TWI434395B - 半導體裝置 - Google Patents

半導體裝置 Download PDF

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Publication number
TWI434395B
TWI434395B TW097148429A TW97148429A TWI434395B TW I434395 B TWI434395 B TW I434395B TW 097148429 A TW097148429 A TW 097148429A TW 97148429 A TW97148429 A TW 97148429A TW I434395 B TWI434395 B TW I434395B
Authority
TW
Taiwan
Prior art keywords
disposed
wiring board
pad
pads
wiring
Prior art date
Application number
TW097148429A
Other languages
English (en)
Chinese (zh)
Other versions
TW200935587A (en
Inventor
佐藤仁志
Original Assignee
新光電氣工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新光電氣工業股份有限公司 filed Critical 新光電氣工業股份有限公司
Publication of TW200935587A publication Critical patent/TW200935587A/zh
Application granted granted Critical
Publication of TWI434395B publication Critical patent/TWI434395B/zh

Links

Classifications

    • H10W90/00—
    • H10W70/60—
    • H10W72/90—
    • H10W72/9415—
    • H10W90/22—
    • H10W90/284—
    • H10W90/724—

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW097148429A 2007-12-14 2008-12-12 半導體裝置 TWI434395B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007323744A JP5265183B2 (ja) 2007-12-14 2007-12-14 半導体装置

Publications (2)

Publication Number Publication Date
TW200935587A TW200935587A (en) 2009-08-16
TWI434395B true TWI434395B (zh) 2014-04-11

Family

ID=40752110

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097148429A TWI434395B (zh) 2007-12-14 2008-12-12 半導體裝置

Country Status (5)

Country Link
US (1) US8022524B2 (enExample)
JP (1) JP5265183B2 (enExample)
KR (1) KR101496920B1 (enExample)
CN (1) CN101459156B (enExample)
TW (1) TWI434395B (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5709386B2 (ja) * 2010-02-19 2015-04-30 キヤノン株式会社 半導体装置の製造方法及び積層型半導体装置の製造方法
US8339231B1 (en) * 2010-03-22 2012-12-25 Flextronics Ap, Llc Leadframe based magnetics package
JP5666366B2 (ja) * 2011-03-31 2015-02-12 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US20130181359A1 (en) * 2012-01-13 2013-07-18 TW Semiconductor Manufacturing Company, Ltd. Methods and Apparatus for Thinner Package on Package Structures
JP2013219170A (ja) * 2012-04-09 2013-10-24 Yokogawa Electric Corp 基板装置
US10115671B2 (en) * 2012-08-03 2018-10-30 Snaptrack, Inc. Incorporation of passives and fine pitch through via for package on package
US8969730B2 (en) * 2012-08-16 2015-03-03 Apple Inc. Printed circuit solder connections
US9443758B2 (en) * 2013-12-11 2016-09-13 Taiwan Semiconductor Manufacturing Co., Ltd. Connecting techniques for stacked CMOS devices
KR102287396B1 (ko) * 2014-10-21 2021-08-06 삼성전자주식회사 시스템 온 패키지 모듈과 이를 포함하는 모바일 컴퓨팅 장치
JP6691762B2 (ja) * 2015-11-03 2020-05-13 日本特殊陶業株式会社 検査用配線基板
KR102192569B1 (ko) * 2015-11-06 2020-12-17 삼성전자주식회사 전자 부품 패키지 및 그 제조방법
FR3044864B1 (fr) * 2015-12-02 2018-01-12 Valeo Systemes De Controle Moteur Dispositif electrique et procede d'assemblage d'un tel dispositif electrique
CN116017847A (zh) * 2023-02-24 2023-04-25 合肥维信诺科技有限公司 电路板及电子设备
CN117976660B (zh) * 2024-03-27 2024-06-21 湖北江城实验室 一种半导体结构及其热测试方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2806357B2 (ja) * 1996-04-18 1998-09-30 日本電気株式会社 スタックモジュール
JPH1117058A (ja) * 1997-06-26 1999-01-22 Nec Corp Ｂｇａパッケージ、その試験用ソケットおよびｂｇａパッケージの試験方法
JP2000101245A (ja) * 1998-09-24 2000-04-07 Ngk Spark Plug Co Ltd 積層樹脂配線基板及びその製造方法
US7102892B2 (en) * 2000-03-13 2006-09-05 Legacy Electronics, Inc. Modular integrated circuit chip carrier
US20030234660A1 (en) * 2002-06-24 2003-12-25 Jain Sunil K. Direct landing technology for wafer probe
JP4086657B2 (ja) * 2002-12-27 2008-05-14 富士通株式会社 積層型半導体装置
US7271581B2 (en) * 2003-04-02 2007-09-18 Micron Technology, Inc. Integrated circuit characterization printed circuit board, test equipment including same, method of fabrication thereof and method of characterizing an integrated circuit device
JP2005150443A (ja) * 2003-11-17 2005-06-09 Sharp Corp 積層型半導体装置およびその製造方法
JP4583850B2 (ja) * 2004-09-16 2010-11-17 富士通セミコンダクター株式会社 半導体装置及びその製造方法
JP2006120935A (ja) * 2004-10-22 2006-05-11 Matsushita Electric Ind Co Ltd 半導体装置及びその製造方法
JP2006351565A (ja) 2005-06-13 2006-12-28 Shinko Electric Ind Co Ltd 積層型半導体パッケージ
JP4512545B2 (ja) * 2005-10-27 2010-07-28 パナソニック株式会社 積層型半導体モジュール
JP4473807B2 (ja) * 2005-10-27 2010-06-02 パナソニック株式会社 積層半導体装置及び積層半導体装置の下層モジュール
JP2007183164A (ja) * 2006-01-06 2007-07-19 Fujitsu Ltd 半導体集積回路装置及びその試験方法
JP2007281129A (ja) * 2006-04-05 2007-10-25 Toshiba Corp 積層型半導体装置
CN101601133B (zh) * 2006-10-27 2011-08-10 宇芯（毛里求斯）控股有限公司 部分图案化的引线框以及在半导体封装中制造和使用其的方法
JP5222509B2 (ja) * 2007-09-12 2013-06-26 ルネサスエレクトロニクス株式会社 半導体装置

Also Published As

Publication number Publication date
CN101459156B (zh) 2012-11-14
US8022524B2 (en) 2011-09-20
JP2009147165A (ja) 2009-07-02
CN101459156A (zh) 2009-06-17
TW200935587A (en) 2009-08-16
KR101496920B1 (ko) 2015-02-27
US20090152693A1 (en) 2009-06-18
JP5265183B2 (ja) 2013-08-14
KR20090064314A (ko) 2009-06-18

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