TWI316887B - Materials and methods for chemical-mechanical planarization - Google Patents

Materials and methods for chemical-mechanical planarization Download PDF

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Publication number
TWI316887B
TWI316887B TW093104265A TW93104265A TWI316887B TW I316887 B TWI316887 B TW I316887B TW 093104265 A TW093104265 A TW 093104265A TW 93104265 A TW93104265 A TW 93104265A TW I316887 B TWI316887 B TW I316887B
Authority
TW
Taiwan
Prior art keywords
major surface
substrate
polishing
abrasive particles
semiconductor substrate
Prior art date
Application number
TW093104265A
Other languages
English (en)
Chinese (zh)
Other versions
TW200510116A (en
Inventor
Sudhakar Balijepalli
Dale J Aldrich
Laura A Grier
Original Assignee
Dow Global Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Inc filed Critical Dow Global Technologies Inc
Publication of TW200510116A publication Critical patent/TW200510116A/zh
Application granted granted Critical
Publication of TWI316887B publication Critical patent/TWI316887B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
TW093104265A 2003-02-24 2004-02-20 Materials and methods for chemical-mechanical planarization TWI316887B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/370,781 US6910951B2 (en) 2003-02-24 2003-02-24 Materials and methods for chemical-mechanical planarization

Publications (2)

Publication Number Publication Date
TW200510116A TW200510116A (en) 2005-03-16
TWI316887B true TWI316887B (en) 2009-11-11

Family

ID=32868224

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093104265A TWI316887B (en) 2003-02-24 2004-02-20 Materials and methods for chemical-mechanical planarization

Country Status (7)

Country Link
US (1) US6910951B2 (enExample)
EP (1) EP1599314A1 (enExample)
JP (1) JP2006518940A (enExample)
KR (1) KR20050107454A (enExample)
CN (1) CN1774316A (enExample)
TW (1) TWI316887B (enExample)
WO (1) WO2004076126A1 (enExample)

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US20090061744A1 (en) * 2007-08-28 2009-03-05 Rajeev Bajaj Polishing pad and method of use
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CN109894930B (zh) * 2019-03-22 2021-06-25 湖南科技大学 一种缓释型柔性磨具及抛光方法
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Also Published As

Publication number Publication date
US6910951B2 (en) 2005-06-28
WO2004076126A1 (en) 2004-09-10
CN1774316A (zh) 2006-05-17
JP2006518940A (ja) 2006-08-17
EP1599314A1 (en) 2005-11-30
US20040166779A1 (en) 2004-08-26
KR20050107454A (ko) 2005-11-11
TW200510116A (en) 2005-03-16

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