JP4532321B2 - 導電パターン形成装置 - Google Patents
導電パターン形成装置 Download PDFInfo
- Publication number
- JP4532321B2 JP4532321B2 JP2005096673A JP2005096673A JP4532321B2 JP 4532321 B2 JP4532321 B2 JP 4532321B2 JP 2005096673 A JP2005096673 A JP 2005096673A JP 2005096673 A JP2005096673 A JP 2005096673A JP 4532321 B2 JP4532321 B2 JP 4532321B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive pattern
- conductive
- thin film
- dielectric thin
- pattern forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G9/00—Developers
- G03G9/08—Developers with toner particles
- G03G9/12—Developers with toner particles in liquid developer mixtures
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/06—Apparatus for electrographic processes using a charge pattern for developing
- G03G15/10—Apparatus for electrographic processes using a charge pattern for developing using a liquid developer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1266—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by electrographic or magnetographic printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0517—Electrographic patterning
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Coating Apparatus (AREA)
- Wet Developing In Electrophotography (AREA)
Description
Claims (6)
- 誘電性薄膜体表面に静電潜像を形成する静電潜像形成手段と、前記静電潜像に導電性粒
子分散溶液を接触供給し、導電粒子で現像する現像手段を具備した導電パターン形成装置
において、
前記導電性粒子分散溶液が、表面に電荷を付与するイオン性有機分子を吸着している粒径が100nm以下の銀、銀酸化物又はそれらの合金からなる導電粒子を無極性溶媒中に分散させて前記イオン性有機分子により導電粒子に電荷を付与し、
前記誘電性薄膜体表面に形成された導電パターンを導電パターン形成基材上に転写する転写手段を具備し、前記基材上に転写された導電パターンを加熱融着する加熱手段を具備することを特徴とする導電パターン形成装置。 - 請求項1記載の導電パターン形成装置において、
前記導電パターンを中間転写体上に転写する転写手段と、前記中間転写体上に転写され
た導電パターンを導電パターン形成基材上に転写する転写手段を具備することを特徴とす
る導電パターン形成装置。 - 請求項1または2記載の導電パターン形成装置において、
前記導電粒子の粒径を10nm以下とし、前記加熱手段の200度以下の加熱により前記導電パターン形成基材上に導電パターンを融着することを特徴とする導電パターン形成装置。 - 請求項1または2記載の導電パターン形成装置において、
前記導電粒子の粒径を5nm以下とし、前記加熱手段の200度以下の加熱により前記導電パターン形成基材上に導電パターンを融着することを特徴とする導電パターン形成装置。 - 請求項1ないし4のいずれかに記載の導電パターン形成装置において、
前記静電潜像形成手段が、構成材料を光照射により前記照射部の表面電荷を失う感光性
材料で形成された誘電性薄膜体と、前記誘電性薄膜体表面に放電または接触により電荷を付与して静電荷を形成する静電荷付与手段と、前記誘電性薄膜体表面の静電荷に光を照射して静電潜像パターンを形成する露光手段を具備することを特徴とする導電パターン形成装置。 - 請求項1ないし4のいずれかに記載の導電パターン形成装置において、
前記誘電性薄膜体が感光性を有しており、前記誘電性薄膜体表面を一様に帯電させる帯
電手段と、一様帯電された誘電性薄膜体表面の任意の部位に光を照射する露光手段からな
ることを特徴とする導電パターン形成装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005096673A JP4532321B2 (ja) | 2005-03-30 | 2005-03-30 | 導電パターン形成装置 |
TW095100169A TW200638828A (en) | 2005-03-30 | 2006-01-03 | Conductive pattern forming device |
PCT/JP2006/301128 WO2006112101A1 (ja) | 2005-03-30 | 2006-01-25 | 導電パターン形成装置 |
KR1020077014173A KR100872148B1 (ko) | 2005-03-30 | 2006-01-25 | 도전 패턴 형성장치 |
CNB2006800010416A CN100548088C (zh) | 2005-03-30 | 2006-01-25 | 导电图案形成装置 |
US11/722,901 US20100031883A1 (en) | 2005-03-30 | 2006-01-25 | Conductive pattern forming apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005096673A JP4532321B2 (ja) | 2005-03-30 | 2005-03-30 | 導電パターン形成装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006278801A JP2006278801A (ja) | 2006-10-12 |
JP4532321B2 true JP4532321B2 (ja) | 2010-08-25 |
Family
ID=37114843
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005096673A Expired - Fee Related JP4532321B2 (ja) | 2005-03-30 | 2005-03-30 | 導電パターン形成装置 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4532321B2 (ja) |
KR (1) | KR100872148B1 (ja) |
CN (1) | CN100548088C (ja) |
TW (1) | TW200638828A (ja) |
WO (1) | WO2006112101A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7301465B2 (ja) | 2019-03-10 | 2023-07-03 | ジヤトコ株式会社 | 動力伝達装置 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007173131A (ja) * | 2005-12-26 | 2007-07-05 | Hitachi Ltd | 微粒子分散液、およびそれを用いた導電パターン形成装置 |
DE102006028536A1 (de) | 2006-06-21 | 2007-12-27 | Axel Ahnert | Verfahren zur Herstellung eines Schaltungsteils auf einem Substrat |
JP4735462B2 (ja) | 2006-07-27 | 2011-07-27 | 株式会社日立製作所 | 導電パターン形成装置と導電パターン形成方法 |
JP4735591B2 (ja) * | 2007-04-03 | 2011-07-27 | 株式会社日立製作所 | 導電パターン形成装置 |
CN101614988B (zh) * | 2008-06-24 | 2011-11-30 | 株式会社日立制作所 | 导电图案形成装置 |
KR100952262B1 (ko) * | 2008-06-27 | 2010-04-09 | 가부시키가이샤 히타치세이사쿠쇼 | 도전 패턴 형성 장치 |
CN102881383A (zh) * | 2012-09-19 | 2013-01-16 | 江西联创电子有限公司 | 一种透明导电薄膜制作方法 |
CN106585089A (zh) * | 2016-11-01 | 2017-04-26 | 重庆乔登彩印包装有限公司 | 一种自适应多功能报纸印刷机 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001144417A (ja) * | 1999-11-17 | 2001-05-25 | Ebara Corp | プリント基板及びその製造方法 |
JP2002151828A (ja) * | 2000-11-15 | 2002-05-24 | Kyocera Corp | 回路パターン形成方法 |
JP2004184598A (ja) * | 2002-12-02 | 2004-07-02 | Tomoegawa Paper Co Ltd | 回路形成用現像剤及びそれを用いた回路形成方法 |
JP2005050992A (ja) * | 2003-07-28 | 2005-02-24 | Toshiba Corp | 配線基板および多層配線基板 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10274864A (ja) | 1997-03-31 | 1998-10-13 | Minolta Co Ltd | 電子写真用液体現像剤 |
JP2000242088A (ja) * | 1999-02-17 | 2000-09-08 | Ricoh Co Ltd | 画像形成方法 |
JP2004233985A (ja) * | 2003-01-08 | 2004-08-19 | Seiko Epson Corp | 液体現像剤 |
JP4387175B2 (ja) * | 2003-07-07 | 2009-12-16 | 積水化学工業株式会社 | 被覆導電性粒子、異方性導電材料及び導電接続構造体 |
-
2005
- 2005-03-30 JP JP2005096673A patent/JP4532321B2/ja not_active Expired - Fee Related
-
2006
- 2006-01-03 TW TW095100169A patent/TW200638828A/zh unknown
- 2006-01-25 CN CNB2006800010416A patent/CN100548088C/zh not_active Expired - Fee Related
- 2006-01-25 KR KR1020077014173A patent/KR100872148B1/ko not_active IP Right Cessation
- 2006-01-25 WO PCT/JP2006/301128 patent/WO2006112101A1/ja not_active Application Discontinuation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001144417A (ja) * | 1999-11-17 | 2001-05-25 | Ebara Corp | プリント基板及びその製造方法 |
JP2002151828A (ja) * | 2000-11-15 | 2002-05-24 | Kyocera Corp | 回路パターン形成方法 |
JP2004184598A (ja) * | 2002-12-02 | 2004-07-02 | Tomoegawa Paper Co Ltd | 回路形成用現像剤及びそれを用いた回路形成方法 |
JP2005050992A (ja) * | 2003-07-28 | 2005-02-24 | Toshiba Corp | 配線基板および多層配線基板 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7301465B2 (ja) | 2019-03-10 | 2023-07-03 | ジヤトコ株式会社 | 動力伝達装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2006112101A1 (ja) | 2006-10-26 |
TW200638828A (en) | 2006-11-01 |
KR20070086536A (ko) | 2007-08-27 |
JP2006278801A (ja) | 2006-10-12 |
CN101044803A (zh) | 2007-09-26 |
TWI323627B (ja) | 2010-04-11 |
KR100872148B1 (ko) | 2008-12-08 |
CN100548088C (zh) | 2009-10-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4532321B2 (ja) | 導電パターン形成装置 | |
JP4735462B2 (ja) | 導電パターン形成装置と導電パターン形成方法 | |
JP4730232B2 (ja) | 基板への導電パターン形成装置および導電パターン形成方法 | |
JP2010087069A (ja) | 導電パターン形成装置 | |
US7608205B2 (en) | Decentralized solution of microscopic particles and circuit formation device | |
JP5336680B1 (ja) | 導電性粒子を含有する液体現像剤及びそれを用いた導電パターン形成方法及び導電パターン形成装置 | |
JP4735591B2 (ja) | 導電パターン形成装置 | |
JP4745025B2 (ja) | 電子回路基板の製造方法 | |
US20100031883A1 (en) | Conductive pattern forming apparatus | |
JP2009265455A (ja) | 導電パターン形成装置 | |
KR100952262B1 (ko) | 도전 패턴 형성 장치 | |
CN101614988B (zh) | 导电图案形成装置 | |
JPH11177213A (ja) | 印刷配線基板の製造方法および装置 | |
JP2002223059A (ja) | 微細パターン形成方法 | |
US20070181429A1 (en) | Process for producing electronic circuit | |
JP2005302955A (ja) | 画像形成装置 | |
JP2002182479A (ja) | プリント配線板の液体現像方法及び液体現像装置 | |
JP2005300924A (ja) | 画像形成装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20061129 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090714 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090914 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20090914 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20090917 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20091117 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100113 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20100608 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20100610 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130618 Year of fee payment: 3 |
|
LAPS | Cancellation because of no payment of annual fees |