CN103167926B - 接合方法、接合结构、电子装置及其制造方法、电子部件 - Google Patents

接合方法、接合结构、电子装置及其制造方法、电子部件 Download PDF

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Publication number
CN103167926B
CN103167926B CN201180049028.9A CN201180049028A CN103167926B CN 103167926 B CN103167926 B CN 103167926B CN 201180049028 A CN201180049028 A CN 201180049028A CN 103167926 B CN103167926 B CN 103167926B
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metal
metal member
low
melting
joining
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CN103167926A (zh
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中野公介
高冈英清
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233—Sheets, foils
    • B23K35/0238—Sheets, foils layered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/05—Alloys based on copper with manganese as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Die Bonding (AREA)
CN201180049028.9A 2010-12-24 2011-12-22 接合方法、接合结构、电子装置及其制造方法、电子部件 Active CN103167926B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2010287782 2010-12-24
JP2010-287782 2010-12-24
JP2011-159922 2011-07-21
JP2011159922 2011-07-21
PCT/JP2011/079781 WO2012086745A1 (ja) 2010-12-24 2011-12-22 接合方法、接合構造、電子装置、電子装置の製造方法、および電子部品

Publications (2)

Publication Number Publication Date
CN103167926A CN103167926A (zh) 2013-06-19
CN103167926B true CN103167926B (zh) 2016-03-09

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Country Status (7)

Country Link
US (2) US9209527B2 (enExample)
EP (1) EP2656955B1 (enExample)
JP (2) JP5664664B2 (enExample)
KR (1) KR101528515B1 (enExample)
CN (1) CN103167926B (enExample)
TW (1) TWI461252B (enExample)
WO (1) WO2012086745A1 (enExample)

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WO2015105088A1 (ja) * 2014-01-07 2015-07-16 株式会社村田製作所 構造材接合方法、接合用シートおよび接合構造
JP6213666B2 (ja) * 2014-04-18 2017-10-18 株式会社村田製作所 被着体の接着分離方法
JP6287739B2 (ja) * 2014-09-30 2018-03-07 株式会社村田製作所 ステンドグラスの製造方法
CN105081500B (zh) * 2015-09-02 2017-02-22 哈尔滨工业大学 一种使用激光前向转印具有特定晶粒取向和数量薄膜诱发金属间化合物生长的方法
WO2017047293A1 (ja) 2015-09-15 2017-03-23 株式会社村田製作所 接合用部材、接合用部材の製造方法、および、接合方法
JP6528852B2 (ja) 2015-09-28 2019-06-12 株式会社村田製作所 ヒートパイプ、放熱部品、ヒートパイプの製造方法
WO2017077824A1 (ja) * 2015-11-05 2017-05-11 株式会社村田製作所 接合用部材、および、接合用部材の製造方法
WO2017134974A1 (ja) 2016-02-01 2017-08-10 株式会社村田製作所 接合材、それを用いた接合方法及び接合構造
JP6621068B2 (ja) * 2016-12-08 2019-12-18 パナソニックＩｐマネジメント株式会社 実装構造体
JP6355091B1 (ja) * 2017-03-07 2018-07-11 パナソニックＩｐマネジメント株式会社 はんだ合金およびそれを用いた接合構造体
CN109983544A (zh) * 2017-03-23 2019-07-05 积水化学工业株式会社 导电性粒子、导电材料以及连接结构体
DE102017206932A1 (de) * 2017-04-25 2018-10-25 Siemens Aktiengesellschaft Lotformteil zum Erzeugen einer Diffusionslötverbindung und Verfahren zum Erzeugen eines Lotformteils
JP6998557B2 (ja) * 2017-09-29 2022-01-18 パナソニックＩｐマネジメント株式会社 はんだ合金およびそれを用いた接合構造体
CN108098172B (zh) * 2017-12-01 2020-03-27 北京工业大学 一种实现Cu/Sn/Cu界面可逆连接的方法
KR102574413B1 (ko) * 2018-12-10 2023-09-04 삼성전기주식회사 코일 전자 부품
US11581239B2 (en) * 2019-01-18 2023-02-14 Indium Corporation Lead-free solder paste as thermal interface material
KR102148297B1 (ko) * 2019-03-06 2020-08-26 성균관대학교산학협력단 이종 금속 재료 간의 접합을 위한 천이액상소결접합 방법
CN109822256B (zh) * 2019-03-15 2021-08-06 南昌大学 一种低熔点In-Sn-Bi合金钎料及制备方法
CN114173983A (zh) * 2019-07-26 2022-03-11 日本斯倍利亚社股份有限公司 预制焊料和使用该预制焊料形成的焊料接合体
DE112020004146T5 (de) * 2019-09-02 2022-05-25 Nihon Superior Co., Ltd. Lötpasten und lötstellen
CN113275787B (zh) * 2020-01-31 2023-05-30 铟泰公司 作为热界面材料的无铅焊料膏
WO2021177006A1 (ja) * 2020-03-06 2021-09-10 三菱電機株式会社 薄板状接合部材およびその製造方法、半導体装置およびその製造方法、ならびに、電力変換装置
JP6799701B1 (ja) * 2020-03-12 2020-12-16 有限会社 ナプラ 金属粒子

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JP2002254194A (ja) * 2000-06-12 2002-09-10 Hitachi Ltd 電子機器およびはんだ
JP2003332731A (ja) * 2002-05-09 2003-11-21 Murata Mfg Co Ltd Ｐｂフリー半田付け物品
CN1930672A (zh) * 2004-03-29 2007-03-14 英特尔公司 允许使用高含锡量焊块的凸块下金属化层
EP1582287A1 (en) * 2004-03-31 2005-10-05 Kabushiki Kaisha Toshiba Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor device
CN101087673A (zh) * 2005-01-11 2007-12-12 株式会社村田制作所 焊膏及电子装置
CN1825578A (zh) * 2005-02-24 2006-08-30 株式会社瑞萨科技 半导体器件及其制造方法
CN101512761A (zh) * 2006-09-01 2009-08-19 株式会社村田制作所 电子部件装置及其制造方法与电子部件组件及其制造方法
CN101681888A (zh) * 2007-06-04 2010-03-24 株式会社村田制作所 电子零部件装置及其制造方法
WO2009051181A1 (ja) * 2007-10-19 2009-04-23 Nihon Superior Sha Co., Ltd. 無鉛はんだ合金
JP2010149185A (ja) * 2008-11-28 2010-07-08 Asahi Kasei E-Materials Corp 金属フィラー、はんだペースト、及び接続構造体

Also Published As

Publication number Publication date
US9209527B2 (en) 2015-12-08
EP2656955A4 (en) 2017-07-19
JP2014223678A (ja) 2014-12-04
EP2656955B1 (en) 2021-08-04
TWI461252B (zh) 2014-11-21
US20160043480A1 (en) 2016-02-11
KR101528515B1 (ko) 2015-06-12
EP2656955A1 (en) 2013-10-30
TW201233485A (en) 2012-08-16
JP5664664B2 (ja) 2015-02-04
JP5907215B2 (ja) 2016-04-26
US20130299236A1 (en) 2013-11-14
WO2012086745A1 (ja) 2012-06-28
CN103167926A (zh) 2013-06-19
US9614295B2 (en) 2017-04-04
JPWO2012086745A1 (ja) 2014-06-05
KR20130077873A (ko) 2013-07-09

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