TWI355430B - - Google Patents
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- Publication number
- TWI355430B TWI355430B TW096106055A TW96106055A TWI355430B TW I355430 B TWI355430 B TW I355430B TW 096106055 A TW096106055 A TW 096106055A TW 96106055 A TW96106055 A TW 96106055A TW I355430 B TWI355430 B TW I355430B
- Authority
- TW
- Taiwan
- Prior art keywords
- printed circuit
- circuit board
- plating
- contact body
- hole
- Prior art date
Links
- 238000007747 plating Methods 0.000 claims description 134
- 239000000758 substrate Substances 0.000 claims description 65
- 238000009713 electroplating Methods 0.000 claims description 50
- 239000004020 conductor Substances 0.000 claims description 42
- 238000000034 method Methods 0.000 claims description 30
- 230000035515 penetration Effects 0.000 claims description 3
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims 1
- 239000002305 electric material Substances 0.000 claims 1
- 229910052707 ruthenium Inorganic materials 0.000 claims 1
- 239000010408 film Substances 0.000 description 57
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 45
- 229910052802 copper Inorganic materials 0.000 description 28
- 239000010949 copper Substances 0.000 description 28
- 239000010410 layer Substances 0.000 description 19
- 239000011889 copper foil Substances 0.000 description 17
- 239000007788 liquid Substances 0.000 description 16
- 239000011347 resin Substances 0.000 description 15
- 229920005989 resin Polymers 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 14
- 239000000243 solution Substances 0.000 description 13
- 239000004642 Polyimide Substances 0.000 description 7
- 230000001965 increasing effect Effects 0.000 description 7
- 229920001721 polyimide Polymers 0.000 description 7
- 230000008859 change Effects 0.000 description 6
- 239000000835 fiber Substances 0.000 description 6
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 5
- 229910052500 inorganic mineral Inorganic materials 0.000 description 5
- 239000011707 mineral Substances 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 230000008030 elimination Effects 0.000 description 3
- 238000003379 elimination reaction Methods 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000002759 woven fabric Substances 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000005242 forging Methods 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000005363 electrowinning Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 238000005382 thermal cycling Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/22—Electroplating combined with mechanical treatment during the deposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/005—Contacting devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/615—Microstructure of the layers, e.g. mixed structure
- C25D5/617—Crystalline layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0257—Brushing, e.g. cleaning the conductive pattern by brushing or wiping
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006045358A JP4878866B2 (ja) | 2006-02-22 | 2006-02-22 | めっき装置及びめっき方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200745388A TW200745388A (en) | 2007-12-16 |
| TWI355430B true TWI355430B (https=) | 2012-01-01 |
Family
ID=38437374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096106055A TW200745388A (en) | 2006-02-22 | 2007-02-16 | Plating apparatus and method of plating |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8679576B2 (https=) |
| EP (1) | EP1988191A4 (https=) |
| JP (1) | JP4878866B2 (https=) |
| KR (1) | KR20080037696A (https=) |
| CN (1) | CN101341278B (https=) |
| TW (1) | TW200745388A (https=) |
| WO (1) | WO2007097335A1 (https=) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100907841B1 (ko) | 2004-09-24 | 2009-07-14 | 이비덴 가부시키가이샤 | 도금 방법 및 도금 장치 |
| US20110056838A1 (en) * | 2009-09-04 | 2011-03-10 | Ibiden, Co., Ltd. | Method of manufacturing printed wiring board |
| TW201410085A (zh) * | 2012-05-02 | 2014-03-01 | Ceramtec Gmbh | 製造具充金屬之通路的陶瓷基材的陶瓷電路板的方法 |
| CN103695894B (zh) * | 2012-09-28 | 2016-03-16 | 亚智科技股份有限公司 | 用于使化学液与基板表面均匀反应的方法及其设备 |
| JP2014138033A (ja) * | 2013-01-15 | 2014-07-28 | Sumitomo Electric Printed Circuit Inc | フレキシブルプリント配線板及びその製造方法 |
| JP2014138032A (ja) * | 2013-01-15 | 2014-07-28 | Sumitomo Electric Printed Circuit Inc | フレキシブルプリント配線板及びその製造方法 |
| CN104217878B (zh) * | 2014-09-15 | 2016-06-22 | 南通万德科技有限公司 | 一种镀贵金属开关触点元件及其制备方法 |
| US10208391B2 (en) | 2014-10-17 | 2019-02-19 | Ut-Battelle, Llc | Aluminum trihalide-neutral ligand ionic liquids and their use in aluminum deposition |
| KR20180024230A (ko) * | 2016-08-29 | 2018-03-08 | 현대모비스 주식회사 | 연속 비구면커브부를 구비한 다면 렌즈 |
| JP6986921B2 (ja) * | 2017-10-12 | 2021-12-22 | 株式会社荏原製作所 | めっき装置及びめっき方法 |
| CN109234776B (zh) * | 2018-09-17 | 2020-04-10 | 芜湖海成科技有限公司 | 一种便捷式导电工装 |
| CN110629264B (zh) * | 2019-11-11 | 2021-09-24 | 生益电子股份有限公司 | 一种pcb电镀装置 |
| CN114197020B (zh) * | 2022-01-10 | 2022-09-06 | 唐山曹妃甸通益机电设备有限公司 | 一种电镀修复设备及其修复方法 |
Family Cites Families (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4073699A (en) | 1976-03-01 | 1978-02-14 | Hutkin Irving J | Method for making copper foil |
| JPS5757896A (en) | 1980-09-26 | 1982-04-07 | Fuji Photo Film Co Ltd | Electrolyzing device for strip-like metallic plate |
| JPS586999A (ja) * | 1981-07-07 | 1983-01-14 | Satoosen:Kk | 連続自動電解めつき方法及び装置 |
| US4964948A (en) | 1985-04-16 | 1990-10-23 | Protocad, Inc. | Printed circuit board through hole technique |
| JPS63270497A (ja) | 1987-04-27 | 1988-11-08 | Nippon Sanmou Senshoku Kk | 導電性材料の電気めつき方法および装置 |
| JPS63297588A (ja) | 1987-05-29 | 1988-12-05 | Sagami Shokai:Kk | 孤立した導電体の電解メッキ法 |
| US5229549A (en) | 1989-11-13 | 1993-07-20 | Sumitomo Electric Industries, Ltd. | Ceramic circuit board and a method of manufacturing the ceramic circuit board |
| FR2657219B1 (fr) * | 1990-01-11 | 1994-02-18 | Gim Industrie Sa | Procede de fabrication de circuits imprimes souples, circuit imprime fabrique par ce procede, et dispositif pour la mise en óoeuvre de ce procede. |
| JP3099498B2 (ja) | 1992-02-24 | 2000-10-16 | 松下電器産業株式会社 | 全面めっき装置の給電装置 |
| JP3057924B2 (ja) | 1992-09-22 | 2000-07-04 | 松下電器産業株式会社 | 両面プリント基板およびその製造方法 |
| JPH06146066A (ja) | 1992-11-05 | 1994-05-27 | Nkk Corp | 連続電解処理装置 |
| JP3291103B2 (ja) | 1993-12-22 | 2002-06-10 | 住友特殊金属株式会社 | 連続表面処理装置 |
| JPH08144086A (ja) | 1994-11-25 | 1996-06-04 | Taisho Kogyo Kk | 給電ロール装置 |
| JP3101197B2 (ja) | 1994-12-01 | 2000-10-23 | イビデン株式会社 | 多層プリント配線板およびその製造方法 |
| CN1117512C (zh) * | 1994-12-01 | 2003-08-06 | 揖斐电株式会社 | 多层印刷电路板及其制造方法 |
| DE19612555C2 (de) * | 1996-03-29 | 1998-03-19 | Atotech Deutschland Gmbh | Verfahren zur selektiven elektrochemischen Behandlung von Leiterplatten und Vorrichtung zur Durchführung des Verfahrens |
| US6534116B2 (en) | 2000-08-10 | 2003-03-18 | Nutool, Inc. | Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence |
| JP2000232078A (ja) * | 1999-02-10 | 2000-08-22 | Toshiba Corp | メッキ方法及びメッキ装置 |
| CN1197150C (zh) | 1999-02-18 | 2005-04-13 | 精工爱普生株式会社 | 半导体装置、安装基板及其制造方法、电路基板和电子装置 |
| JP4309503B2 (ja) * | 1999-02-18 | 2009-08-05 | イビデン株式会社 | 連続帯の電気めっき装置 |
| JP4480236B2 (ja) | 1999-08-06 | 2010-06-16 | イビデン株式会社 | 電解めっき液、その液を用いた多層プリント配線板の製造方法および多層プリント配線板 |
| US6294060B1 (en) * | 1999-10-21 | 2001-09-25 | Ati Properties, Inc. | Conveyorized electroplating device |
| US6863209B2 (en) | 2000-12-15 | 2005-03-08 | Unitivie International Limited | Low temperature methods of bonding components |
| TW584899B (en) * | 2001-07-20 | 2004-04-21 | Nutool Inc | Planar metal electroprocessing |
| US7238092B2 (en) | 2001-09-28 | 2007-07-03 | Novellus Systems, Inc. | Low-force electrochemical mechanical processing method and apparatus |
| JP3916946B2 (ja) * | 2001-12-14 | 2007-05-23 | イビデン株式会社 | 電解めっき液の評価方法および多層プリント配線板の製造方法 |
| US20040262150A1 (en) * | 2002-07-18 | 2004-12-30 | Toshikazu Yajima | Plating device |
| JP4212905B2 (ja) | 2003-01-23 | 2009-01-21 | 株式会社荏原製作所 | めっき方法およびこれに使用するめっき装置 |
| US6802761B1 (en) * | 2003-03-20 | 2004-10-12 | Hitachi Global Storage Technologies Netherlands B.V. | Pattern-electroplated lapping plates for reduced loads during single slider lapping and process for their fabrication |
| JP3723963B2 (ja) * | 2003-06-06 | 2005-12-07 | 三井金属鉱業株式会社 | メッキ装置および電子部品実装用フィルムキャリアテープの製造方法 |
| JP2005113173A (ja) * | 2003-10-03 | 2005-04-28 | Toppan Printing Co Ltd | フレキシブル多層配線基板の電解めっき装置 |
| US8349393B2 (en) * | 2004-07-29 | 2013-01-08 | Enthone Inc. | Silver plating in electronics manufacture |
| KR100907841B1 (ko) | 2004-09-24 | 2009-07-14 | 이비덴 가부시키가이샤 | 도금 방법 및 도금 장치 |
-
2006
- 2006-02-22 JP JP2006045358A patent/JP4878866B2/ja not_active Expired - Fee Related
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2007
- 2007-02-16 TW TW096106055A patent/TW200745388A/zh not_active IP Right Cessation
- 2007-02-20 WO PCT/JP2007/053096 patent/WO2007097335A1/ja not_active Ceased
- 2007-02-20 KR KR1020087005135A patent/KR20080037696A/ko not_active Ceased
- 2007-02-20 EP EP07714599A patent/EP1988191A4/en not_active Withdrawn
- 2007-02-20 CN CN2007800008355A patent/CN101341278B/zh not_active Expired - Fee Related
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2008
- 2008-08-06 US US12/186,919 patent/US8679576B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| EP1988191A1 (en) | 2008-11-05 |
| KR20080037696A (ko) | 2008-04-30 |
| JP4878866B2 (ja) | 2012-02-15 |
| CN101341278B (zh) | 2011-07-06 |
| WO2007097335A1 (ja) | 2007-08-30 |
| EP1988191A4 (en) | 2012-10-31 |
| CN101341278A (zh) | 2009-01-07 |
| US20090029037A1 (en) | 2009-01-29 |
| TW200745388A (en) | 2007-12-16 |
| JP2007224347A (ja) | 2007-09-06 |
| US8679576B2 (en) | 2014-03-25 |
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