TWI461252B - A bonding method, a bonding structure, an electronic device, an electronic device manufacturing method, and an electronic component - Google Patents

A bonding method, a bonding structure, an electronic device, an electronic device manufacturing method, and an electronic component Download PDF

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Publication number
TWI461252B
TWI461252B TW100147807A TW100147807A TWI461252B TW I461252 B TWI461252 B TW I461252B TW 100147807 A TW100147807 A TW 100147807A TW 100147807 A TW100147807 A TW 100147807A TW I461252 B TWI461252 B TW I461252B
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TW
Taiwan
Prior art keywords
metal
melting point
metal member
alloy
bonding
Prior art date
Application number
TW100147807A
Other languages
English (en)
Chinese (zh)
Other versions
TW201233485A (en
Inventor
中野公介
高岡英清
Original Assignee
村田製作所股份有限公司
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Publication of TW201233485A publication Critical patent/TW201233485A/zh
Application granted granted Critical
Publication of TWI461252B publication Critical patent/TWI461252B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0233—Sheets or foils
    • B23K35/0238—Sheets or foils layered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/05—Alloys based on copper with manganese as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/346—Solder materials or compositions specially adapted therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Die Bonding (AREA)
TW100147807A 2010-12-24 2011-12-21 A bonding method, a bonding structure, an electronic device, an electronic device manufacturing method, and an electronic component TWI461252B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010287782 2010-12-24
JP2011159922 2011-07-21

Publications (2)

Publication Number Publication Date
TW201233485A TW201233485A (en) 2012-08-16
TWI461252B true TWI461252B (zh) 2014-11-21

Family

ID=46314012

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100147807A TWI461252B (zh) 2010-12-24 2011-12-21 A bonding method, a bonding structure, an electronic device, an electronic device manufacturing method, and an electronic component

Country Status (7)

Country Link
US (2) US9209527B2 (enExample)
EP (1) EP2656955B1 (enExample)
JP (2) JP5664664B2 (enExample)
KR (1) KR101528515B1 (enExample)
CN (1) CN103167926B (enExample)
TW (1) TWI461252B (enExample)
WO (1) WO2012086745A1 (enExample)

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WO2015105088A1 (ja) * 2014-01-07 2015-07-16 株式会社村田製作所 構造材接合方法、接合用シートおよび接合構造
WO2015159784A1 (ja) * 2014-04-18 2015-10-22 株式会社村田製作所 被着体の接着分離方法、金属複合材料
JP6287739B2 (ja) * 2014-09-30 2018-03-07 株式会社村田製作所 ステンドグラスの製造方法
CN105081500B (zh) * 2015-09-02 2017-02-22 哈尔滨工业大学 一种使用激光前向转印具有特定晶粒取向和数量薄膜诱发金属间化合物生长的方法
WO2017047293A1 (ja) 2015-09-15 2017-03-23 株式会社村田製作所 接合用部材、接合用部材の製造方法、および、接合方法
WO2017056842A1 (ja) 2015-09-28 2017-04-06 株式会社村田製作所 ヒートパイプ、放熱部品、ヒートパイプの製造方法
WO2017077824A1 (ja) * 2015-11-05 2017-05-11 株式会社村田製作所 接合用部材、および、接合用部材の製造方法
CN108430690B (zh) * 2016-02-01 2021-05-14 株式会社村田制作所 接合材料、使用该接合材料的接合方法和接合结构
JP6621068B2 (ja) * 2016-12-08 2019-12-18 パナソニックＩｐマネジメント株式会社 実装構造体
JP6355091B1 (ja) * 2017-03-07 2018-07-11 パナソニックＩｐマネジメント株式会社 はんだ合金およびそれを用いた接合構造体
JPWO2018174066A1 (ja) * 2017-03-23 2020-01-23 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
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JP6998557B2 (ja) * 2017-09-29 2022-01-18 パナソニックＩｐマネジメント株式会社 はんだ合金およびそれを用いた接合構造体
CN108098172B (zh) * 2017-12-01 2020-03-27 北京工业大学 一种实现Cu/Sn/Cu界面可逆连接的方法
KR102574413B1 (ko) * 2018-12-10 2023-09-04 삼성전기주식회사 코일 전자 부품
US11581239B2 (en) * 2019-01-18 2023-02-14 Indium Corporation Lead-free solder paste as thermal interface material
KR102148297B1 (ko) * 2019-03-06 2020-08-26 성균관대학교산학협력단 이종 금속 재료 간의 접합을 위한 천이액상소결접합 방법
CN109822256B (zh) * 2019-03-15 2021-08-06 南昌大学 一种低熔点In-Sn-Bi合金钎料及制备方法
CN114173983A (zh) * 2019-07-26 2022-03-11 日本斯倍利亚社股份有限公司 预制焊料和使用该预制焊料形成的焊料接合体
US12521822B2 (en) * 2019-09-02 2026-01-13 Nihon Superior Co., Ltd. Sn solder paste comprising cu-co metal particles
CN113275787B (zh) * 2020-01-31 2023-05-30 铟泰公司 作为热界面材料的无铅焊料膏
WO2021177006A1 (ja) * 2020-03-06 2021-09-10 三菱電機株式会社 薄板状接合部材およびその製造方法、半導体装置およびその製造方法、ならびに、電力変換装置
JP6799701B1 (ja) * 2020-03-12 2020-12-16 有限会社 ナプラ 金属粒子

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Also Published As

Publication number Publication date
US20130299236A1 (en) 2013-11-14
JP2014223678A (ja) 2014-12-04
TW201233485A (en) 2012-08-16
JP5907215B2 (ja) 2016-04-26
JPWO2012086745A1 (ja) 2014-06-05
EP2656955A4 (en) 2017-07-19
EP2656955A1 (en) 2013-10-30
US9209527B2 (en) 2015-12-08
CN103167926A (zh) 2013-06-19
WO2012086745A1 (ja) 2012-06-28
EP2656955B1 (en) 2021-08-04
CN103167926B (zh) 2016-03-09
US9614295B2 (en) 2017-04-04
US20160043480A1 (en) 2016-02-11
KR20130077873A (ko) 2013-07-09
KR101528515B1 (ko) 2015-06-12
JP5664664B2 (ja) 2015-02-04

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