TW200948881A - Polymer particle, conductive particle, anisotropic conductive material, and connection structure - Google Patents

Abstract

Disclosed are polymer particles which can improve electrical conduction reliability when connection object members are electrically connected with each other by conductive particles obtained by forming a metal layer on the surfaces of the polymer particles or an anisotropic conductive material containing the conductive particles. Conductive particles using the polymer particles are also disclosed. Specifically, a polymer particle is obtained by polymerizing a monomer which is an alicyclic compound having at least two ring structures. A conductive particle (5) comprises the polymer particle and a metal layer coated over the surface of the polymer particle.

Description

200948881 VI. Description of the Invention: [Technical Field] The present invention relates to a polymer particle formed by polymerization of a monomer, for example, which can be used for conducting conductive particles between electrodes of a connecting member. Polymer particles, and conductive particle anisotropic conductive materials and bonded structures using the polymer particles. • [Prior Art] 异 Anisotropic conductive materials such as anisotropic conductive pastes, anisotropic conductive inks, anisotropic conductive adhesives, anisotropic conductive films, or anisotropic conductive sheets are widely known. The anisotropic conductive materials are in the paste, ink or resin with a conductive particle +. The anisotropic electrical material is used, for example, to electrically connect electrodes between substrates such as a glass substrate or a printed substrate. As an example of the conductive particles used in the above anisotropic conductive material, conductive particles having a substrate particle and a conductive layer formed on the surface of the substrate particle are disclosed in the following Patent Document. In order to form a substrate granule, a divinyl benzene-ethylethylene mixture is used as a part of the monomer. The group of conductive particles has a compressive elastic modulus at a particle diameter displacement of 丨〇% of 2.5 Xl 〇 9 N/m 2 or less, a compression deformation recovery ratio of 30% or more, and a crack and strain of 30% or more. In the case where the electrodes of the substrate are electrically connected by using the conductive particles described above, the connection resistance value is lowered, and the connection reliability is improved. [Invention] Solution to Problem] Previously, a printed circuit board was used on a surface of a polyimide film to bond a three-layer flexible printed circuit board of (4) via an epoxy 139450.doc 200948881. In recent years, with the miniaturization of electronic equipment, a method of thinning a flexible printed circuit board provided with an electrode has been studied. For example, a two-layer flexible printed circuit board on which an electrode is directly provided on a polyimide film is used. When the two-layer flexible printed circuit board is connected to the electrode of the glass substrate by using the anisotropic conductive material containing the conductive particles disclosed in the patent document, the connection resistance between the electrodes is increased. In the previous three-layer flexible printed circuit board, the anisotropic conductive material was bonded to the epoxy adhesive, and the adhesion of the anisotropic conductive material was relatively poor. Then, in the two-layer printable printed circuit board, the anisotropic conductive material is directly bonded to the polyimide film, and the adhesion of the anisotropic conductive material is likely to be low. Further, when the two layers of the flexible printed circuit board and the electrodes of the glass substrate are connected by the conductive particles disclosed in Patent Document 1, there is a case where the deformation of the conductive particles is high but the deformation recovery rate is high. Therefore, the anisotropic conductive material is peeled off due to the repulsive force of the conductive particles. Therefore, there is a case where the connection resistance value between the electrodes cannot be sufficiently reduced. Further, when the two-layer flexible printed circuit board is connected to the electrodes of the glass substrate, the anisotropic conductive material is placed on the substrate, and the other substrates are superposed on the substrate so that the electrodes face each other. Then, the conductive particles are compressed by pressurization to connect the electrodes. In the electrode which is in contact with the conductive particles disclosed in Patent Document 1, the indentation generated by the application of pressure at the time of the pressurization is not sufficiently formed. Further, there is a case where a void is formed around the conductive particles. Therefore, there is a case where there is a conduction between the two layers of the flexible printed circuit board and the electrodes of the glass substrate. 139450.doc 200948881 The electrical reliability is low. An object of the present invention is to provide a conductive material of a polymerized particle, m, a conductive material and a bonded structure, and a coated structure; the snow particles are coated with a conductive layer having a metal layer on the surface or each of the conductive particles. The anisotropic conductivity is connected to h W * and (1) is electrically conductive (four), and when the connection member is electrically connected, the conductivity reliability can be improved.限 The purpose of the reference is to provide the following polymer particles, and the conductive particles of the particles, the anisotropic conductive material and the connection structure. The polymer particles are formed with a metal layer on the surface to make the two layers flexible. When the printed substrate is electrically connected to the electrodes of the printed substrate and the glass substrate, the connection resistance between the electrodes can be reduced, and the conductive particles can form an indentation on the electrode to be contacted. Further, another limited object of the present invention is to provide a polymer particle 1 and a conductive particle of the (four) polymer particle, an anisotropic conductive material 4, and a connection structure, wherein the polymer particle has a low melting point on the surface of use. When the conductive particles of the metal layer are electrically connected to the connection member, even if they are impacted by dropping or the like, it is difficult to cause cracks in the low-melting-point metal layer. [Technical means for solving the problem] According to a broader aspect of the present invention, polymer particles obtained by polymerizing a monomer having a cyclic oxime cyclic compound having at least a coating and a mouth structure are provided. In a particular aspect of the polymer particles of Benming, the at least two ring structures are bicyclic or tricyclic. 139450.doc 200948881 In other specific aspects of the polymer particles of the present invention, the above monomer is an acrylic monomer. The compression recovery ratio in the other specific aspects of the polymer particles of the present invention is 50% or less, and the compression elastic modulus at the time of compression of 10% is in the range of 98 Å to 7.9 Å N/mm 2 . Further, in other specific aspects of the polymer particles of the present invention, the recovery rate is from 1 〇 to 50%. The polymer particles of the invention are preferably obtained by polymerizing a monofunctional monomer having at least one constitutive alicyclic compound with a polyfunctional monomer, preferably by having the inclusion as having at least 2 ring-shaped alicyclic compound monofunctional monomer 2G to 9G% by weight and polyfunctional monomer Μ·weight °/. The monomer component is obtained by polymerization. Further, the polymer particles of the present invention are also preferably obtained by polymerizing a polyfunctional monomer which is an alicyclic compound having a ring structure to a knife. In this case, it is preferred to obtain a monopolymer obtained by including a polyfunctional monomer 2 (% by weight or more) as an alicyclic compound having at least two ring structures. Further, the polymer particles of the present invention are also preferably obtained by using a monofunctional monomer as an alicyclic compound having a ring structure of v 2 and a polyfunctional compound as an alicyclic compound having at least two ring structures. The monomer particles of the present invention have the polymer particles composed of the present invention and the metal layer covering the surface of the polymer particles. In the special sadness of the thundering puller of the present invention, the compression recovery rate is 139450.doc 200948881 45% or less. In another specific g sample of the electroconductive particle of the present invention, the outer surface of the metal layer is a metal layer containing nickel, a metal layer containing palladium or a metal layer containing a low melting point metal. The anisotropic conductive material of the present invention comprises conductive particles and a binder resin. The connection structure of the present invention includes an i-th connection target member, a second connection pair ❹ 冓 yak, and conductive particles configured by connecting the first and second connection target members according to the present invention. Further, the connection structure according to the present invention includes a connection target member, a first connection target member, and a connection portion that connects the second and second connection target members, and the connection portion is anisotropic according to the present invention. A conductive material is formed. [Effects of the Invention] According to the present invention, by polymerizing a monomer which is an alicyclic compound having at least two ring structures to obtain polymer particles, conductivity of a metal layer formed on the surface of the poly-person particles is utilized. The particles or the anisotropic conductive material containing the conductive (tetra) can improve the electrical conductivity reliability when the material is electrically connected to the object member. When the conductive substrate of the polymer particles of the present invention is used to connect the printed circuit board to the electrodes of the glass substrate, the connection resistance between the electrodes is lowered. Further, Rongxian 易于 is easy to print the electrode of the substrate or the glass substrate = the indentation formed by the contact of the conductive particles on the electrode. Therefore, it is possible to improve the electrical conductivity between the printed substrate and the electrode of the glass substrate. In particular, in the case where the printed substrate is a two-layer flexible printed circuit board, the conduction reliability between the electrodes can be improved. Further, when the conductive particles having the low-melting-point metal layer formed on the surface of the polymer particles of the present invention are used to electrically connect the connection member, it is difficult to form a low-melting metal layer even if the impact is dropped. Cracks appear on it. [Embodiment] Hereinafter, the present invention will be described in detail. (Polymer particles) The polymer particles of the present invention are obtained by polymerizing a monomer which is an alicyclic compound having at least two ring structures. The above alicyclic compound having at least two ring structures is preferably a polycyclic compound. Examples of the at least two ring structures include a bicyclic structure, a tricyclic structure, a spiro% structure, and a two-spiro ring structure. Among them, the above at least two ring structures are preferably an anthracene bicyclic structure or a tricyclic structure. If at least two of the above ring structures are bicyclic or tricyclic, then the reduction of the compression recovery of the polymer particles is reduced. Therefore, even if an anisotropic conductive material containing conductive particles using the polymer particles is used, a printed circuit board such as a two-layer flexible printed circuit board is connected to an electrode of a glass substrate, and the repulsive force of the conductive particles is also caused. The anisotropic conductive material becomes difficult to peel off. Further, an indentation is likely to be formed on the electrode that the conductive particles are in contact with. Furthermore, the indentation formed on the electrodes is electrically conductive! A concave portion of an electrode formed by extruding an electrode. Since the conductive particles are generally spherical, the concave portion of the electrode is generally hemispherical. It has become difficult to guide. 139450.doc 200948881 Electricity creates a gap around the particles. Further, the voids are caused by peeling of the interface from the connection member such as the substrate or the electrode by the adhesive layer or the like. Better 疋 does not create the above gap. However, the above voids can also be produced to the extent that the electrical reliability is not affected. The above soap body is not particularly limited as long as it is an alicyclic compound having at least two ring structures. Examples of the monomer include an acrylic acid monomer, an ethylene compound, an epoxy compound, and an isocyanate compound. Among them, an acrylic monomer is preferred because the compression recovery ratio of the above polymer particles can be lowered. Specific examples of the acrylic monomer include dihydroxyindenyl tricyclodecane di(meth)acrylate, adamantanediol di(meth)acrylate, and isobutyl (meth)acrylate; Methyl)dicyclopentene vinegar, dicyclopentanyl (meth)acrylate, 2-methyl-2-amantane vinegar (meth)acrylate, 2-ethyl-2·adamantane (meth)acrylate Ester or (mercapto)acrylic acid 3-hydroxy-^adamantyl ester and the like. Further, the term "(meth)acrylate" means methacrylate or acrylate. Specific examples of the vinyl ether compound include tricyclodecane vinyl ether or tricyclodecane monomethyl vinyl ether. In the present invention, a monomer other than the monomer may be used as a monomer component together with the monomer having at least two ring structure alicyclic compounds. The content of the monomer which is an alicyclic compound having at least two ring structures is preferably 5% by weight or more, and more preferably 20% by weight or more, based on 100% by weight of the monomer component. Examples of the other monomer include styrene, divinylbenzene, and the like. Further, examples of the other monomer include: 139450.doc 200948881 polybutylene di(meth)acrylate, trimethylolpropane tris(decyl)acrylate, tetramethylol methane tris(fluorenyl) Acrylate, pentaerythritol tri(decyl) acrylate, dipentaerythritol hexa(meth) acrylate, decyl decyl acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, (methyl) 2-ethylhexyl acrylate, ethylene glycol (meth) acrylate vinegar, trifluoroethyl (meth) acrylate, pentafluoro propyl (meth) acrylate or (meth) acrylate Ester and the like. In the case of using a single-functional acrylic monomer as an alicyclic compound having at least two ring structures, it is 100 parts by weight based on the monomer component. In the oxime, the content of the monofunctional acrylic monomer is preferably in the range of 4 〇 to 6 〇 by weight 0 / 。. As the monofunctional acrylic monomer, it is suitable to use: (fluorenyl) isodecyl acrylate, dicyclopentenyl (meth)acrylate, monocyclopentanyl (meth) acrylate, 2-methyl (meth) acrylate Base-2-adamantate, 2-ethyl 2 -adamantyl (meth)acrylate or 3-hydroxy-indole-adamantyl (meth)acrylate. When a difunctional acrylic monomer as an alicyclic compound having at least two ring structures is used, the content of the difunctional acrylic monomer is preferably 1% by weight of the monomer component. It is within 2〇~8〇% by weight. As the difunctional acrylic monomer, di-methyl-tricyclodecane bis(indenyl) acrylate or 1,3-adamantanediol di(meth)acrylic acid vinegar is suitably used. The polymer particles of the present invention are preferably polymerized by reacting a monofunctional monomer (hereinafter sometimes referred to as "monic acid monomer A") as an alicyclic compound having at least a fine structure. The monomer component preferably contains the above-mentioned monofunctional monomer A and a polyfunctional monomer. Examples of the above-mentioned multi-139450.doc 200948881 functional monomer include aromatic compounds or polyfunctional groups having at least two vinyl groups. Examples of the aromatic compound include 1,2-divinylbenzene, iota, 3-divinylbenzene, iota, 4-divinylbenzene, etc. As the aromatic compound, a new one is commercially available. Manufactured by Nippon Steel Chemical Co., Ltd. "DVB960". The polyfunctional acrylic monomer preferably has a _(RO)n-unit, and examples thereof include polybutylene glycol di(meth)acrylate, trishydroxypropylpropane tris(decyl)acrylate, and four. Methylol tris(meth)propionate, pentaerythritol tris(decyl) acrylate, pentaerythritol tetra(meth) acrylate, triethylene glycol bis(indenyl) acrylate or dipentaerythritol hexa Methyl) acrylate or the like. Further, the above-mentioned Chinese carbon number is an alkylene group of 丨~9, and η is an integer of 1 or more. When the above monofunctional monomer oxime is polymerized with a polyfunctional monomer, the 〇% κ value can be made higher than in the case where only the above-mentioned monofunctional monomer A is polymerized, so that 1% K can be obtained. The value is controlled within a preferred range and the compression recovery rate can be improved. Namely, by using a polyfunctional monomer as a crosslinking agent together with the above monofunctional fluorene monomer A, it is possible to control 10 ° /. K value and compression recovery rate. The monomer component preferably contains the above-mentioned monofunctional monomer 8%, weight %, and polyfunctional monomer 1G to the amount of sacrificial %. In this case, it is possible to easily obtain polymer particles having a value of -1 〇% K and a compression recovery ratio showing a preferred value. The above monomer component preferably contains the above-mentioned monofunctional monomer Α2 (four)% by weight, and the polyfunctional monomer is 20 to 80% by weight, more a a a a

Preferably, the fluorene comprises 40 to 60% by weight of the above monofunctional monomer A and 40 to 60% by weight of the polyfunctional monomer. The polymer particles of the present invention are more precisely composed of polyfunctional monoterpenoids having an alicyclic compound having at least two ring structures (hereinafter, sometimes abbreviated as a plurality of 139450.doc -11 - 200948881 Can be the monomer B). In the monomer component (4), even if the polyfunctional monomer B is polymerized, the 1% κ value can be made higher, and the 1 (% κ value) can be controlled to be preferable. The range and the compression recovery rate can be made larger. In #, other monomers may also be used together with the above-mentioned polyfunctional monomer.

The monomer component preferably contains 20% by weight or more of the above polyfunctional monomer. When the content of the polyfunctional monomer k is 20% by weight or more, the polymer particles are not too soft, and the (IV) K value can be increased to control the ίο% κ value to a preferred range. Further, when the polyfunctional monomer β is used in combination with an acrylic monomer such as polybutylene glycol di(meth)acrylic acid vinegar having two functional groups, the 1 G% K value can be controlled. In the preferred range. Further, in the case where the monomer monocyclic aromatic ring and the ethylene-based monomer having at least two functional groups such as dilute benzene are used in combination, the i 〇 % K value and the compression recovery ratio can be improved. The above monomer component is 100% by weight. The lower limit of the above polyfunctional 〇 3 is 20% by weight, and the upper limit is 80% by weight.

The % upper limit is 6% by weight. The content of the above-mentioned monomer component (10) may be 1% by weight based on the weight of the polyfunctional monomer. Further, the other monomer used in combination with the above monomer may be a monofunctional monomer A which is a cyclic compound of a ruthenium having a to-two-coating structure. By using the above-mentioned monomer B and the above-mentioned polyfunctional monomer B in combination, the (4) K value and the shrinkage recovery ratio can be controlled to a preferred range. The polymerization method is not particularly limited. Specific examples of the polymerization method include a previously known polymerization method such as a heart floating polymerization method, a pore polymerization method, a seed polymerization method or a dispersion polymerization method. 139450.doc •12- 200948881 Due to the wide particle size distribution, the suspension polymerization method and the emulsion polymerization method can be used to manufacture; = particles, so the purpose of the above is ^^. The purpose of the fine particles of the particle size of the mouth is better. When suspension polymerization is used, it is preferred to obtain hydrazine by polymerization. In the case of the law, the particles of the agglomerate are classified, and the polymer particles having the desired particle size or particle size distribution are selected.

Further, since it is not necessary to carry out classification, monodisperse polymer particles can be obtained, so the seed polymerization method is preferable for the purpose of mass-producing polymer particles having a mesh size. The seed polymerization method is a method in which seed particles of styrene polymer particles t are swelled and polymerized by using a monomer which is an alicyclic compound having at least a 2: ring structure. The polymer particles of the present invention may also contain components of the filament particles in the case where the polymer particles of the present invention are produced by the use of seeds. For example, when styrene agglomerate particles are used as the seed particles, there is a case where S has the present ethylene polymer in the obtained polymer particles. The above-mentioned poly-σ, the granule is not particularly limited. The solvent can be selected according to the above-mentioned single body forming knife. Examples of the solvent include water, alcohol, granules, ketones, and acetates. Other solvents than those solvents may also be used. Specific examples of the above alcohols include, for example, a#, ethanol or propanol. Specific examples of the cellosolve include methyl cellosolve or ethyl cellosolve. Specific examples of the ketone include acetone, methyl ethyl ketone, mercaptobutyl ketone or 2-butanone. Specific examples of the above acetates include ethyl acetate and butyl acetate. Specific examples of the other solvent include acetonitrile, N,N-dimethylguanamine or dimercaptosulfoxide. These solvents may be used alone or in combination of two or more. 139450.doc -13- 200948881 The average particle size of the polymer particles is preferably in the range of 0^000 μm. The lower limit of the average particle diameter of the polymer particles is 丨μιη, and preferably the lower limit is 1.5 μηη, and particularly preferably, the lower limit is 2. The upper limit of the average particle diameter of the polymer particles is 5 〇〇 pm, and the upper limit is preferably 3 〇〇, and particularly preferably, the upper limit is 30 μηι. When the average particle diameter is too small, the contact area between the conductive particles and the electrode becomes small, so that the connection resistance value becomes high. Further, when a metal layer is formed on the surface of the polymer particles by electroless plating, aggregation tends to occur, and aggregated conductive particles are easily formed. When the average particle diameter is too large, the conductive particles are less likely to be sufficiently compressed, and thus the connection resistance value between the electrodes is increased. The above average particle diameter represents a number average particle diameter. The average particle diameter can be measured, for example, using a Coulter counter (manufactured by Beckman Co., Ltd.). The cv value (coefficient of variation of the particle size distribution) of the agglomerate particles is preferably the following, more preferably 3% or less. When the scv value exceeds 1%, there is a case where the interval between the electrodes connected by the conductive particles is uneven. The above CV value is represented by the following formula. CV value (%) = (p / Dn) xlo 〇 P : standard deviation of the diameter of the polymer particles

Dn: The average recovery of the average particle size of the polymer particles is preferably less than 5% by weight, and the better compression recovery rate of the lower peach 1 is superior, and there is an anisotropic conduction due to the repulsive force of the electrode-conducting particles. Material from base: 1 case. As a result, there is a case where the connection resistance value between the electrodes is changed to 139450.doc 200948881. The compression recovery ratio of the polymer particles is preferably 5% or more, more preferably 10% or more, and still more preferably 20% or more. The above compression recovery rate can be measured as follows. Polymer particles are dispersed on the sample stage. For the dispersed polymer particles, a small compression tester was used to apply a load in the center of the polymer particles until the reverse load value (5.00 mN) was reached. Thereafter, the negative load is released until the origin load value (0.40 mN) is reached. The load-compression displacement during this period was measured, and the compression recovery ratio was obtained by the following formula. Furthermore, ❹ set the load speed to 0.33 mN/sec. For the above-mentioned micro compression tester, for example, "Fischerscope H-100" manufactured by Fischer Co., Ltd. or the like can be used. Compression recovery rate χ 100 : Compression displacement from the origin load value to the reverse load value when the load is applied L2 : Compression displacement from the reverse load value to the origin load value when the load is released

The compressive elastic modulus (10% K value) when the diameter of the polymer particles is 10% is preferably in the range of 196 to 6,860 N/mm 2 . The lower limit of 10% K is 980 N/mm2, and the upper limit is 4,900 N/mm2. The compressive elastic modulus (20% K value) at a 20% displacement of the polymer particles is preferably in the range of 196-6,860 N/mm2. The lower limit of the 20% K value is 600 N/mm2, and the lower limit is 980 N/mm2, and the upper limit is 4,900 N/mm2, and the upper limit is 3,900 N/mm2. The diameter of the polymer particles is shifted by 30°/. The compressive elastic modulus (30% K value) is preferably in the range of 196 to 6,860 N/mm2. The lower limit of the 30% K value is 600 N/mm2, and the lower limit is 980 N/mm2, and the upper limit is 4,900 N/mm2. If the compression modulus (10% K value, 20% K value, and 30% K value) is too low, the polymer particles are destroyed when compressed. If the compressive elastic modulus (10% K value, 20% K value, and 30% K value) is too high, the connection resistance between the electrodes becomes high. The above compression elastic modulus (10% K value, 20% K value, and 30% K value) can be measured as follows. Using a micro-compression tester's smooth end face of a diamond cylinder with a diameter of 5 μμηη, at a compression speed of 26 mN/s and a maximum test load of 10 g, 'polymer particles compression. The load value (N) and the compression displacement (mm) at this time were measured. The above-described compressive elastic modulus can be obtained from the obtained measured value by the following formula. For the above-mentioned micro compression tester, for example, rFischersc〇peH1® manufactured by Fischer Co., Ltd. or the like can be used. K value (N/mm2)=(3/21/2).F·S.3/2.R-1/2 F. Load of polymer particles under compression deformation 丨〇%, 2〇% or 3〇% Value (N) s. Compressive displacement 聚合物 (mm) when the polymer particles are compressed and deformed by 10%, 2〇% or 3〇% R: radius of the polymer particles The above-mentioned compressive elastic modulus generally and quantitatively indicates the polymer particles Hard degree. By using the above-described compression elastic modulus, the hardness of the polymer particles can be quantitatively and uniquely expressed. (Electrically conductive particles) The electroconductive particles of the present invention have the above polymer particles and a metal layer covering the surface of the particles of the polymer 139450.doc • 16-200948881. The metal constituting the above metal layer is not particularly limited. Examples of the metal include gold, silver, copper, platinum, rhodium, iron, lead, tin, aluminum, cobalt, indium, nickel, chromium, titanium, ruthenium, osmium, iridium, cadmium, palladium, tin, lead alloy, Tin _ = gold, tin · silver alloy or tin I silver alloy. Among them, the metal constituting the above gold layer is preferably nickel, copper, palladium or gold. The method of forming the above metal layer on the surface of the polymer particles is not particularly limited: The method for forming the above metal layer may, for example, be a method of electrolessly intercalating a metal: or a mineral. Among them, the method of forming the surface of the polymer particles is preferably a method of forming by electroless plating. The outer surface of the above metal layer of the orthoparticle is preferably a gold layer or a recording layer: a bell, preferably a layer or a layer. Further, the above metal layer is preferably: preferably::: formed on the surface of the recording layer. By forming the genus layer, the inter-electrode resistance value connected by the conductive particles becomes low. In addition, when the surface of the metal layer is a nickel layer or a palladium layer, the surface of the metal layer is in contact with the electrode, and the oxide covering the electrode is easily removed. Therefore, the outer surface of the metal layer and the metal of the electrode surface are easily contacted, and the connection resistance value becomes low. The outer surface of the metal layer is also preferably a metal layer containing nickel, a metal layer containing '' or a metal $ containing a low melting point metal. Outside the metal layer: in the case of a metal layer containing nickel or a metal layer containing palladium, the oxide of the metal covering the surface of the electrode can be easily removed, and the outer surface of the metal layer and the metal of the surface become easy. Contact, so the connection resistance value becomes low. When the outer surface of the gold layer is a metal layer containing a low melting point metal, the metal layer and the electrode containing the low melting point metal are reflowed by 139450.doc •17·200948881 When the surface contact is not in contact with the point contact, the connection resistance value is lowered. Further, when the conductive particles having a low-spot metal layer are formed on the surface of the polymer particle and the connection target member is electrically connected, even It is also difficult to cause cracks in the low-melting-point metal layer by the impact of falling, etc. The metal layer may be a single layer or a laminated structure of two or more layers. When the metal layer has a two-layered structure, The metal layer, the inner layer/outer layer may be a nickel layer/gold layer, a recording layer & layer, or a (four)/low (four) metal layer. As the low melting point metal layer, that is, a metal layer containing a low melting point metal, a metal layer comprising tin, comprising a metal layer of tin and silver, a metal layer comprising tin and copper, a metal layer comprising tin, silver and copper, or a tin, silver and a recorded metal layer, etc. The so-called low melting point metal, It is a metal having a melting point of less than c. Further, in the metal amount % contained in the metal layer containing the low-refining metal, the content of tin is preferably 5% by weight or more, more preferably 70%. It is more than 5% by weight, and more preferably 9% by weight or more. (4) When the outer surface of the metal layer of the sub-surface is a low-melting-point metal layer, the stress applied to the conductive particles can be relaxed, so that it can be easily connected. Between the electrodes, when the conductive particles having a low melting point metal layer are formed on the surface of the metal layer of the conductive particles of the polymer particles of the present invention, and the connection member is electrically connected, even if it is dropped, etc. It is difficult to generate cracks on the low-melting-point metal layer by impact. Therefore, the reliability of the conductive layer can be improved. 139450.doc 200948881 The thickness of the above metal layer is preferably in the range of 5 to 7 〇, 〇〇〇 nm. Thickness of the above metal layer The lower limit of the better is 1 〇 nm, and the lower limit is preferably 2 〇 nm, and the upper limit is preferably 4 〇, 〇〇〇 nm, and the upper limit is 5 〇〇 nm, and the upper limit is 200 nm. If the thickness of the metal layer is too thin, there is a case where the conductivity cannot be obtained. If the thickness of the metal layer is too thick, the difference in thermal expansion coefficient between the polymer particles and the metal layer becomes large, and the metal layer becomes large. The case where the glutinous rice is peeled off from the polymer particles.

In the case of a laminate structure, the thickness of the above metal layer indicates the total thickness of each metal layer. The compression recovery ratio of the conductive particles is preferably 5% or less, preferably 45 Å/Å or less, more preferably 40% or less. When the compression recovery ratio is exceeded, there is a case where the anisotropic conductive material is peeled off from the substrate or the like due to the repulsive force of the conductive particles used for the connection between the electrodes. As a result, there is a case where the connection resistance value between the electrodes becomes high. When the compression recovery ratio of the conductive particles is 45% or less, the connection resistance value between the electrodes can be further reduced. The compression recovery ratio of the conductive particles is preferably 5% to 1, more preferably ι% or more and further preferably 20% or more. (Anisotropic Conductive Material) The anisotropic conductive material of the present invention comprises a chargeable electric particle and a binder resin. The above binder resin is not particularly limited. For example, an insulating resin is used as the above binder resin. The binder resin may, for example, be a vinyl resin, a thermoplastic resin, a curable resin, a thermoplastic block or an elastomer. The above-mentioned binder resin can be used only in the form of 'I39450.doc 200948881 ❹. Specific examples of the vinyl resin include a vinyl acetate resin, an acrylic resin, and a styrene resin. Specific examples of the thermoplastic resin include polyolefin resin, ethylene-vinyl acetate copolymer, and polyamine resin. Specific examples of the curable resin include a % oxygen resin, an amine ester resin, a polyimide resin, or an unsaturated polyester resin. Further, the curable resin may be a room temperature curing resin, a thermosetting resin, a photocurable resin or a moisture curing resin. The above curable resin can be combined with a hardener (4). Specific examples of the above thermoplastic block copolymers include styrene-butadiene-styrene block copolymer, styrene-isoprene-styrene block copolymer, and styrene-butadiene. a hydride of a styrene block copolymer or a hydride of a styrene-isopentadiene-styrene block copolymer or the like. Specific examples of the above elastomer include a styrene-butadiene copolymer rubber or an acrylonitrile-styrene block copolymer rubber. ❹ Anisotropic conductive materials In addition to conductive particles and binder resins, examples of the mouth may also contain fillers, extenders, softeners, plasticizers, polymeric touches, hardening catalysts, colorants, antioxidants, Heat stabilizer, light stabilizer. Various additions such as an agent, an antistatic agent, or a flame retardant The conductive particles are dispersed in the above-mentioned binder resin. The conventionally known dispersion method is not particularly limited. The method of dispersing the electroconductive particle in the resin can be, for example, a method in which conductive particles are added to the binder resin, and then dispersed by a carrier such as a planetary mixer; a homogenizer or the like is used; The ordering and kneading is dispersed in water or an organic solvent, and the 14 particles are evenly added and then added to the silky _ riding, and the 130050.doc •20·200948881 planetary mixer is used to push t and n into the kneading and dispersing it. Method; a method in which a resin is diluted with water or a broadcast, and a conductive particle, a star, a star mixer, or the like is mixed and dispersed. The anisotropic conductive material of the present invention is a conductive oil black η anisotropic conductive paste, an anisotropic conductive sheet or the like. In the case where the conductive property of the present invention is included: a conductive film or an anisotropic material is used as an anisotropic conductive material of an anisotropic conductive y, and a film-like adhesive such as an anisotropic conductive sheet is also used. Alternatively, a film-like adhesive containing no conductive particles may be laminated on the film-like adhesive containing the conductive film of the 暮雷丨. 3 (connection structure) Viscosity: =: The conductive particles of the present invention or the conductive particles are used to form a bonded structure. It is preferable to connect the connection target member and obtain the connection, preferably including the first connection target member, the second connection: the target member, and the connection that electrically connects the first and second connection target members, and the connection portion is the present invention The conductive particles or the anisotropic conductive material comprising the conductive 2:-substrate and the binder resin. In the case of an achievable particle, the connecting portion itself is a conductive particle. That is, the second connection target member is connected by conductive particles. = Connection: The specific components of the device include semiconductor chips, capacitors, and electronic components for the monolithic body, and circuit boards such as a glass substrate. The tenth printed circuit board and the electrode provided on the connection target member include a metal electrode such as a pole, a recording electrode, a tin electrode, an electrode, a copper electrode, or a pole or a crane electrode of 139450.doc -21 . 200948881. When the connection target member is a flexible printed circuit board, the electrode is preferably a gold electrode, a nickel electrode, a tin electrode or a copper electrode. When the connection target member is a glass substrate, the electrode is preferably An aluminum electrode, a copper electrode, a molybdenum electrode or a tungsten electrode. Further, when the electrode is an aluminum electrode, the electrode may be an electrode formed only of aluminum, or may be an electrode having an aluminum layer on a surface layer of the metal oxide layer. Examples of the metal oxide include indium oxide doped with a trivalent metal element or zinc oxide doped with a trivalent metal element. Examples of the trivalent metal element include Sn, A1, Ga, and the like. The conductive particles of the invention or the anisotropic conductive material containing the conductive particles and the binder resin are electrically connected to the connection target member on which the metal electrode is formed, The connection resistance value is low. Among them, an aluminum electrode or a copper electrode is preferred. Fig. 1 is a front cross-sectional view schematically showing an example of a connection structure using conductive particles according to an embodiment of the present invention. The one or more connected structures have a structure in which the printed circuit board 4 is connected to the upper surface of the glass substrate 2 via the anisotropic conductive film 3 including a plurality of conductive particles 5. A plurality of electrodes are provided on the upper surface of the glass substrate 2. h. A plurality of electrode electrodes are provided on the lower surface of the printed circuit board 4. The electrode 2a and the electrode layer are connected by a plurality of conductive particles 5. In the present embodiment, a two-layer flexible printed circuit board is used as the printed circuit board 4. Further, a connection member other than the two-layer flexible printed circuit board may be used. Further, in the drawing, the printed circuit board 4 and the conductive particles 5 are schematically shown. The connection between the electrodes 2a to 4a is usually due to the glass. After the conductive particles 5 are placed on the electrodes 2a 139450.doc • 22-200948881 of the substrate 2, the printed boards 4 are superposed on the glass substrate 2 with the electrodes 2a and 4 facing each other, and M is performed by adding M. The conductive particles 5 are compressed by pressurization. However, as described in the above-mentioned Patent Document 1, the conductive particles formed on the surface of the sub-surface with a metal layer have a high compression recovery rate. As shown in Fig. 3, when the electrodes are connected to each other using the conductive particles 101, it is easy to restore the shape of the conductive particles 〇1 and the electrodes h and the blunt circumference φ by the compressed conductive particles ιοί. Further, voids A are generated. Further, it is difficult to form a sharp mark in the portion where the electrode 2a and the crucible are in contact with the conductive particles 1〇1. Therefore, the connection resistance between the electrodes 2a and 43 cannot be sufficiently reduced. In the case where the conductive particles 5 of the present embodiment are used in the case where the conductive particles of the connection structure shown in the figure are enlarged, the electrode 2&, the electrode and the conductive particle 5 are used. The contact portion is likely to form an indentation. Therefore, the connection resistance value of the electrode 2a and the intercardiac can be sufficiently reduced. Further, it is difficult to generate the above-described voids A. Hereinafter, the present invention will be specifically described by way of examples and comparative examples. The invention is not limited to the following examples. The following materials were prepared as a monomer component for obtaining polymer particles. (as a monomer having an alicyclic compound having at least two ring structures) dimethyl-tricyclodecane diacrylate i,3-adamantane diacrylate, isodecyl methacrylate, methyl acrylate袼ester 139450.doc •23· 200948881 dicyclopentenyl acrylate dicyclopentanyl acrylate tricyclic oxime acesulfame tricyclodecane monodecyl vinyl ether (single compound having at least 2 ring structures of alicyclic compounds) Other monomers other than the body) Divinylbenzene (manufactured by Nippon Steel Chemical Co., Ltd., "DVB960") Styrene polybutylene glycol diacrylate (manufactured by Kyoeisha Chemical Co., Ltd., "Light Acrylate PTMGA-250") Acrylic ring Ester Diethyl-Alpha-Acrylic Acid Trimethyl methacrylate triacrylate pentaerythritol tetraacrylate (Example 1) (Preparation of polymer seed particle dispersion) Ion exchange water was added to a separable flask 2500 g, 250 g of styrene, 50 g of octyl mercaptan and 0.5 g of sodium carbonate were stirred under a nitrogen atmosphere. Thereafter, 2.5 g of potassium peroxide was added by heating to 70 ° C, and the reaction was carried out for 24 hours, whereby polymer seed particles were obtained. 5 g of the obtained polymer seed particles, 5 g of ion-exchanged water, and 100 g of a 5 wt% aqueous solution of polyvinyl alcohol were mixed, and after being dispersed by ultrasonic waves, they were added to a separation flask and stirred to obtain Polymer seed particle dispersion. 139450.doc -24· 200948881 (Production of polymer particles) 38 g of decyl-tricyclic bismuth acrylate, 152 g of divinylbenzene, 26 g of benzamidine peroxide, triethanolamine lauryl sulfate 1 〇 g, 130 g of ethanol was added to the ion-exchanged water 丨〇〇〇g, and the mixture was stirred to obtain an emulsified liquid. The obtained emulsion was added in portions to the polymer seed particle dispersion. Thereafter, 5 〇〇 g of an aqueous solution of 5 wt% of polyvinyl alcohol was added, and the mixture was reacted for 9 hours under a nitrogen atmosphere at 85 ° C to obtain polymer particles. ❿ (Production of conductive particles) After the obtained polymer particles are washed and dried, a two-layer structure having a nickel layer and a gold layer laminated on the surface of the nickel layer is formed on the surface of the polymer particles by electroless plating. The metal layer 'produces conductive particles. Further, the thickness of the nickel layer is 〇·07 μηι, and the thickness of the gold layer is 〇 2 μιη. (Production of an anisotropic conductive film) A bisphenol oxime type epoxy resin (EPlkote 10〇9, manufactured by Japan Epoxy Resins Co., Ltd.), ι by weight, an acrylic rubber (weight average molecular weight of about 800,000), 40 parts by weight Methyl ethyl ketone 2 parts by weight, microcapsule type modifier ("HX 3941 HP" manufactured by Asahi Kasei Chemicals Co., Ltd.) 50 weight damage, decane coupling agent (SH 6040 manufactured by Dow Corning Toray Silicone Co., Ltd.) 2 parts by weight were mixed, and conductive particles were added so as to be 3% by volume, and dispersed to obtain a resin composition. The obtained resin composition coated dough was subjected to a release treatment to a thickness of PET (polyethylene terephthalate) film, and dried by hot air of (10) for 5 minutes to prepare an anisotropic conductive film. The resulting anisotropic conductive film 139450.doc -25- 200948881 has a thickness of 12 . (Production of Connection Structure) The known anisotropic conductive film was cut into a size of 5 mm X 5 mm. The cut-off anisotropic conductive film is attached to a glass substrate (having a height of 0.2 μm, L/S=20 μηι/20 μηη) having a guide wire for resistance measurement on one side (width is 3) The center of the aluminum electrode side of cm, 3 cm in length. Then, a 2-layer flexible printed substrate provided with the same aluminum electrode (width is

/-V cm ' is 1 cm in length) Aligned and aligned after the electrodes overlap each other.

The laminated body of the glass substrate and the two-layer flexible printed circuit board was thermocompression-bonded under pressure conditions of 1 〇N and i8 (rc and 2 sec.) to obtain a bonded structure. A two-layer flexible printed circuit board on which an aluminum electrode is directly formed on a polyimide film (Examples 2 to 16 and Comparative Examples 1 to 4), except for the types of monomer components used in the production of polymer particles and

The polymer seed particle dispersion liquid, the polymer particles, the conductive particles, the anisotropic conductive film, and the bonded structure were produced in the same manner as in Example 以外 except that the amounts were changed as shown in the following Tables i and 2. (Example 17) The following electroless plating was carried out using the polymer particles obtained in Example 1, a nickel step. Electroless nickel plating step: The obtained polymer particles are subjected to a weight of ionic adsorbent (iv) for 5 minutes, and then added to a 1% by weight aqueous solution of palladium sulfate: after adding dimercaptoamine borane Reduction treatment, filtration, cleaning, 139450.doc •26_ 200948881 This obtains polymer particles with palladium attached. Then, a 1 wt% solution of sodium succinate in which sodium succinate was dissolved in 500 mL of ion-exchanged water was prepared. To the solution, 10 g of polymer particles to which palladium was attached was added and mixed to prepare a slurry. Sulfuric acid was added to the slurry to adjust the pH of the slurry to 5.

As a nickel plating solution, 10 weights of nickel sulfate were prepared. /❶, sodium hypophosphite 1% by weight, sodium hydroxide 4% by weight, and sodium succinate 20% by weight nickel plating solution. After the above slurry having a pH adjusted to 5 was heated to the rib, the nickel plating solution was successively added dropwise to the slurry, and the mixture was stirred for 2 minutes to carry out a plating reaction. It was confirmed that no hydrogen was generated to end the plating reaction. Then, a nickel plating solution containing 20% by weight of nickel sulfate, 5% by weight of dimethylamine borane, and 5% by weight of sodium cerium oxide was prepared. At the end of the plating reaction using the nickel plating solution in the previous stage, the nickel plating solution was continuously added dropwise, and the plating reaction was carried out by stirring 1 time 4 . In this manner, a nickel layer is formed on the surface of the polymer particles to obtain conductive particles. Further, the thickness of the nickel layer is 〇·1 μηι. An anisotropic film and a connection structure were produced in the same manner as in Example 1 except that the obtained conductive particles were used. (Example 18) Using the conductive particles obtained in Example 17 except that the thickness of the nickel layer was changed to 0. 7 μηι, the following non-electrical energy step was carried out. ^ Non-electrolytic chain step: Add 10 g of the obtained guide snow 1 , Λ, etc. to 500 mL of ion-exchanged water, 139450.doc -27· 200948881 by the ultrasonic processor to make it fully dispersed, thus A particle suspension is obtained. While stirring the suspension at 50 ° C, slowly add 0.02 mol/L of palladium sulfate, ethylenediamine 〇.〇4 mol/L as a crosslinking agent, and 0.06 mol/L of sodium formate as a reducing agent. The electroless plating solution having a pH of 10.0 as a crystal modifier was subjected to electroless palladium plating. The non-electrolytic bond is terminated when the thickness of the palladium layer reaches 〇.〇3 μιη. Then, it is obtained by washing and vacuum drying to obtain conductive particles having a layer of the surface layer of the recording layer. An anisotropic conductive film and a bonded structure were produced in the same manner as in Example 1 except that the obtained conductive particles were used. Further, the thickness 镍 of the nickel layer is 0.07 μηη, and the thickness of the palladium layer is 〇 3 μιη. (Example 19) An electroless nickel plating step was carried out on the surface of the polymer particles in the same manner as in Example 7 except that the polymer particles obtained in Example 1 were changed to the polymer particles obtained in Example 5. A nickel layer is formed to obtain conductive particles. An anisotropic conductive film and a bonded structure were produced in the same manner as in Example except that the obtained conductive particles were used. ◎ (Example 20) The conductive particles obtained in Example 17 were changed to the conductive particles obtained in Example 19, except that the thickness of the nickel layer was changed to 〇〇7. In the same manner as in Example 1, except that the non-electrolytic shovel step was carried out in the same manner as in Example 18 to obtain a conductive particle having a palladium layer on the surface layer of the recording layer except that the obtained conductive particles were used, an anisotropic conductive film was produced in the same manner as in Example 1. And the connection structure. 139450.doc •28·200948881 (Examples 21 to 46 and Comparative Examples 5 to 8) In addition to the production of polymer particles, the amount of μ compounding was changed to the following, and the type of the early body component used in the word and its A polymer seed particle dispersion liquid, polymer particles, conductive particles, an anisotropic conductive film, and a bonded structure were produced in the same manner as in Example 1 except for the above. (Example 47) 125 Irrigation of ion-exchanged water of 1252 g and polyethylene glycol

❹ 2135 g of aqueous solution is divided into 2, g * g * knife discharge liquid, adding dimethylol-tricyclodecane diacrylic acid Θ purpose 38 g, two γ «Μ * ^ 1 c->, - this 52 g, As a polymerization initiator, 5.9 g of Perbutyl® (manufactured by Ayamoto Co., Ltd.) was mixed and mixed to obtain a mixed solution. Spoiled in a nitrogen ring & τ, and after 7 hours of arcing the resulting mixture for polymerization, the particles were taken out by the gas. The ion-exchanged water and the c-particles were washed to remove the dispersion medium. Then, the polymer particles are obtained by drying. The obtained polymer particles have an average particle diameter of 240 Å and a CV value of 0.42 /. The polymer particles are electrolyzed (4), and the thickness of the polymer particles is 〇. 3' of the underlying nickel plating layer. Then, the polymer particles forming the underlying mineral nickel layer are subjected to electrolytic copper plating to form a copper layer having a thickness of 10 μηι, and then electroplating is performed using an electrolytic plating solution containing tin and silver. A low-melting-point metal layer having a thickness of 25 μm. Thus, a conductivity of a copper layer and a low-melting-point metal layer (tin: silver-96.5 wt%: 3.9 wt%) is sequentially formed on the surface of the polymer particles. Further, the average particle hollow of the conductive particles is 3 1 ' 'cv value is 1. Further, the content of tin and silver of the metal layer on the surface of the polymer particles is by using fluorescent X-ray 139450 .doc •29- 200948881 Line Analysis The analysis was carried out by the analysis of "EDX-800HS" manufactured by Shimadzu Corporation. (Examples 48 to 50 and Comparative Example 9) The types of monomer components used in the production of polymer particles and the amount of blending thereof were changed. Polymer particles and conductive particles were produced in the same manner as in Example 47 except as shown in the following Table 5. (Examples 51 to 90) The types of the monomer components used in the production of the polymer particles and The blending amount was changed to the same as that shown in the following Tables 6 to 8, and polymer particles were obtained in the same manner as in Example i. Using the obtained polymer particles, an electroless plating step was carried out in the same manner as in Example 7 A conductive layer was formed on the surface of the polymer particles to obtain conductive particles. An anisotropic conductive film and a bonded structure were produced in the same manner as in Example 1 except that the obtained conductive particles were used. (Examples 91 to 13) 〇) In addition to the single used as polymer particles

139450.doc The type of the monomer component used in the same manner as in Example 1 is the same as in the case of Example 1, in which the thickness of the nickel layer is 〇〇7 in the same manner as in Examples 17 and 18: the palladium plating step is obtained. An anisotropic conductive film and a connection structure were produced in the same manner as in Example 1 except for the recording layer 0. (Evaluation) (1) Average particle diameter of polymer particles The average particle size of the obtained polymer particles was measured using a Coulter counter (manufactured by Beckman Coulter Co., Ltd.). (2) Cv value of polymer particles The CV value of the obtained polymer particles was measured using a Coulter counter (manufactured by Beckman Coulter Co., Ltd.). Ο . (3) Compressive elastic modulus of polymer particles The compressive elastic modulus (1〇% κ) of the obtained polymer particles was measured using a micro pressure Ifg tester (Fischersc〇pe H-100) manufactured by Fischer Co., Ltd. Value, 20% K value and 30% K value). (4) Compression recovery ratio of polymer particles and conductive particles The compression recovery ratio of the obtained polymer particles and conductive particles was measured using a micro compression tester ("Fisehersc〇pe H-100" manufactured by Fischer Co., Ltd.). (5) Connection resistance value The connection resistance value between the opposing electrodes of the obtained connection structure was measured by a 4-terminal method. Further, the connection resistance value was evaluated on the basis of the following evaluation criteria. [Evaluation criteria for connection resistance value] ◎: Connection resistance value is 2.0 Ω or less 〇: Connection resistance value exceeds 2.0 Ω and is 3.0 Ω or less △: Connection resistance value exceeds 3.0 Ω and is 5.0 Ω or less 139450.doc -31- 200948881 x : The connection resistance value exceeds 5.0 Ω. (6) Observation of the electrode Using a differential interference microscope, the glass substrate of the connection structure of the hall is placed on the electrode of the glass substrate, and the indentation formation of the electrode of the guide is evaluated by the following evaluation criteria. Whether there is. Further, using a metal microscope, the presence or absence of voids in the electrode portion of the conductive particles 7 was observed. In addition, regarding the presence or absence of the electrode pressure π < ~ formation, the electrode area is 0.02 mm 2 , and the observation is performed by the interference microscope with the outer 8 8 (1), and the nose electrode 0.02 mm 2 is worn and milled. The number of rainbow indentations. The average value of the number of indentations per electrode 2 was calculated by observing any of the ten 邛 positions using a differential interference microscope. [Evaluation criteria for the presence or absence of indentation formation] ◎. The indentation of 0.02 mm2 per electrode is more than one. The indentation of 0.02 mm2 per electrode is 20 or more and less than 25 △. Indentation of 0.02 mm2 per electrode 5 or more and less than 20 X. Each of the electrodes has an indentation of less than 5 (2). The drop strength test preparation is provided with 112 electrodes (280 μm diameter) at intervals of 〇·5 mm. The wafer is then 6 mm long and 6 mm horizontal. A flux ("WS-9160-M7" manufactured by Cookson Electronics Co., Ltd.) was applied to the electrode of the wafer. The obtained conductive particles were placed on all the electrodes, and reflowed under the conditions of a heating temperature of 25 ° C and 30 seconds to mount the conductive particles on the electrodes. Then, a printed substrate provided with a copper electrode (305 μm in diameter) was prepared. 139450.doc -32- 200948881 Applying solder paste to the printed circuit board (Matsuya Metal is now drinking "M705_GRN360_K2_V" manufactured by 丄 公司 卜 将 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 On the printed circuit board of the solder paste, the connection structure was obtained: According to the JEDEC standard JESD22-B111, the drop strength test of the obtained connection structure was carried out, and the evaluation was performed based on the following evaluation criteria. The obtained connection structure forms a daisy chain circuit. That is to say, it is convenient to produce the disconnection of the electrode, and the disconnection can also be detected. Furthermore, the electrode layer faces the outer surface and sequentially forms a copper layer, a nickel-phosphorus layer and a gold layer. [Evaluation criteria for the drop impact test]于. In all 15 矽 wafers, the number of electrode breaks dropped more than 1 △ △: In all 15 矽 wafers, the number of drops of the electrode break is 5 以上 or more and less than 100 times.

x. The number of drops of the electrode break in all 15 wafers was less than 5 times. The results are shown in Table 10 below. Furthermore, in Tables 1 to 1 below, "_" indicates that no evaluation has been made. 139450.doc •33· 200948881 [ϊ <] Example (Ν CN vi 00 m Ni/Au Ο cn 〇\ CN 3315 1775 1294 inch <Ν 00 1—Η T—^ (N 〇〇1 1-1 Inch 1—^ ι—1 Ni/Au Ο rn 卜 (Ν 3246 1746 1226 Ο 1—Η (N (N 〇〇1 Ο ν〇 inch r^ Ni/Au Ο m* 〇〇 (Ν 3138 1559 m (Ν Ον 1-^ inch r4 〇〇1 Ον 00 m CN Ni/Au ο CO 00 oi 3177 1226 1069 oo Η ΓΟ 1—Η (Ν (Ν ί4ί 1 00 (N ^Γί 〇〇CO Ni/Au Ο rn卜(N 2471 m σ\ cn cn r»H ΓΟ (Ν 〇〇#. 1 卜寸 Ni/Au Ο ro 00 CN 2687 cn in oo 1432 Ό (N 〇(Ν 〇〇4ί 1 νο inchΤ"·Η Ni/Au Ο rn 卜 CN 2922 2030 1844 卜mm 〇(Ν 〇〇 1 1 <Ti 〇〇CO (Ν yr> τ-^ Ni/Au Ο rn 00 c4 2991 2157 2206 〇οο cn (Ν <Ν 〇Ο 41 1 inch CN 00 m Ni/Au ο CO 00 (N 3138 1-H 1942 inch ο m Η (Ν 〇〇1 inch 1-Η Ι^Η v〇Ni/Au ο 00 CN 3354 2030 Ί—^ o οο m <Ν CN 〇〇1 (Ν inchτ—Η rH Ni/Au Ο rn (N 3638 2246 1912 mm (Ν 1 τ—Η 00 m (Ν in Ni/Au ο 00 00 (N 2295 2001 inch Η (Ν 〇〇1 3 Q 3 3 3 ^Ξ〇 plating Application method (metal layer) Average particle diameter of polymer particles (μιη) CV value (%) of polymer particles rO I Ο V 屮 荽Μ 屮 B 压缩 1 1 Polymer compression recovery rate (%) i Conductive Compressive recovery rate of particles (%) Connection resistance value Indentation formation Whether or not voids are produced with or without drop strength Test Dimethylol-tricyclodecane diacrylate Acrylic acid isophthalic acid ester Dicyclopentene ester acrylic acid secondary ring Amyl divinyl styrene polybutylene glycol diacrylate hexyl hexyl acrylate S; 哒 哒 ※ ※ 139450.doc • 34- 200948881 [ζί Comparative example inch ON ON Ni/Au Ο cn 00 (Ν 2981 1814 1755 in in <N rn <1 < 1 m Ni/Au ο rn 00 (Ν 5296 4472 4894 vn uS XX 1 CN OO cn (N Ni/Au Ο cn 00 (Ν (N in cn <3 X 1 00 m CN Ni/Au ο C^i 卜 (Ν 1422 | 1079 1402 inch rn < X 1 Example 00 m 152 Ni/Pd Cn 〇〇oi | 2991 | 2157 2206 〇CO r—H ◎ ◎ 1 oo m (N Ο rn 卜 (N | 2991 | 2157 [2206 | 〇m O) H ◎ ◎ 1 〇〇00 m (N iH Ni/ Pd Ο cn 00 (N | 3981 | 2295 2001 jn 卜m CN ◎ ◎ 1 卜 00 CN ο ΓΟ 〇\ (N | 3981 | 2295 [2001 | 00 cn O) ◎ ◎ 1 v〇<N 1—H 00 m Ni/Au Ο cn 卜 3481 1775 1334 CN CN inch cs 〇〇m 1 ΙΟ 〇\ ON | Ni/Au Ο <ri 00 CN 4717 2746 2560 τ—< 寸卜 m CN (N 〇〇1 inch CN 00 m Ni/Au Ο rn 00 <N 3119 1569 1089 iH CN 〇〇1 m On On Ni/Au Ο rn 00 (N 4050 2560 2099 r- mo —H CN 〇〇1 3 3 3 3 3 Plating Method (metal layer) Average particle diameter of polymer particles (μιη) cv value (%) of polymer particles 10% of polymer particles K value (N/mm2) 20% of polymer particles K value (N/mm2) I § m 压缩 Light polymer particle compression recovery rate (%) Conductive particle compression recovery rate (%) Connection resistance value Indentation formation Whether or not voids are produced with or without drop strength test Dimethylol-tricyclic oxime Alkyl diacrylate isodecyl acrylate dicyclopentenyl acrylate dicyclopentanyl divinyl styrene polybutylene glycol diacrylate hexyl hexyl bromide BQiL* V〇Y Β 哒 哒 ※ ※ * 139450.doc ······· Ν' 2460 1421 1156 »<2(Ν(Ν 0 ο cn cn m inch T-^ v〇Ni/Au ο ΓΟ 00 CN 2744 1744 1362 OO <N ο 〇 ( (N cn VO to τ~^ Ni /Au ο rn Γ^ fN 2813 1989 1862 ON m oi ο ο 00 m <Ν m Ni/Au ο 00 (Ν 2930 2195 2136 o 00 m (N CN ο ο 沄〇 Ni Ni/Au Ο CO as CN 3010 2387 2387 qj Ό CN ο <] 碟 os CN (N 00 C^i Ni/Au ο rn 卜 (Ν [3254 | 1882 1245 vj cs m <N 〇〇碟00 CN 1-^ Ni/Au Ο Γ<*ΐ os CN 2793 1725 1186 cn (N ON (Ν oi 〇〇v〇Ni/Au Ο Γ^ϊ Γ Η | 2666 | 1431 1147 ON cn oi 〇〇V〇cs OO r4 Ni/Au Ο cn 00 (Ν [2185 | 1186 '1049 对»—n 〇 inch (Ν 〇ο CN 卜 On Ni/Au ο cn cn [2186 | 1109 m V) 00 OO Bu Yu r4 〇ο ri (N 〇〇m Ni/Au ο cn 卜 <N 2705 1548 〇in Ό cn cn ο CN ο 〇 (N inch Ni/Au ο 00 (Ν [2881 | 1676 1656 $ (Ν CN ο 〇m fN (N inch 1—^ Ni/Au Ο ΓΛ 卜 CN 3067 1784 1597 1 ο m Ο oi 〇ο CN OO m (N »n Ni/Au Ο ΓΛ OO CN 3342 1872 1686 <Ν (Ν 〇ο 3 3 3 /*-N v25 3 3 3 3 W 3 s 3 2 3 /-st$o Fill in 100 light as g > UU review Φ rO 1 & o 屮rC' 1 r<g B % U 荽g 错·费ί 塄/—Ν ... 4 趄% connection resistance value trace formation with or without void generation 1 drop strength test 1 dimethylol-tricyclodecane diacrylate slip Love, 1 Ί Domain W 1 ΓΟ ¢ ¢ - Zhao Wei μ Tricyclodecane vinyl ether tricyclodecane monomethyl vinyl ether divinyl phenyl styrene hydrazine, 1 Η slip tO Chu Sanethylene glycol diacrylate trimethylolpropane triacrylate slip 0 «Γ S 钵 哒 ※ ※ l Φ2ΐ * 139450.doc -36- 200948881 ο ο [inch ΐ ¥ Meal Jj 00 | Ni/Au| 〇rn 〇\ (Ν 4518 4204 4528 mr*i XX 1 卜 Ni/Au 〇tn 00 (Ν 1813 1343 1813 s v-ϊ cn XX 1 1—^ Ni/Au ο rn 00 <Ν 1078 ο ON On 1215 On r~j cn < X 1 yn Ni/Au ο cn 00 (Ν s inch inch ΓΟ S cn <] X 1 Ni/Au ο cn os (Ν 3406 1872 rH m CN ο (Ν 〇〇1 〇\ f—Η Ni Ni/Au ο cn 卜 (Ν 3306 2361 2405 Η 〇 〇 <] 1 S 1—^ |Ni/Au| Ο cn VO (Ν ο ζ> oo VO ΓΟ <N ΓΟ in CN 〇&lt ;3 4ί 1 iNi/Aul ο ΓΟ οο (Ν ο ν〇〇\ ON mm inch inch 〇 \ CN 〇< dish 1 Ni/Au ο rn Η 2558 1509 1303 oo (N so (N Ο CS 〇〇1 ψ -^ inch, howl 1丨丨丨Η Ni\ Ni/Au Ο m" 00 (Ν 2142 1096 1045 OO t> οο ( 〇〇 〇〇 1 〇 (Ν 00 m Ni/Au ο rn 00 CN 2391 1176 m cn (Ν 〇〇1 os m inch production - Ni/Au ο ΓΠ 卜 (Ν 2724 1872 1725 in (Ν Ο (Ν 〇〇 1 oo cn v〇 inch 1—^ Ni/Au ο rn ν〇(Ν 2920 2029 2254 Ό Ο c4 〇〇碟1 〇〇ΓΛ (N <n 1—^ Ni/Au Ο ΓΛ ΟΝ CN 2960 2185 2308 Os m 00 m cn <Ν 〇〇41 1 ^sO m os r—η 1—^ Ni/Au Ο ΓΛ 〇Ν CN 3276 2375 2401 et al rj Γ Η 〇<] 1 3 /—N ^&C / —Ν bi 3 -w 3 ss 3 'w^ S 'W1 Average particle size of polymer particles (μηι) g > Ο U ea ε ο 矣ε δ 屮# 1 & om W 屮2 费ί屮Connection resistance value The presence or absence of the formation of the indentation 1 The presence or absence of the void strength test 丨 Dimethylol-tricyclodecane diacrylate 遛Ί 铋 塯W 塯 蓑遛 蓑遛 蟹 B- 遛Ί 裴遛Ί 潜Case « Pack 1〇你'Ί Tricyclodecane monomethyl vinyl ether 蓑tO Ί 蓑ο i4 Polybutylene glycol diacrylate temperature t0 € Submersible Ί Ί ι ι0 π| 溜 韶 ' '·! 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Claims (1)

200948881 VII. Patent application scope: A polymer particle of two ring structures obtained by polymerizing a monomer having at least a cyclic ruthenium compound. 2. The polymer particle ring structure or tricyclic structure of claim 1. Wherein at least two of the above ring structures are double, wherein the above monomer is an acrylic acid. 3. The polymer particle monomer of claim 1 or 2. The polymer particles according to any one of items 1 to 3, wherein the compression recovery ratio is Ο/. The compressive elastic modulus at μ and compressed by 10% is in the range of 980 to 4, 9 〇〇 N/mm 2 . 5. The polymer particle of claim 4, wherein the compression recovery ratio is in the range of ～. 6. The sub-" is obtained by polymerizing an alicyclic compound having a polymer particle ring structure of at least 2, such as a monofunctional monomer and a polyfunctional monomer. The polymer particles of the group 6 are polymerized by polymerizing a monofunctional monomer comprising 20 to 90 parts by weight of an alicyclic compound having at least 2 ring structures and a polyfunctional monomer of 8 〇 〇 〇 / 〇 The monomer component of the body is a polymer particle of the term 1 or 2, which is obtained by polymerizing a polyfunctional monomer having at least two alicyclic compounds of the oxime, '"* structure. The polymer particles of the above item 8 are obtained by polymerizing a monomer component comprising 2% by weight of a polyfunctional monomer having an alicyclic compound having at least two ring structures. Polymer particles of claim 1 or 2 which are obtained by polymerizing a monofunctional monomer having an alicyclic compound having at least 2 139450.doc 200948881 ring structures and an alicyclic compound having at least 2 ring structures. The result of the functional monomer. 11 12 13. 14. 15. 16. An electroconductive particle which has a right to bite seven or eight hundred polymer particles of the item 1 or 2 and a metal layer covering the surface of the polymer particle. For example, in the case of claim 11, the compression recovery rate is 45% or less. The electroconductive particle of claim 11, wherein the outer surface of the metal layer is a metal layer containing nickel, a metal layer containing #s3 palladium or a metal layer containing a low melting point metal. It comprises the electrically conductive particles of claim 11 an anisotropic conductive material and a binder resin. The second connection pair is as claimed. A connection structure (four) includes a 帛1 connection target member and an electroconductive particle that connects the i-th and second connection target members. A connecting structure body member and a coupling portion. The connection portion including the first connection target member and the second connection pair 1 and the second connection target member is formed by the anisotropic conductive material as claimed in claim 14 139450.doc