ATE266071T1 - Schleifmittelzusammensetzung zum polieren eines halbleiterbauteils und herstellung des halbleiterbauteils mit derselben - Google Patents

Schleifmittelzusammensetzung zum polieren eines halbleiterbauteils und herstellung des halbleiterbauteils mit derselben

Info

Publication number
ATE266071T1
ATE266071T1 AT99906467T AT99906467T ATE266071T1 AT E266071 T1 ATE266071 T1 AT E266071T1 AT 99906467 T AT99906467 T AT 99906467T AT 99906467 T AT99906467 T AT 99906467T AT E266071 T1 ATE266071 T1 AT E266071T1
Authority
AT
Austria
Prior art keywords
semiconductor component
abrasive composition
polishing
atom
producing
Prior art date
Application number
AT99906467T
Other languages
English (en)
Inventor
Takanori Kido
Kagetaka Ichikawa
Original Assignee
Showa Denko Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko Kk filed Critical Showa Denko Kk
Application granted granted Critical
Publication of ATE266071T1 publication Critical patent/ATE266071T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31051—Planarisation of the insulating layers
    • H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
AT99906467T 1998-02-24 1999-02-24 Schleifmittelzusammensetzung zum polieren eines halbleiterbauteils und herstellung des halbleiterbauteils mit derselben ATE266071T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP4228898 1998-02-24
PCT/JP1999/000844 WO1999043761A1 (fr) 1998-02-24 1999-02-24 Composition abrasive de polissage d'un dispositif semiconducteur et procede de production d'un dispositif semiconducteur afferent

Publications (1)

Publication Number Publication Date
ATE266071T1 true ATE266071T1 (de) 2004-05-15

Family

ID=12631866

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99906467T ATE266071T1 (de) 1998-02-24 1999-02-24 Schleifmittelzusammensetzung zum polieren eines halbleiterbauteils und herstellung des halbleiterbauteils mit derselben

Country Status (9)

Country Link
US (2) US6436835B1 (de)
EP (1) EP1061111B1 (de)
JP (1) JP3672493B2 (de)
KR (1) KR100583842B1 (de)
AT (1) ATE266071T1 (de)
DE (1) DE69917010T2 (de)
ES (1) ES2216490T3 (de)
TW (1) TW510917B (de)
WO (1) WO1999043761A1 (de)

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Also Published As

Publication number Publication date
TW510917B (en) 2002-11-21
KR20010041248A (ko) 2001-05-15
EP1061111A4 (de) 2001-05-30
US20020045350A1 (en) 2002-04-18
WO1999043761A1 (fr) 1999-09-02
EP1061111B1 (de) 2004-05-06
KR100583842B1 (ko) 2006-05-26
US6410444B1 (en) 2002-06-25
EP1061111A1 (de) 2000-12-20
ES2216490T3 (es) 2004-10-16
DE69917010T2 (de) 2005-04-07
JP3672493B2 (ja) 2005-07-20
DE69917010D1 (de) 2004-06-09
US6436835B1 (en) 2002-08-20

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