KR100975808B1 - 기판검사용 치구 - Google Patents

기판검사용 치구 Download PDF

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Publication number
KR100975808B1
KR100975808B1 KR1020080023783A KR20080023783A KR100975808B1 KR 100975808 B1 KR100975808 B1 KR 100975808B1 KR 1020080023783 A KR1020080023783 A KR 1020080023783A KR 20080023783 A KR20080023783 A KR 20080023783A KR 100975808 B1 KR100975808 B1 KR 100975808B1
Authority
KR
South Korea
Prior art keywords
contact
contactor
connection electrode
guide plate
guide hole
Prior art date
Application number
KR1020080023783A
Other languages
English (en)
Korean (ko)
Other versions
KR20080093865A (ko
Inventor
미노루 가토
다다카즈 미야타케
Original Assignee
니혼덴산리드가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 니혼덴산리드가부시키가이샤 filed Critical 니혼덴산리드가부시키가이샤
Publication of KR20080093865A publication Critical patent/KR20080093865A/ko
Application granted granted Critical
Publication of KR100975808B1 publication Critical patent/KR100975808B1/ko

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
KR1020080023783A 2007-04-17 2008-03-14 기판검사용 치구 KR100975808B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2007-00108738 2007-04-17
JP2007108738 2007-04-17

Publications (2)

Publication Number Publication Date
KR20080093865A KR20080093865A (ko) 2008-10-22
KR100975808B1 true KR100975808B1 (ko) 2010-08-13

Family

ID=40146625

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080023783A KR100975808B1 (ko) 2007-04-17 2008-03-14 기판검사용 치구

Country Status (3)

Country Link
JP (1) JP2008286788A (ja)
KR (1) KR100975808B1 (ja)
TW (1) TW200848759A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101656047B1 (ko) 2016-03-23 2016-09-09 주식회사 나노시스 기판 검사용 지그

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010276510A (ja) * 2009-05-29 2010-12-09 Nidec-Read Corp 検査用治具
JP5381609B2 (ja) * 2009-10-20 2014-01-08 日本電産リード株式会社 検査用治具及び接触子
JP5428748B2 (ja) * 2009-10-21 2014-02-26 日本電産リード株式会社 検査用治具のメンテナンス方法及び基板検査装置
JP5514619B2 (ja) * 2009-12-24 2014-06-04 ガーディアンジャパン株式会社 配線検査治具
KR101795836B1 (ko) * 2011-02-10 2017-11-08 니혼덴산리드가부시키가이샤 검사 지그
JP2013003002A (ja) * 2011-06-17 2013-01-07 Hioki Ee Corp プローブユニットおよび回路基板検査装置
JP5662925B2 (ja) * 2011-12-14 2015-02-04 富士通株式会社 治具の特定支援装置、治具の特定支援方法及び治具の特定支援プログラム
JP6184667B2 (ja) * 2012-07-26 2017-08-23 日置電機株式会社 プローブユニット、基板検査装置およびプローブユニット製造方法
JP6104724B2 (ja) * 2013-06-12 2017-03-29 日置電機株式会社 プローブユニット、基板検査装置およびプローブユニット製造方法
WO2016087369A2 (en) * 2014-12-04 2016-06-09 Technoprobe S.P.A. Testing head comprising vertical probes
TW201942581A (zh) * 2018-03-30 2019-11-01 日商日本電產理德股份有限公司 檢查治具以及具備該治具的檢查裝置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000171514A (ja) 1998-12-08 2000-06-23 Delaware Capital Formation Inc 検査治具
JP2000292437A (ja) 1992-11-09 2000-10-20 Nhk Spring Co Ltd 導電性接触子及び導電性接触子ユニット
JP2004163228A (ja) 2002-11-12 2004-06-10 Toyo Denshi Giken Kk プローブとそれを用いたコンタクト装置
JP2005099037A (ja) 2004-11-17 2005-04-14 Koyo Technos:Kk 接触ピン

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3505495B2 (ja) * 2000-09-13 2004-03-08 日本電産リード株式会社 基板検査用検査治具、該検査治具を備えた基板検査装置および基板検査用検査治具の組立方法
JP2006329998A (ja) * 2006-07-19 2006-12-07 Nidec-Read Corp 基板検査用治具、及びこれに用いる検査用プローブ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000292437A (ja) 1992-11-09 2000-10-20 Nhk Spring Co Ltd 導電性接触子及び導電性接触子ユニット
JP2000171514A (ja) 1998-12-08 2000-06-23 Delaware Capital Formation Inc 検査治具
JP2004163228A (ja) 2002-11-12 2004-06-10 Toyo Denshi Giken Kk プローブとそれを用いたコンタクト装置
JP2005099037A (ja) 2004-11-17 2005-04-14 Koyo Technos:Kk 接触ピン

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101656047B1 (ko) 2016-03-23 2016-09-09 주식회사 나노시스 기판 검사용 지그

Also Published As

Publication number Publication date
TWI354108B (ja) 2011-12-11
KR20080093865A (ko) 2008-10-22
TW200848759A (en) 2008-12-16
JP2008286788A (ja) 2008-11-27

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