WO2014081041A1 - 表面処理電解銅箔、積層板、及びプリント配線板 - Google Patents
表面処理電解銅箔、積層板、及びプリント配線板 Download PDFInfo
- Publication number
- WO2014081041A1 WO2014081041A1 PCT/JP2013/081806 JP2013081806W WO2014081041A1 WO 2014081041 A1 WO2014081041 A1 WO 2014081041A1 JP 2013081806 W JP2013081806 W JP 2013081806W WO 2014081041 A1 WO2014081041 A1 WO 2014081041A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- copper foil
- electrolytic copper
- roughness
- treated electrolytic
- ppm
- Prior art date
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
Definitions
- the present invention relates to a surface-treated electrolytic copper foil, a laminated board, and a printed wiring board.
- the fine pitch of the conductor pattern with respect to the printed wiring board is better formed as the roughness of the copper foil roughening surface is lower. Therefore, with recent finer pitches of conductor patterns, demands for lowering the roughness of the copper foil roughening surface are increasing.
- a copper foil is bonded to a resin to form a laminated plate.
- the adhesion reliability with the resin at that time increases as the roughness of the rough surface of the copper foil increases the anchor effect generated on the rough surface. It becomes good.
- the adhesion reliability is one of the important management items in forming a fine pitch, and it is said that 90 ° peel strength should be a certain value (0.6 kg / cm) or more.
- Another method for evaluating adhesion reliability is to immerse a laminate with a resin substrate in a high temperature bath at 260 ° C. and measure the number of blisters generated on the surface.
- Piece / m 2 is regarded as a standard for adhesion reliability.
- Patent Document 1 discloses a surface area (three-dimensional area: A ⁇ m 2 ) and a two-dimensional area when a two-dimensional area having a surface roughness (Rzjis) of 2.5 ⁇ m or less and a surface area of 6550 ⁇ m 2 is measured by a laser method.
- the ratio of the surface area ratio (B) calculated by the ratio [(A) / (6550)] to 1.25 to 2.50, and the amount of chromium per unit area of the two-dimensional region is 2.0 mg / m 2
- the surface-treated copper foil characterized by providing the adhesive surface with the insulating resin base material which is the above is disclosed.
- the conventional technique mainly focuses on and controls Rz on the roughened surface of the copper foil.
- the number of occurrences of swelling of the adhesive interface with the resin substrate is different even if the Rz of the roughened surface of the copper foil is controlled to be the same value and the other conditions are the same. The result was obtained. For this reason, it has been found that a copper foil in which only the Rz on the roughened surface of the copper foil is controlled is not sufficient to obtain good adhesion reliability.
- the present invention provides a surface-treated electrolytic copper foil, a laminate, and a printed wiring board that can be fine pitched and have excellent adhesion reliability with a resin.
- the roughness Rz of the rough surface of the copper foil measured using a stylus roughness meter is 2.0 ⁇ m or less, and the roughness of the rough surface is This is a surface-treated electrolytic copper foil having a Kurtosis number Sku of 2-4.
- the roughness Rz is 0.8 to 1.8 ⁇ m.
- the kurtosis number Sku is 2.5 to 3.5.
- the ratio A / B between the surface area A of the rough surface and the area B obtained when the rough surface is viewed in plan is 1.2 to 2.0.
- the ratio A / B is 1.3 to 1.9.
- the normal peel strength is 0.8 kg / cm or more.
- the present invention is a laminated plate formed by laminating the surface-treated electrolytic copper foil of the present invention and a resin substrate.
- the present invention is a printed wiring board made of the laminated board of the present invention.
- a surface-treated electrolytic copper foil, a laminate, and a printed wiring board that can be fine pitched and have excellent adhesion reliability with a resin.
- the electrolytic copper foil used in the present invention is useful for an electrolytic copper foil used by making a laminate by bonding to a resin substrate and removing it by etching.
- the electrolytic copper foil used in the present invention is for the purpose of improving the peel strength (adhesion reliability) of the copper foil after lamination on the surface of the copper foil that adheres to the resin substrate, that is, the roughened surface.
- a roughening treatment is performed on the surface of the copper foil after the pretreatment to perform fist-like electrodeposition.
- the electrolytic copper foil has irregularities at the time of manufacture, the irregularities are further increased by enhancing the convex portions of the electrolytic copper foil by roughening treatment.
- the roughness Rz of the rough surface of the copper foil measured using a stylus type roughness meter is 2.0 ⁇ m or less in accordance with JIS B0601-1994.
- the roughness Rz of the roughened surface measured using a stylus roughness meter is preferably 0.8 to 1.8 ⁇ m, more preferably 1.0 to 1.7 ⁇ m. This roughness Rz can be controlled by optimizing the shine surface (S surface) processing conditions of the copper foil and using a double-side smooth raw foil.
- the kurtosis number Sku of the roughness curve of the rough surface is determined from the viewpoint that the “sharpness” affects the adhesion reliability with the resin substrate for the unevenness present on the rough surface. It is controlled to 2-4.
- the kurtosis number Sku of the roughness curve represents the degree of sharpness (roundness) of the unevenness on the rough surface of the copper foil. It becomes a curve.
- the kurtosis number Sku of the roughness curve is an index of the degree of sharpness of unevenness in the three-dimensional surface roughness measurement with a non-contact type roughness meter in conformity with ISO 25178 draft.
- the height of the unevenness (mountain) in the Z-axis direction which is obtained by dividing the following squared average of the peak height Z (x) at the reference length lr by the square of the root mean square roughness Rq below. is there.
- the kurtosis number Sku of the roughness curve increases as the degree of sharpness and sharpness of the unevenness on the rough surface of the copper foil increases.
- the variation in the size of the unevenness existing on the rough surface of the copper foil increases as the degree of sharpness of the unevenness becomes sharper. Therefore, by controlling the kurtosis number Sku of the roughness curve indicating that the shape of the unevenness is controlled, the unevenness of the unevenness existing on the copper foil rough surface can be further suppressed. In this way, by suppressing the variation in the size of the unevenness present on the rough surface of the copper foil, it is difficult for air to accumulate on the surface of the copper foil even if the pitch is fine.
- the kurtosis number Sku of the roughness curve of the rough surface is less than 2, sufficient adhesion to the resin cannot be maintained, and if it exceeds 4, there is a problem that swelling occurs after heating as described above.
- the kurtosis number Sku of the roughness curve is preferably 2.5 to 3.7, more preferably 2.5 to 3.5, and more preferably 2.4 to 3.4.
- the kurtosis number Sku can be controlled by optimizing the roughening condition of the copper foil.
- the ratio A / B between the surface area A of the rough surface (surface roughened) and the area B obtained when the rough surface is viewed in plan is 1.2 to 2. 0 is preferred.
- the surface area A is a surface area (three-dimensional area) when a two-dimensional region in a predetermined range is measured by a laser method, and an area B obtained when the rough surface is viewed in plan is an area of the two-dimensional region. Indicates. These surface area ratios A / B are alternative indicators of the contact area between the surface-treated electrolytic copper foil and the resin substrate.
- the surface area ratio A / B is less than 1.2, there is a possibility that sufficient adhesion with the resin cannot be secured. If it exceeds 0.0, as described above, there is a possibility that the problem of swelling occurs after heating.
- the surface area ratio A / B is more preferably 1.3 to 1.9.
- the surface area ratio A / B can be controlled by optimizing the roughening treatment conditions of the copper foil. For example, when W is added to the copper roughening solution, the surface area ratio A / B increases. Further, when the current density is increased in the copper roughening treatment, the surface area ratio A / B is increased, and when the current density is decreased, the surface area ratio is decreased. In this way, the surface area ratio A / B can be controlled to 1.2 to 2.0.
- the surface-treated electrolytic copper foil of the present invention has a good normal peel strength.
- the surface-treated electrolytic copper foil of the present invention preferably has a normal peel strength measured according to JIS C5016 of 0.8 kg / cm or more.
- the normal peel strength is more preferably 0.9 kg / cm or more.
- the surface-treated electrolytic copper foil of the present invention As described above, high-temperature bath swelling is well suppressed. Specifically, the surface-treated electrolytic copper foil of the present invention is formed after forming a fine pitch circuit as a conductor pattern and then immersing it in a high-temperature bath at 260 ° C. for 1 minute when adhered on a roughened surface with a resin substrate. The number of blisters generated is preferably 0-1 / m 2 .
- an electrolytic copper foil (raw foil) is prepared.
- the electrolytic copper foil used in the present invention is an electrolytic copper foil having a high temperature elongation in which pinholes are suppressed, which is a useful characteristic as a raw foil.
- the electrolytic copper foil used in the present invention is produced by electrolysis using a sulfuric acid copper sulfate electrolytic solution.
- a sulfuric acid copper sulfate electrolytic solution By adjusting the glue concentration in the electrolyte to 0.5 ppm or less, preferably 0.01 to less than 0.2 ppm, and preferably, an adjusted amount of chloride ions is added, and the electrolyte temperature, sulfuric acid
- concentration as well By adjusting other electrolysis conditions such as concentration as well, an electrolytic copper foil having no high-temperature elongation can be obtained without generating pinholes.
- the amount of glue taken into the electrolytic copper foil produced using the electrolytic solution is reduced, crystal annealing (recrystallization) is promoted during high temperature treatment, and as a result, the elongation at high temperature is increased.
- Electrolyte composition Cu: 50 to 120 g / l H 2 SO 4 : 20 to 200 g / l, preferably 40 to 120 g / l Chloride ion (Cl ⁇ ): 20 to 100 ppm (mg / l) Nika: 0.5 ppm (mg / l) or less, preferably 0.01 to less than 0.2 ppm (mg / l)
- Electrolysis conditions Electrolyte temperature: 20-70 ° C, preferably 40-60 ° C Current density: 20 to 150 A / dm 2 Anode: Pb
- the sulfuric acid concentration is 20 to 200 g / l, preferably 40 to 120 g / l. If it is less than 20 g / l, the electroconductivity of the electrolytic solution decreases and the electrolytic cell voltage increases. If it exceeds 200 g / l, the production of a high-temperature stretched copper foil becomes increasingly difficult, and the corrosion of the equipment tends to occur.
- chloride ions are added in an amount of 20 to 100 ppm (mg / l). Outside this range, the basic properties (such as tensile strength and roughness) of the electrolytic copper foil are not constant.
- Chloride ions are added in the form of hydrochloric acid, sodium chloride, potassium chloride and the like.
- the electrolyte temperature is 20 to 70 ° C., preferably 40 to 60 ° C.
- the electrolyte temperature is lowered, a high-temperature stretched copper foil can be produced even if the glue concentration is increased. If it is less than 20 degreeC, the electrical conductivity of electrolyte solution will fall and an electrolytic cell voltage will rise. When it exceeds 70 degreeC, manufacture of a high high temperature elongation copper foil becomes difficult gradually, and energy cost also increases.
- the current density range is 20 to 150 A / dm 2 in order to produce an electrolytic copper foil in a stable and practically acceptable time.
- ⁇ Foil foil making conditions> In the electrolytic solution at the time of making the green foil, the glue concentration is 1 to 10 ppm, SPS [bis (3-sulfopropyl) disulfide disodium] is 1 to 50 ppm, and the amine compound [tertiary amine compound] is 1 to By setting it to 50 ppm, the raw foil surface is smoothed (the unevenness is not sharp). Thereby, the shape of the roughening particle
- the kurtosis number Sku can be made smaller than that of a general electrolytic copper foil (for example, when the raw foil is made of an electrolytic solution to which copper, sulfuric acid, Cl, and glue are added).
- the following compounds are used as a tertiary amine compound.
- R 1 and R 2 are selected from the group consisting of hydroxyalkyl groups, ether groups, aryl groups, aromatic substituted alkyl groups, unsaturated hydrocarbon groups, and alkyl groups.
- R 1 and R 2 were both methyl groups.
- the above-mentioned compounds used in the examples described later can be obtained, for example, by mixing a predetermined amount of Deconal Ex-314 manufactured by Nagase ChemteX Corporation and dimethylamine and reacting at 60 ° C. for 3 hours.
- roughening treatment is performed on the surface of the electrolytic copper foil.
- the roughening treatment for example, the following conditions can be employed.
- the roughened surface of the electrolytic copper foil is defined as the roughened surface.
- both As and W are added, or Mo is added to round the shape of the roughened particles.
- the kurtosis number Sku can be reduced.
- the shape of the roughened particles can be sharpened (the tips of the particles are sharp).
- the kurtosis number Sku can be increased.
- the liquid temperature for example, lower than 20 ° C. and lower than 25 ° C.
- the shape of the roughened particles can be sharpened (the tips of the particles are sharp). In this way, the kurtosis number Sku can be increased.
- thin copper plating is performed as a covering layer for preventing the particles from falling off.
- the following conditions can be adopted.
- ⁇ Covered copper plating conditions> By increasing the current density (for example, greater than 60 A / dm 2 ), the shape of the roughened particles can be sharpened (the tips of the particles are sharp). In this way, the kurtosis number Sku can be increased.
- a treating process for forming one or more single metal layers or alloy layers selected from Cu, Cr, Ni, Fe, Co and Zn on the roughened surface.
- alloy plating include Cu—Ni, Cu—Co, Cu—Ni—Co, Cu—Zn and others.
- Such treating treatment serves as a determinant of the final properties of the copper foil and as a barrier.
- a heat-resistant layer or a rust-proof layer may be formed on the roughened surface with a simple substance or alloy of nickel, cobalt, copper, zinc or the like, and further, the surface may be subjected to a treatment such as chromate treatment or silane coupling treatment. Good.
- a heat-resistant layer or a rust-preventing layer may be formed from nickel, cobalt, copper, zinc alone or an alloy without roughening, and the surface may be subjected to a treatment such as chromate treatment or silane coupling treatment.
- a treatment such as chromate treatment or silane coupling treatment.
- one or more layers selected from the group consisting of a heat-resistant layer, a rust-preventing layer, a chromate treatment layer, and a silane coupling treatment layer may be formed on the surface (roughening surface) of the roughening treatment layer.
- You may form 1 or more types of layers selected from the group which consists of a heat-resistant layer, a rust prevention layer, a chromate treatment layer, and a silane coupling treatment layer on the surface of electrolytic copper foil.
- the above-mentioned heat-resistant layer, rust prevention layer, chromate treatment layer, and silane coupling treatment layer may each be formed of a plurality of layers (for example, 2 layers or more
- the laminate can be produced by bonding the surface-treated electrolytic copper foil of the present invention to the resin substrate from the roughened surface side.
- the resin substrate is not particularly limited as long as it has characteristics applicable to a printed wiring board or the like.
- a paper base phenol resin, a paper base epoxy resin, a synthetic fiber cloth base epoxy resin for rigid PWB Glass cloth / paper composite substrate epoxy resin, glass cloth / glass nonwoven fabric composite substrate epoxy resin, glass cloth substrate epoxy resin, etc. are used, polyester film, polyimide film, liquid crystal polymer (LCP) film etc. for FPC Can be used.
- a prepreg in which a base material such as glass cloth is impregnated with a resin and the resin is cured to a semi-cured state is prepared. It can be carried out by superposing a copper foil on the prepreg from the opposite surface of the coating layer and heating and pressing.
- FPC it is laminated on a copper foil under high temperature and high pressure without using an adhesive on a substrate such as a polyimide film, or a polyimide precursor is applied, dried, cured, etc.
- a laminated board can be manufactured by performing.
- the laminate of the present invention can be used for various printed wiring boards (PWB) and is not particularly limited.
- PWB printed wiring boards
- the single-sided PWB, the double-sided PWB, and the multilayer PWB 3
- rigid PWB, flexible PWB (FPC), and rigid flex PWB from the viewpoint of the type of insulating substrate material.
- raw foil was produced under the production conditions shown in Table 1, followed by roughening treatment under the production conditions shown in Table 2, and further according to the production conditions shown in Table 3.
- the roughened surface was covered with copper to form a rough surface.
- the treated surface M represents a mat surface (copper deposition surface)
- the treated surface S represents a Shine surface.
- a / B Surface area ratio (A / B);
- the surface area of the rough surface was measured by a laser microscope.
- the measurement environment temperature was 23 to 25 ° C.
- Kurtosis number Sku An Olympus LEXT OLS 4000 three-dimensional surface shape measuring apparatus was used to measure an area of 257.9 ⁇ 257.9 ⁇ m on the roughened surface of the test material with a resolution of 0.12 ⁇ m in plane and 0.01 ⁇ m in height.
- the measurement environment temperature was 23 to 25 ° C.
- Hot tub swelling A copper foil was laminated and bonded to a glass cloth base epoxy resin plate, and a fine pitch circuit was formed on the copper foil by etching (ferric chloride aqueous solution) to prepare a laminate. Subsequently, the laminate was immersed in a high temperature bath at 260 ° C. for 1 minute, and the number of blisters generated on the surface was measured and converted to the number per 1 m 2 . The evaluation results are shown in Table 4.
- Examples 1 to 6 all had good adhesion reliability, and no swelling occurred even when immersed in a high-temperature bath.
- the roughness Rz is 2.0 ⁇ m or less, but the Kurtosis number Sku of the roughness curve of the rough surface is outside the range of 2 to 4, so is the adhesion reliability poor? Alternatively, many blisters occurred when immersed in a hot tub.
- FIG. 1 the SEM observation photograph of the roughening process surface of the sample of Example 1 is shown.
- FIG. 2 the SEM observation photograph of the roughening process surface of the sample of the comparative example 1 is shown.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
本発明は、ファインピッチ化が可能で且つ樹脂との密着信頼性に優れた表面処理電解銅箔、積層板、及びプリント配線板を提供する。
本発明において使用する電解銅箔は、銅箔の、樹脂基板と接着する面、即ち粗化面に、積層後の銅箔の引き剥し強さ(密着信頼性)を向上させることを目的として、前処理後の銅箔の表面にふしこぶ状の電着を行う粗化処理が施される。電解銅箔は製造時点で凹凸を有しているが、粗化処理により電解銅箔の凸部を増強して凹凸を一層大きくする。
本発明の表面処理電解銅箔は、JIS B0601-1994に準拠して、触針式粗度計を用いて測定される銅箔の粗面の粗度Rzが2.0μm以下である。粗度Rzが2.0μm超であると、銅箔表面と樹脂基板との接着界面において、銅箔表面に形成された微細な凹凸に空気が溜まりやすくなり、この空気が抜け難い。このため、高温状態にすると微細な凹凸に溜まった空気が膨張し、膨れが発生する。触針式粗度計を用いて測定される前記粗化面の粗度Rzは好ましくは0.8~1.8μm、より好ましくは1.0~1.7μmである。この粗度Rzは、銅箔のシャイン面(S面)処理条件の最適化並びに両面平滑生箔の使用により制御することができる。
本発明の表面処理電解銅箔は、粗面に存在する凹凸について、その「尖り度」が樹脂基板との密着信頼性に影響を与えるという観点から、粗面の粗さ曲線のクルトシス数Skuを2~4に制御されている。粗さ曲線のクルトシス数Skuは、銅箔粗面における凹凸の尖り具合(丸み具合)を表し、クルトシス数Skuが小さくなるほど凹凸は丸みを帯びた曲線となり、クルトシス数Skuが大きくなるほど凹凸は尖った曲線となる。粗さ曲線のクルトシス数Skuは、ISO25178ドラフトに準拠した非接触式粗さ計による三次元表面粗さ測定における、凹凸の尖り具合の指標であり、下記式で表され、三次元表面粗さのZ軸方向の凹凸(山の)高さであって、基準長さlrにおける山の高さZ(x)の下記四乗平均を、下記二乗平均平方根粗さRqの四乗で割ったものである。
基準長さlrにおける山の高さの四乗平均:
{(1/lr)×∫Z4(x)dx(但しインテグラルは0からlrまでの積算値)}
二乗平均平方根粗さRq:
Rq:√{(1/lr)×∫Z2(x)dx(但しインテグラルは0からlrまでの積算値)}
粗さ曲線のクルトシス数Sku:
Sku=(1/Rq4)×{(1/lr)×∫Z4(x)dx(但しインテグラルは0からlrまでの積算値)}
本発明の表面処理電解銅箔は、粗面(粗化処理された面)の表面積Aと、粗面を平面視したときに得られる面積Bとの比A/Bが1.2~2.0であるのが好ましい。ここで、表面積Aは、所定範囲の二次元領域をレーザー法で測定したときの表面積(三次元面積)であり、粗面を平面視したときに得られる面積Bは、当該二次元領域の面積を示す。これらの表面積比A/Bは、表面処理電解銅箔と、樹脂基板との接触面積の代替指標であり、1.2未満であると樹脂との密着力が十分に確保できないおそれがあり、2.0超であると、上述のとおり、加熱後に膨れが発生するという問題が生じるおそれがある。表面積比A/Bは、より好ましくは1.3~1.9である。表面積比A/Bは、銅箔の粗化処理条件を最適化することで制御することができる。例えば、銅粗化処理液にWを添加すると表面積比A/Bは大きくなる。また、銅粗化処理において電流密度を高くすると表面積比A/Bは大きくなり、電流密度を低くすると表面積比は小さくなる。このようにして表面積比A/Bを1.2~2.0に制御することができる。
本発明の表面処理電解銅箔は、上述のように、良好な常態ピール強度を有している。詳細には、本発明の表面処理電解銅箔は、JIS C5016に準拠して測定された常態ピール強度が0.8kg/cm以上であるのが好ましい。また、当該常態ピール強度は、より好ましくは0.9kg/cm以上である。
本発明の表面処理電解銅箔は、上述のように、高温浴膨れが良好に抑制されている。詳細には、本発明の表面処理電解銅箔は、導体パターンとしてファインピッチ回路を形成した後、樹脂基板と粗化面で接着させたときに、260℃の高温浴槽に1分間浸漬した後の膨れ発生数が、0~1個/m2であるのが好ましい。
(A)電解液組成:
Cu:50~120g/l
H2SO4:20~200g/l、好ましくは40~120g/l
塩化物イオン(Cl-):20~100ppm(mg/l)
ニカワ:0.5ppm(mg/l)以下、好ましくは0.01~0.2ppm(mg/l)未満
(B)電解条件:
電解液温度:20~70℃、好ましくは40~60℃
電流密度:20~150A/dm2
アノード:Pb
<生箔製箔条件>
生箔製箔時の電解液において、膠濃度を1~10ppmとし、SPS〔ビス(3-スルフォプロピル)ジスルファイド2ナトリウム〕を1~50ppmとし、アミン系化合物〔3級アミン化合物〕を1~50ppmとすることで、生箔表面を平滑にする(凹凸が鋭くなくなる)。これにより、その後の粗化処理、かぶせ銅めっき後の表面の粗化粒子の形状が丸くなる。このようにして、クルトシス数Skuを一般的な電解銅箔(例えば生箔が銅、硫酸、Cl、ニカワを添加した電解液で製造された場合)よりも小さくすることができる。
なお、3級アミン化合物として以下の化合物を用いる。
なお、後述の実施例で用いた上記化合物は例えばナガセケムテックス株式会社製デコナール Ex-314とジメチルアミンを所定量混合させ、60℃で3時間反応を行うことで得ることができる。
〔銅粗化処理条件〕
Cu:5~50g/l
H2SO4:10~100g/l
・その他の添加元素(条件1~4のいずれか)
(条件1)
As:0.01~20mg/l(ppm)かつ
W:0.01~10mg/l(ppm)
(条件2)
Mo:0.01~5mg/l(ppm)
(条件3)
Mo:0.01~5mg/l(ppm)
かつ
As:0.01~5mg/l(ppm)および/またはW:0.01~5mg/l(ppm)および/またはCo:0.01~0.5mg/l(ppm)
(条件4)
As:0.01~20mg/l(ppm)かつ
W:0.01~10mg/l(ppm)かつ
Co:0.01~0.5mg/l(ppm)
液温:室温(20℃)~50℃
電流密度:5~120A/dm2
時間:1~30秒
〔銅粗化処理条件〕
Cu:5~50g/l
H2SO4:10~100g/l
・その他の添加元素(条件1~4のいずれか)
(条件1)
As:0.01~5mg/l(ppm)かつ
W:0.01~5mg/l(ppm)
(条件2)
Mo:0.01~3mg/l(ppm)
(条件3)
Mo:0.01~3mg/l(ppm)
かつ
As:0.01~5mg/l(ppm)および/またはW:0.01~5mg/l(ppm)および/またはCo:0.01~1mg/l(ppm)
(条件4)
W:0.01~5mg/l(ppm)および/またはCo:0.01~1mg/l(ppm)
液温:室温(20℃)~50℃
電流密度:5~130A/dm2
時間:1~30秒
<銅粗化処理条件>
銅粗化処理液において、AsおよびWの両方を添加する、又は、Moを添加することで、粗化粒子の形状を丸くする。このようにして、クルトシス数Skuを小さくすることができる。
また、銅粗化処理液において、Coを添加する、またはWを単独で添加する(As無)ことで、粗化粒子の形状を鋭くすることができる(粒子の先が尖る)。このようにして、クルトシス数Skuを大きくすることができる。
さらに、液温を低くする(例えば20℃以上25℃よりも低くする)ことで、粗化粒子の形状を鋭くすることができる(粒子の先が尖る)。このようにして、クルトシス数Skuを大きくすることができる。
〔かぶせ銅薄層めっき条件〕
Cu:30~100g/l
H2SO4:10~200g/l
液温:室温~75℃
電流密度:5~65A/dm2
時間:1~30秒
<かぶせ銅めっき条件>
電流密度を高くする(例えば60A/dm2より大きくする)ことで、粗化粒子の形状を鋭くすることができる(粒子の先が尖る)。このようにして、クルトシス数Skuを大きくすることができる。
また、粗化面にニッケル、コバルト、銅、亜鉛の単体または合金等で耐熱層または防錆層を形成しても良く、更にその表面にクロメート処理、シランカップリング処理などの処理を施してもよい。または粗化処理を行わずに、ニッケル、コバルト、銅、亜鉛の単体または合金等で耐熱層又は防錆層を形成し、さらにその表面にクロメート処理、シランカップリング処理などの処理を施してもよい。すなわち、粗化処理層の表面(粗化面)に、耐熱層、防錆層、クロメート処理層及びシランカップリング処理層からなる群から選択された1種以上の層を形成してもよく、電解銅箔の表面に、耐熱層、防錆層、クロメート処理層及びシランカップリング処理層からなる群から選択された1種以上の層を形成してもよい。なお、上述の耐熱層、防錆層、クロメート処理層、シランカップリング処理層はそれぞれ複数の層で形成されてもよい(例えば2層以上、3層以上など)。
株式会社小坂研究所製接触粗さ計Surfcorder SE-3C触針式粗度計を用いて測定した。
粗面の表面積はレーザー顕微鏡による測定法を使用した。オリンパス製 LEXT OLS 4000を用いて粗化処理面の257.9×257.9μm相当面積B(実データでは66524μm2)における三次元表面積Aを測定して、三次元表面積A÷二次元表面積B=面積比(A/B)とする手法により設定を行った。測定環境温度は23~25℃とした。
オリンパス製 LEXT OLS 4000三次元表面形状測定装置を使用し、試験材の粗化処理面の257.9×257.9μmのエリアを、平面0.12μm、高さ0.01μmの分解能で測定した。測定環境温度は23~25℃とした。
JIS C5016(8.1.6測定(1)方法A(90°方向引きはがし方法))に準拠し、引張り試験機オートグラフ100で常態ピール強度を測定した。
銅箔をガラスクロス基材エポキシ樹脂板に積層接着し、エッチング(塩化第二鉄水溶液)により銅箔にファインピッチ回路を形成して積層体を作成した。続いて、260℃の高温浴に当該積層体を1分間浸漬させて、表面に発生する膨れの数を測定し、1m2当たりの個数に換算した。
評価結果を表4に示す。
実施例1~6は、いずれも良好な密着信頼性を有し、高温浴槽に浸漬しても膨れの発生が無かった。
比較例1~4は、いずれも粗度Rzが2.0μm以下であるが、粗面の粗さ曲線のクルトシス数Skuが2~4の範囲外であるため、密着信頼性が不良であるか、或いは、高温浴槽に浸漬したときに膨れが多数発生した。
図1に、実施例1の試料の粗化処理面のSEM観察写真を示す。図2に、比較例1の試料の粗化処理面のSEM観察写真を示す。
Claims (8)
- 触針式粗度計を用いて測定される銅箔の粗面の粗度Rzが2.0μm以下であり、前記粗面の粗さ曲線のクルトシス数Skuが2~4である表面処理電解銅箔。
- 前記粗度Rzが0.8~1.8μmである請求項1に記載の表面処理電解銅箔。
- 前記クルトシス数Skuが2.5~3.5である請求項1又は2に記載の表面処理電解銅箔。
- 前記粗面の表面積Aと、前記粗面を平面視したときに得られる面積Bとの比A/Bが1.2~2.0である請求項1~3のいずれかに記載の表面処理電解銅箔。
- 前記比A/Bが1.3~1.9である請求項4に記載の表面処理電解銅箔。
- 常態ピール強度が0.8kg/cm以上である請求項1~5のいずれかに記載の表面処理電解銅箔。
- 請求項1~6のいずれかに記載の表面処理電解銅箔と樹脂基板とを積層して構成した積層板。
- 請求項7に記載の積層板を材料としたプリント配線板。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014531008A JP5710845B2 (ja) | 2012-11-26 | 2013-11-26 | 表面処理電解銅箔、積層板、プリント配線板、及び電子機器 |
CN201380061468.5A CN104812945B (zh) | 2012-11-26 | 2013-11-26 | 表面处理电解铜箔、积层板、印刷配线板、及电子机器 |
KR1020147025481A KR20140124402A (ko) | 2012-11-26 | 2013-11-26 | 표면 처리 전해 동박, 적층판, 및 프린트 배선판 |
KR1020167036617A KR102078897B1 (ko) | 2012-11-26 | 2013-11-26 | 표면 처리 전해 동박, 적층판, 및 프린트 배선판 |
PH12015501174A PH12015501174B1 (en) | 2012-11-26 | 2015-05-26 | Surface-treated electrolytic copper foil, laminate, and printed circuit board |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012-257896 | 2012-11-26 | ||
JP2012257896 | 2012-11-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2014081041A1 true WO2014081041A1 (ja) | 2014-05-30 |
Family
ID=50776215
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2013/081806 WO2014081041A1 (ja) | 2012-11-26 | 2013-11-26 | 表面処理電解銅箔、積層板、及びプリント配線板 |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP5710845B2 (ja) |
KR (2) | KR102078897B1 (ja) |
CN (1) | CN104812945B (ja) |
MY (1) | MY176308A (ja) |
PH (1) | PH12015501174B1 (ja) |
TW (1) | TWI509111B (ja) |
WO (1) | WO2014081041A1 (ja) |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017018232A1 (ja) * | 2015-07-29 | 2017-02-02 | 三井金属鉱業株式会社 | 粗化処理銅箔、銅張積層板及びプリント配線板 |
WO2018020940A1 (ja) * | 2016-07-26 | 2018-02-01 | パナソニックIpマネジメント株式会社 | 透視型電極用積層板、透視型電極素材、デバイス及び透視型電極用積層板の製造方法 |
TWI630289B (zh) * | 2015-07-03 | 2018-07-21 | 三井金屬鑛業股份有限公司 | Roughened copper foil, copper laminated board and printed circuit board |
US20180288884A1 (en) * | 2017-03-31 | 2018-10-04 | Jx Nippon Mining & Metals Corporation | Surface Treated Copper Foil, Surface Treated Copper Foil With Resin Layer, Copper Foil With Carrier, Laminate, Method For Manufacturing Printed Wiring Board, Heat Dissipation Substrate, And Method For Manufacturing Electronic Device |
WO2018198905A1 (ja) * | 2017-04-25 | 2018-11-01 | 古河電気工業株式会社 | 表面処理銅箔 |
WO2019198610A1 (ja) * | 2018-04-10 | 2019-10-17 | Dic株式会社 | 複合構造体およびその製造方法 |
WO2019208368A1 (ja) * | 2018-04-25 | 2019-10-31 | 古河電気工業株式会社 | 表面処理銅箔、銅張積層板、及びプリント配線板 |
JP2019207905A (ja) * | 2018-05-28 | 2019-12-05 | 古河電気工業株式会社 | リードフレーム材およびその製造方法ならびに半導体パッケージ |
JP2020502728A (ja) * | 2016-11-11 | 2020-01-23 | イルジン マテリアルズ カンパニー リミテッドIljin Materials Co., Ltd. | 耐屈曲性に優れた二次電池用電解銅箔及びその製造方法 |
WO2020246467A1 (ja) * | 2019-06-07 | 2020-12-10 | 古河電気工業株式会社 | 表面処理銅箔、銅張積層板、及びプリント配線板 |
US10925170B2 (en) | 2017-03-31 | 2021-02-16 | Jx Nippon Mining & Metals Corporation | Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device |
CN112805414A (zh) * | 2018-09-28 | 2021-05-14 | 古河电气工业株式会社 | 表面处理铜箔、以及使用该表面处理铜箔的覆铜板及电路基板 |
JP2021524661A (ja) * | 2019-02-01 | 2021-09-13 | 長春石油化學股▲分▼有限公司 | 電解銅箔、集電体、電極、及びそれを含むリチウムイオン二次電池 |
WO2022153580A1 (ja) * | 2021-01-15 | 2022-07-21 | Jx金属株式会社 | 表面処理銅箔、銅張積層板及びプリント配線板 |
WO2023281773A1 (ja) * | 2021-07-09 | 2023-01-12 | Jx金属株式会社 | 表面処理銅箔、銅張積層板及びプリント配線板 |
EP4132235A4 (en) * | 2020-03-30 | 2024-04-10 | Mitsubishi Materials Corp | BONDED BODY AND INSULATION CIRCUIT BOARD |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018047933A1 (ja) * | 2016-09-12 | 2018-03-15 | 古河電気工業株式会社 | 銅箔およびこれを有する銅張積層板 |
CN111836716B (zh) | 2018-03-30 | 2023-02-24 | 三井金属矿业株式会社 | 覆铜层叠板 |
JP7392996B2 (ja) | 2019-06-19 | 2023-12-06 | 金居開發股▲分▼有限公司 | アドバンスド電解銅箔及びそれを適用した銅張積層板 |
TWI776168B (zh) * | 2019-06-19 | 2022-09-01 | 金居開發股份有限公司 | 進階反轉電解銅箔及應用其的銅箔基板 |
TWI697574B (zh) * | 2019-11-27 | 2020-07-01 | 長春石油化學股份有限公司 | 電解銅箔、電極及包含其之鋰離子電池 |
US11670455B2 (en) * | 2020-06-11 | 2023-06-06 | Mitsui Mining & Smelting Co., Ltd. | Double-sided copper-clad laminate |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005290519A (ja) * | 2004-04-02 | 2005-10-20 | Mitsui Mining & Smelting Co Ltd | 銅箔及びその製造方法 |
JP2008285751A (ja) * | 2007-04-19 | 2008-11-27 | Mitsui Mining & Smelting Co Ltd | 表面処理銅箔及びその表面処理銅箔を用いて得られる銅張積層板並びにその銅張積層板を用いて得られるプリント配線板 |
JP2009105286A (ja) * | 2007-10-24 | 2009-05-14 | Mitsui Mining & Smelting Co Ltd | 表面処理銅箔 |
JP2011009267A (ja) * | 2009-06-23 | 2011-01-13 | Hitachi Cable Ltd | プリント配線板用銅箔およびその製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI434965B (zh) * | 2008-05-28 | 2014-04-21 | Mitsui Mining & Smelting Co | A roughening method for copper foil, and a copper foil for a printed wiring board which is obtained by the roughening method |
WO2010061736A1 (ja) * | 2008-11-25 | 2010-06-03 | 日鉱金属株式会社 | 印刷回路用銅箔 |
JP5885054B2 (ja) * | 2010-04-06 | 2016-03-15 | 福田金属箔粉工業株式会社 | 銅張積層板用処理銅箔及び該処理銅箔を絶縁性樹脂基材に接着してなる銅張積層板並びに該銅張積層板を用いたプリント配線板。 |
JP5634103B2 (ja) * | 2010-04-06 | 2014-12-03 | 福田金属箔粉工業株式会社 | 銅張積層板用処理銅箔及び該処理銅箔を絶縁性樹脂基材に接着してなる銅張積層板並びに該銅張積層板を用いたプリント配線板。 |
EP2615196A1 (en) * | 2010-10-06 | 2013-07-17 | Furukawa Electric Co., Ltd. | Copper foil and manufacturing method therefor, copper foil with carrier and manufacturing method therefor, printed circuit board, and multilayer printed circuit board |
KR20140009323A (ko) * | 2011-01-26 | 2014-01-22 | 스미토모 베이클리트 컴퍼니 리미티드 | 프린트 배선판 및 프린트 배선판의 제조 방법 |
-
2013
- 2013-11-26 MY MYPI2015701682A patent/MY176308A/en unknown
- 2013-11-26 KR KR1020167036617A patent/KR102078897B1/ko active IP Right Grant
- 2013-11-26 CN CN201380061468.5A patent/CN104812945B/zh active Active
- 2013-11-26 WO PCT/JP2013/081806 patent/WO2014081041A1/ja active Application Filing
- 2013-11-26 JP JP2014531008A patent/JP5710845B2/ja active Active
- 2013-11-26 KR KR1020147025481A patent/KR20140124402A/ko active Application Filing
- 2013-11-26 TW TW102143163A patent/TWI509111B/zh active
-
2015
- 2015-05-26 PH PH12015501174A patent/PH12015501174B1/en unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005290519A (ja) * | 2004-04-02 | 2005-10-20 | Mitsui Mining & Smelting Co Ltd | 銅箔及びその製造方法 |
JP2008285751A (ja) * | 2007-04-19 | 2008-11-27 | Mitsui Mining & Smelting Co Ltd | 表面処理銅箔及びその表面処理銅箔を用いて得られる銅張積層板並びにその銅張積層板を用いて得られるプリント配線板 |
JP2009105286A (ja) * | 2007-10-24 | 2009-05-14 | Mitsui Mining & Smelting Co Ltd | 表面処理銅箔 |
JP2011009267A (ja) * | 2009-06-23 | 2011-01-13 | Hitachi Cable Ltd | プリント配線板用銅箔およびその製造方法 |
Cited By (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI630289B (zh) * | 2015-07-03 | 2018-07-21 | 三井金屬鑛業股份有限公司 | Roughened copper foil, copper laminated board and printed circuit board |
WO2017018232A1 (ja) * | 2015-07-29 | 2017-02-02 | 三井金属鉱業株式会社 | 粗化処理銅箔、銅張積層板及びプリント配線板 |
JPWO2017018232A1 (ja) * | 2015-07-29 | 2017-09-21 | 三井金属鉱業株式会社 | 粗化処理銅箔、銅張積層板及びプリント配線板 |
CN107923047B (zh) * | 2015-07-29 | 2020-05-01 | 纳美仕有限公司 | 粗糙化处理铜箔、覆铜层叠板及印刷电路板 |
CN107923047A (zh) * | 2015-07-29 | 2018-04-17 | 三井金属矿业株式会社 | 粗糙化处理铜箔、覆铜层叠板及印刷电路板 |
JPWO2018020940A1 (ja) * | 2016-07-26 | 2019-06-27 | パナソニックIpマネジメント株式会社 | 透視型電極用積層板、透視型電極素材、デバイス及び透視型電極用積層板の製造方法 |
WO2018020940A1 (ja) * | 2016-07-26 | 2018-02-01 | パナソニックIpマネジメント株式会社 | 透視型電極用積層板、透視型電極素材、デバイス及び透視型電極用積層板の製造方法 |
JP2022050471A (ja) * | 2016-11-11 | 2022-03-30 | イルジン マテリアルズ カンパニー リミテッド | 耐屈曲性に優れた二次電池用電解銅箔及びその製造方法 |
JP7061120B2 (ja) | 2016-11-11 | 2022-04-27 | イルジン マテリアルズ カンパニー リミテッド | 耐屈曲性に優れた二次電池用電解銅箔及びその製造方法 |
JP2020502728A (ja) * | 2016-11-11 | 2020-01-23 | イルジン マテリアルズ カンパニー リミテッドIljin Materials Co., Ltd. | 耐屈曲性に優れた二次電池用電解銅箔及びその製造方法 |
US20180288884A1 (en) * | 2017-03-31 | 2018-10-04 | Jx Nippon Mining & Metals Corporation | Surface Treated Copper Foil, Surface Treated Copper Foil With Resin Layer, Copper Foil With Carrier, Laminate, Method For Manufacturing Printed Wiring Board, Heat Dissipation Substrate, And Method For Manufacturing Electronic Device |
US10925171B2 (en) * | 2017-03-31 | 2021-02-16 | Jx Nippon Mining & Metals Corporation | Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, heat dissipation substrate, and method for manufacturing electronic device |
US10925170B2 (en) | 2017-03-31 | 2021-02-16 | Jx Nippon Mining & Metals Corporation | Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device |
WO2018198905A1 (ja) * | 2017-04-25 | 2018-11-01 | 古河電気工業株式会社 | 表面処理銅箔 |
JPWO2018198905A1 (ja) * | 2017-04-25 | 2019-06-27 | 古河電気工業株式会社 | 表面処理銅箔 |
US20210162680A1 (en) * | 2018-04-10 | 2021-06-03 | Dic Corporation | Composite structure and manufacturing method therefor |
WO2019198610A1 (ja) * | 2018-04-10 | 2019-10-17 | Dic株式会社 | 複合構造体およびその製造方法 |
JPWO2019198610A1 (ja) * | 2018-04-10 | 2020-04-30 | Dic株式会社 | 複合構造体およびその製造方法 |
EP3778219A4 (en) * | 2018-04-10 | 2021-12-29 | DIC Corporation | Composite structure and manufacturing method therefor |
WO2019208368A1 (ja) * | 2018-04-25 | 2019-10-31 | 古河電気工業株式会社 | 表面処理銅箔、銅張積層板、及びプリント配線板 |
JP6606317B1 (ja) * | 2018-04-25 | 2019-11-13 | 古河電気工業株式会社 | 表面処理銅箔、銅張積層板、及びプリント配線板 |
JP7032239B2 (ja) | 2018-05-28 | 2022-03-08 | 古河電気工業株式会社 | リードフレーム材およびその製造方法ならびに半導体パッケージ |
JP2019207905A (ja) * | 2018-05-28 | 2019-12-05 | 古河電気工業株式会社 | リードフレーム材およびその製造方法ならびに半導体パッケージ |
CN112805414B (zh) * | 2018-09-28 | 2022-06-24 | 古河电气工业株式会社 | 表面处理铜箔、以及使用该表面处理铜箔的覆铜板及电路基板 |
CN112805414A (zh) * | 2018-09-28 | 2021-05-14 | 古河电气工业株式会社 | 表面处理铜箔、以及使用该表面处理铜箔的覆铜板及电路基板 |
JP7082240B2 (ja) | 2019-02-01 | 2022-06-07 | 長春石油化學股▲分▼有限公司 | 表面処理銅箔及び銅箔基板 |
JP2021524661A (ja) * | 2019-02-01 | 2021-09-13 | 長春石油化學股▲分▼有限公司 | 電解銅箔、集電体、電極、及びそれを含むリチウムイオン二次電池 |
US11145867B2 (en) | 2019-02-01 | 2021-10-12 | Chang Chun Petrochemical Co., Ltd. | Surface treated copper foil |
JP2021529261A (ja) * | 2019-02-01 | 2021-10-28 | 長春石油化學股▲分▼有限公司 | 表面処理銅箔及び銅箔基板 |
US11362337B2 (en) | 2019-02-01 | 2022-06-14 | Chang Chun Petrochemical Co., Ltd. | Electrodeposited copper foil and electrode, and lithium-ion secondary battery comprising the same |
US11283080B2 (en) | 2019-02-01 | 2022-03-22 | Chang Chun Petrochemical Co., Ltd. | Electrodeposited copper foil, current collector, electrode, and lithium ion secondary battery comprising the same |
EP3828970A4 (en) * | 2019-02-01 | 2022-05-18 | Chang Chun Petrochemical Co., Ltd. | ELECTROLYTIC COPPER SHEET, CURRENT COLLECTOR, ELECTRODE AND SECONDARY LITHIUM-ION BATTERY INCLUDING ELECTROLYTIC COPPER SHEET |
CN113795615A (zh) * | 2019-06-07 | 2021-12-14 | 古河电气工业株式会社 | 表面处理铜箔、覆铜层叠板以及印刷电路板 |
WO2020246467A1 (ja) * | 2019-06-07 | 2020-12-10 | 古河電気工業株式会社 | 表面処理銅箔、銅張積層板、及びプリント配線板 |
JP6845382B1 (ja) * | 2019-06-07 | 2021-03-17 | 古河電気工業株式会社 | 表面処理銅箔、銅張積層板、及びプリント配線板 |
EP4132235A4 (en) * | 2020-03-30 | 2024-04-10 | Mitsubishi Materials Corp | BONDED BODY AND INSULATION CIRCUIT BOARD |
WO2022153580A1 (ja) * | 2021-01-15 | 2022-07-21 | Jx金属株式会社 | 表面処理銅箔、銅張積層板及びプリント配線板 |
WO2022154102A1 (ja) * | 2021-01-15 | 2022-07-21 | Jx金属株式会社 | 表面処理銅箔、銅張積層板及びプリント配線板 |
WO2023281773A1 (ja) * | 2021-07-09 | 2023-01-12 | Jx金属株式会社 | 表面処理銅箔、銅張積層板及びプリント配線板 |
WO2023281759A1 (ja) * | 2021-07-09 | 2023-01-12 | Jx金属株式会社 | 表面処理銅箔、銅張積層板及びプリント配線板 |
Also Published As
Publication number | Publication date |
---|---|
TW201428139A (zh) | 2014-07-16 |
MY176308A (en) | 2020-07-28 |
PH12015501174A1 (en) | 2015-08-10 |
TWI509111B (zh) | 2015-11-21 |
JP5710845B2 (ja) | 2015-04-30 |
PH12015501174B1 (en) | 2015-08-10 |
KR20140124402A (ko) | 2014-10-24 |
KR20170002705A (ko) | 2017-01-06 |
CN104812945B (zh) | 2018-08-28 |
KR102078897B1 (ko) | 2020-02-19 |
JPWO2014081041A1 (ja) | 2017-01-05 |
CN104812945A (zh) | 2015-07-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5710845B2 (ja) | 表面処理電解銅箔、積層板、プリント配線板、及び電子機器 | |
JP5180815B2 (ja) | 表面処理電解銅箔及びその製造方法 | |
KR100941219B1 (ko) | 전해 동박, 그 전해 동박을 이용하여 얻어진 표면 처리 전해 동박, 그 표면 처리 전해 동박을 이용한 동장 적층판 및 프린트 배선판 | |
JP6543001B2 (ja) | 表面処理銅箔、並びにこれを用いた銅張積層板およびプリント配線板 | |
JP3910623B1 (ja) | 電解銅箔の製造方法及びその製造方法で得られた電解銅箔、その電解銅箔を用いて得られた表面処理電解銅箔、その表面処理電解銅箔を用いた銅張積層板及びプリント配線板 | |
JP2013019056A5 (ja) | ||
KR20060041689A (ko) | 표면처리동박 및 회로기판 | |
WO2022255420A1 (ja) | 粗化処理銅箔、銅張積層板及びプリント配線板 | |
JP2007217791A (ja) | 電解銅箔、その電解銅箔を用いて得られた表面処理電解銅箔、その表面処理電解銅箔を用いた銅張積層板及びプリント配線板 | |
CN104271813A (zh) | 表面处理铜箔及使用其的积层板、铜箔、印刷配线板、电子机器、以及印刷配线板的制造方法 | |
CN105142897A (zh) | 附载体铜箔、印刷配线板、覆铜积层板、电子机器及印刷配线板的制造方法 | |
KR101695236B1 (ko) | 동박, 이를 포함하는 전기부품 및 전지 | |
KR101168613B1 (ko) | 표면처리층의 구조가 개선된 전해동박 및 그 제조방법과, 동장적층판 및 인쇄회로기판 | |
KR20090084517A (ko) | 내열성과 내약품성이 개선된 인쇄회로용 동박 및 그제조방법 | |
JPWO2020246467A1 (ja) | 表面処理銅箔、銅張積層板、及びプリント配線板 | |
TWI647096B (zh) | 表面處理銅箔及其製造方法 | |
TW202001000A (zh) | 表面處理銅箔、覆銅積層板及印刷線路板 | |
TWI808700B (zh) | 粗化處理銅箔、銅箔積層板及印刷佈線板 | |
WO2022255422A1 (ja) | 粗化処理銅箔、銅張積層板及びプリント配線板 | |
JP2011009453A (ja) | プリント配線板用銅箔 | |
KR20230095677A (ko) | 내열성을 가지는 표면처리동박, 이를 포함하는 동박적층판 및 프린트 배선판 | |
JP2023040316A (ja) | 表面処理金属箔及び金属張積層板 | |
KR101315364B1 (ko) | 내열성이 개선된 표면 처리 동박 및 그 제조방법 | |
JP2014208482A (ja) | キャリア付銅箔、プリント配線板、銅張積層板、電子機器及びプリント配線板の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ENP | Entry into the national phase |
Ref document number: 2014531008 Country of ref document: JP Kind code of ref document: A |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 13856578 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 20147025481 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 12015501174 Country of ref document: PH |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 13856578 Country of ref document: EP Kind code of ref document: A1 |