JP2008523632A5 - - Google Patents

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Publication number
JP2008523632A5
JP2008523632A5 JP2007545713A JP2007545713A JP2008523632A5 JP 2008523632 A5 JP2008523632 A5 JP 2008523632A5 JP 2007545713 A JP2007545713 A JP 2007545713A JP 2007545713 A JP2007545713 A JP 2007545713A JP 2008523632 A5 JP2008523632 A5 JP 2008523632A5
Authority
JP
Japan
Prior art keywords
flat plate
backside
contaminant particles
particles according
reducing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007545713A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008523632A (ja
Filing date
Publication date
Priority claimed from US11/239,000 external-priority patent/US20060124155A1/en
Application filed filed Critical
Publication of JP2008523632A publication Critical patent/JP2008523632A/ja
Publication of JP2008523632A5 publication Critical patent/JP2008523632A5/ja
Pending legal-status Critical Current

Links

JP2007545713A 2004-12-13 2005-12-13 裏面汚染物粒子を減少させるための技術 Pending JP2008523632A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US63552404P 2004-12-13 2004-12-13
US11/239,000 US20060124155A1 (en) 2004-12-13 2005-09-30 Technique for reducing backside particles
PCT/US2005/044987 WO2006065778A2 (en) 2004-12-13 2005-12-13 Technique for recuding bakcside particles

Publications (2)

Publication Number Publication Date
JP2008523632A JP2008523632A (ja) 2008-07-03
JP2008523632A5 true JP2008523632A5 (enExample) 2009-02-05

Family

ID=36582375

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007545713A Pending JP2008523632A (ja) 2004-12-13 2005-12-13 裏面汚染物粒子を減少させるための技術

Country Status (5)

Country Link
US (1) US20060124155A1 (enExample)
JP (1) JP2008523632A (enExample)
KR (1) KR20070095943A (enExample)
TW (1) TW200633036A (enExample)
WO (1) WO2006065778A2 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6328814B1 (en) * 1999-03-26 2001-12-11 Applied Materials, Inc. Apparatus for cleaning and drying substrates
KR100939596B1 (ko) * 2001-11-02 2010-02-01 어플라이드 머티어리얼스, 인코포레이티드 단일 웨이퍼 건조기 및 건조 방법
US20060207634A1 (en) * 2005-03-16 2006-09-21 Applied Materials, Inc. Methods and apparatus for maintaining a fluid level in a tank
US7544254B2 (en) * 2006-12-14 2009-06-09 Varian Semiconductor Equipment Associates, Inc. System and method for cleaning an ion implanter
TWI479559B (zh) 2007-06-28 2015-04-01 Quantum Global Tech Llc 以選擇性噴灑蝕刻來清潔腔室部件的方法和設備
TWI402111B (zh) * 2010-07-06 2013-07-21 Au Optronics Corp 製程反應系統
US20120247504A1 (en) * 2010-10-01 2012-10-04 Waleed Nasr System and Method for Sub-micron Level Cleaning of Surfaces
TWI568509B (zh) * 2013-07-30 2017-02-01 兆遠科技股份有限公司 防止塵粒進入腔室及清理腔室的裝置
US9318347B2 (en) 2014-08-14 2016-04-19 International Business Machines Corporation Wafer backside particle mitigation
US9184042B1 (en) * 2014-08-14 2015-11-10 International Business Machines Corporation Wafer backside particle mitigation
KR102516885B1 (ko) * 2018-05-10 2023-03-30 삼성전자주식회사 증착 장비 및 이를 이용한 반도체 장치 제조 방법
US12420314B2 (en) * 2019-10-18 2025-09-23 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor cleaning apparatus and method

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR910010639A (ko) * 1989-11-13 1991-06-29 제임스 조셉 드롱 압력차에 의해 제품의 표면에서 오염입자를 제거시키는 방법 및 장치
US5372652A (en) * 1993-06-14 1994-12-13 International Business Machines Corporation Aerosol cleaning method
US6108189A (en) * 1996-04-26 2000-08-22 Applied Materials, Inc. Electrostatic chuck having improved gas conduits
US5925228A (en) * 1997-01-09 1999-07-20 Sandia Corporation Electrophoretically active sol-gel processes to backfill, seal, and/or densify porous, flawed, and/or cracked coatings on electrically conductive material
US6080272A (en) * 1998-05-08 2000-06-27 Micron Technology, Inc. Method and apparatus for plasma etching a wafer
US6170496B1 (en) * 1998-08-26 2001-01-09 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for servicing a wafer platform
US6460552B1 (en) * 1998-10-05 2002-10-08 Lorimer D'arcy H. Method and apparatus for cleaning flat workpieces
US6362946B1 (en) * 1999-11-02 2002-03-26 Varian Semiconductor Equipment Associates, Inc. Electrostatic wafer clamp having electrostatic seal for retaining gas
JP3981243B2 (ja) * 2001-04-09 2007-09-26 日東電工株式会社 クリーニング機能付き搬送部材、及びこれに用いるクリーニング用ラベルシ―ト
US6689221B2 (en) * 2000-12-04 2004-02-10 Applied Materials, Inc. Cooling gas delivery system for a rotatable semiconductor substrate support assembly
JP3749848B2 (ja) * 2001-09-28 2006-03-01 大日本スクリーン製造株式会社 基板周縁処理装置
US6554909B1 (en) * 2001-11-08 2003-04-29 Saint-Gobain Ceramics & Plastics, Inc. Process for cleaning components using cleaning media
US6933507B2 (en) * 2002-07-17 2005-08-23 Kenneth H. Purser Controlling the characteristics of implanter ion-beams
US20040029494A1 (en) * 2002-08-09 2004-02-12 Souvik Banerjee Post-CMP cleaning of semiconductor wafer surfaces using a combination of aqueous and CO2 based cryogenic cleaning techniques

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