TWI358114B - Leadless semiconductor package and method of manuf - Google Patents

Leadless semiconductor package and method of manuf Download PDF

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Publication number
TWI358114B
TWI358114B TW95144752A TW95144752A TWI358114B TW I358114 B TWI358114 B TW I358114B TW 95144752 A TW95144752 A TW 95144752A TW 95144752 A TW95144752 A TW 95144752A TW I358114 B TWI358114 B TW I358114B
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Taiwan
Prior art keywords
leads
lead
frame
package
thickness
Prior art date
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TW95144752A
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English (en)
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TW200737475A (en
Inventor
Antonio Romarico S San
Anang Subagio
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Advanced Interconnect Tech Ltd
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Publication of TW200737475A publication Critical patent/TW200737475A/zh
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Publication of TWI358114B publication Critical patent/TWI358114B/zh

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    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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Description

1358114 九、發明說明： 【發明所屬之技術領域】 本發明係關於-種無引線半導體封裝及其製造此封裝之 方法。更明確地說’本發明係關於一種製造具有減少之引 線毛邊及改良之焊料填角之無引線半導體封裝的方法。 【先前技術】 半導體元件封裝向包裝於封裝内之被稱為半導體晶粒的 —或多個積體電路元件提供環境保護。半導體晶粒具有藉 由導線結合、捲帶結合或其類似結合而電互連至引線框或 插入益之内部引線部分的輸入/輸出（1/〇)概塾。引線框或 插入器之相反外部引線部分電互連至印刷電路板上之電 路、撓性電路或其他外部電路。聚合物模塑樹脂包裝半導 體晶粒及引線框或插入器之至少内部引線部分。 當引線框或插人器之外部引線末端終止於封裝主體之表 面處且不延伸超過封裝佔據面積時，封裝被稱為,,無引線" 封裝。習知無引線封裝包括具有安置於正方形封裝 =表面之周邊周圍的四組引線之四邊爲平無引線戀) 息：’及具有安置於封裝之底部之對邊的兩组引線之雙邊 扁平無引線（DFN)封裝。 =於：造某些有引線及無引線半導體封裝，以薄片形 = 之引線'框。此矩陣被稱為框架。在製造期 導胆日日粒附著於安置於由引線框之内 之孔徑内的晶粒襯墊。接著將線界疋 端。當晶粒附著至每連至内部引線末 寸者至母一晶粒襯墊並電互連至構成框架之每 H6I45.doc 1358114 -引線框時，整個組件被模塑樹脂密封。在模塑樹脂固化 或另外硬化之後，藉由被稱為單一化之製程而使個別封裝 與密封框架分離。 " 單-化之-方法被稱為鋸切。使用鋸子切開模塑樹脂及 金屬引線框。因為模塑樹脂相對較硬且金屬引線框相對較 軟，所以鎮條必須切開不同材料且不可能為任一材料而最 佳化鑛條設計。來自銘切之金屬碎片點附於雜條，從而使 切割表面變形且減少錄條之使用壽命。引線框之不完全切 割導致毛邊之形成。毛邊可自一外部引線末端延伸至緊密 間隔之相鄰外部引線末端，從而導致短路。 在ikenaga等人的美國專利第6,744，118號中揭示一克服 關於銀切之困難之方法。參看圖1，Ikenaga等人揭示具有 沿一鋸軌104或104,而定位之一減小厚度部分1〇2的一引線 框100。自一側部分地蝕刻引線框以形成減小厚度部分 一側姓刻在此項技術中被稱為"半蝕刻"。此參考文 獻揭示㈣之寬度不能等於減小厚度部分之寬度，因為沿 蝕刻部分之寬度存在變化且不會平滑地進行切割。相應 也，雜條寬度經選擇以大於減小厚度部分之寬度⑽執 104’）或小於減小厚度部分之寬度（鑛轨1〇4卜對於鑛執 7 ’裂縫形成之問題仍然存在，且碎片（儘管減少）仍係 問題。 選擇鋸軌1〇4減少必須由鋸條切割之金屬之量，減少金 屬碎片在猫條上之累積且亦減少所形成之毛邊的數量。圖 2 °兒明此方法之缺點。引線108之外緣之-部分106自成模 116l45.doc 1358114 塑膠封裂主體之周邊110凹入，此係被稱為”拉回”的情 形。拉回產生用以與印刷電路板丨12接觸之減小區域，從 而影響點著完整性。另彳’—焊料填角114不延伸至封裝 周邊110’從而使檢驗變得困難。另夕卜引線之基底處： 表面積115減小。在裝配期’引線並排排列並由膠帶支
撐。導線結合過程在結合一金結合導線時將力施加至弓I 線。若此力不受控制，則引線將彎曲。因為可施加至"拉 回”引線之力有限，所以可用於導線結合之金導線的直徑 亦有限β 在Jeong等人的美國專利第6,6〇5,865號中揭示鋸切之另 方法。如圖3中所示，美國專利第6,6〇5,865號揭示含具 有一減小厚度突出物120之一引線框118的一封裝ιΐ6。沖 ,剪切表面122’@而單一化封裝。然而，突出物之減小 厚度降低引線之穩定性，從而使導線124之結合更為困 難。剪㈣應力引人引線及封裝，此可藉由引起分層或微 裂縫而影響可靠性。 相應地，仍需要不具有上述缺點之用以製造無引線半導 體封裝之方法，且仍需要改良之無引線半導體封裝。 【發明内容】 ' 根據本發明之第一實施例，提供一種用於一半導體封裝 之框架。該框架包括以一矩陣來排列並藉由連接條帶而互 連之複數個引線框。每―引線框包括引線且該等連接條帶 使相鄰引線框之引線彼此互連。該等連接條帶具有安置於 該等相鄰引線框之該等引線之間的溝槽，其減少待由一鋸 II6I45.doc 條在單一化期間切割之金屬之量。 x康本I月之第二實施例，提供一種用於一半導體封裝 之框架’該框牟且 、± 、 ’、/、有以一矩陣來排列並藉由連接條帶而互 之複數個引線框。將半導體晶粒黏著於由該等引線框中 =各別引線框之内部弓丨線末端外接的晶粒襯塾上且組件接 著被模塑樹脂來4+ ,A ** . πο 。接者，沿該等連接條帶來切割成模組 件以單一化個別本 卜 牛導體封裝。母一引線框包括引線且該等 連接條帶使相㈣線框之引線彼此互連。㈣連接條帶在 每引線框之相鄰引線之間具有減小厚度部分，使得在單 化之後暴露於該半導體封裝之側面上的該等引線之部分 具有比該等減小厚度部分大的輪廓高度。 根據本發月之第二貫施例’提供—種製造—半導體封裝 方法該方法包括下列步驟：提供__ u α & _ 列並藉由連接條帶而互連之複數個引線框之框架，其中每 -引線框具有複數則線且料連接條帶使相㈣線框之 引線彼此互連；在每-引線框之相鄰引線之間的該等連接 條帶中形成溝槽以形成減小厚度部分；將半導體晶粒電連 接至4等引線框中之务別引線框的内部引線；藉由—模塑 化合物來總體密封該等引線框及半導體晶粒；&沿該等連 接條帶來切割該模塑化合物及該框架以單一化個別半導體 封裝’其中暴露於該等個別半導體封裝之側面上的該等引 線之部分具有比該減小厚度部分大的輪廓高度。 在隨附圖式及下文描述中闡述本發明之—或多個實施例 之細節。本發明之其他目標、特徵及優點將自描述 IJ6 N5.doc 1358114 及申請專利範圍而變得顯而易見。 【實施方式】
圖4為本發明之一框架1〇之部分透視圖，且圖5為本發明 之一框架10之部分剖視圖。框架1〇由諸如銅或銅基合金之 導電材料形成。就銅基而言，其意謂合金含有按重量計大 於50%之銅。一鋸軌12說明一鋸條22將橫過而分離相鄰引 線框14、14’之路徑。每一引線框14包括引線16且相鄰引線 忙之引線1 6’藉由連接條帶1 8而彼此連接。如下所述，連接 條帶18具備減少鋸條22在單一化期間必須切開之金屬之量 的溝槽20。頂面蝕刻輪廓可視需要包括在鋸切之前連接引 線16、16'之處的一底切21。此底切21減少將在鋸切期間將 移除之金屬之量並進一步最小化側面毛邊之形成。 圖6說明作為框架之部件的引線框14之仰視圖而圖7為 引線框14之俯視圖。引線框14包括複數個引線“。將一晶 粒襯墊23安置於由引線16之内部末端所界定之中心孔徑
中。繫連條帶24自晶粒襯塾23之轉角延伸。將繫連條帶24 形成為具有自相對於晶粒襯㈣之末端延伸之突起26的大 體筆直之條帶體。如先前所述，將連接條帶18安置於引線 框14之周邊周圍以將引線16互連至相鄰引線框之引線16,。 鑛執12在大體垂直於引線之縱軸之方向上沿連接條帶1 8延 伸。 每一引線16具有安置於該 表面28及該引線之頂表面上 隔開並與晶粒襯墊2 3間隔開 引線之底表面上之一第一引線 之一結合點3 0。引線16彼此間 以使引線與晶粒襯墊電隔離。 116145.doc • 10- 1358114 • 錢說明之實_巾，引線框μ具有安詩晶粒襯塾23之 四邊之每一者上的八根引線16。在圖6中，由交叉影線指 不引線框14之減小厚度部分。舉例而言，引線“之末端部 分及晶粒襯墊23之周邊的厚度可減小，以形成有助於將晶 粒襯塾23及引線16鎖定於模塑樹脂中之唇緣^。同樣 地，連接條帶具備安置於引線框14之相鄰引線16之間的 減小厚度部分（溝槽）20。 . • 應、瞭解，可按特定應用之需要而更改引線之數量及定 位。舉例而言，引線框可包括安置於晶粒槪塾之對邊上的 兩組引線以用於雙邊無引線半導體封裝。此外，應瞭解， 可將晶粒襯塾消除以用於某些封裝組態，諸如用於下文所 述之圖11之覆晶組態。 圖8為框架1()之示意圖。框架包括以料來排列之複數 個引線框Μ。所說明之矩陣為引線框之8χ8矩陣，然而框 架10可包括呈任何所要陣列圖案之任何適宜數量的引線 Φ 框。 圖9Α至圖⑽描！會在連續製造步驟期間的本發明之半導 體元件封裝50。在圖9Α中，藉由連接條帶㈣引線框㈣ 相鄰引線框14,互連。形成_陣列之引線框ΐ4、14，之導 電材料的薄片具有-等於晶粒襯塾23及引線Μ之所要輪廊 高度之輪廟高度，，h”。儘管圖9Α說明兩個互連引線框，但 預期任何數量之引線框可經互連而用於多個封裝之組件。 藉由諸如衝鍛、化學㈣、雷射㈣或其㈣ 何已知製程而形成引線框Μ之特徵，包括晶粒概塾23、引 116145.doc 1358114 線16、連接條帶18及繫連條帶24β藉由諸如化學蝕刻或雷 射切除之受控減成製程來形成此等特徵中 i 田 寸诚甲之母—者中的減 小厚度區域。舉例而言，可用化學抗蝕劑塗佈意欲形成一 引線16之接觸表面、一連接條帶18之全厚度部分及—曰 概塾23之中心部分的每一表面，並可將剩餘表面暴露= 合蝕刻劑一段時間以有效地將暴露區域之厚度減小至—所 要減小厚度"Γ。減小厚度通常係連接條帶之鋸線部分、晶 粒襯墊及引線之唇緣以及繫連條帶所需的。減小厚度 在輪廟高度” h"之厚度的30%與7〇%之間，且更佳在輪廓高 度的40%與60%之間。 今门 參看圖9B，在形成引線框14之後，可用一材料來電鍍引 線16之結合點30及晶粒襯墊23之結合點刊以有助於與結合 導線結合。舉例而言，可用鎳、雀巴、金、銀及其他可導線 結合之金屬或金屬合金中之一或多者來電鍍結合點刊、 36 ° 參看圖9C，在導線結合之製備中，將每一引線16之底表 面28及晶粒襯墊23之底表面固定至一表面％。在所說明之 實施例中，使表面38形成於膠帶上。其次，使用諸如焊 料、環氧樹脂、雙面膠帶等等之習知結合材料將一半導體 晶粒4 0固定至晶粒襯墊。 多看圖9D，在將晶粒4〇固定至晶粒襯墊之後，將結合 導線42連接於晶粒4〇之表面上的1/〇襯墊料與引線上的結 & ”沾3 0之間。在某些貫施例中，結合導線亦經由結合點 3將Ο襯塾電互連至晶粒襯塾。可藉由超音波結合（其中 116145.doc -12- 1358114 力與超音波振動脈衝之組合以形成冶 (其中施加壓力與高溫之組合以形成烊接）或熱料 焊其中施加壓力、高溫與超音波脈衝之組合以形成 :)來執行導線結合。用於結合之導線竹較佳為 ΐ二T基合金。可使用捲帶自動結合()作為 ¥線結合之替代方法。
之減小厚度部分在導線結合期間不影響引線 之％疋性’因為接觸點30相鄰於厚度等於引線16 廊高度.V的連接條帶18之-部分。此與先前技術配置: 處在於，移除相鄰引線框之接觸點之間的材料減小 了接觸點與表面38之間的接觸區域’ ？而使引線在導線結 合期間相對較不穩定。 ° 參看圖9Ε’在完成導線結合之後，藉由一模塑化合物邨 來密封晶粒4〇、引線框14及結合導線42。藉由諸如轉移成
型或射出成型之任何習知技術將模'塑化合物安置於封裝部 —周圍；f莫塑化合物46為諸如聚合物模塑樹月旨（例如，環 氧树脂）之電絕緣材料。聚合物模塑樹脂之典型流動溫戶 在約25〇°C與約赋之間。或者，模塑化合物可為低溫： 熱玻璃複合物。 繫連條帶24及錢34之減小厚度允許㈣化合物^被收 納於繫連條帶24及唇緣34下，從而允許繫連條帶及唇緣^ 將曰曰粒襯塾23機械鎖^於模塑化合物财並有助於將晶粒 襯墊固持於封裝中。類似地，唇緣32將接觸點16錨定 裝中。 ' I I6145.doc 13 1358114 • I看㈣，在成型之後，移除表面則可用—材料來電 鍍接觸點16之底表面28以有助於與外部電路之電互連。舉 例而5 ’可用錄、、金、銀或其他適合材料中之—或多 者·來電鍍底表面28。 參看圖9G，鋸切或其他適合製程接著用以切開模塑化合 物46及連接條帶丨8以分離相鄰引線框14、",並形成個別半 導體封裝。如最佳於圖4及圖5中所見的，由溝槽2〇產生之 • 連接條帶18之減小厚度部分減少鋸條22在單一化5丨線框時 必須切開之金屬之量。另外，溝槽2〇產生引線16之暴露表 面28之間的空間。即使引線以經後單一化電鍍，此空間亦 降低或消除導致引線之間的短路之毛邊或汗跡之可能性。 返回參看圖9G，每一半導體封裝5〇具有一底部（第一）封 裝面52、一相對頂部（第二）封裝面54及在該底部封裝面w 與-玄頂部封裝面54之間延伸的封裝側面56。由模塑化合物 46部分地形成封裝面。將每一引線“之底表面及晶粒：墊 験 22之底表面暴露於封裝5〇之底面^上。 可將封裝50電耦接至一外部電路，諸如印刷電路、撓性 電路、另一半導體封裝、測試元.件或其他部件或元件。如 圖1 〇中所述，可將封裝5〇焊接至一印刷電路板6〇。有利的 ^暴露於封裝50之側表面56處的引線16之部分為全輪廊 高度之引線16 1而使板點著期間之全高度焊料填角62成 為可迠。將圖2及圖3之先前枝術填角與圖1 0之填角進行比 較展示本發明之引線16在封裝50之底表面52與側表面56上 具有較大接觸區域（暴露區域）.，從而改良板黏著完整性使 1 i6l45.doc 其優於由先前技術所達成的板點著完整性。另外，本發明 之接觸點〗6提供一更顯著之焊 年科填角62，此使檢驗比缺乏 I見填角或具有減小可見填角之先前技術填角的檢驗容 易0 -看圖11，在本發明之替代實施例中，藉由覆晶結合將 匕括積體電路元件4〇之半導體元件封裝66連接至引線框 心此等封裝大體類似於圖9中所示之封裝並可使用相同 而开/成T同之處在於已消除圖9之晶粒襯墊U及導 線42並藉由焊接或其類似方法將晶片上之"◦襯塾料電互 連至引線1 6上之結合點3 〇。 大體而。’本發明之框架包括藉由連接條帶互連之複數 個引線框，該等連接條帶具備安置於每一引線框之相鄰引 線:間的溝槽以減少鑛條在單一化封裝時必須切開之金屬 之量。此外，溝槽產生暴露引線之間的空間，從而降低或 消除導致引線之間的短路之毛邊或汙跡之可能性。溝槽不 二響將引線電互連至積體電路元件期間之引i的穩定性， ，而確保一致結合完整性。同樣’所得封裝具有暴露於允 許板黏著期間之焊料填角之側面上的完整引線材料。 儘管在雄封積體電路元件方面進行描述，但本發明之封 裝亦可用以密封混和元件，其中一或多個被動或光學元件 耦接至單個aH粒襯墊上之一或多個積體電路元件。 已掐述本發明之若干實施例。然而，應瞭解，可在不背 離本發明之精神及範嘴的情況下進行各種修改。相應地， 其他實施例在隨附之申請專利範圍之範疇内。 116145.doc 1358114 【圖式簡單說明】 圖1為在單一化之前自先前技術已知之引線框矩陣之— 刀的橫截面圖。 圖2為自圖丨之引線框矩陣單一化之後的半導體封裝之外 弓丨線部分的橫截面圖。 圖3為自先前技術已知之具有突出減小厚度外部引線部 分之半導體封裝的橫截面圖。
圖4為說明用於單一化之鋸線的本發明之框架之部分透 視圖。 圖5為圏4之框架之部分剖視圖。 圖6為圖4之框架之引線框部件的仰視圖。 圖7為圖6之框架之引線框部件的俯視圖。 圖8為圖4之框架之示意圖。 之半導 圖9Α至圖9G描繪在連續 體元件封裝。 製造步驟期間的本發明
圖1 〇為點著至印刷電路板的本發明 橫戴面圖。 X 之半導體封裝之部分 圖 發明 115兒明藉由覆晶結合將半導體晶 之替代半導體封裝。 粒連接至引線框的本 【主要元件符號說明】 10 框架 12 鋸軌 Μ，14， 引線框 16' 引線 II6145.doc 16 1358114
18 連接條帶 20 溝槽 21 底切 22 鋸條 23 晶粒觀塾 24 繫連條帶 26 突起 28 第一引線表面/底表面 30, 36 結合點 32, 34 唇緣 38 表面 40 半導體晶粒 42 結合導線 44 I/O襯墊 46 模塑化合物 50 半導體封裝 52 底部封裝面 54 頂部封裝面 56 封裝側面 60 印刷電路板 62 焊料填角 66 無引線封裝 100 引線框 102 減小厚度部分 116145.doc 17 1358114
104，104, 106 108 110 112 114 115 118 120 122 124 錯執 引線108之外緣之部分 引線 封裝周邊 印刷電路板 焊料填角 表面積 封裝 引線框 減小厚度突出物 表面 導線
116145.doc -18 -

Claims (1)

1358114 中文申請專利範圍替換本(100年9月） 十、申請專利範圍： 嚤 1. 一種用於製造一用以包裝 其包含下列步驟： (a).提供一導電框架，其具有以一矩陣來排列之複數 個引線框，每一引線框具有自一中心孔徑向外延伸之複 數個間隔引線，該導電框架進一步具有接合該等引線框 中之相鄰引線框之相對外部末端部分的複數個連接條 帶； ⑻·在該等連接條帶中形成—溝槽以在該等引線框之 每一者中之相㈣線的該等外部末端部分之間形成一減 小厚度部分，使得沿著一第一 弟方向之分開相鄰引線框及 在該等相鄰引線框之該等中 τ 札仫之間寺距離且橫越該 等連接條帶的-路徑之該引線框的交錯部分具有一完整 著：：及’減；之南度’以及每一該減少之高度部分沿 Π，該完整之高度部分具有較大之距離，該等連 接條，以—垂直該第-方向之第二方向延伸； (C)·將该半導體晶粒電搞接5 j3| 黾耦接至该等引線之内部； 粒=用一模塑化合物來密封該框架及該半導體晶 一= ::=切割該模塑化合物及該框架以形成單 於該減小厚度部分之高度。 刀一有大 2.如請求们之方法，其中 來形成該溝槽。 /忙架之—側化學蝕刻 116I45-1000926.doc 1358114 言、項2之方法，其中該溝槽將該減小厚度部分之厚 度減小至該框架之厚度的30%至70%。 * 月长項2之方法，其中藉由鋸切來進行該切割步驟 項4之方法，其中該鑛切步戰產生用以構成該半 導體封裝之一周邊表面之一部分的該等外部引線部分之 一側面部分β 如月长項5之方法，其中該等外部引線部分之該側面部 分的局度等於該框架之高度。 7·如凊求項5之方法，其中用一金屬塗佈構成該等周邊表 面之該等側面部分以增強焊料濕潤。 8. 如清求項2之方法，其中該框架進一步包括一安置於該 中心孔徑内之晶粒襯墊且將該半導體晶粒與該晶粒襯墊 結合。 9. 如請求項8之方法，其中該化學蝕刻步驟進一步在該等 引線及該晶粒襯塾中之至少一者上形成一唇緣。 10. 如請求項2之方法，其中將該半導體晶粒直接與該等引 線之各内部末端部分結合。 11· 一種用於一半導體封裝之導電框架，其包含： 複數個引線框’其以一矩陣來排列，每一引線框具有 一第一側及一相對之第二側，且具有自一中心孔徑向外 延伸之複數個間隔引線；及 複數個連接條帶，其接合該等引線框中之相鄰引線框 之各外部末端部分’每一連接條帶包括介於相鄰引線之 116145-1000926.doc .間的-區域’其沒有引線接合該條帶，#中該等引線之 每者具有一完整厚度部分及在該引線框之該第一側處 之-減少厚度部分，該減少厚度部分沿著該連接條帶的 一第-方Μ與其交錯之1二方向延伸超過該完整厚 度部分’以及一溝槽’延伸入每—該連接條帶之該區域 並安置於每-該引線框之各相鄰引線之間，使得沿著該 第一方向之一軸中的中心孔徑之間等距離，在該區域中 每-該連接條帶具有—小於該等引線之完整厚度部分之 厚度，以及在2又該等引線之部分巾，且藉此連接在該 第二方向之相鄰引線框之引線之相對外部末端部分，具 有一相等於該等引線之該完整厚度部分之厚度。 12.如請求項R導電框架’其中位於該溝槽下方之該連接 條帶之一部分的厚度為該導電框架之厚度之3〇%至 70%。 13·如請求項!2之導電框架，進一步包含一晶粒襯塾係安置 於該中心孔徑内。 如請求項13之導電框架’其中該晶粒襯墊及該等引線中 之至少-者包括一圍繞其一周邊的減小厚度唇緣。 15· —種密封至少一半導體晶粒之無引線封裝，其包含·· 一引線框，其具有自各内部引線末端向外延伸至各外 部引線末端之複數個引線，其令該等内部引線末端界定 -中心孔# ’且該等外部引線末端之各側面部分界定该 無引線封裝之-周邊表面，其t該等内部引線末端且： —底切口使得該等外部引線末端具有較該等内部引線末 116145-]〇〇〇926 d〇( 1358114 端厚之一厚度； 該至少一半導體晶粒，其安置於該中心孔徑内並電^ 連至該等内部引線末端，該半導體晶粒之至少一外部部 分係安置於一與該等内部引線末端共平面之表面上；及 一模塑化合物’其密封該至少一半導體晶粒及該等内 部引線末端，其中該模塑化合物進一步界定該無引線封 裝之該周邊表面。 16. 如=求項15之無引線封裝，其中由料外部引線末端所 界定之該周邊表面具有—相當於已藉由化學蝕刻而部分 地形成且藉由鋸切而部分地形成的表面。 17. 如:求項16之無弓丨線封裝，其中由該等外部引線末端所 界疋之„亥周邊表面係由一增強悍料可濕性之金 佈。 主 18. 如請求項17之i引蝻 …線封裝’其中一晶粒襯墊係安置於診 中心孔控内且該至.—、上增祕 ^ 半導體晶粒係與該晶粒襯墊結 19.如請求項17之盔引綠4 線封裝’其中該至少一半導體 直接與該等内部$丨線末端結合。 116145-1000926.doc
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