KR101242143B1 - 정밀하게 시간 조정된 레이저 펄스를 원형 및 나선형 궤적으로 이동시킴으로써 구멍을 처리하는 방법 - Google Patents

정밀하게 시간 조정된 레이저 펄스를 원형 및 나선형 궤적으로 이동시킴으로써 구멍을 처리하는 방법 Download PDF

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Publication number
KR101242143B1
KR101242143B1 KR1020077002761A KR20077002761A KR101242143B1 KR 101242143 B1 KR101242143 B1 KR 101242143B1 KR 1020077002761 A KR1020077002761 A KR 1020077002761A KR 20077002761 A KR20077002761 A KR 20077002761A KR 101242143 B1 KR101242143 B1 KR 101242143B1
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South Korea
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hole
target
laser
sample
entry
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Expired - Fee Related
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KR1020077002761A
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Korean (ko)
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KR20070039582A (ko
Inventor
로버트 엠. 페일쏘프
웨이솅 레이
히사시 마츠모토
글렌 시멘슨
데이빗 에이. 와트
마크 에이. 언래쓰
윌리암 제이. 조든스
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일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
  • Sampling And Sample Adjustment (AREA)
KR1020077002761A 2004-08-04 2005-08-01 정밀하게 시간 조정된 레이저 펄스를 원형 및 나선형 궤적으로 이동시킴으로써 구멍을 처리하는 방법 Expired - Fee Related KR101242143B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/912,525 US7259354B2 (en) 2004-08-04 2004-08-04 Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories
US10/912,525 2004-08-04
PCT/US2005/027584 WO2006017583A2 (en) 2004-08-04 2005-08-01 Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories

Publications (2)

Publication Number Publication Date
KR20070039582A KR20070039582A (ko) 2007-04-12
KR101242143B1 true KR101242143B1 (ko) 2013-03-12

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KR1020077002761A Expired - Fee Related KR101242143B1 (ko) 2004-08-04 2005-08-01 정밀하게 시간 조정된 레이저 펄스를 원형 및 나선형 궤적으로 이동시킴으로써 구멍을 처리하는 방법

Country Status (8)

Country Link
US (1) US7259354B2 (enExample)
JP (4) JP2008509006A (enExample)
KR (1) KR101242143B1 (enExample)
CN (1) CN101035645B (enExample)
DE (1) DE112005001893T5 (enExample)
GB (1) GB2431371A (enExample)
TW (1) TWI353279B (enExample)
WO (1) WO2006017583A2 (enExample)

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JP2008509006A (ja) 2008-03-27
US7259354B2 (en) 2007-08-21
JP6014465B2 (ja) 2016-10-25
WO2006017583A2 (en) 2006-02-16
TW200610605A (en) 2006-04-01
GB0701804D0 (en) 2007-03-14
JP2013091102A (ja) 2013-05-16
JP2012066308A (ja) 2012-04-05
CN101035645B (zh) 2010-12-15
JP2016153142A (ja) 2016-08-25
CN101035645A (zh) 2007-09-12
DE112005001893T5 (de) 2007-09-06
KR20070039582A (ko) 2007-04-12
TWI353279B (en) 2011-12-01
GB2431371A (en) 2007-04-25
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WO2006017583A3 (en) 2006-03-30
US20060027544A1 (en) 2006-02-09

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