TWI483253B - 源極側非對稱預充電程式化設計 - Google Patents
源極側非對稱預充電程式化設計 Download PDFInfo
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- TWI483253B TWI483253B TW097104918A TW97104918A TWI483253B TW I483253 B TWI483253 B TW I483253B TW 097104918 A TW097104918 A TW 097104918A TW 97104918 A TW97104918 A TW 97104918A TW I483253 B TWI483253 B TW I483253B
- Authority
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- Taiwan
- Prior art keywords
- memory cell
- voltage
- stylized
- selected memory
- channel
- Prior art date
Links
- 238000000034 method Methods 0.000 claims description 61
- 230000008878 coupling Effects 0.000 claims description 30
- 238000010168 coupling process Methods 0.000 claims description 30
- 238000005859 coupling reaction Methods 0.000 claims description 30
- 230000004044 response Effects 0.000 claims description 5
- 238000013461 design Methods 0.000 description 35
- 238000010586 diagram Methods 0.000 description 30
- 238000004088 simulation Methods 0.000 description 21
- 238000007667 floating Methods 0.000 description 11
- 238000003860 storage Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 238000012545 processing Methods 0.000 description 9
- 230000002829 reductive effect Effects 0.000 description 9
- 230000005641 tunneling Effects 0.000 description 7
- 238000009826 distribution Methods 0.000 description 5
- 230000000087 stabilizing effect Effects 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 230000006870 function Effects 0.000 description 4
- 230000001419 dependent effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000001808 coupling effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/34—Determination of programming status, e.g. threshold voltage, overprogramming or underprogramming, retention
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0483—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells having several storage transistors connected in series
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/08—Address circuits; Decoders; Word-line control circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/10—Programming or data input circuits
- G11C16/12—Programming voltage switching circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/30—Power supply circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/10—Programming or data input circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Read Only Memory (AREA)
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US88863807P | 2007-02-07 | 2007-02-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200901198A TW200901198A (en) | 2009-01-01 |
| TWI483253B true TWI483253B (zh) | 2015-05-01 |
Family
ID=39676017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097104918A TWI483253B (zh) | 2007-02-07 | 2008-02-12 | 源極側非對稱預充電程式化設計 |
Country Status (8)
| Country | Link |
|---|---|
| US (3) | US7952929B2 (enExample) |
| EP (2) | EP2122628B1 (enExample) |
| JP (2) | JP5279729B2 (enExample) |
| KR (1) | KR101444491B1 (enExample) |
| CN (2) | CN101617370B (enExample) |
| CA (1) | CA2672245A1 (enExample) |
| TW (1) | TWI483253B (enExample) |
| WO (1) | WO2008095294A1 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI822270B (zh) * | 2022-08-24 | 2023-11-11 | 旺宏電子股份有限公司 | 記憶體裝置及其程式化方法 |
| US12237024B2 (en) | 2022-08-24 | 2025-02-25 | Macronix International Co., Ltd. | Memory device and programming method thereof |
Families Citing this family (64)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8280431B2 (en) | 2006-12-29 | 2012-10-02 | Intel Corporation | Apparatus for end-user transparent utilization of computational, storage, and network capacity of mobile devices, and associated methods |
| JP5136328B2 (ja) * | 2008-09-26 | 2013-02-06 | 富士通セミコンダクター株式会社 | 半導体メモリ、半導体メモリの動作方法およびシステム |
| KR101036720B1 (ko) * | 2009-02-02 | 2011-05-24 | 주식회사 하이닉스반도체 | 불휘발성 메모리 소자의 동작 방법 |
| US8638609B2 (en) | 2010-05-19 | 2014-01-28 | Spansion Llc | Partial local self boosting for NAND |
| US8472271B2 (en) | 2011-02-18 | 2013-06-25 | International Business Machines Corporation | Systems and methods for memory device precharging |
| US8614918B2 (en) | 2011-05-02 | 2013-12-24 | Micron Technology, Inc. | Memory apparatus and methods |
| JP2013058276A (ja) * | 2011-09-07 | 2013-03-28 | Toshiba Corp | 半導体記憶装置 |
| JP5254413B2 (ja) * | 2011-09-22 | 2013-08-07 | 株式会社東芝 | 不揮発性半導体記憶装置 |
| US8842479B2 (en) * | 2011-10-11 | 2014-09-23 | Macronix International Co., Ltd. | Low voltage programming in NAND flash with two stage source side bias |
| KR20130044693A (ko) * | 2011-10-24 | 2013-05-03 | 에스케이하이닉스 주식회사 | 반도체 메모리 장치 및 그 동작 방법 |
| US9171627B2 (en) * | 2012-04-11 | 2015-10-27 | Aplus Flash Technology, Inc. | Non-boosting program inhibit scheme in NAND design |
| US8982625B2 (en) | 2012-08-31 | 2015-03-17 | Micron Technology, Inc. | Memory program disturb reduction |
| JP2015026406A (ja) * | 2013-07-24 | 2015-02-05 | 株式会社東芝 | 不揮発性半導体記憶装置 |
| KR102179845B1 (ko) | 2014-02-03 | 2020-11-17 | 삼성전자주식회사 | 비휘발성 메모리 장치 및 그것의 프로그램 방법 |
| KR102210328B1 (ko) | 2014-02-12 | 2021-02-01 | 삼성전자주식회사 | 불휘발성 메모리 장치, 메모리 시스템 및 불휘발성 메모리 장치의 동작 방법 |
| US9396791B2 (en) | 2014-07-18 | 2016-07-19 | Micron Technology, Inc. | Programming memories with multi-level pass signal |
| CN105427884B (zh) * | 2014-09-12 | 2019-06-28 | 上海华虹宏力半导体制造有限公司 | 一种新的x译码器电路 |
| US9368222B2 (en) | 2014-10-01 | 2016-06-14 | Sandisk Technologies Inc. | Bit line pre-charge with current reduction |
| US9472288B2 (en) * | 2014-10-29 | 2016-10-18 | Hewlett-Packard Development Company, L.P. | Mitigating parasitic current while programming a floating gate memory array |
| KR102222594B1 (ko) | 2014-11-13 | 2021-03-08 | 삼성전자주식회사 | 비휘발성 메모리 장치, 그것의 소거 방법, 및 그것을 포함하는 메모리 시스템 |
| JP5992983B2 (ja) * | 2014-12-03 | 2016-09-14 | ウィンボンド エレクトロニクス コーポレーション | 不揮発性半導体記憶装置 |
| WO2016186086A1 (ja) * | 2015-05-15 | 2016-11-24 | 国立大学法人東北大学 | 抵抗変化型素子を備えた記憶回路 |
| US9947418B2 (en) * | 2016-04-12 | 2018-04-17 | Micron Technology, Inc. | Boosted channel programming of memory |
| US9779819B1 (en) | 2016-06-24 | 2017-10-03 | Micron Technology, Inc. | Connecting memory cells to a data line sequentially while applying a program voltage to the memory cells |
| KR102469684B1 (ko) * | 2016-06-30 | 2022-11-22 | 에스케이하이닉스 주식회사 | 반도체 메모리 장치의 프로그램 방법 |
| US9640273B1 (en) | 2016-08-25 | 2017-05-02 | Sandisk Technologies Llc | Mitigating hot electron program disturb |
| KR102656828B1 (ko) | 2017-01-05 | 2024-04-18 | 에스케이하이닉스 주식회사 | 메모리 장치 및 이의 동작 방법 |
| KR102295521B1 (ko) | 2017-03-16 | 2021-08-30 | 삼성전자 주식회사 | 비휘발성 메모리 장치 및 비휘발성 메모리 장치의 프로그램 방법 |
| WO2018186853A1 (en) * | 2017-04-05 | 2018-10-11 | Hewlett-Packard Development Company, L.P. | On-die actuator evaluation with pre-charged thresholds |
| KR102289598B1 (ko) | 2017-06-26 | 2021-08-18 | 삼성전자주식회사 | 불휘발성 메모리 장치 및 그것을 포함하는 메모리 시스템 그리고 그것의 프로그램 방법 |
| US11232841B2 (en) | 2017-09-05 | 2022-01-25 | Samsung Electronics Co., Ltd. | Methods of operating memory devices based on sub-block positions and related memory system |
| KR102336659B1 (ko) * | 2017-09-05 | 2021-12-07 | 삼성전자 주식회사 | 데이터 신뢰성을 향상시키기 위한 메모리 동작을 수행하는 메모리 장치, 이를 포함하는 메모리 시스템 및 메모리 장치의 동작 방법 |
| US11152074B2 (en) * | 2018-02-28 | 2021-10-19 | Samsung Electronics Co., Ltd. | Memory device with improved program performance and method of operating the same |
| KR102441580B1 (ko) * | 2018-02-28 | 2022-09-07 | 삼성전자주식회사 | 프로그램 성능이 개선된 메모리 장치 및 이의 동작방법 |
| US11217311B2 (en) | 2018-02-28 | 2022-01-04 | Samsung Electronics Co., Ltd. | Memory device with improved program performance and method of operating the same |
| KR102532998B1 (ko) | 2018-04-16 | 2023-05-16 | 삼성전자주식회사 | 비휘발성 메모리 장치 및 비휘발성 메모리 장치의 프로그램 방법 |
| US10643718B2 (en) | 2018-06-07 | 2020-05-05 | Sandisk Technologies Llc | Non-volatile memory with countermeasure for program disturb including purge during precharge |
| US10541037B2 (en) | 2018-06-07 | 2020-01-21 | Sandisk Technologies Llc | Non-volatile memory with countermeasure for program disturb including delayed ramp down during program verify |
| US10580504B2 (en) | 2018-06-07 | 2020-03-03 | Sandisk Technologies Llc | Non-volatile memory with countermeasure for program disturb including spike during boosting |
| US10553298B1 (en) | 2018-07-27 | 2020-02-04 | Sandisk Technologies Llc | Non-volatile memory with countermeasure for select gate disturb |
| US10559368B1 (en) | 2018-08-07 | 2020-02-11 | Sandisk Technologies Llc | Non-volatile memory with countermeasures for select gate disturb during program pre-charge |
| US10665300B1 (en) | 2018-11-12 | 2020-05-26 | Micron Technology, Inc. | Apparatus and methods for discharging control gates after performing an access operation on a memory cell |
| US10726920B2 (en) | 2018-11-26 | 2020-07-28 | Sandisk Technologies Llc | Pre-charge voltage for inhibiting unselected NAND memory cell programming |
| CN110289034A (zh) * | 2019-06-28 | 2019-09-27 | 长江存储科技有限责任公司 | 非易失性存储器及其操作方法 |
| KR102757291B1 (ko) * | 2019-08-01 | 2025-01-20 | 에스케이하이닉스 주식회사 | 메모리 장치 및 이의 동작 방법 |
| JP2021047939A (ja) | 2019-09-17 | 2021-03-25 | キオクシア株式会社 | 半導体記憶装置 |
| KR20250070140A (ko) | 2019-10-22 | 2025-05-20 | 양쯔 메모리 테크놀로지스 씨오., 엘티디. | 비휘발성 메모리 장치 및 제어 방법 |
| CN114467143A (zh) * | 2019-11-14 | 2022-05-10 | 长江存储科技有限责任公司 | 用于执行编程操作的方法及相关的存储器件 |
| EP3915115B1 (en) * | 2019-11-28 | 2023-07-19 | Yangtze Memory Technologies Co., Ltd. | Methods of enhancing speed of reading data from memory device |
| KR20210089385A (ko) * | 2020-01-08 | 2021-07-16 | 에스케이하이닉스 주식회사 | 메모리 장치 및 그 동작 방법 |
| WO2021155524A1 (en) | 2020-02-06 | 2021-08-12 | Yangtze Memory Technologies Co., Ltd. | Method of programming 3d memory device and related 3d memory device |
| US10957394B1 (en) | 2020-02-10 | 2021-03-23 | Sandisk Technologies Llc | NAND string pre-charge during programming by injecting holes via substrate |
| US11081162B1 (en) * | 2020-02-24 | 2021-08-03 | Sandisk Technologies Llc | Source side precharge and boosting improvement for reverse order program |
| JP6966587B2 (ja) | 2020-03-02 | 2021-11-17 | ウィンボンド エレクトロニクス コーポレーション | 半導体記憶装置および読出し方法 |
| KR102897358B1 (ko) * | 2020-07-30 | 2025-12-05 | 삼성전자 주식회사 | 프로그래밍 동안 양방향 채널 프리차지를 수행하는 비휘발성 메모리 장치 |
| CN117423375A (zh) * | 2020-12-15 | 2024-01-19 | 长江存储科技有限责任公司 | 用于nand存储器操作的架构和方法 |
| US11901010B2 (en) | 2020-12-16 | 2024-02-13 | Micron Technology, Inc. | Enhanced gradient seeding scheme during a program operation in a memory sub-system |
| TWI736495B (zh) * | 2020-12-30 | 2021-08-11 | 旺宏電子股份有限公司 | 用於記憶裝置之編程方法 |
| CN114822615A (zh) * | 2021-01-20 | 2022-07-29 | 长江存储科技有限责任公司 | 存储器的编程操作方法及装置 |
| JP7677611B2 (ja) | 2021-03-03 | 2025-05-15 | 国立大学法人東北大学 | 抵抗変化型素子を備えた記憶回路 |
| US12230328B2 (en) | 2021-11-25 | 2025-02-18 | Samsung Electronics Co., Ltd. | Semiconductor device |
| US20240079069A1 (en) * | 2022-08-23 | 2024-03-07 | Samsung Electronics Co., Ltd. | Operation method of memory device |
| US12488846B2 (en) * | 2023-04-24 | 2025-12-02 | SanDisk Technologies, Inc. | Negative word line enabled pre-boosting strategy to improve NAND program performance |
| TWI855786B (zh) * | 2023-07-21 | 2024-09-11 | 旺宏電子股份有限公司 | 記憶體裝置及其預充電方法 |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6717847B2 (en) * | 2001-09-17 | 2004-04-06 | Sandisk Corporation | Selective operation of a multi-state non-volatile memory system in a binary mode |
| US20050207220A1 (en) * | 2004-03-16 | 2005-09-22 | Ken Takeuchi | Nonvolatile semiconductor memory |
| US20050213385A1 (en) * | 2004-03-29 | 2005-09-29 | Kabushiki Kaisha Toshiba | Semiconductor memory device |
| US20050226055A1 (en) * | 2004-04-13 | 2005-10-13 | Guterman Daniel C | Programming inhibit for non-volatile memory |
| US20050232012A1 (en) * | 2004-04-19 | 2005-10-20 | Hynix Semiconductor Inc. | NAND flash memory device and method of programming the same |
| US20060002167A1 (en) * | 2004-06-30 | 2006-01-05 | Micron Technology, Inc. | Minimizing adjacent wordline disturb in a memory device |
| US20060044872A1 (en) * | 2004-09-02 | 2006-03-02 | Nazarian Hagop A | NAND flash depletion cell structure |
| US20060227613A1 (en) * | 2005-04-11 | 2006-10-12 | Hynix Semiconductor Inc. | Non-volatile memory device and method of preventing hot electron program disturb phenomenon |
| US20060245252A1 (en) * | 2005-04-27 | 2006-11-02 | Micron Technology, Inc. | Flash memory programming to reduce program disturb |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6230233B1 (en) * | 1991-09-13 | 2001-05-08 | Sandisk Corporation | Wear leveling techniques for flash EEPROM systems |
| KR960000616B1 (ko) * | 1993-01-13 | 1996-01-10 | 삼성전자주식회사 | 불휘발성 반도체 메모리 장치 |
| KR950015768A (ko) * | 1993-11-17 | 1995-06-17 | 김광호 | 불휘발성 반도체 메모리 장치의 배선단락 검출회로 및 그 방법 |
| US5729683A (en) * | 1995-05-18 | 1998-03-17 | Compaq Computer Corporation | Programming memory devices through the parallel port of a computer system |
| US5715194A (en) * | 1996-07-24 | 1998-02-03 | Advanced Micro Devices, Inc. | Bias scheme of program inhibit for random programming in a nand flash memory |
| KR100272037B1 (ko) * | 1997-02-27 | 2000-12-01 | 니시무로 타이죠 | 불휘발성 반도체 기억 장치 |
| JPH10302488A (ja) * | 1997-02-27 | 1998-11-13 | Toshiba Corp | 不揮発性半導体記憶装置 |
| KR100496797B1 (ko) * | 1997-12-29 | 2005-09-05 | 삼성전자주식회사 | 반도체메모리장치의프로그램방법 |
| KR100297602B1 (ko) * | 1997-12-31 | 2001-08-07 | 윤종용 | 비휘발성메모리장치의프로그램방법 |
| US6453365B1 (en) * | 1998-02-11 | 2002-09-17 | Globespanvirata, Inc. | Direct memory access controller having decode circuit for compact instruction format |
| JP3863330B2 (ja) * | 1999-09-28 | 2006-12-27 | 株式会社東芝 | 不揮発性半導体メモリ |
| JP3810985B2 (ja) * | 2000-05-22 | 2006-08-16 | 株式会社東芝 | 不揮発性半導体メモリ |
| EP1191542B1 (en) | 2000-09-22 | 2008-10-29 | SAMSUNG ELECTRONICS Co. Ltd. | Driving circuits for a memory cell array in a NAND-type flash memory device |
| JP3829088B2 (ja) * | 2001-03-29 | 2006-10-04 | 株式会社東芝 | 半導体記憶装置 |
| US20020161941A1 (en) * | 2001-04-30 | 2002-10-31 | Sony Corporation And Electronics, Inc | System and method for efficiently performing a data transfer operation |
| US6456528B1 (en) * | 2001-09-17 | 2002-09-24 | Sandisk Corporation | Selective operation of a multi-state non-volatile memory system in a binary mode |
| JP2003151289A (ja) * | 2001-11-09 | 2003-05-23 | Toshiba Corp | 不揮発性半導体メモリ及びその書き込み方法 |
| US6807106B2 (en) * | 2001-12-14 | 2004-10-19 | Sandisk Corporation | Hybrid density memory card |
| US6859397B2 (en) * | 2003-03-05 | 2005-02-22 | Sandisk Corporation | Source side self boosting technique for non-volatile memory |
| JP4398750B2 (ja) * | 2004-02-17 | 2010-01-13 | 株式会社東芝 | Nand型フラッシュメモリ |
| JP4728726B2 (ja) * | 2005-07-25 | 2011-07-20 | 株式会社東芝 | 半導体記憶装置 |
| JP4891580B2 (ja) * | 2005-08-31 | 2012-03-07 | 株式会社東芝 | 不揮発性半導体記憶装置 |
| US7561472B2 (en) * | 2006-09-11 | 2009-07-14 | Micron Technology, Inc. | NAND architecture memory with voltage sensing |
| US7511996B2 (en) * | 2006-11-30 | 2009-03-31 | Mosaid Technologies Incorporated | Flash memory program inhibit scheme |
| JP2008146771A (ja) * | 2006-12-12 | 2008-06-26 | Toshiba Corp | 半導体記憶装置 |
| KR100961196B1 (ko) * | 2007-06-29 | 2010-06-10 | 주식회사 하이닉스반도체 | 리드 디스터브가 억제되도록 하는 플래시 메모리소자의리드 방법 |
| KR101259792B1 (ko) * | 2007-07-10 | 2013-05-02 | 삼성전자주식회사 | 낸드 플래시 메모리 소자의 읽기 방법 |
| US7751245B2 (en) * | 2007-10-10 | 2010-07-06 | Micron Technology, Inc. | Programming sequence in NAND memory |
| US7782674B2 (en) * | 2007-10-18 | 2010-08-24 | Micron Technology, Inc. | Sensing of memory cells in NAND flash |
-
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- 2008-02-06 JP JP2009548552A patent/JP5279729B2/ja not_active Expired - Fee Related
- 2008-02-06 WO PCT/CA2008/000232 patent/WO2008095294A1/en not_active Ceased
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- 2008-02-06 KR KR1020097018585A patent/KR101444491B1/ko active Active
- 2008-02-06 CN CN2012105707999A patent/CN103137200A/zh active Pending
- 2008-02-06 CA CA002672245A patent/CA2672245A1/en not_active Abandoned
- 2008-02-06 EP EP12168362A patent/EP2490225A1/en not_active Withdrawn
- 2008-02-12 TW TW097104918A patent/TWI483253B/zh not_active IP Right Cessation
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Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6717847B2 (en) * | 2001-09-17 | 2004-04-06 | Sandisk Corporation | Selective operation of a multi-state non-volatile memory system in a binary mode |
| US20050207220A1 (en) * | 2004-03-16 | 2005-09-22 | Ken Takeuchi | Nonvolatile semiconductor memory |
| US20050213385A1 (en) * | 2004-03-29 | 2005-09-29 | Kabushiki Kaisha Toshiba | Semiconductor memory device |
| US20050226055A1 (en) * | 2004-04-13 | 2005-10-13 | Guterman Daniel C | Programming inhibit for non-volatile memory |
| US20050232012A1 (en) * | 2004-04-19 | 2005-10-20 | Hynix Semiconductor Inc. | NAND flash memory device and method of programming the same |
| US20060002167A1 (en) * | 2004-06-30 | 2006-01-05 | Micron Technology, Inc. | Minimizing adjacent wordline disturb in a memory device |
| US20060044872A1 (en) * | 2004-09-02 | 2006-03-02 | Nazarian Hagop A | NAND flash depletion cell structure |
| US20060227613A1 (en) * | 2005-04-11 | 2006-10-12 | Hynix Semiconductor Inc. | Non-volatile memory device and method of preventing hot electron program disturb phenomenon |
| US20060245252A1 (en) * | 2005-04-27 | 2006-11-02 | Micron Technology, Inc. | Flash memory programming to reduce program disturb |
Non-Patent Citations (1)
| Title |
|---|
| Takeuchi, K. et al., "A 56nm CMOS 99mm2 8Gb Multi-level NAND Flash Memory with 10MB/s Program Throughput", Solid-State Circuits, 2006 IEEE International Conference Digest of Technical Papers, Feb. 6-9, 2006 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI822270B (zh) * | 2022-08-24 | 2023-11-11 | 旺宏電子股份有限公司 | 記憶體裝置及其程式化方法 |
| US12237024B2 (en) | 2022-08-24 | 2025-02-25 | Macronix International Co., Ltd. | Memory device and programming method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2122628A1 (en) | 2009-11-25 |
| EP2122628B1 (en) | 2012-05-30 |
| CN101617370A (zh) | 2009-12-30 |
| JP2011076715A (ja) | 2011-04-14 |
| TW200901198A (en) | 2009-01-01 |
| JP5279729B2 (ja) | 2013-09-04 |
| CA2672245A1 (en) | 2008-08-14 |
| JP5476572B2 (ja) | 2014-04-23 |
| JP2010518538A (ja) | 2010-05-27 |
| US8537617B2 (en) | 2013-09-17 |
| CN103137200A (zh) | 2013-06-05 |
| KR101444491B1 (ko) | 2014-09-24 |
| CN101617370B (zh) | 2014-07-16 |
| US8139414B2 (en) | 2012-03-20 |
| WO2008095294A1 (en) | 2008-08-14 |
| US20110194351A1 (en) | 2011-08-11 |
| US20120262986A1 (en) | 2012-10-18 |
| EP2490225A1 (en) | 2012-08-22 |
| EP2122628A4 (en) | 2010-02-24 |
| KR20090117794A (ko) | 2009-11-12 |
| US7952929B2 (en) | 2011-05-31 |
| US20080186776A1 (en) | 2008-08-07 |
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