TWI460745B - A circuit connecting material, a film-like circuit connecting material using the same, a connecting structure of a circuit member, and a connection method of a circuit member - Google Patents

A circuit connecting material, a film-like circuit connecting material using the same, a connecting structure of a circuit member, and a connection method of a circuit member Download PDF

Info

Publication number
TWI460745B
TWI460745B TW099113330A TW99113330A TWI460745B TW I460745 B TWI460745 B TW I460745B TW 099113330 A TW099113330 A TW 099113330A TW 99113330 A TW99113330 A TW 99113330A TW I460745 B TWI460745 B TW I460745B
Authority
TW
Taiwan
Prior art keywords
circuit
circuit connecting
connecting material
particles
conductive particles
Prior art date
Application number
TW099113330A
Other languages
English (en)
Chinese (zh)
Other versions
TW201112273A (en
Inventor
有福征宏
小林宏治
藤繩貢
Original Assignee
日立化成股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立化成股份有限公司 filed Critical 日立化成股份有限公司
Publication of TW201112273A publication Critical patent/TW201112273A/zh
Application granted granted Critical
Publication of TWI460745B publication Critical patent/TWI460745B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/026—Nanotubes or nanowires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/532—Conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nanotechnology (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
  • Wire Bonding (AREA)
  • Adhesive Tapes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
TW099113330A 2009-04-28 2010-04-27 A circuit connecting material, a film-like circuit connecting material using the same, a connecting structure of a circuit member, and a connection method of a circuit member TWI460745B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009109102 2009-04-28

Publications (2)

Publication Number Publication Date
TW201112273A TW201112273A (en) 2011-04-01
TWI460745B true TWI460745B (zh) 2014-11-11

Family

ID=43032117

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099113330A TWI460745B (zh) 2009-04-28 2010-04-27 A circuit connecting material, a film-like circuit connecting material using the same, a connecting structure of a circuit member, and a connection method of a circuit member

Country Status (7)

Country Link
US (1) US20120138868A1 (enExample)
EP (1) EP2426787A4 (enExample)
JP (2) JP4930623B2 (enExample)
KR (1) KR101228780B1 (enExample)
CN (1) CN102396113B (enExample)
TW (1) TWI460745B (enExample)
WO (1) WO2010125965A1 (enExample)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5592808B2 (ja) * 2010-09-15 2014-09-17 日東電工株式会社 配線回路基板
US9835942B2 (en) 2010-12-14 2017-12-05 Kaneka Corporation Photosensitive resin composition and use thereof
JP2012156309A (ja) * 2011-01-26 2012-08-16 Nitto Denko Corp 配線回路基板およびその製造方法ならびに燃料電池
KR101381118B1 (ko) * 2011-11-04 2014-04-04 제일모직주식회사 이방 전도성 접착 필름용 조성물 및 이를 이용한 이방 전도성 접착 필름
JP6231256B2 (ja) * 2011-12-15 2017-11-15 デクセリアルズ株式会社 異方性導電接着剤、及び電子部品の接続方法
KR101611318B1 (ko) * 2012-01-25 2016-04-11 가부시키가이샤 가네카 신규한 안료 함유 절연막용 수지 조성물 및 그 이용
KR20130091521A (ko) * 2012-02-08 2013-08-19 삼성디스플레이 주식회사 이방성 도전층을 포함하는 미세 전자 소자 및 미세 전자 소자 형성 방법
KR102027246B1 (ko) * 2013-03-14 2019-10-01 삼성전자주식회사 디지타이저 및 그 제조 방법
JP6358535B2 (ja) * 2013-04-26 2018-07-18 パナソニックＩｐマネジメント株式会社 配線板間接続構造、および配線板間接続方法
WO2015008330A1 (ja) * 2013-07-16 2015-01-22 日立化成株式会社 感光性樹脂組成物、フィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ及び半導体装置
JP5869538B2 (ja) * 2013-08-13 2016-02-24 Ｊｘ金属株式会社 表面処理された金属粉の製造方法
KR102186491B1 (ko) * 2014-01-02 2020-12-03 헨켈 아이피 앤드 홀딩 게엠베하 나노-미립자 충전제를 함유하는 필름
JP6437323B2 (ja) * 2014-02-14 2018-12-12 デクセリアルズ株式会社 接続構造体の製造方法、及び回路接続材料
CN104951156A (zh) * 2014-03-31 2015-09-30 宸盛光电有限公司 电容式触控装置
KR102240963B1 (ko) * 2014-10-28 2021-04-16 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름, 그 제조 방법, 및 접속 구조체
FR3038446B1 (fr) 2015-07-01 2017-07-21 Hydromecanique & Frottement Materiau composite conducteur elabore a partir de poudres revetues
KR101959536B1 (ko) * 2016-04-05 2019-03-18 주식회사 아이에스시 이종의 입자가 혼합된 도전성 입자를 포함하는 이방도전성 시트
JP6551794B2 (ja) * 2016-05-30 2019-07-31 パナソニックＩｐマネジメント株式会社 導電粒子、ならびに回路部材の接続材料、接続構造、および接続方法
US10689548B2 (en) * 2017-01-20 2020-06-23 Polyonics, Inc. Electrostatic dissipative surface coating and high temperature label employing same
TWI799557B (zh) * 2018-03-28 2023-04-21 日商琳得科股份有限公司 樹脂組合物、密封片及密封體
US11224131B2 (en) * 2018-04-04 2022-01-11 Lenovo (Singapore) Pte. Ltd. Systems and methods for surface mounting cable connections
JP6819656B2 (ja) 2018-07-25 2021-01-27 カシオ計算機株式会社 回路基板、プログラム、及び、ボタン構造
KR102187881B1 (ko) * 2018-07-26 2020-12-07 주식회사 에이엔케이 마이크로 led 검사용 프로브 소켓 디바이스 제조 방법
US10844282B2 (en) * 2019-03-11 2020-11-24 King Fahd University Of Petroleum And Minerals Corrosion inhibiting formulations and uses thereof
JP7585016B2 (ja) * 2019-12-13 2024-11-18 日本化学工業株式会社 被覆粒子及びそれを含む導電性材料
JP7634978B2 (ja) * 2019-12-13 2025-02-25 日本化学工業株式会社 被覆粒子及びそれを含む導電性材料
JP7715145B2 (ja) * 2020-03-25 2025-07-30 株式会社レゾナック 導電性複合粒子の製造方法、導電性複合粒子、及び回路接続用接着剤フィルム
JP2022175801A (ja) * 2021-05-14 2022-11-25 デクセリアルズ株式会社 導電粒子、及び導電粒子の製造方法
WO2025097125A1 (en) * 2023-11-03 2025-05-08 Worcester Polytechnic Institute Polymer-conductor matrix electrical interconnect

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI229119B (en) * 1997-03-31 2005-03-11 Hitachi Chemical Co Ltd Circuit-connecting material and circuit terminal connected structure and connecting method
TWI265191B (en) * 2004-05-10 2006-11-01 Hitachi Chemical Co Ltd Adhesive composition, material for connecting circuit, connecting structure of circuit member and semiconductor device
WO2009051043A1 (ja) * 2007-10-15 2009-04-23 Hitachi Chemical Company, Ltd. 回路接続用接着フィルム及び回路接続構造体

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59120436A (ja) 1982-12-27 1984-07-12 Seikosha Co Ltd 異方導電性ゴムシ−トの製造方法
US4731282A (en) * 1983-10-14 1988-03-15 Hitachi Chemical Co., Ltd. Anisotropic-electroconductive adhesive film
JPS60191228A (ja) 1984-10-29 1985-09-28 Seiko Epson Corp 表示装置の接続構造
JP2546262B2 (ja) 1987-03-25 1996-10-23 日立化成工業株式会社 回路の接続部材およびその製造方法
JPH01169808A (ja) * 1987-12-25 1989-07-05 Hitachi Ltd 異方性導電接着剤
JPH01251787A (ja) 1988-03-31 1989-10-06 Toshiba Corp 電子部品の接続装置
JP3907217B2 (ja) 1993-07-29 2007-04-18 日立化成工業株式会社 回路接続材料とその接続材料を用いた回路の接続方法
JP2004095269A (ja) * 2002-08-30 2004-03-25 Idemitsu Kosan Co Ltd 異方導電粒子及び異方導電性接着剤
AU2003284508A1 (en) * 2002-11-29 2004-06-23 Hitachi Chemical Co., Ltd. Adhesive composition, adhesive composition for circuit connection, connected circuit structure, and semiconductor devices
JP2004265729A (ja) * 2003-02-28 2004-09-24 Jst Mfg Co Ltd 異方導電シート
CN100437838C (zh) * 2003-07-07 2008-11-26 积水化学工业株式会社 包覆导电性粒子、各向异性导电材料以及导电连接结构体
JP5247968B2 (ja) * 2003-12-02 2013-07-24 日立化成株式会社 回路接続材料、及びこれを用いた回路部材の接続構造
JP2006066163A (ja) * 2004-08-26 2006-03-09 Sumitomo Electric Ind Ltd 異方導電膜用導電性粒子及びそれを用いた異方導電膜
TW200635158A (en) * 2004-10-22 2006-10-01 Jsr Corp Anisotropic conductive connector for inspecting wafer, manufacturing method thereof, waver inspection probe card, manufacturing method thereof, and wafer inspection device
WO2006043629A1 (ja) * 2004-10-22 2006-04-27 Jsr Corporation アダプター装置およびその製造方法並びに回路装置の電気的検査装置
JP2007165028A (ja) 2005-12-12 2007-06-28 Matsushita Electric Ind Co Ltd 異方導電性材料とこれを用いた実装方法
JP4852311B2 (ja) 2006-01-12 2012-01-11 積水化学工業株式会社 導電性粒子、異方性導電材料及び導電接続構造体
JP4967482B2 (ja) 2006-02-27 2012-07-04 日立化成工業株式会社 導電粒子、接着剤組成物及び回路接続材料
JP2009037928A (ja) * 2007-08-02 2009-02-19 Sumitomo Electric Ind Ltd 電極接続用接着剤
US20100277884A1 (en) * 2007-10-02 2010-11-04 Hitachi Chemical Company, Ltd. Circuit-connecting material and circuit terminal connection structure
CN101828434A (zh) * 2007-10-18 2010-09-08 日立化成工业株式会社 粘接剂组合物和使用其的电路连接材料、以及电路部件的连接方法和电路连接体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI229119B (en) * 1997-03-31 2005-03-11 Hitachi Chemical Co Ltd Circuit-connecting material and circuit terminal connected structure and connecting method
TWI265191B (en) * 2004-05-10 2006-11-01 Hitachi Chemical Co Ltd Adhesive composition, material for connecting circuit, connecting structure of circuit member and semiconductor device
WO2009051043A1 (ja) * 2007-10-15 2009-04-23 Hitachi Chemical Company, Ltd. 回路接続用接着フィルム及び回路接続構造体

Also Published As

Publication number Publication date
TW201112273A (en) 2011-04-01
WO2010125965A1 (ja) 2010-11-04
EP2426787A1 (en) 2012-03-07
KR101228780B1 (ko) 2013-01-31
JP4930623B2 (ja) 2012-05-16
KR20120015438A (ko) 2012-02-21
EP2426787A4 (en) 2013-11-20
JP2012114092A (ja) 2012-06-14
JP2010277997A (ja) 2010-12-09
CN102396113B (zh) 2014-09-24
CN102396113A (zh) 2012-03-28
US20120138868A1 (en) 2012-06-07

Similar Documents

Publication Publication Date Title
TWI460745B (zh) A circuit connecting material, a film-like circuit connecting material using the same, a connecting structure of a circuit member, and a connection method of a circuit member
TWI398880B (zh) Circuit connection material and circuit connection structure
JP4897778B2 (ja) 接続フィルム、並びに、接合体及びその製造方法
TWI502608B (zh) 導電性粒子、異向性導電薄膜及接合體以及連接方法
TWI395801B (zh) Circuit connection material and circuit structure of the connection structure
JP4862944B2 (ja) 回路接続材料
TWI402326B (zh) Circuit connection material and circuit structure of the connection structure
JP6900954B2 (ja) 接着剤組成物
JP5410387B2 (ja) 導電性粒子及びその製造方法、並びに異方性導電フィルム、接合体、及び接続方法
KR20120051699A (ko) 도전성 입자, 이방성 도전 필름, 접합체 및 접속 방법
TW200932855A (en) Adhesive composition, film-like adhesive, and connection structure for circuit member
JP2011060502A (ja) 絶縁粒子付き導電性粒子、異方性導電材料及び接続構造体
TW201832415A (zh) 異向性導電膜、連接結構體、連接結構體之製造方法及連接方法
WO2012086278A1 (ja) 異方性導電接着フィルム、接続構造体及びその製造方法
CN101690425A (zh) 电路部件的连接结构
CN103548207B (zh) 电路连接材料、电路部件的连接结构以及电路部件的连接结构的制造方法
CN108291114A (zh) 电路连接用粘接剂组合物和结构体
TWI781158B (zh) 接著劑組成物及結構體
JP5834548B2 (ja) 絶縁被覆導電粒子及び異方導電性接着フィルム
CN113410671A (zh) 连接材料
TW201936844A (zh) 接著劑膜
HK40051347A (en) Connection material
HK1167278A (en) Conductive particles, anisotropic conductive film, assembly, and connection method

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees