CN100412486C - 基板干燥装置和基板干燥方法 - Google Patents

基板干燥装置和基板干燥方法 Download PDF

Info

Publication number
CN100412486C
CN100412486C CNB200410055261XA CN200410055261A CN100412486C CN 100412486 C CN100412486 C CN 100412486C CN B200410055261X A CNB200410055261X A CN B200410055261XA CN 200410055261 A CN200410055261 A CN 200410055261A CN 100412486 C CN100412486 C CN 100412486C
Authority
CN
China
Prior art keywords
substrate
air
rectifying plate
exhaust device
air knife
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB200410055261XA
Other languages
English (en)
Chinese (zh)
Other versions
CN1576763A (zh
Inventor
岛井太
河田茂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of CN1576763A publication Critical patent/CN1576763A/zh
Application granted granted Critical
Publication of CN100412486C publication Critical patent/CN100412486C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B15/00—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form
    • F26B15/10—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form with movement in a path composed of one or more straight lines, e.g. compound, the movement being in alternate horizontal and vertical directions
    • F26B15/12—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form with movement in a path composed of one or more straight lines, e.g. compound, the movement being in alternate horizontal and vertical directions the lines being all horizontal or slightly inclined
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Solid Materials (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
CNB200410055261XA 2003-06-27 2004-06-26 基板干燥装置和基板干燥方法 Expired - Fee Related CN100412486C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003184525A JP3865717B2 (ja) 2003-06-27 2003-06-27 基板乾燥装置および基板乾燥方法
JP184525/03 2003-06-27
JP184525/2003 2003-06-27

Publications (2)

Publication Number Publication Date
CN1576763A CN1576763A (zh) 2005-02-09
CN100412486C true CN100412486C (zh) 2008-08-20

Family

ID=34184261

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB200410055261XA Expired - Fee Related CN100412486C (zh) 2003-06-27 2004-06-26 基板干燥装置和基板干燥方法

Country Status (4)

Country Link
JP (1) JP3865717B2 (enExample)
KR (1) KR101074957B1 (enExample)
CN (1) CN100412486C (enExample)
TW (1) TW200504322A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4494269B2 (ja) * 2005-03-30 2010-06-30 大日本スクリーン製造株式会社 基板処理装置
JP4679403B2 (ja) * 2006-03-20 2011-04-27 株式会社日立ハイテクノロジーズ 基板乾燥装置、基板乾燥方法、及び基板の製造方法
KR200452969Y1 (ko) * 2008-12-29 2011-04-04 주식회사 케이씨텍 대면적 기판의 건조장치
JP2013045877A (ja) * 2011-08-24 2013-03-04 Tokyo Electron Ltd 基板処理装置
KR101557021B1 (ko) * 2011-11-07 2015-10-02 (주) 나인테크 평판표시패널 건조 장치
JP6209572B2 (ja) * 2015-01-28 2017-10-04 芝浦メカトロニクス株式会社 基板処理装置
JP6801926B2 (ja) * 2016-09-26 2020-12-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法及び基板処理装置
KR102498913B1 (ko) * 2021-06-29 2023-02-13 주식회사 디엠에스 기판 건조장치

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0244327U (enExample) * 1988-09-20 1990-03-27
US5014447A (en) * 1988-02-10 1991-05-14 Thermo Electron Web Systems, Inc. Positive pressure web floater dryer with parallel flow
JPH0735478A (ja) * 1993-07-20 1995-02-07 Shimada Phys & Chem Ind Co Ltd エアーナイフ装置
JPH09159360A (ja) * 1995-12-07 1997-06-20 Joichi Takada 板状物乾燥装置
JPH11354487A (ja) * 1998-06-03 1999-12-24 Dainippon Screen Mfg Co Ltd 基板乾燥装置および基板乾燥方法
JP2000230783A (ja) * 1999-02-09 2000-08-22 Shibaura Mechatronics Corp 乾燥処理装置
JP2003124184A (ja) * 2001-10-18 2003-04-25 Sumitomo Precision Prod Co Ltd 基板処理装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2983495B2 (ja) * 1997-05-20 1999-11-29 株式会社カイジョー 基板の乾燥方法
JP3754905B2 (ja) * 2001-09-10 2006-03-15 東京エレクトロン株式会社 基板乾燥装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5014447A (en) * 1988-02-10 1991-05-14 Thermo Electron Web Systems, Inc. Positive pressure web floater dryer with parallel flow
JPH0244327U (enExample) * 1988-09-20 1990-03-27
JPH0735478A (ja) * 1993-07-20 1995-02-07 Shimada Phys & Chem Ind Co Ltd エアーナイフ装置
JPH09159360A (ja) * 1995-12-07 1997-06-20 Joichi Takada 板状物乾燥装置
JPH11354487A (ja) * 1998-06-03 1999-12-24 Dainippon Screen Mfg Co Ltd 基板乾燥装置および基板乾燥方法
JP2000230783A (ja) * 1999-02-09 2000-08-22 Shibaura Mechatronics Corp 乾燥処理装置
JP2003124184A (ja) * 2001-10-18 2003-04-25 Sumitomo Precision Prod Co Ltd 基板処理装置

Also Published As

Publication number Publication date
JP2005016887A (ja) 2005-01-20
TW200504322A (en) 2005-02-01
KR20050001374A (ko) 2005-01-06
CN1576763A (zh) 2005-02-09
JP3865717B2 (ja) 2007-01-10
KR101074957B1 (ko) 2011-10-18
TWI321641B (enExample) 2010-03-11

Similar Documents

Publication Publication Date Title
CN1325177C (zh) 一种清洁装置和清洁方法
US7931755B2 (en) Method for removing deposit from substrate and method for drying substrate, as well as apparatus for removing deposit from substrate and apparatus for drying substrate using these methods
JP4263615B2 (ja) フローコーティング方法及び装置
CN100412486C (zh) 基板干燥装置和基板干燥方法
JP4494269B2 (ja) 基板処理装置
JP5565673B2 (ja) ミストエッチング装置及びミストエッチング方法
JP6495986B2 (ja) 基板処理装置
CN101134201B (zh) 容器盖的异物清除装置
TWI446480B (zh) 基板冷卻裝置
JP2007301442A (ja) 粉塵除去装置
US20060278160A1 (en) Photoresist coating method and apparatus for performing same
CN100466216C (zh) 运送处理装置
TWI726084B (zh) 用於自塗佈系統擷取製程氣體之具有排氣歧管的設備
JP2001358114A (ja) 乾燥装置
JP3629411B2 (ja) エアーナイフ乾燥装置
KR19990078060A (ko) 플라즈마에칭방법 및 플라즈마에칭장치
JP2007059417A (ja) 基板処理装置
JP2008194661A (ja) エアクリーナヘッドの噴出口の噴出角度と吸込口の吸込角度と配置
JPH09141170A (ja) 塗布装置
JPH07181467A (ja) 基板のクリーニング方法およびその装置
JP2005268572A (ja) 基板処理装置
RU2832101C2 (ru) Устройство лазерной обработки и способ лазерной обработки
JP2020150190A (ja) 基板処理装置および基板処理方法
JP4288367B2 (ja) エアクリーナヘッドの噴出口の傾斜角度と吸込口の風量調整
CN211045383U (zh) 玻璃基板的制造装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20080820