GB2431371A - Methods for processing holes by moving precisely timed laser pulses in circularand spriral trajectories - Google Patents

Methods for processing holes by moving precisely timed laser pulses in circularand spriral trajectories

Info

Publication number
GB2431371A
GB2431371A GB0701804A GB0701804A GB2431371A GB 2431371 A GB2431371 A GB 2431371A GB 0701804 A GB0701804 A GB 0701804A GB 0701804 A GB0701804 A GB 0701804A GB 2431371 A GB2431371 A GB 2431371A
Authority
GB
United Kingdom
Prior art keywords
specimen
acceleration
circularand
spriral
trajectories
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0701804A
Other languages
English (en)
Other versions
GB0701804D0 (en
Inventor
Robert M Pailthorp
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electro Scientific Industries Inc
Original Assignee
Electro Scientific Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scientific Industries Inc filed Critical Electro Scientific Industries Inc
Publication of GB0701804D0 publication Critical patent/GB0701804D0/en
Publication of GB2431371A publication Critical patent/GB2431371A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
  • Sampling And Sample Adjustment (AREA)
GB0701804A 2004-08-04 2007-01-31 Methods for processing holes by moving precisely timed laser pulses in circularand spriral trajectories Withdrawn GB2431371A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/912,525 US7259354B2 (en) 2004-08-04 2004-08-04 Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories
PCT/US2005/027584 WO2006017583A2 (en) 2004-08-04 2005-08-01 Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories

Publications (2)

Publication Number Publication Date
GB0701804D0 GB0701804D0 (en) 2007-03-14
GB2431371A true GB2431371A (en) 2007-04-25

Family

ID=35756401

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0701804A Withdrawn GB2431371A (en) 2004-08-04 2007-01-31 Methods for processing holes by moving precisely timed laser pulses in circularand spriral trajectories

Country Status (8)

Country Link
US (1) US7259354B2 (enExample)
JP (4) JP2008509006A (enExample)
KR (1) KR101242143B1 (enExample)
CN (1) CN101035645B (enExample)
DE (1) DE112005001893T5 (enExample)
GB (1) GB2431371A (enExample)
TW (1) TWI353279B (enExample)
WO (1) WO2006017583A2 (enExample)

Families Citing this family (72)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080287935A1 (en) * 2002-11-13 2008-11-20 Josef Bille System and method for photoablation using multiple focal points using cyclical phase modulation
US7259354B2 (en) * 2004-08-04 2007-08-21 Electro Scientific Industries, Inc. Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories
JP2007268576A (ja) * 2006-03-31 2007-10-18 Hitachi Via Mechanics Ltd レーザ加工方法
JP4917361B2 (ja) * 2006-06-13 2012-04-18 株式会社ディスコ ビアホールの加工方法
JP4787091B2 (ja) * 2006-06-27 2011-10-05 株式会社ディスコ ビアホールの加工方法
JP2008126252A (ja) * 2006-11-17 2008-06-05 Disco Abrasive Syst Ltd レーザー加工装置
ITPD20070201A1 (it) * 2007-06-08 2008-12-09 Helios Technology Societa A Re Macchina per la rimozione di superfici di semiconduttori, ed in particolare di superfici con circuiti integrati
US20090118716A1 (en) * 2007-11-07 2009-05-07 Intralase, Inc. System and method for scanning a pulsed laser beam
US8142423B2 (en) 2007-11-07 2012-03-27 Amo Development, Llc. System and method for incising material
US8231612B2 (en) * 2007-11-19 2012-07-31 Amo Development Llc. Method of making sub-surface photoalterations in a material
US9101446B2 (en) * 2008-01-02 2015-08-11 Intralase Corp. System and method for scanning a pulsed laser beam
US9108270B2 (en) * 2008-01-02 2015-08-18 Amo Development, Llc System and method for scanning a pulsed laser beam
DE102008011425A1 (de) * 2008-02-27 2009-09-03 Mtu Aero Engines Gmbh Optimiertes Bearbeiten einer Kontur mittels gepulstem Werkzueg
US8173038B2 (en) * 2008-04-18 2012-05-08 Corning Incorporated Methods and systems for forming microstructures in glass substrates
US20090312859A1 (en) * 2008-06-16 2009-12-17 Electro Scientific Industries, Inc. Modifying entry angles associated with circular tooling actions to improve throughput in part machining
US20110150371A1 (en) * 2008-07-28 2011-06-23 Sonoco Development, Inc. Flexible Pouch With Easy-Opening Features
US8230664B2 (en) * 2008-07-28 2012-07-31 Sonoco Development, Inc. Pouch opening feature and method for making the same
US8525074B2 (en) * 2008-12-26 2013-09-03 Denso Corporation Machining method and machining system for micromachining a part in a machine component
JP2011045906A (ja) * 2009-08-26 2011-03-10 Denso Corp 機構部品における微細加工部の加工方法および加工装置
JP4595018B2 (ja) * 2009-02-23 2010-12-08 株式会社新川 半導体装置の製造方法およびボンディング装置
WO2011038788A1 (en) * 2009-02-27 2011-04-07 Picodrill Sa A method of generating a hole or recess or well in a substrate, a device for carrying out the method, and a high frequency high voltage source for use in such a device
US20100252959A1 (en) * 2009-03-27 2010-10-07 Electro Scientific Industries, Inc. Method for improved brittle materials processing
DE102009044316B4 (de) 2009-10-22 2015-04-30 Ewag Ag Verfahren zur Herstellung einer Fläche und/oder einer Kante an einem Rohling sowie Laserbearbeitungsvorrichtung zur Durchführung des Verfahrens
JP2011110598A (ja) * 2009-11-30 2011-06-09 Panasonic Corp レーザ加工方法およびレーザ加工装置
DE102010011508B4 (de) 2010-03-15 2015-12-10 Ewag Ag Verfahren zur Herstellung zumindest einer Spannut und zumindest einer Schneidkante und Laserbearbeitungsvorrichtung
WO2012165588A1 (ja) 2011-06-03 2012-12-06 住友電気工業株式会社 光源装置および加工方法
US9289858B2 (en) * 2011-12-20 2016-03-22 Electro Scientific Industries, Inc. Drilling holes with minimal taper in cured silicone
US9931712B2 (en) 2012-01-11 2018-04-03 Pim Snow Leopard Inc. Laser drilling and trepanning device
JP2013146780A (ja) * 2012-01-23 2013-08-01 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板のレーザ加工方法
US8716625B2 (en) * 2012-02-03 2014-05-06 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Workpiece cutting
KR20140124374A (ko) * 2012-02-10 2014-10-24 아사히 가라스 가부시키가이샤 기판을 드릴링하는 디바이스 및 기판을 드릴링하는 방법
JP2013248624A (ja) * 2012-05-30 2013-12-12 Disco Corp レーザー加工装置
DE102012111771B4 (de) * 2012-12-04 2020-12-03 Ewag Ag Verfahren zur Bearbeitung eines Werkstücks unter Verwendung einer Laserbearbeitungsvorrichtung zur Herstellung eines Schneidwerkzeugs
WO2014110276A1 (en) 2013-01-11 2014-07-17 Electro Scientific Industries, Inc. Laser pulse energy control systems and methods
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
KR102245812B1 (ko) * 2013-03-15 2021-04-30 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 Aod 이동 저감을 위한 aod 툴 정착을 위한 레이저 시스템 및 방법
CN105102169B (zh) * 2013-03-15 2017-05-03 伊雷克托科学工业股份有限公司 用于声光偏转器击溃处理的激光系统和方法
EP2781296B1 (de) * 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
JP5574008B2 (ja) * 2013-04-26 2014-08-20 株式会社デンソー 機構部品における微細加工部の加工方法および加工装置
US10335887B2 (en) * 2013-11-14 2019-07-02 Lincoln Global, Inc. Methods and systems for plasma cutting holes and contours in workpieces
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
KR102445217B1 (ko) 2014-07-08 2022-09-20 코닝 인코포레이티드 재료를 레이저 가공하는 방법 및 장치
TWI659793B (zh) 2014-07-14 2019-05-21 美商康寧公司 用於使用可調整雷射束焦線來處理透明材料的系統及方法
JP6785238B2 (ja) 2015-02-27 2020-11-18 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド クロス軸微細加工のための高速ビーム操作
EP3848334A1 (en) 2015-03-24 2021-07-14 Corning Incorporated Alkaline earth boro-aluminosilicate glass article with laser cut edge
CN104722932B (zh) * 2015-03-28 2016-09-14 大族激光科技产业集团股份有限公司 一种非晶硅太阳电池玻璃基底的激光钻孔方法
CN116213918A (zh) 2015-09-09 2023-06-06 伊雷克托科学工业股份有限公司 镭射处理设备、镭射处理工件的方法及相关配置
JP6671145B2 (ja) * 2015-10-30 2020-03-25 株式会社レーザーシステム 加工樹脂基板の製造方法およびレーザー加工装置
JP6552948B2 (ja) * 2015-11-27 2019-07-31 株式会社ディスコ ウエーハの加工方法、及び加工装置
CN109803786B (zh) 2016-09-30 2021-05-07 康宁股份有限公司 使用非轴对称束斑对透明工件进行激光加工的设备和方法
JP7066701B2 (ja) 2016-10-24 2022-05-13 コーニング インコーポレイテッド シート状ガラス基体のレーザに基づく加工のための基体処理ステーション
KR102401037B1 (ko) 2016-12-30 2022-05-24 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 레이저 가공 장치에서 광학계의 수명을 연장하는 방법 및 시스템
JP2018134678A (ja) * 2017-02-23 2018-08-30 ローランドディー．ジー．株式会社 加工方法
WO2019003513A1 (ja) * 2017-06-29 2019-01-03 パナソニックＩｐマネジメント株式会社 レーザ加工システムおよびレーザ加工システムの制御方法
CN107520545B (zh) * 2017-09-01 2019-06-21 大族激光科技产业集团股份有限公司 激光钻孔方法
EP3774166A4 (en) 2018-06-05 2022-01-19 Electro Scientific Industries, Inc. LASER PROCESSING DEVICE, METHOD OF OPERATION THEREOF AND METHOD OF PROCESSING WORKPIECES USING SAME
US11548099B2 (en) * 2018-12-03 2023-01-10 Mitsubishi Electric Corporation Laser processing method and laser processing apparatus
JP7325194B2 (ja) * 2019-02-19 2023-08-14 三菱重工業株式会社 溶接物製造方法、溶接物製造システム及び溶接物
CN111151898A (zh) * 2020-01-07 2020-05-15 深圳市吉祥云科技有限公司 一种呈螺旋方向上升且振幅盘绕的打孔方法及打孔系统
KR102864252B1 (ko) * 2020-03-04 2025-09-26 삼성디스플레이 주식회사 전자 장치 제조 방법
CN111370220A (zh) * 2020-03-11 2020-07-03 大族激光科技产业集团股份有限公司 一种充电线圈加工方法及无线充电装置
CN111901971B (zh) * 2020-08-01 2021-11-16 生益电子股份有限公司 一种电路板及其制造方法
US11889612B2 (en) 2020-08-26 2024-01-30 Tae Technologies, Inc. Ion beam paths on target surfaces for neutron beam generation
EP4046741B1 (fr) 2021-02-23 2023-11-01 DM Surfaces SA Procede d'usinage laser d'un composant horloger
CN113727526B (zh) * 2021-08-31 2023-05-26 深圳市大族数控科技股份有限公司 线路板保护层开窗方法
CN114131222B (zh) * 2021-12-27 2024-12-20 浙江华工光润智能装备技术有限公司 一种玻璃异形孔加工方法
WO2023167873A1 (en) * 2022-03-02 2023-09-07 Tae Technologies, Inc. Ion beam exclusion paths on the target surface to optimize neutron beam performance
CN114682932B (zh) * 2022-04-14 2024-02-09 强一半导体(苏州)股份有限公司 一种适用于生瓷片的激光加工通孔的方法
CN115502585B (zh) * 2022-09-02 2023-05-09 广州添利电子科技有限公司 一种大孔径镭射孔的加工方法
CN116393835A (zh) * 2023-03-02 2023-07-07 深圳市吉祥云科技有限公司 碳纤维增强复合材料激光切割方法、系统、设备及介质
CN119901315B (zh) * 2025-01-14 2025-11-07 华能信息技术有限公司 防止车辆上车载定位设备被拆除的监控方法、装置和设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5841102A (en) * 1996-11-08 1998-11-24 W. L. Gore & Associates, Inc. Multiple pulse space processing to enhance via entrance formation at 355 nm
US6492616B1 (en) * 1999-05-24 2002-12-10 Nippon Steel Chemical Co., Ltd. Processes for laser beam machining of resin film for wiring boards and manufacture of wiring boards
JP2003048088A (ja) * 2001-07-31 2003-02-18 Mitsubishi Electric Corp レーザ加工方法及びレーザ加工機
US20040183855A1 (en) * 2001-11-30 2004-09-23 Chen-Hsiung Cheng Method of laser milling using constant tool path algorithm

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS564391A (en) * 1979-06-21 1981-01-17 Toshiba Corp Laser working method
JPH02169194A (ja) * 1988-12-23 1990-06-29 Shin Meiwa Ind Co Ltd 穴あけ切断方法
JP3162255B2 (ja) * 1994-02-24 2001-04-25 三菱電機株式会社 レーザ加工方法及びその装置
US5856649A (en) * 1994-02-25 1999-01-05 Fanuc Ltd. Laser beam machine
JP3372339B2 (ja) * 1994-02-25 2003-02-04 ファナック株式会社 レーザ加工装置
JPH0810972A (ja) * 1994-06-27 1996-01-16 Hitachi Constr Mach Co Ltd パルスレーザ加工装置
US5841099A (en) * 1994-07-18 1998-11-24 Electro Scientific Industries, Inc. Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets
JP3515838B2 (ja) * 1995-10-02 2004-04-05 ファナック株式会社 レーザ加工装置、レーザ加工方法、及びプログラム作成装置
JPH1080783A (ja) * 1996-09-06 1998-03-31 Amada Co Ltd 熱切断機における丸穴切断方法およびその装置
JP2001244604A (ja) * 2000-02-28 2001-09-07 Mitsubishi Gas Chem Co Inc 炭酸ガスレーザーによる孔あけ方法
JP2001332867A (ja) * 2000-05-24 2001-11-30 Hitachi Chem Co Ltd プリント配線板の製造法およびその方法によって製造したプリント配線板
TW503143B (en) 2000-10-06 2002-09-21 Hitachi Via Mechanics Ltd Method and apparatus for drilling printed wiring boards
CN1295052C (zh) * 2001-11-30 2007-01-17 松下电器产业株式会社 激光铣削方法及系统
US6706998B2 (en) 2002-01-11 2004-03-16 Electro Scientific Industries, Inc. Simulated laser spot enlargement
DE10207288B4 (de) * 2002-02-21 2005-05-04 Newson Engineering Nv Verfahren zum Bohren von Löchern mittels eines Laserstrahls in einem Substrat, insbesondere in einem elektrischen Schaltungsubstrat
US20040112881A1 (en) * 2002-04-11 2004-06-17 Bloemeke Stephen Roger Circle laser trepanning
US6749285B2 (en) * 2002-07-25 2004-06-15 Matsushita Electric Industrial Co., Ltd. Method of milling repeatable exit holes in ink-jet nozzles
JP3720034B2 (ja) * 2003-05-26 2005-11-24 住友重機械工業株式会社 穴あけ加工方法
US7259354B2 (en) * 2004-08-04 2007-08-21 Electro Scientific Industries, Inc. Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5841102A (en) * 1996-11-08 1998-11-24 W. L. Gore & Associates, Inc. Multiple pulse space processing to enhance via entrance formation at 355 nm
US6492616B1 (en) * 1999-05-24 2002-12-10 Nippon Steel Chemical Co., Ltd. Processes for laser beam machining of resin film for wiring boards and manufacture of wiring boards
JP2003048088A (ja) * 2001-07-31 2003-02-18 Mitsubishi Electric Corp レーザ加工方法及びレーザ加工機
US20040183855A1 (en) * 2001-11-30 2004-09-23 Chen-Hsiung Cheng Method of laser milling using constant tool path algorithm

Also Published As

Publication number Publication date
JP2008509006A (ja) 2008-03-27
US7259354B2 (en) 2007-08-21
JP6014465B2 (ja) 2016-10-25
WO2006017583A2 (en) 2006-02-16
TW200610605A (en) 2006-04-01
GB0701804D0 (en) 2007-03-14
JP2013091102A (ja) 2013-05-16
JP2012066308A (ja) 2012-04-05
CN101035645B (zh) 2010-12-15
KR101242143B1 (ko) 2013-03-12
JP2016153142A (ja) 2016-08-25
CN101035645A (zh) 2007-09-12
DE112005001893T5 (de) 2007-09-06
KR20070039582A (ko) 2007-04-12
TWI353279B (en) 2011-12-01
JP5581303B2 (ja) 2014-08-27
WO2006017583A3 (en) 2006-03-30
US20060027544A1 (en) 2006-02-09

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Legal Events

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WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)