KR101528515B1 - 접합 방법, 접합 구조, 전자 장치, 전자 장치의 제조 방법 및 전자 부품 - Google Patents

접합 방법, 접합 구조, 전자 장치, 전자 장치의 제조 방법 및 전자 부품 Download PDF

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KR101528515B1
KR101528515B1 KR1020137007337A KR20137007337A KR101528515B1 KR 101528515 B1 KR101528515 B1 KR 101528515B1 KR 1020137007337 A KR1020137007337 A KR 1020137007337A KR 20137007337 A KR20137007337 A KR 20137007337A KR 101528515 B1 KR101528515 B1 KR 101528515B1
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South Korea
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metal
melting point
metal member
bonding material
bonding
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KR20130077873A (ko
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코스케 나카노
히데키요 타카오카
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가부시키가이샤 무라타 세이사쿠쇼
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233—Sheets, foils
    • B23K35/0238—Sheets, foils layered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/05—Alloys based on copper with manganese as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Die Bonding (AREA)
KR1020137007337A 2010-12-24 2011-12-22 접합 방법, 접합 구조, 전자 장치, 전자 장치의 제조 방법 및 전자 부품 Active KR101528515B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2010287782 2010-12-24
JPJP-P-2010-287782 2010-12-24
JP2011159922 2011-07-21
JPJP-P-2011-159922 2011-07-21
PCT/JP2011/079781 WO2012086745A1 (ja) 2010-12-24 2011-12-22 接合方法、接合構造、電子装置、電子装置の製造方法、および電子部品

Publications (2)

Publication Number Publication Date
KR20130077873A KR20130077873A (ko) 2013-07-09
KR101528515B1 true KR101528515B1 (ko) 2015-06-12

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KR1020137007337A Active KR101528515B1 (ko) 2010-12-24 2011-12-22 접합 방법, 접합 구조, 전자 장치, 전자 장치의 제조 방법 및 전자 부품

Country Status (7)

Country Link
US (2) US9209527B2 (enExample)
EP (1) EP2656955B1 (enExample)
JP (2) JP5664664B2 (enExample)
KR (1) KR101528515B1 (enExample)
CN (1) CN103167926B (enExample)
TW (1) TWI461252B (enExample)
WO (1) WO2012086745A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015105088A1 (ja) * 2014-01-07 2015-07-16 株式会社村田製作所 構造材接合方法、接合用シートおよび接合構造
WO2015159784A1 (ja) * 2014-04-18 2015-10-22 株式会社村田製作所 被着体の接着分離方法、金属複合材料
JP6287739B2 (ja) * 2014-09-30 2018-03-07 株式会社村田製作所 ステンドグラスの製造方法
CN105081500B (zh) * 2015-09-02 2017-02-22 哈尔滨工业大学 一种使用激光前向转印具有特定晶粒取向和数量薄膜诱发金属间化合物生长的方法
WO2017047293A1 (ja) 2015-09-15 2017-03-23 株式会社村田製作所 接合用部材、接合用部材の製造方法、および、接合方法
JP6528852B2 (ja) 2015-09-28 2019-06-12 株式会社村田製作所 ヒートパイプ、放熱部品、ヒートパイプの製造方法
WO2017077824A1 (ja) * 2015-11-05 2017-05-11 株式会社村田製作所 接合用部材、および、接合用部材の製造方法
CN108430690B (zh) 2016-02-01 2021-05-14 株式会社村田制作所 接合材料、使用该接合材料的接合方法和接合结构
JP6621068B2 (ja) * 2016-12-08 2019-12-18 パナソニックＩｐマネジメント株式会社 実装構造体
JP6355091B1 (ja) * 2017-03-07 2018-07-11 パナソニックＩｐマネジメント株式会社 はんだ合金およびそれを用いた接合構造体
CN109983544A (zh) * 2017-03-23 2019-07-05 积水化学工业株式会社 导电性粒子、导电材料以及连接结构体
DE102017206932A1 (de) * 2017-04-25 2018-10-25 Siemens Aktiengesellschaft Lotformteil zum Erzeugen einer Diffusionslötverbindung und Verfahren zum Erzeugen eines Lotformteils
JP6998557B2 (ja) * 2017-09-29 2022-01-18 パナソニックＩｐマネジメント株式会社 はんだ合金およびそれを用いた接合構造体
CN108098172B (zh) * 2017-12-01 2020-03-27 北京工业大学 一种实现Cu/Sn/Cu界面可逆连接的方法
KR102574413B1 (ko) * 2018-12-10 2023-09-04 삼성전기주식회사 코일 전자 부품
US11581239B2 (en) * 2019-01-18 2023-02-14 Indium Corporation Lead-free solder paste as thermal interface material
KR102148297B1 (ko) * 2019-03-06 2020-08-26 성균관대학교산학협력단 이종 금속 재료 간의 접합을 위한 천이액상소결접합 방법
CN109822256B (zh) * 2019-03-15 2021-08-06 南昌大学 一种低熔点In-Sn-Bi合金钎料及制备方法
EP4005727A4 (en) * 2019-07-26 2023-07-26 Nihon Superior Co., Ltd. PREFORM SOLDER AND ITEM FORMED WITH THIS PREFORM SOLDER BOUND
WO2021045131A1 (ja) * 2019-09-02 2021-03-11 株式会社日本スペリア社 はんだペースト及びはんだ接合体
CN113275787B (zh) * 2020-01-31 2023-05-30 铟泰公司 作为热界面材料的无铅焊料膏
US12330212B2 (en) * 2020-03-06 2025-06-17 Mitsubishi Electric Corporation Thin sheet-like connecting member and manufacturing method therefor, semiconductor device and manufacturing method therefor, and power conversion device
JP6799701B1 (ja) * 2020-03-12 2020-12-16 有限会社 ナプラ 金属粒子

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6602777B1 (en) * 2001-12-28 2003-08-05 National Central University Method for controlling the formation of intermetallic compounds in solder joints

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6371361B1 (en) * 1996-02-09 2002-04-16 Matsushita Electric Industrial Co., Ltd. Soldering alloy, cream solder and soldering method
US5863493A (en) * 1996-12-16 1999-01-26 Ford Motor Company Lead-free solder compositions
WO1999048639A1 (en) * 1998-03-26 1999-09-30 Nihon Superior Sha Co., Ltd. Leadless solder
JP3414388B2 (ja) 2000-06-12 2003-06-09 株式会社日立製作所 電子機器
JP3763520B2 (ja) * 2000-12-25 2006-04-05 Ｔｄｋ株式会社 はんだ付け用組成物
JP2003211289A (ja) * 2002-01-21 2003-07-29 Fujitsu Ltd 導電性接合材料、それを用いた接合方法及び電子機器
JP2003332731A (ja) * 2002-05-09 2003-11-21 Murata Mfg Co Ltd Ｐｂフリー半田付け物品
JP4071049B2 (ja) * 2002-06-18 2008-04-02 松下電器産業株式会社 鉛フリー半田ペースト
JP4271684B2 (ja) * 2003-10-24 2009-06-03 日鉱金属株式会社 ニッケル合金スパッタリングターゲット及びニッケル合金薄膜
US7064446B2 (en) 2004-03-29 2006-06-20 Intel Corporation Under bump metallization layer to enable use of high tin content solder bumps
JP2005288458A (ja) * 2004-03-31 2005-10-20 Toshiba Corp 接合体、半導体装置、接合方法、及び半導体装置の製造方法
KR100867871B1 (ko) 2005-01-11 2008-11-07 가부시키가이샤 무라타 세이사쿠쇼 솔더 페이스트, 및 전자장치
JP4344707B2 (ja) * 2005-02-24 2009-10-14 株式会社ルネサステクノロジ 半導体装置およびその製造方法
JP4501818B2 (ja) * 2005-09-02 2010-07-14 日立電線株式会社 銅合金材およびその製造方法
EP2017031B1 (en) * 2006-04-26 2017-09-13 Senju Metal Industry Co., Ltd Solder paste
CN101512761A (zh) * 2006-09-01 2009-08-19 株式会社村田制作所 电子部件装置及其制造方法与电子部件组件及其制造方法
CN101681888B (zh) 2007-06-04 2012-08-22 株式会社村田制作所 电子零部件装置及其制造方法
KR101406174B1 (ko) * 2007-06-18 2014-06-12 엠케이전자 주식회사 주석, 은 및 비스무스를 함유하는 무연솔더
WO2009051181A1 (ja) * 2007-10-19 2009-04-23 Nihon Superior Sha Co., Ltd. 無鉛はんだ合金
CN101842506B (zh) * 2007-11-01 2012-08-22 古河电气工业株式会社 强度、弯曲加工性、抗应力松弛性能优异的铜合金材料及其制造方法
JP5169354B2 (ja) * 2008-03-18 2013-03-27 富士通株式会社 接合材料及びそれを用いた接合方法
JP5584909B2 (ja) * 2008-11-28 2014-09-10 株式会社弘輝 接続構造体
KR101276147B1 (ko) * 2009-09-03 2013-06-18 가부시키가이샤 무라타 세이사쿠쇼 솔더 페이스트, 그것을 사용한 접합 방법, 및 접합 구조
TWI480382B (zh) * 2010-11-19 2015-04-11 村田製作所股份有限公司 A conductive material, a connecting method using the same, and a connecting structure

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6602777B1 (en) * 2001-12-28 2003-08-05 National Central University Method for controlling the formation of intermetallic compounds in solder joints

Also Published As

Publication number Publication date
CN103167926A (zh) 2013-06-19
EP2656955A1 (en) 2013-10-30
JPWO2012086745A1 (ja) 2014-06-05
JP2014223678A (ja) 2014-12-04
JP5664664B2 (ja) 2015-02-04
TW201233485A (en) 2012-08-16
CN103167926B (zh) 2016-03-09
WO2012086745A1 (ja) 2012-06-28
US20130299236A1 (en) 2013-11-14
US9209527B2 (en) 2015-12-08
US20160043480A1 (en) 2016-02-11
TWI461252B (zh) 2014-11-21
EP2656955A4 (en) 2017-07-19
KR20130077873A (ko) 2013-07-09
EP2656955B1 (en) 2021-08-04
JP5907215B2 (ja) 2016-04-26
US9614295B2 (en) 2017-04-04

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