TWI320571B - Dynamic nonvolatile random access memory ne transistor cell and random access memory array - Google Patents
Dynamic nonvolatile random access memory ne transistor cell and random access memory arrayInfo
- Publication number
- TWI320571B TWI320571B TW092125058A TW92125058A TWI320571B TW I320571 B TWI320571 B TW I320571B TW 092125058 A TW092125058 A TW 092125058A TW 92125058 A TW92125058 A TW 92125058A TW I320571 B TWI320571 B TW I320571B
- Authority
- TW
- Taiwan
- Prior art keywords
- random access
- access memory
- transistor cell
- memory array
- dynamic nonvolatile
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/8213—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using SiC technology
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/20—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having two electrodes, e.g. diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Semiconductor Memories (AREA)
- Read Only Memory (AREA)
- Non-Volatile Memory (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2002951339A AU2002951339A0 (en) | 2002-09-12 | 2002-09-12 | Non volatile memory cell |
AU2003900911A AU2003900911A0 (en) | 2003-02-28 | 2003-02-28 | Nonvolatile memory cell |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200421345A TW200421345A (en) | 2004-10-16 |
TWI320571B true TWI320571B (en) | 2010-02-11 |
Family
ID=31994781
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW092125058A TWI320571B (en) | 2002-09-12 | 2003-09-10 | Dynamic nonvolatile random access memory ne transistor cell and random access memory array |
Country Status (6)
Country | Link |
---|---|
US (1) | US7362609B2 (zh) |
EP (2) | EP1537585A4 (zh) |
JP (2) | JP2005538552A (zh) |
KR (2) | KR20100107084A (zh) |
TW (1) | TWI320571B (zh) |
WO (1) | WO2004025660A1 (zh) |
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US6534867B1 (en) * | 1999-09-27 | 2003-03-18 | Kabushiki Kaisha Toshiba | Semiconductor device, semiconductor element and method for producing same |
WO2005059955A2 (en) * | 2003-11-18 | 2005-06-30 | Halliburton Energy Services | A high temperature memory device |
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US20060006393A1 (en) * | 2004-07-06 | 2006-01-12 | Ward Allan Iii | Silicon-rich nickel-silicide ohmic contacts for SiC semiconductor devices |
KR100744566B1 (ko) * | 2006-09-08 | 2007-08-01 | 한국전자통신연구원 | 금속산화물을 이용한 게이트 스택, 이를 포함하는트랜지스터 일체형 메모리 소자 및 그 메모리소자의구동방법 |
US8377812B2 (en) * | 2006-11-06 | 2013-02-19 | General Electric Company | SiC MOSFETs and self-aligned fabrication methods thereof |
US20080108190A1 (en) * | 2006-11-06 | 2008-05-08 | General Electric Company | SiC MOSFETs and self-aligned fabrication methods thereof |
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JP2008204581A (ja) * | 2007-02-22 | 2008-09-04 | Elpida Memory Inc | 不揮発性ram |
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US20090251960A1 (en) * | 2008-04-07 | 2009-10-08 | Halliburton Energy Services, Inc. | High temperature memory device |
US7688117B1 (en) | 2008-04-21 | 2010-03-30 | The United States Of America As Represented By The Administrator Of National Aeronautics And Space Administration | N channel JFET based digital logic gate structure |
US8189364B2 (en) * | 2008-12-17 | 2012-05-29 | Qs Semiconductor Australia Pty Ltd. | Charge retention structures and techniques for implementing charge controlled resistors in memory cells and arrays of memory |
WO2010104918A1 (en) | 2009-03-10 | 2010-09-16 | Contour Semiconductor, Inc. | Three-dimensional memory array comprising vertical switches having three terminals |
US20110042685A1 (en) * | 2009-08-18 | 2011-02-24 | Qs Semiconductor Australia Pty Ltd | Substrates and methods of fabricating epitaxial silicon carbide structures with sequential emphasis |
US8507966B2 (en) | 2010-03-02 | 2013-08-13 | Micron Technology, Inc. | Semiconductor cells, arrays, devices and systems having a buried conductive line and methods for forming the same |
US9608119B2 (en) * | 2010-03-02 | 2017-03-28 | Micron Technology, Inc. | Semiconductor-metal-on-insulator structures, methods of forming such structures, and semiconductor devices including such structures |
US9646869B2 (en) | 2010-03-02 | 2017-05-09 | Micron Technology, Inc. | Semiconductor devices including a diode structure over a conductive strap and methods of forming such semiconductor devices |
US8288795B2 (en) | 2010-03-02 | 2012-10-16 | Micron Technology, Inc. | Thyristor based memory cells, devices and systems including the same and methods for forming the same |
US8513722B2 (en) | 2010-03-02 | 2013-08-20 | Micron Technology, Inc. | Floating body cell structures, devices including same, and methods for forming same |
KR101932909B1 (ko) * | 2010-03-04 | 2018-12-27 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 메모리 장치 및 반도체 장치 |
US8537618B2 (en) | 2010-08-26 | 2013-09-17 | Steven Jeffrey Grossman | RAM memory device with NAND type interface |
US8228730B2 (en) | 2010-08-31 | 2012-07-24 | Micron Technology, Inc. | Memory cell structures and methods |
US8598621B2 (en) | 2011-02-11 | 2013-12-03 | Micron Technology, Inc. | Memory cells, memory arrays, methods of forming memory cells, and methods of forming a shared doped semiconductor region of a vertically oriented thyristor and a vertically oriented access transistor |
US8952418B2 (en) | 2011-03-01 | 2015-02-10 | Micron Technology, Inc. | Gated bipolar junction transistors |
US8519431B2 (en) | 2011-03-08 | 2013-08-27 | Micron Technology, Inc. | Thyristors |
US8772848B2 (en) | 2011-07-26 | 2014-07-08 | Micron Technology, Inc. | Circuit structures, memory circuitry, and methods |
US9224738B1 (en) | 2014-08-18 | 2015-12-29 | Micron Technology, Inc. | Methods of forming an array of gated devices |
US9209187B1 (en) | 2014-08-18 | 2015-12-08 | Micron Technology, Inc. | Methods of forming an array of gated devices |
US9673054B2 (en) | 2014-08-18 | 2017-06-06 | Micron Technology, Inc. | Array of gated devices and methods of forming an array of gated devices |
CN104966665B (zh) * | 2015-05-21 | 2018-08-28 | 西安电子科技大学 | 一种改善SiC与SiO2界面态密度的方法 |
DE102015118616B3 (de) * | 2015-10-30 | 2017-04-13 | Infineon Technologies Austria Ag | Latchup-fester Transistor |
EP3236653B1 (en) * | 2016-04-19 | 2019-04-10 | Nokia Technologies Oy | Field-effect transistor array, methods of making and using a field-effect transistor array and associated computer program |
US11663455B2 (en) * | 2020-02-12 | 2023-05-30 | Ememory Technology Inc. | Resistive random-access memory cell and associated cell array structure |
US11177280B1 (en) | 2020-05-18 | 2021-11-16 | Sandisk Technologies Llc | Three-dimensional memory device including wrap around word lines and methods of forming the same |
CN114974339A (zh) * | 2021-02-22 | 2022-08-30 | 联华电子股份有限公司 | 存储器阵列 |
FR3120470B1 (fr) * | 2021-03-05 | 2023-12-29 | Diamfab | Condensateur comprenant un empilement de couches en materiau semi-conducteur a large bande interdite |
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-
2003
- 2003-09-10 TW TW092125058A patent/TWI320571B/zh not_active IP Right Cessation
- 2003-09-12 EP EP03794699A patent/EP1537585A4/en not_active Withdrawn
- 2003-09-12 KR KR1020107021028A patent/KR20100107084A/ko not_active Application Discontinuation
- 2003-09-12 EP EP10183908A patent/EP2296151A1/en not_active Withdrawn
- 2003-09-12 WO PCT/AU2003/001186 patent/WO2004025660A1/en active IP Right Grant
- 2003-09-12 US US10/526,382 patent/US7362609B2/en not_active Expired - Fee Related
- 2003-09-12 KR KR1020057004311A patent/KR101032870B1/ko not_active IP Right Cessation
- 2003-09-12 JP JP2004534858A patent/JP2005538552A/ja active Pending
-
2010
- 2010-10-06 JP JP2010226721A patent/JP2011091395A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
TW200421345A (en) | 2004-10-16 |
KR20100107084A (ko) | 2010-10-04 |
JP2011091395A (ja) | 2011-05-06 |
US7362609B2 (en) | 2008-04-22 |
KR101032870B1 (ko) | 2011-05-06 |
EP1537585A1 (en) | 2005-06-08 |
EP2296151A1 (en) | 2011-03-16 |
US20060007727A1 (en) | 2006-01-12 |
JP2005538552A (ja) | 2005-12-15 |
KR20050053658A (ko) | 2005-06-08 |
WO2004025660A1 (en) | 2004-03-25 |
EP1537585A4 (en) | 2007-08-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |