TWI293764B - Coated conductive particles, anisotropic conductive material and conductive connection structure - Google Patents

Coated conductive particles, anisotropic conductive material and conductive connection structure Download PDF

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Publication number
TWI293764B
TWI293764B TW093120189A TW93120189A TWI293764B TW I293764 B TWI293764 B TW I293764B TW 093120189 A TW093120189 A TW 093120189A TW 93120189 A TW93120189 A TW 93120189A TW I293764 B TWI293764 B TW I293764B
Authority
TW
Taiwan
Prior art keywords
particles
conductive
insulating
metal
coated
Prior art date
Application number
TW093120189A
Other languages
English (en)
Chinese (zh)
Other versions
TW200506971A (en
Inventor
Takeshi Wakiya
Shinya Uenoyama
Akihiko Tateno
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of TW200506971A publication Critical patent/TW200506971A/zh
Application granted granted Critical
Publication of TWI293764B publication Critical patent/TWI293764B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B17/00—Insulators or insulating bodies characterised by their form
    • H01B17/56—Insulating bodies
    • H01B17/62—Insulating-layers or insulating-films on metal bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B17/00—Insulators or insulating bodies characterised by their form
    • H01B17/56—Insulating bodies
    • H01B17/64—Insulating bodies with conductive admixtures, inserts or layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
TW093120189A 2003-07-07 2004-07-06 Coated conductive particles, anisotropic conductive material and conductive connection structure TWI293764B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003271540 2003-07-07
JP2003413653A JP4387175B2 (ja) 2003-07-07 2003-12-11 被覆導電性粒子、異方性導電材料及び導電接続構造体

Publications (2)

Publication Number Publication Date
TW200506971A TW200506971A (en) 2005-02-16
TWI293764B true TWI293764B (en) 2008-02-21

Family

ID=33566812

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093120189A TWI293764B (en) 2003-07-07 2004-07-06 Coated conductive particles, anisotropic conductive material and conductive connection structure

Country Status (4)

Country Link
JP (1) JP4387175B2 (ja)
KR (1) KR100766205B1 (ja)
TW (1) TWI293764B (ja)
WO (1) WO2005004172A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI394174B (zh) * 2011-02-23 2013-04-21 Sekisui Chemical Co Ltd Conductive particles, method for producing conductive particles, anisotropic conductive material, and connecting structure
TWI449768B (zh) * 2010-04-19 2014-08-21 Sumitomo Metal Mining Co Production method of conductive paste

Families Citing this family (47)

* Cited by examiner, † Cited by third party
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JP4563110B2 (ja) 2004-08-20 2010-10-13 積水化学工業株式会社 導電性微粒子の製造方法
JP2006269296A (ja) * 2005-03-24 2006-10-05 Sekisui Chem Co Ltd 突起粒子の製造方法、突起粒子、導電性突起粒子及び異方性導電材料
JP4532321B2 (ja) * 2005-03-30 2010-08-25 株式会社日立製作所 導電パターン形成装置
JP4936678B2 (ja) * 2005-04-21 2012-05-23 積水化学工業株式会社 導電性粒子及び異方性導電材料
JP2006331714A (ja) * 2005-05-24 2006-12-07 Sekisui Chem Co Ltd 導電性微粒子及び異方性導電材料
JP4589810B2 (ja) * 2005-06-07 2010-12-01 積水化学工業株式会社 導電性微粒子及び異方性導電材料
JP2006351464A (ja) * 2005-06-20 2006-12-28 Sekisui Chem Co Ltd 導電性粒子、導電性粒子の製造方法及び異方性導電材料
JP2007035574A (ja) * 2005-07-29 2007-02-08 Sekisui Chem Co Ltd 導電性微粒子、異方性導電材料、及び、接続構造体
JP4950451B2 (ja) * 2005-07-29 2012-06-13 積水化学工業株式会社 導電性微粒子、異方性導電材料、及び、接続構造体
KR100719807B1 (ko) 2005-12-30 2007-05-18 제일모직주식회사 절연 도전성 미립자 및 이를 이용한 이방 도전성 필름
JP2007207665A (ja) * 2006-02-03 2007-08-16 Sekisui Chem Co Ltd 導電性粒子の製造方法、導電性粒子及び異方性導電材料
WO2007099965A1 (ja) * 2006-02-27 2007-09-07 Hitachi Chemical Company, Ltd. 回路接続材料、これを用いた回路部材の接続構造及びその製造方法
KR100879450B1 (ko) * 2006-10-30 2009-01-20 이계영 전기 접속 장치
JP4897344B2 (ja) * 2006-04-28 2012-03-14 積水化学工業株式会社 導電性微粒子及び異方性導電材料
JP4780197B2 (ja) * 2006-10-17 2011-09-28 日立化成工業株式会社 被覆粒子及びその製造方法、並びに、被覆粒子を用いた異方導電性接着剤組成物及び異方導電性接着剤フィルム
JP5074082B2 (ja) * 2007-04-16 2012-11-14 ソニーケミカル＆インフォメーションデバイス株式会社 導電性粒子体及びこれを用いた異方性導電接続材料、並びに導電性粒子体の製造方法
KR101410108B1 (ko) * 2007-05-15 2014-06-25 히타치가세이가부시끼가이샤 회로 접속 재료 및 회로 부재의 접속 구조
JP5425636B2 (ja) * 2007-10-22 2014-02-26 日本化学工業株式会社 被覆導電性粉体およびそれを用いた導電性接着剤
WO2009078469A1 (ja) * 2007-12-18 2009-06-25 Hitachi Chemical Company, Ltd. 絶縁被覆導電粒子、異方導電接着フィルム及びそれらの製造方法
JP5626288B2 (ja) * 2008-02-05 2014-11-19 日立化成株式会社 導電粒子、異方導電性接着剤、接続構造体、及び接続構造体の製造方法
JP5151920B2 (ja) * 2008-02-05 2013-02-27 日立化成工業株式会社 導電粒子及び導電粒子の製造方法
JP5395482B2 (ja) * 2008-03-25 2014-01-22 積水化学工業株式会社 被覆導電性微粒子、異方性導電材料、及び、導電接続構造体
CN102047347B (zh) * 2008-07-01 2012-11-28 日立化成工业株式会社 电路连接材料和电路连接结构体
JP5368760B2 (ja) * 2008-09-29 2013-12-18 積水化学工業株式会社 絶縁被覆導電性粒子、異方性導電材料及び接続構造体
JP4758470B2 (ja) * 2008-12-18 2011-08-31 シャープ株式会社 突起電極の形成方法及び置換金めっき液
JP4877407B2 (ja) * 2009-07-01 2012-02-15 日立化成工業株式会社 被覆導電粒子及びその製造方法
JP5554077B2 (ja) * 2009-09-15 2014-07-23 株式会社日本触媒 絶縁性微粒子被覆導電性微粒子、異方性導電接着剤組成物、および異方性導電成形体
JP5534891B2 (ja) * 2010-03-26 2014-07-02 積水化学工業株式会社 導電性粒子、導電性粒子の製造方法、異方性導電材料及び接続構造体
JP2012003917A (ja) * 2010-06-16 2012-01-05 Sekisui Chem Co Ltd 導電性粒子、異方性導電材料及び接続構造体
JP5703149B2 (ja) * 2011-07-06 2015-04-15 積水化学工業株式会社 絶縁性粒子付き導電性粒子、異方性導電材料及び接続構造体
JP5803393B2 (ja) * 2011-08-02 2015-11-04 日立化成株式会社 絶縁被覆導電粒子及び異方導電性接着フィルム
JP5421982B2 (ja) * 2011-12-22 2014-02-19 積水化学工業株式会社 導電性微粒子、異方性導電材料、及び、接続構造体
JP5973257B2 (ja) * 2012-07-03 2016-08-23 日本化学工業株式会社 導電性粒子及びそれを含む導電性材料
KR102076066B1 (ko) 2012-07-03 2020-02-11 세키스이가가쿠 고교가부시키가이샤 절연성 입자 부착 도전성 입자, 도전 재료 및 접속 구조체
JP5939063B2 (ja) * 2012-07-11 2016-06-22 日立化成株式会社 絶縁被覆導電粒子及びそれを用いた異方導電性接着剤
KR101534841B1 (ko) * 2012-11-07 2015-07-07 제일모직주식회사 돌기형 도전성 미립자 및 이를 포함하는 이방 도전성 필름
JP6302336B2 (ja) * 2013-04-16 2018-03-28 積水化学工業株式会社 光硬化性導電材料用導電性粒子、光硬化性導電材料、接続構造体の製造方法及び接続構造体
JP2015110743A (ja) * 2013-10-28 2015-06-18 積水化学工業株式会社 有機無機ハイブリッド粒子の製造方法、導電性粒子、導電材料及び接続構造体
JP6450154B2 (ja) * 2013-11-12 2019-01-09 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6577723B2 (ja) * 2014-03-10 2019-09-18 積水化学工業株式会社 絶縁性粒子付き導電性粒子、導電材料及び接続構造体
JP6431411B2 (ja) * 2014-03-10 2018-11-28 積水化学工業株式会社 絶縁性粒子付き導電性粒子、導電材料及び接続構造体
JP6592235B2 (ja) * 2014-10-02 2019-10-16 積水化学工業株式会社 絶縁性粒子付き導電性粒子、絶縁性粒子付き導電性粒子の製造方法、導電材料及び接続構造体
JP2017111883A (ja) * 2015-12-14 2017-06-22 日立金属株式会社 圧着端子および端子付き電線
JP7028641B2 (ja) * 2016-05-19 2022-03-02 積水化学工業株式会社 導電材料及び接続構造体
WO2017222010A1 (ja) * 2016-06-22 2017-12-28 積水化学工業株式会社 接続構造体、金属原子含有粒子及び接合用組成物
US10964441B2 (en) 2016-12-21 2021-03-30 3M Innovative Properties Company Conductive particles, articles, and methods
JP7328856B2 (ja) * 2019-09-26 2023-08-17 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI449768B (zh) * 2010-04-19 2014-08-21 Sumitomo Metal Mining Co Production method of conductive paste
TWI394174B (zh) * 2011-02-23 2013-04-21 Sekisui Chemical Co Ltd Conductive particles, method for producing conductive particles, anisotropic conductive material, and connecting structure

Also Published As

Publication number Publication date
WO2005004172A1 (ja) 2005-01-13
JP2005044773A (ja) 2005-02-17
TW200506971A (en) 2005-02-16
JP4387175B2 (ja) 2009-12-16
KR100766205B1 (ko) 2007-10-10
KR20060052782A (ko) 2006-05-19

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