JPS5757896A - Electrolyzing device for strip-like metallic plate - Google Patents
Electrolyzing device for strip-like metallic plateInfo
- Publication number
- JPS5757896A JPS5757896A JP13389080A JP13389080A JPS5757896A JP S5757896 A JPS5757896 A JP S5757896A JP 13389080 A JP13389080 A JP 13389080A JP 13389080 A JP13389080 A JP 13389080A JP S5757896 A JPS5757896 A JP S5757896A
- Authority
- JP
- Japan
- Prior art keywords
- plate
- electrolyte
- strip
- surface side
- metallic plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE: To electrolyte both surfaces of a metallic plate effectively by providing the 1st and 2nd electrodes opposite to one surface side and other surface side of a strip-like metallic plate traveling continuously in electrolyte, coupling the 1st electrode and one pole of an electroc power source, and coupling the 1st and 2nd electrodes in the electrolyte.
CONSTITUTION: The 1st cathode plate 9 and 2nd cathode plate 9' are provided in a way as to oppose respectively to one surface side and other surface side of a strip- like metallic plate 1 traveling continuously in electrolyte 8. The 1st plate 9 and the cathode 10 of an electric power source are coupled via a bus bar 11, and the plate 9 and the plate 9' are coupled via an electrically conductive member 90 in the electrolyte 8. Therefore, the anodically oxidized films formed on the plate 1 are made uniform in the width direction.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13389080A JPS5757896A (en) | 1980-09-26 | 1980-09-26 | Electrolyzing device for strip-like metallic plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13389080A JPS5757896A (en) | 1980-09-26 | 1980-09-26 | Electrolyzing device for strip-like metallic plate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5757896A true JPS5757896A (en) | 1982-04-07 |
JPS623240B2 JPS623240B2 (en) | 1987-01-23 |
Family
ID=15115486
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13389080A Granted JPS5757896A (en) | 1980-09-26 | 1980-09-26 | Electrolyzing device for strip-like metallic plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5757896A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62250197A (en) * | 1986-04-21 | 1987-10-31 | Taisho Kogyo Kk | Plating device |
JPH0319314B2 (en) * | 1982-02-09 | 1991-03-14 | Yooko Kareui Korupi | |
WO2007086510A1 (en) * | 2006-01-30 | 2007-08-02 | Ibiden Co., Ltd. | Plating apparatus and plating method |
US7481909B2 (en) | 2004-09-24 | 2009-01-27 | Ibiden Co., Ltd. | Plating apparatus, plating method and multilayer printed circuit board |
US8679576B2 (en) | 2006-02-22 | 2014-03-25 | Ibiden Co., Ltd. | Plating apparatus and method of plating |
KR101712170B1 (en) * | 2015-11-30 | 2017-03-06 | (주)동진금속 | CONTINUOUS Oxide FILM FORMING APPARATUS OF COMMERCIAL ANNEALED ALUMINIUM ELECTRICAL CONDUCTOR WIRE AND CONTINUOUS Oxide FILM FORMING METHOD OF COMMERCIAL ANNEALED ALUMINIUM ELECTRICAL CONDUCTOR WIRE |
-
1980
- 1980-09-26 JP JP13389080A patent/JPS5757896A/en active Granted
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0319314B2 (en) * | 1982-02-09 | 1991-03-14 | Yooko Kareui Korupi | |
JPS62250197A (en) * | 1986-04-21 | 1987-10-31 | Taisho Kogyo Kk | Plating device |
US7481909B2 (en) | 2004-09-24 | 2009-01-27 | Ibiden Co., Ltd. | Plating apparatus, plating method and multilayer printed circuit board |
US7897027B2 (en) | 2004-09-24 | 2011-03-01 | Ibiden Co., Ltd. | Plating apparatus, plating method and multilayer printed circuit board |
US8197659B2 (en) | 2004-09-24 | 2012-06-12 | Ibiden Co., Ltd. | Plating apparatus, plating method and multilayer printed circuit board |
US8383956B2 (en) | 2004-09-24 | 2013-02-26 | Ibiden Co., Ltd. | Plating apparatus, plating method and multilayer printed circuit board |
WO2007086510A1 (en) * | 2006-01-30 | 2007-08-02 | Ibiden Co., Ltd. | Plating apparatus and plating method |
JP4781371B2 (en) * | 2006-01-30 | 2011-09-28 | イビデン株式会社 | Plating apparatus and plating method |
US8128790B2 (en) | 2006-01-30 | 2012-03-06 | Ibiden Co., Ltd. | Plating apparatus and plating method |
US8721863B2 (en) | 2006-01-30 | 2014-05-13 | Ibiden Co., Ltd. | Plating apparatus and plating method |
US8679576B2 (en) | 2006-02-22 | 2014-03-25 | Ibiden Co., Ltd. | Plating apparatus and method of plating |
KR101712170B1 (en) * | 2015-11-30 | 2017-03-06 | (주)동진금속 | CONTINUOUS Oxide FILM FORMING APPARATUS OF COMMERCIAL ANNEALED ALUMINIUM ELECTRICAL CONDUCTOR WIRE AND CONTINUOUS Oxide FILM FORMING METHOD OF COMMERCIAL ANNEALED ALUMINIUM ELECTRICAL CONDUCTOR WIRE |
Also Published As
Publication number | Publication date |
---|---|
JPS623240B2 (en) | 1987-01-23 |
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