JP3865717B2 - 基板乾燥装置および基板乾燥方法 - Google Patents

基板乾燥装置および基板乾燥方法 Download PDF

Info

Publication number
JP3865717B2
JP3865717B2 JP2003184525A JP2003184525A JP3865717B2 JP 3865717 B2 JP3865717 B2 JP 3865717B2 JP 2003184525 A JP2003184525 A JP 2003184525A JP 2003184525 A JP2003184525 A JP 2003184525A JP 3865717 B2 JP3865717 B2 JP 3865717B2
Authority
JP
Japan
Prior art keywords
substrate
drying apparatus
air
rectifying plate
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2003184525A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005016887A (ja
Inventor
太 島井
茂 河田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Priority to JP2003184525A priority Critical patent/JP3865717B2/ja
Priority to KR1020040047143A priority patent/KR101074957B1/ko
Priority to TW093118664A priority patent/TW200504322A/zh
Priority to CNB200410055261XA priority patent/CN100412486C/zh
Publication of JP2005016887A publication Critical patent/JP2005016887A/ja
Application granted granted Critical
Publication of JP3865717B2 publication Critical patent/JP3865717B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B15/00—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form
    • F26B15/10—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form with movement in a path composed of one or more straight lines, e.g. compound, the movement being in alternate horizontal and vertical directions
    • F26B15/12—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form with movement in a path composed of one or more straight lines, e.g. compound, the movement being in alternate horizontal and vertical directions the lines being all horizontal or slightly inclined
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Solid Materials (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2003184525A 2003-06-27 2003-06-27 基板乾燥装置および基板乾燥方法 Expired - Lifetime JP3865717B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003184525A JP3865717B2 (ja) 2003-06-27 2003-06-27 基板乾燥装置および基板乾燥方法
KR1020040047143A KR101074957B1 (ko) 2003-06-27 2004-06-23 기판 건조장치 및 기판 건조방법
TW093118664A TW200504322A (en) 2003-06-27 2004-06-25 Device for drying substrate and method for drying substrate
CNB200410055261XA CN100412486C (zh) 2003-06-27 2004-06-26 基板干燥装置和基板干燥方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003184525A JP3865717B2 (ja) 2003-06-27 2003-06-27 基板乾燥装置および基板乾燥方法

Publications (2)

Publication Number Publication Date
JP2005016887A JP2005016887A (ja) 2005-01-20
JP3865717B2 true JP3865717B2 (ja) 2007-01-10

Family

ID=34184261

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003184525A Expired - Lifetime JP3865717B2 (ja) 2003-06-27 2003-06-27 基板乾燥装置および基板乾燥方法

Country Status (4)

Country Link
JP (1) JP3865717B2 (enExample)
KR (1) KR101074957B1 (enExample)
CN (1) CN100412486C (enExample)
TW (1) TW200504322A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4494269B2 (ja) * 2005-03-30 2010-06-30 大日本スクリーン製造株式会社 基板処理装置
JP4679403B2 (ja) * 2006-03-20 2011-04-27 株式会社日立ハイテクノロジーズ 基板乾燥装置、基板乾燥方法、及び基板の製造方法
KR200452969Y1 (ko) * 2008-12-29 2011-04-04 주식회사 케이씨텍 대면적 기판의 건조장치
JP2013045877A (ja) * 2011-08-24 2013-03-04 Tokyo Electron Ltd 基板処理装置
KR101557021B1 (ko) * 2011-11-07 2015-10-02 (주) 나인테크 평판표시패널 건조 장치
JP6209572B2 (ja) * 2015-01-28 2017-10-04 芝浦メカトロニクス株式会社 基板処理装置
JP6801926B2 (ja) * 2016-09-26 2020-12-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法及び基板処理装置
KR102498913B1 (ko) * 2021-06-29 2023-02-13 주식회사 디엠에스 기판 건조장치

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5014447A (en) * 1988-02-10 1991-05-14 Thermo Electron Web Systems, Inc. Positive pressure web floater dryer with parallel flow
JPH0244327U (enExample) * 1988-09-20 1990-03-27
JPH0735478A (ja) * 1993-07-20 1995-02-07 Shimada Phys & Chem Ind Co Ltd エアーナイフ装置
JPH09159360A (ja) * 1995-12-07 1997-06-20 Joichi Takada 板状物乾燥装置
JP2983495B2 (ja) * 1997-05-20 1999-11-29 株式会社カイジョー 基板の乾燥方法
JPH11354487A (ja) * 1998-06-03 1999-12-24 Dainippon Screen Mfg Co Ltd 基板乾燥装置および基板乾燥方法
JP4213805B2 (ja) * 1999-02-09 2009-01-21 芝浦メカトロニクス株式会社 乾燥処理装置
JP3754905B2 (ja) * 2001-09-10 2006-03-15 東京エレクトロン株式会社 基板乾燥装置
JP2003124184A (ja) * 2001-10-18 2003-04-25 Sumitomo Precision Prod Co Ltd 基板処理装置

Also Published As

Publication number Publication date
JP2005016887A (ja) 2005-01-20
CN100412486C (zh) 2008-08-20
TW200504322A (en) 2005-02-01
KR20050001374A (ko) 2005-01-06
CN1576763A (zh) 2005-02-09
KR101074957B1 (ko) 2011-10-18
TWI321641B (enExample) 2010-03-11

Similar Documents

Publication Publication Date Title
TWI285136B (en) Substrate processing equipment
JP3865717B2 (ja) 基板乾燥装置および基板乾燥方法
JP6495986B2 (ja) 基板処理装置
CN101134201B (zh) 容器盖的异物清除装置
BRPI0503864A (pt) aparelho vibratório de separação de material, e, separador vibratório de material
JP2007301442A (ja) 粉塵除去装置
JP3556816B2 (ja) 枚葉印刷機のシート案内装置
JP2004284183A (ja) インクジェット記録装置
JP2002110619A (ja) 基板処理装置
JP4509613B2 (ja) 基板処理装置
CN100466216C (zh) 运送处理装置
JP3629411B2 (ja) エアーナイフ乾燥装置
JPH0943826A (ja) 感光材料乾燥装置
JP2005088320A (ja) 印刷機の集塵装置
CN113741156A (zh) 显影处理装置和显影处理方法
CN211518870U (zh) 一种四色印刷的密闭除尘型彩色印刷面覆膜处理系统
JP2003280166A (ja) 乾燥装置
JP3049618B2 (ja) 水切り用エアーナイフ装置
JP2000320969A (ja) キャップの水滴除去装置
JPH0710374B2 (ja) 塗布、含浸調整方法
JP7543929B2 (ja) 用紙搬送装置、及び、当該用紙搬送装置を用いるインクジェット記録装置
JP4374565B2 (ja) 異物除去ノズル及びそれを備えた除去装置
JP2004255353A (ja) 塗装システム
JPH08295007A (ja) 枚葉印刷機デリバリ部の集塵装置
CN202951632U (zh) 干燥食品分选装置和具备该分选装置的干燥食品分选线

Legal Events

Date Code Title Description
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20060529

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20060606

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060807

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20061003

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20061003

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

Ref document number: 3865717

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20091013

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101013

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101013

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20111013

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20111013

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121013

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121013

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20131013

Year of fee payment: 7

EXPY Cancellation because of completion of term