TWI353279B - Methods for processing holes by moving precisely t - Google Patents
Methods for processing holes by moving precisely t Download PDFInfo
- Publication number
- TWI353279B TWI353279B TW094126325A TW94126325A TWI353279B TW I353279 B TWI353279 B TW I353279B TW 094126325 A TW094126325 A TW 094126325A TW 94126325 A TW94126325 A TW 94126325A TW I353279 B TWI353279 B TW I353279B
- Authority
- TW
- Taiwan
- Prior art keywords
- target
- laser
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- center
- Prior art date
Links
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- 238000012545 processing Methods 0.000 title claims description 29
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- 102100040428 Chitobiosyldiphosphodolichol beta-mannosyltransferase Human genes 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 206010012335 Dependence Diseases 0.000 description 1
- 240000001931 Ludwigia octovalvis Species 0.000 description 1
- 101150093954 Nrep gene Proteins 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 241000425571 Trepanes Species 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
- Sampling And Sample Adjustment (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/912,525 US7259354B2 (en) | 2004-08-04 | 2004-08-04 | Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200610605A TW200610605A (en) | 2006-04-01 |
| TWI353279B true TWI353279B (en) | 2011-12-01 |
Family
ID=35756401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094126325A TWI353279B (en) | 2004-08-04 | 2005-08-03 | Methods for processing holes by moving precisely t |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7259354B2 (enExample) |
| JP (4) | JP2008509006A (enExample) |
| KR (1) | KR101242143B1 (enExample) |
| CN (1) | CN101035645B (enExample) |
| DE (1) | DE112005001893T5 (enExample) |
| GB (1) | GB2431371A (enExample) |
| TW (1) | TWI353279B (enExample) |
| WO (1) | WO2006017583A2 (enExample) |
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| JP2008126252A (ja) * | 2006-11-17 | 2008-06-05 | Disco Abrasive Syst Ltd | レーザー加工装置 |
| ITPD20070201A1 (it) * | 2007-06-08 | 2008-12-09 | Helios Technology Societa A Re | Macchina per la rimozione di superfici di semiconduttori, ed in particolare di superfici con circuiti integrati |
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| TW503143B (en) | 2000-10-06 | 2002-09-21 | Hitachi Via Mechanics Ltd | Method and apparatus for drilling printed wiring boards |
| JP5028722B2 (ja) * | 2001-07-31 | 2012-09-19 | 三菱電機株式会社 | レーザ加工方法及びレーザ加工機 |
| CN1295052C (zh) * | 2001-11-30 | 2007-01-17 | 松下电器产业株式会社 | 激光铣削方法及系统 |
| US6897405B2 (en) * | 2001-11-30 | 2005-05-24 | Matsushita Electric Industrial Co., Ltd. | Method of laser milling using constant tool path algorithm |
| US6706998B2 (en) | 2002-01-11 | 2004-03-16 | Electro Scientific Industries, Inc. | Simulated laser spot enlargement |
| DE10207288B4 (de) * | 2002-02-21 | 2005-05-04 | Newson Engineering Nv | Verfahren zum Bohren von Löchern mittels eines Laserstrahls in einem Substrat, insbesondere in einem elektrischen Schaltungsubstrat |
| US20040112881A1 (en) * | 2002-04-11 | 2004-06-17 | Bloemeke Stephen Roger | Circle laser trepanning |
| US6749285B2 (en) * | 2002-07-25 | 2004-06-15 | Matsushita Electric Industrial Co., Ltd. | Method of milling repeatable exit holes in ink-jet nozzles |
| JP3720034B2 (ja) * | 2003-05-26 | 2005-11-24 | 住友重機械工業株式会社 | 穴あけ加工方法 |
| US7259354B2 (en) * | 2004-08-04 | 2007-08-21 | Electro Scientific Industries, Inc. | Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories |
-
2004
- 2004-08-04 US US10/912,525 patent/US7259354B2/en not_active Expired - Lifetime
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2005
- 2005-08-01 JP JP2007524948A patent/JP2008509006A/ja active Pending
- 2005-08-01 KR KR1020077002761A patent/KR101242143B1/ko not_active Expired - Fee Related
- 2005-08-01 WO PCT/US2005/027584 patent/WO2006017583A2/en not_active Ceased
- 2005-08-01 DE DE112005001893T patent/DE112005001893T5/de not_active Withdrawn
- 2005-08-01 CN CN2005800304241A patent/CN101035645B/zh not_active Expired - Fee Related
- 2005-08-03 TW TW094126325A patent/TWI353279B/zh not_active IP Right Cessation
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- 2007-01-31 GB GB0701804A patent/GB2431371A/en not_active Withdrawn
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- 2011-12-20 JP JP2011277880A patent/JP5581303B2/ja not_active Expired - Fee Related
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- 2012-11-09 JP JP2012247224A patent/JP6014465B2/ja not_active Expired - Fee Related
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2008509006A (ja) | 2008-03-27 |
| US7259354B2 (en) | 2007-08-21 |
| JP6014465B2 (ja) | 2016-10-25 |
| WO2006017583A2 (en) | 2006-02-16 |
| TW200610605A (en) | 2006-04-01 |
| GB0701804D0 (en) | 2007-03-14 |
| JP2013091102A (ja) | 2013-05-16 |
| JP2012066308A (ja) | 2012-04-05 |
| CN101035645B (zh) | 2010-12-15 |
| KR101242143B1 (ko) | 2013-03-12 |
| JP2016153142A (ja) | 2016-08-25 |
| CN101035645A (zh) | 2007-09-12 |
| DE112005001893T5 (de) | 2007-09-06 |
| KR20070039582A (ko) | 2007-04-12 |
| GB2431371A (en) | 2007-04-25 |
| JP5581303B2 (ja) | 2014-08-27 |
| WO2006017583A3 (en) | 2006-03-30 |
| US20060027544A1 (en) | 2006-02-09 |
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