基板の製造方法及び情報処理装置
JP2011075450A (ja) 特性検査装置及びテーピング装置
CN220359671U (zh) 部件的取出装置、电子部件的制造装置
JPWO2019012576A1 (ja) 撮像装置、表面実装機及び検査装置
JP6556200B2 (ja) 電子部品実装装置、基板の製造方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees