TWI442070B - A substrate inspection jig and an electrode structure of the connecting electrode portion of the jig - Google Patents
A substrate inspection jig and an electrode structure of the connecting electrode portion of the jig Download PDFInfo
- Publication number
- TWI442070B TWI442070B TW096117254A TW96117254A TWI442070B TW I442070 B TWI442070 B TW I442070B TW 096117254 A TW096117254 A TW 096117254A TW 96117254 A TW96117254 A TW 96117254A TW I442070 B TWI442070 B TW I442070B
- Authority
- TW
- Taiwan
- Prior art keywords
- contactor
- connection electrode
- holding
- substrate
- contact
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims description 118
- 238000007689 inspection Methods 0.000 title claims description 108
- 230000001681 protective effect Effects 0.000 claims description 8
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 238000002788 crimping Methods 0.000 claims description 3
- 238000005259 measurement Methods 0.000 description 13
- 238000012545 processing Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 230000007246 mechanism Effects 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000012937 correction Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/0675—Needle-like
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Tests Of Electronic Circuits (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006135867A JP4041831B2 (ja) | 2006-05-15 | 2006-05-15 | 基板検査用治具及びこの治具における接続電極部の電極構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200815776A TW200815776A (en) | 2008-04-01 |
| TWI442070B true TWI442070B (zh) | 2014-06-21 |
Family
ID=38693833
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096117254A TWI442070B (zh) | 2006-05-15 | 2007-05-15 | A substrate inspection jig and an electrode structure of the connecting electrode portion of the jig |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP4041831B2 (ja) |
| KR (1) | KR101021744B1 (ja) |
| CN (1) | CN101443669B (ja) |
| TW (1) | TWI442070B (ja) |
| WO (1) | WO2007132739A1 (ja) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009250917A (ja) * | 2008-04-10 | 2009-10-29 | Nidec-Read Corp | 基板検査用治具及び検査用接触子 |
| JP5504698B2 (ja) * | 2009-06-02 | 2014-05-28 | 日本電産リード株式会社 | 検査用治具及び検査用接触子 |
| WO2012108066A1 (ja) * | 2011-02-10 | 2012-08-16 | 日本電産リード株式会社 | 検査治具 |
| JP2013100994A (ja) * | 2011-11-07 | 2013-05-23 | Nidec-Read Corp | 基板検査治具、治具ベースユニット及び基板検査装置 |
| JP5986397B2 (ja) * | 2012-02-28 | 2016-09-06 | 日本電産リード株式会社 | 検査用治具 |
| JP2013257195A (ja) * | 2012-06-12 | 2013-12-26 | Nidec-Read Corp | 基板検査治具及び基板検査装置 |
| JP6221358B2 (ja) * | 2013-06-04 | 2017-11-01 | 日本電産リード株式会社 | 基板検査方法、及び基板検査装置 |
| JP6283929B2 (ja) * | 2013-10-08 | 2018-02-28 | 日本電産リード株式会社 | 検査用治具及び検査用治具の製造方法 |
| CN105510758A (zh) * | 2015-11-27 | 2016-04-20 | 湖北三江航天红峰控制有限公司 | 一种用于低电阻导通的设备 |
| KR101656047B1 (ko) | 2016-03-23 | 2016-09-09 | 주식회사 나노시스 | 기판 검사용 지그 |
| CN114325296A (zh) | 2020-09-30 | 2022-04-12 | 揖斐电株式会社 | 导通检查用治具和印刷布线板的检查方法 |
| KR102245761B1 (ko) * | 2021-01-13 | 2021-04-28 | 엘엠디지털 주식회사 | 멀티 그리드 베이스가 구비된 인쇄회로기판 검사용 지그 |
| KR102649845B1 (ko) * | 2023-11-29 | 2024-03-21 | 주식회사 나노시스 | 반도체 소자 테스터 지그 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH065639Y2 (ja) * | 1986-03-20 | 1994-02-09 | 松下電器産業株式会社 | コンタクトピン |
| JPH0656401B2 (ja) * | 1986-12-19 | 1994-07-27 | 東京エレクトロン株式会社 | 検査装置 |
| TW392074B (en) * | 1997-11-05 | 2000-06-01 | Feinmetall Gmbh | Test head for microstructures with interface |
| JP2001133483A (ja) * | 1999-11-04 | 2001-05-18 | Takashi Nansai | Ｗストロークプリント基板検査機用治具 |
| JP3899075B2 (ja) * | 2002-03-05 | 2007-03-28 | リカ デンシ アメリカ， インコーポレイテッド | 電子パッケージと試験機器をインターフェースするための装置 |
| CN1482468A (zh) * | 2002-09-13 | 2004-03-17 | 中芯国际集成电路制造（上海）有限公 | 检测探针接触电阻的测试结构与方法 |
-
2006
- 2006-05-15 JP JP2006135867A patent/JP4041831B2/ja not_active Expired - Fee Related
-
2007
- 2007-05-10 CN CN2007800174904A patent/CN101443669B/zh not_active Expired - Fee Related
- 2007-05-10 WO PCT/JP2007/059685 patent/WO2007132739A1/ja active Application Filing
- 2007-05-10 KR KR1020087027510A patent/KR101021744B1/ko active IP Right Grant
- 2007-05-15 TW TW096117254A patent/TWI442070B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR20080112365A (ko) | 2008-12-24 |
| KR101021744B1 (ko) | 2011-03-15 |
| CN101443669B (zh) | 2012-01-25 |
| JP4041831B2 (ja) | 2008-02-06 |
| TW200815776A (en) | 2008-04-01 |
| JP2007309648A (ja) | 2007-11-29 |
| WO2007132739A1 (ja) | 2007-11-22 |
| CN101443669A (zh) | 2009-05-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |