CN1774316A - 用于化学机械平面化的材料和方法 - Google Patents

用于化学机械平面化的材料和方法 Download PDF

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Publication number
CN1774316A
CN1774316A CNA2004800103002A CN200480010300A CN1774316A CN 1774316 A CN1774316 A CN 1774316A CN A2004800103002 A CNA2004800103002 A CN A2004800103002A CN 200480010300 A CN200480010300 A CN 200480010300A CN 1774316 A CN1774316 A CN 1774316A
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CN
China
Prior art keywords
major surface
polishing
substrate
semiconductor
abrasive particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2004800103002A
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English (en)
Chinese (zh)
Inventor
S·巴里耶帕利
D·J·奥尔德里奇
L·A·格里尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Global Technologies LLC
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Dow Global Technologies LLC
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Filing date
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Application filed by Dow Global Technologies LLC filed Critical Dow Global Technologies LLC
Publication of CN1774316A publication Critical patent/CN1774316A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
CNA2004800103002A 2003-02-24 2004-02-19 用于化学机械平面化的材料和方法 Pending CN1774316A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/370,781 2003-02-24
US10/370,781 US6910951B2 (en) 2003-02-24 2003-02-24 Materials and methods for chemical-mechanical planarization

Publications (1)

Publication Number Publication Date
CN1774316A true CN1774316A (zh) 2006-05-17

Family

ID=32868224

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2004800103002A Pending CN1774316A (zh) 2003-02-24 2004-02-19 用于化学机械平面化的材料和方法

Country Status (7)

Country Link
US (1) US6910951B2 (enExample)
EP (1) EP1599314A1 (enExample)
JP (1) JP2006518940A (enExample)
KR (1) KR20050107454A (enExample)
CN (1) CN1774316A (enExample)
TW (1) TWI316887B (enExample)
WO (1) WO2004076126A1 (enExample)

Cited By (7)

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CN103252710A (zh) * 2013-04-08 2013-08-21 清华大学 用于超硬材料的化学机械平坦化抛光垫及制备、抛光方法
CN103534790A (zh) * 2011-05-17 2014-01-22 二和钻石工业股份有限公司 Cmp垫调整器及用于制造cmp垫调整器的方法
CN109894930A (zh) * 2019-03-22 2019-06-18 湖南科技大学 一种缓释型柔性磨具及抛光方法
CN110774167A (zh) * 2018-07-26 2020-02-11 台湾积体电路制造股份有限公司 化学机械研磨垫的形成方法、化学机械研磨方法及其装置
CN113246016A (zh) * 2021-06-09 2021-08-13 广东工业大学 一种多层多功能cmp抛光垫及其制备方法和应用
WO2022133789A1 (en) * 2020-12-23 2022-06-30 Yangtze Memory Technologies Co., Ltd. Methods for polishing dielectric layer in forming semiconductor device
CN114686110A (zh) * 2020-12-30 2022-07-01 安集微电子科技（上海）股份有限公司 一种化学机械抛光液

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JP6091773B2 (ja) * 2012-06-11 2017-03-08 株式会社東芝 半導体装置の製造方法
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JP6088919B2 (ja) * 2013-06-28 2017-03-01 株式会社東芝 半導体装置の製造方法
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CN103534790A (zh) * 2011-05-17 2014-01-22 二和钻石工业股份有限公司 Cmp垫调整器及用于制造cmp垫调整器的方法
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CN103534790B (zh) * 2011-05-17 2016-07-06 二和钻石工业股份有限公司 Cmp垫调整器及用于制造cmp垫调整器的方法
CN103252710A (zh) * 2013-04-08 2013-08-21 清华大学 用于超硬材料的化学机械平坦化抛光垫及制备、抛光方法
CN103252710B (zh) * 2013-04-08 2016-04-20 清华大学 用于超硬材料的化学机械平坦化抛光垫及制备、抛光方法
CN110774167A (zh) * 2018-07-26 2020-02-11 台湾积体电路制造股份有限公司 化学机械研磨垫的形成方法、化学机械研磨方法及其装置
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