TWI354108B - - Google Patents

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Publication number
TWI354108B
TWI354108B TW097113668A TW97113668A TWI354108B TW I354108 B TWI354108 B TW I354108B TW 097113668 A TW097113668 A TW 097113668A TW 97113668 A TW97113668 A TW 97113668A TW I354108 B TWI354108 B TW I354108B
Authority
TW
Taiwan
Prior art keywords
contact
connection electrode
guide
inspection
substrate inspection
Prior art date
Application number
TW097113668A
Other languages
English (en)
Chinese (zh)
Other versions
TW200848759A (en
Inventor
Minoru Kato
Tadakazu Miyatake
Original Assignee
Nidec Read Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidec Read Corp filed Critical Nidec Read Corp
Publication of TW200848759A publication Critical patent/TW200848759A/zh
Application granted granted Critical
Publication of TWI354108B publication Critical patent/TWI354108B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
TW097113668A 2007-04-17 2008-04-15 Jig for substrate inspection TW200848759A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007108738 2007-04-17

Publications (2)

Publication Number Publication Date
TW200848759A TW200848759A (en) 2008-12-16
TWI354108B true TWI354108B (ja) 2011-12-11

Family

ID=40146625

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097113668A TW200848759A (en) 2007-04-17 2008-04-15 Jig for substrate inspection

Country Status (3)

Country Link
JP (1) JP2008286788A (ja)
KR (1) KR100975808B1 (ja)
TW (1) TW200848759A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI464687B (zh) * 2011-12-14 2014-12-11 Fujitsu Ltd 治具之指定支援裝置、治具之指定支援方法、及記錄媒體

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010276510A (ja) * 2009-05-29 2010-12-09 Nidec-Read Corp 検査用治具
JP5381609B2 (ja) * 2009-10-20 2014-01-08 日本電産リード株式会社 検査用治具及び接触子
JP5428748B2 (ja) * 2009-10-21 2014-02-26 日本電産リード株式会社 検査用治具のメンテナンス方法及び基板検査装置
JP5514619B2 (ja) * 2009-12-24 2014-06-04 ガーディアンジャパン株式会社 配線検査治具
JP4974311B1 (ja) * 2011-02-10 2012-07-11 日本電産リード株式会社 検査治具
JP2013003002A (ja) * 2011-06-17 2013-01-07 Hioki Ee Corp プローブユニットおよび回路基板検査装置
JP6184667B2 (ja) * 2012-07-26 2017-08-23 日置電機株式会社 プローブユニット、基板検査装置およびプローブユニット製造方法
JP6104724B2 (ja) * 2013-06-12 2017-03-29 日置電機株式会社 プローブユニット、基板検査装置およびプローブユニット製造方法
WO2016087369A2 (en) * 2014-12-04 2016-06-09 Technoprobe S.P.A. Testing head comprising vertical probes
KR101656047B1 (ko) 2016-03-23 2016-09-09 주식회사 나노시스 기판 검사용 지그
TW201942581A (zh) 2018-03-30 2019-11-01 日商日本電產理德股份有限公司 檢查治具以及具備該治具的檢查裝置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5414369A (en) 1992-11-09 1995-05-09 Nhk Spring Co., Ltd. Coil spring-pressed needle contact probe modules with offset needles
US6194908B1 (en) 1997-06-26 2001-02-27 Delaware Capital Formation, Inc. Test fixture for testing backplanes or populated circuit boards
JP3505495B2 (ja) * 2000-09-13 2004-03-08 日本電産リード株式会社 基板検査用検査治具、該検査治具を備えた基板検査装置および基板検査用検査治具の組立方法
JP2004163228A (ja) 2002-11-12 2004-06-10 Toyo Denshi Giken Kk プローブとそれを用いたコンタクト装置
JP3690801B2 (ja) 2004-11-17 2005-08-31 株式会社コーヨーテクノス 接触ピン
JP2006329998A (ja) * 2006-07-19 2006-12-07 Nidec-Read Corp 基板検査用治具、及びこれに用いる検査用プローブ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI464687B (zh) * 2011-12-14 2014-12-11 Fujitsu Ltd 治具之指定支援裝置、治具之指定支援方法、及記錄媒體

Also Published As

Publication number Publication date
TW200848759A (en) 2008-12-16
KR100975808B1 (ko) 2010-08-13
KR20080093865A (ko) 2008-10-22
JP2008286788A (ja) 2008-11-27

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees