TWI321641B - - Google Patents

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Publication number
TWI321641B
TWI321641B TW093118664A TW93118664A TWI321641B TW I321641 B TWI321641 B TW I321641B TW 093118664 A TW093118664 A TW 093118664A TW 93118664 A TW93118664 A TW 93118664A TW I321641 B TWI321641 B TW I321641B
Authority
TW
Taiwan
Prior art keywords
substrate
air
rectifying plate
exhaust means
cover
Prior art date
Application number
TW093118664A
Other languages
English (en)
Chinese (zh)
Other versions
TW200504322A (en
Inventor
Futoshi Shimai
Shigeru Kawata
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200504322A publication Critical patent/TW200504322A/zh
Application granted granted Critical
Publication of TWI321641B publication Critical patent/TWI321641B/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B15/00—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form
    • F26B15/10—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form with movement in a path composed of one or more straight lines, e.g. compound, the movement being in alternate horizontal and vertical directions
    • F26B15/12—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form with movement in a path composed of one or more straight lines, e.g. compound, the movement being in alternate horizontal and vertical directions the lines being all horizontal or slightly inclined
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Solid Materials (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW093118664A 2003-06-27 2004-06-25 Device for drying substrate and method for drying substrate TW200504322A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003184525A JP3865717B2 (ja) 2003-06-27 2003-06-27 基板乾燥装置および基板乾燥方法

Publications (2)

Publication Number Publication Date
TW200504322A TW200504322A (en) 2005-02-01
TWI321641B true TWI321641B (enExample) 2010-03-11

Family

ID=34184261

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093118664A TW200504322A (en) 2003-06-27 2004-06-25 Device for drying substrate and method for drying substrate

Country Status (4)

Country Link
JP (1) JP3865717B2 (enExample)
KR (1) KR101074957B1 (enExample)
CN (1) CN100412486C (enExample)
TW (1) TW200504322A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI618905B (zh) * 2015-01-28 2018-03-21 Shibaura Mechatronics Corp Substrate processing device

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4494269B2 (ja) * 2005-03-30 2010-06-30 大日本スクリーン製造株式会社 基板処理装置
JP4679403B2 (ja) * 2006-03-20 2011-04-27 株式会社日立ハイテクノロジーズ 基板乾燥装置、基板乾燥方法、及び基板の製造方法
KR200452969Y1 (ko) * 2008-12-29 2011-04-04 주식회사 케이씨텍 대면적 기판의 건조장치
JP2013045877A (ja) * 2011-08-24 2013-03-04 Tokyo Electron Ltd 基板処理装置
KR101557021B1 (ko) * 2011-11-07 2015-10-02 (주) 나인테크 평판표시패널 건조 장치
JP6801926B2 (ja) * 2016-09-26 2020-12-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法及び基板処理装置
KR102498913B1 (ko) * 2021-06-29 2023-02-13 주식회사 디엠에스 기판 건조장치

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5014447A (en) * 1988-02-10 1991-05-14 Thermo Electron Web Systems, Inc. Positive pressure web floater dryer with parallel flow
JPH0244327U (enExample) * 1988-09-20 1990-03-27
JPH0735478A (ja) * 1993-07-20 1995-02-07 Shimada Phys & Chem Ind Co Ltd エアーナイフ装置
JPH09159360A (ja) * 1995-12-07 1997-06-20 Joichi Takada 板状物乾燥装置
JP2983495B2 (ja) * 1997-05-20 1999-11-29 株式会社カイジョー 基板の乾燥方法
JPH11354487A (ja) * 1998-06-03 1999-12-24 Dainippon Screen Mfg Co Ltd 基板乾燥装置および基板乾燥方法
JP4213805B2 (ja) * 1999-02-09 2009-01-21 芝浦メカトロニクス株式会社 乾燥処理装置
JP3754905B2 (ja) * 2001-09-10 2006-03-15 東京エレクトロン株式会社 基板乾燥装置
JP2003124184A (ja) * 2001-10-18 2003-04-25 Sumitomo Precision Prod Co Ltd 基板処理装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI618905B (zh) * 2015-01-28 2018-03-21 Shibaura Mechatronics Corp Substrate processing device

Also Published As

Publication number Publication date
JP2005016887A (ja) 2005-01-20
CN100412486C (zh) 2008-08-20
TW200504322A (en) 2005-02-01
KR20050001374A (ko) 2005-01-06
CN1576763A (zh) 2005-02-09
JP3865717B2 (ja) 2007-01-10
KR101074957B1 (ko) 2011-10-18

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees