TWI410745B - 微影裝置及元件製造方法 - Google Patents

微影裝置及元件製造方法 Download PDF

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Publication number
TWI410745B
TWI410745B TW099106186A TW99106186A TWI410745B TW I410745 B TWI410745 B TW I410745B TW 099106186 A TW099106186 A TW 099106186A TW 99106186 A TW99106186 A TW 99106186A TW I410745 B TWI410745 B TW I410745B
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TW
Taiwan
Prior art keywords
substrate
liquid
slit
gas
substrate table
Prior art date
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TW099106186A
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English (en)
Chinese (zh)
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TW201024916A (en
Inventor
包伯 史翠卡克
史喬德 尼可拉斯 萊伯特斯 當德斯
葛瑞夫 羅芙 佛德瑞克 丹
克里斯汀恩 亞歷山大 胡格丹
馬汀斯 漢德利克斯 安東尼斯 里恩德斯
喬洛恩 喬恩斯 蘇菲亞 馬莉亞 馬丁斯
米歇爾 瑞潘
Original Assignee
Ａｓｍｌ荷蘭公司
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Publication of TW201024916A publication Critical patent/TW201024916A/zh
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Publication of TWI410745B publication Critical patent/TWI410745B/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW099106186A 2005-05-03 2006-04-20 微影裝置及元件製造方法 TWI410745B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/120,176 US7433016B2 (en) 2005-05-03 2005-05-03 Lithographic apparatus and device manufacturing method

Publications (2)

Publication Number Publication Date
TW201024916A TW201024916A (en) 2010-07-01
TWI410745B true TWI410745B (zh) 2013-10-01

Family

ID=36716876

Family Applications (2)

Application Number Title Priority Date Filing Date
TW099106186A TWI410745B (zh) 2005-05-03 2006-04-20 微影裝置及元件製造方法
TW095114175A TWI326004B (en) 2005-05-03 2006-04-20 Lithographic apparatus and device manufacturing method

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW095114175A TWI326004B (en) 2005-05-03 2006-04-20 Lithographic apparatus and device manufacturing method

Country Status (7)

Country Link
US (10) US7433016B2 (enExample)
EP (4) EP2267539A1 (enExample)
JP (3) JP4077849B2 (enExample)
KR (1) KR100706922B1 (enExample)
CN (3) CN101794084B (enExample)
SG (1) SG126920A1 (enExample)
TW (2) TWI410745B (enExample)

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CN104570618B (zh) * 2014-12-25 2016-08-17 浙江大学 基于亲疏水交替表面的浸没流场密封装置
CN104597720B (zh) * 2015-01-15 2016-08-17 浙江大学 一种用于浸没式光刻机的气液隔离装置
CN113189849B (zh) * 2021-04-22 2023-08-11 中国科学院光电技术研究所 一种近场光刻浸没系统及其浸没单元和接口模组

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