CN101459156B - 半导体器件 - Google Patents

半导体器件 Download PDF

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Publication number
CN101459156B
CN101459156B CN2008101832527A CN200810183252A CN101459156B CN 101459156 B CN101459156 B CN 101459156B CN 2008101832527 A CN2008101832527 A CN 2008101832527A CN 200810183252 A CN200810183252 A CN 200810183252A CN 101459156 B CN101459156 B CN 101459156B
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CN
China
Prior art keywords
wiring
pad
wiring substrate
pads
semiconductor device
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CN2008101832527A
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English (en)
Chinese (zh)
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CN101459156A (zh
Inventor
佐藤仁志
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Publication of CN101459156A publication Critical patent/CN101459156A/zh
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    • H10W90/00—
    • H10W70/60—
    • H10W72/90—
    • H10W72/9415—
    • H10W90/22—
    • H10W90/284—
    • H10W90/724—

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  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
CN2008101832527A 2007-12-14 2008-12-12 半导体器件 Active CN101459156B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007323744A JP5265183B2 (ja) 2007-12-14 2007-12-14 半導体装置
JP2007-323744 2007-12-14
JP2007323744 2007-12-14

Publications (2)

Publication Number Publication Date
CN101459156A CN101459156A (zh) 2009-06-17
CN101459156B true CN101459156B (zh) 2012-11-14

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ID=40752110

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008101832527A Active CN101459156B (zh) 2007-12-14 2008-12-12 半导体器件

Country Status (5)

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US (1) US8022524B2 (enExample)
JP (1) JP5265183B2 (enExample)
KR (1) KR101496920B1 (enExample)
CN (1) CN101459156B (enExample)
TW (1) TWI434395B (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5709386B2 (ja) * 2010-02-19 2015-04-30 キヤノン株式会社 半導体装置の製造方法及び積層型半導体装置の製造方法
US8339231B1 (en) * 2010-03-22 2012-12-25 Flextronics Ap, Llc Leadframe based magnetics package
JP5666366B2 (ja) * 2011-03-31 2015-02-12 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US20130181359A1 (en) * 2012-01-13 2013-07-18 TW Semiconductor Manufacturing Company, Ltd. Methods and Apparatus for Thinner Package on Package Structures
JP2013219170A (ja) * 2012-04-09 2013-10-24 Yokogawa Electric Corp 基板装置
US10115671B2 (en) * 2012-08-03 2018-10-30 Snaptrack, Inc. Incorporation of passives and fine pitch through via for package on package
US8969730B2 (en) * 2012-08-16 2015-03-03 Apple Inc. Printed circuit solder connections
US9443758B2 (en) * 2013-12-11 2016-09-13 Taiwan Semiconductor Manufacturing Co., Ltd. Connecting techniques for stacked CMOS devices
KR102287396B1 (ko) * 2014-10-21 2021-08-06 삼성전자주식회사 시스템 온 패키지 모듈과 이를 포함하는 모바일 컴퓨팅 장치
JP6691762B2 (ja) * 2015-11-03 2020-05-13 日本特殊陶業株式会社 検査用配線基板
KR102192569B1 (ko) * 2015-11-06 2020-12-17 삼성전자주식회사 전자 부품 패키지 및 그 제조방법
FR3044864B1 (fr) * 2015-12-02 2018-01-12 Valeo Systemes De Controle Moteur Dispositif electrique et procede d'assemblage d'un tel dispositif electrique
CN116017847A (zh) * 2023-02-24 2023-04-25 合肥维信诺科技有限公司 电路板及电子设备
CN117976660B (zh) * 2024-03-27 2024-06-21 湖北江城实验室 一种半导体结构及其热测试方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5883426A (en) * 1996-04-18 1999-03-16 Nec Corporation Stack module

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JPH1117058A (ja) * 1997-06-26 1999-01-22 Nec Corp Ｂｇａパッケージ、その試験用ソケットおよびｂｇａパッケージの試験方法
JP2000101245A (ja) * 1998-09-24 2000-04-07 Ngk Spark Plug Co Ltd 積層樹脂配線基板及びその製造方法
US7102892B2 (en) * 2000-03-13 2006-09-05 Legacy Electronics, Inc. Modular integrated circuit chip carrier
US20030234660A1 (en) * 2002-06-24 2003-12-25 Jain Sunil K. Direct landing technology for wafer probe
JP4086657B2 (ja) * 2002-12-27 2008-05-14 富士通株式会社 積層型半導体装置
US7271581B2 (en) * 2003-04-02 2007-09-18 Micron Technology, Inc. Integrated circuit characterization printed circuit board, test equipment including same, method of fabrication thereof and method of characterizing an integrated circuit device
JP2005150443A (ja) * 2003-11-17 2005-06-09 Sharp Corp 積層型半導体装置およびその製造方法
JP4583850B2 (ja) * 2004-09-16 2010-11-17 富士通セミコンダクター株式会社 半導体装置及びその製造方法
JP2006120935A (ja) * 2004-10-22 2006-05-11 Matsushita Electric Ind Co Ltd 半導体装置及びその製造方法
JP2006351565A (ja) 2005-06-13 2006-12-28 Shinko Electric Ind Co Ltd 積層型半導体パッケージ
JP4512545B2 (ja) * 2005-10-27 2010-07-28 パナソニック株式会社 積層型半導体モジュール
JP4473807B2 (ja) * 2005-10-27 2010-06-02 パナソニック株式会社 積層半導体装置及び積層半導体装置の下層モジュール
JP2007183164A (ja) * 2006-01-06 2007-07-19 Fujitsu Ltd 半導体集積回路装置及びその試験方法
JP2007281129A (ja) * 2006-04-05 2007-10-25 Toshiba Corp 積層型半導体装置
CN101601133B (zh) * 2006-10-27 2011-08-10 宇芯（毛里求斯）控股有限公司 部分图案化的引线框以及在半导体封装中制造和使用其的方法
JP5222509B2 (ja) * 2007-09-12 2013-06-26 ルネサスエレクトロニクス株式会社 半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5883426A (en) * 1996-04-18 1999-03-16 Nec Corporation Stack module

Also Published As

Publication number Publication date
US8022524B2 (en) 2011-09-20
JP2009147165A (ja) 2009-07-02
CN101459156A (zh) 2009-06-17
TW200935587A (en) 2009-08-16
KR101496920B1 (ko) 2015-02-27
US20090152693A1 (en) 2009-06-18
JP5265183B2 (ja) 2013-08-14
TWI434395B (zh) 2014-04-11
KR20090064314A (ko) 2009-06-18

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