TWI283457B - Manufacturing method of semiconductor device - Google Patents
Manufacturing method of semiconductor device Download PDFInfo
- Publication number
- TWI283457B TWI283457B TW92104240A TW92104240A TWI283457B TW I283457 B TWI283457 B TW I283457B TW 92104240 A TW92104240 A TW 92104240A TW 92104240 A TW92104240 A TW 92104240A TW I283457 B TWI283457 B TW I283457B
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- Prior art keywords
- semiconductor
- tape
- semiconductor device
- mother substrate
- manufacturing
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H01L2924/19043—Component type being a resistor
Description
1283457 玖、發明說明: 技術領域 本發明係關於一種半導體裝置之製造方法,尤其是關於 一種有效技術適用於使用製品形成部以縱橫方式整齊排列 配置形成於主面上的基板(配線母基板),並在各製品^成部 上搭載厚度薄至100 m以下之半導體元件(半導體晶片), 利用導電性之金屬線來連接半導體元件之各電極配線母 基板之配線,再以絕緣性樹脂層被覆配線母基板之主面 側,以在配線母基板背面之配線上形成凸塊電極(突起電 極),其次將配線母基板在樹脂層彼此與製品形成部之邊= 予以切斷而製造薄型半導體裝置的技術中者。 先前技術 作為半導體裝置(半導體積體電路裝置)之製造技術之一, 較為人所周知者有使用製品形成部以縱橫方式整齊排列配 置形成於主面上的配線母基板,並在各製品形成部上搭載 半導體元件,利用導電性之金屬線來連接半導體元件之各 電極與配線母基板之配線’再以絕緣性樹脂層被覆配線母 基板之主面側,之後將配線母基板在樹脂層彼此與製品形 成部之邊界予以切斷而製造半導體裝置的技術。 y 又,在日本專利特開平10_27836號公報中,有揭示一種 雖非為使用配線母基板之半導體裝置之製造方法,但是在 進行功叱元件之動作檢查後的基板表面上貼附保護膠帶, 之後刮削基板背面,且在基板背面貼附切割膠帶,切斷基 板並分離成每一複數個功能元件以形成晶片零件,將晶片 !283457 :件自切割膠帶拾取並介以指定糊材搭載於指定封裝構件 ’使糊材硬化後,再去除保護膠帶的技術。在該技術 ,係訝厚度620 /zm之基板進行背面磨光以形成4〇〇“m。 又i在自切割膠帶拾取晶片零件的情況,係利用丨支頂起針 將叩片零件頂起,同時利用平頭吸具(c〇u叫來保持晶片零
件。 V 發明内容 (發明所欲解決之問題) 本申請人係從半導體裝置之薄型化方面,來檢討組入厚 度100/zm以下之半導體元件後的厚度為〇·5 mm以下之半導 缸裝置該軸況,係採用使用將製品形成部以縱橫方式整 齊排列形成於主面上的配線母基板,且在製造之最終階段 對配線母基板作縱橫切斷以將各製品形成部當作半導體裝 置的方法。 圖15係顯示早於本發明而先行檢討之半導體裝置的模式 剖視圖;圖16係顯示同圖15之半導體裝置之製造方法的流 程圖。 如圖15所示,半導體裝置6〇係包含有由配線基板構造所 構成的基板61,·固定於該基板61之主面(圖中上面)上的半導 體元件62 ;連接半導體元件62表面之未圖示的電極與形成 於基板61之主面上之未圖示的配線之導電性金屬線〇,•被 覆半導體元件62或金屬線63等且由設於基板61之主面上的 絕緣性樹脂所構成的密封體64 ;以及設於基板6丨之背面的 凸塊電極(突起電極)65。凸塊電極65係形成於設在基板61背 1283457 面之未圖不的配線上。基板61之周面及密封體料之周面由 於係構成以切割刀所切斷的自,所以基板61及密封體料之 各周面係每一各周面分別位於同一面上。 孩種的半導體裝置6G’例如係按照圖16所示之流程圖來 ,造。亦即’在準備形成半導體元件的半導體元件部以縱 橫方式整齊排列形成於主面上的半導體母基板(晶圓)之後, 於晶圓之主面全區上貼附保護膠帶(S301)。其次,研磨(背 面磨光:BG)晶圓之背面俾使厚度75()"m之晶圓成為_ mm之厚度(S302)。 其次,自晶圓剝離保護膠帶(謂3),且在晶圓之背面貼附 :刀割膠帶_4)。之後,以切劉刀將晶圓作縱橫切斷… d · S305)。在利用切割刀進行的切斷中,係在半導體元件 邵之邊界進行切斷,且切斷係設為切割膠帶之中途深度。 ^ 被刀離的各半導體元件係呈由切割膠帶支持的狀 態。 其次,在準備構成半導體裝置之製品形成部以縱橫方式 }齊排列形成於主面上的配線母基板之後,每次拾取一個 刀°'〗膠τ上之半導體元件並將之運送固定在上述各製品形 $部之半導體元件固定部上(晶片接合:S306),接著利用導 電性金屬線㈣接半導體元件之電極與配線母基板之配線 (打線接合:S307>。 二入在配線母基板之主面上形成絕緣性樹脂層俾於被 覆半導體元件及金屬線(樹脂層形成:S308)。 八’入,在配線母基板之背面形成凸塊電極(突起電 1283457 極)(S309)。凸塊電極係形成於配線母基板背面之配線(電 極)上。 其次,在絕緣性樹脂層之主面上貼附支持體,同時利用 切割刀沿著製品形成物之邊界’纟自配線母基板開始並經 過絕緣性樹脂層而切斷至上述支持體之中途深度為止以將 各製品形成部個片化(S31〇)。依該切斷所得的個片化,即可 製造複數個如圖15所示的半導體裝置,6〇。 但是,在該種的半導體裝置之製造方法中,其對晶圓之 背面進行背面磨光(研磨)使晶圓之厚度成為1〇〇以瓜以下且 與習知之40”m相較可大幅減薄。該種的極薄晶圓容易破 裂’進而容易發生缺陷,且難以處理。 、又,在晶片接合步驟中,雖係將頂起針自切割膠帶之下 万頂起以使半導體元件浮起,同時在使之下降的吸具之下 面真空吸附保持半導體元件並進行半導體元件之拾取,但 是在該吸具所進行的半導體元件之處理中,由於 :(半導體晶片)薄至10〇™下,所以·容易發生破裂;缺 ^。又’由於吸具之保持面係直接接觸半導體元件以 容易傷及半導體元件之表面。 圓)=:之目的係在於其不易發生極薄之半導體母基板(晶 回)的破灰、缺陷’且提高半導體裝置之製造良率者。 /發明之另一目的係在於提供一種抑止半導體元件之製 &及+導體元件之搭載等半導體元件之處理時的' 件<破裂、缺陷發生並製造廉價的半導體裝置之方法。疋 本發明之前面說明及其他之目的與新類的特徵,從本說 Ϊ283457 明書之記載及附圖中將 (解決問題之手段) 若簡單說明本案所揭 如以下所述。 可更加明白。 示之發明中作為其代表 的概要,則 (1)在本發明 < 半導體裝置 導麵签Λ 4㈠曰 ^ k万法中,係分別準備半 導植母基板(晶圓)及製品形 i ® l· ^ ^ ^ 4 ^縱檢万式整齊排列形成於 M^ ^ 具耐熱性且透明之黏著膠帶所 構成的保護膠帶來被覆晶圓之 . 圓士北^、 3圓足王面,同時研磨(背面磨光)晶 圓之Η面以將晶圓之屋户形士、 持之切… 於00_以下’在框體所支 … / A以月面而貼附晶圓,利用切割刀將晶圓 〈王面側並包含保護膠帶切斷至切割膠帶之中途深度為止 以形成切割膠帶所支持的複數個半導體元件(半導體晶片), 且以真空吸附型之吸具每次拾取-個切割膠帶上之半導體 -件並運送固定在半導體母基板之各製品形成部的半導 體元件固定部上,再去除貼附在各半導體元件之主面上的 保護膠帶,並利用導電性金屬線來連接半導體元件之電極 與配線母基板之配線,且在配線母基板之主面上形成絕緣 性樹脂層俾於被覆半導體元件及金屬線等,在絕緣性樹脂 層之主面上貼附支持體並依支持體來支持配線母基板,再 利用切割刀沿著製品形成部之邊界而自配線母基板並經過 絕緣性樹脂層而切斷至上述支持體之中途深度為止以將各 製品形成部個片化(半導體元件化),藉由自支持體剥離製品 形成部以製造半導體裝置。在形成上述絕緣性樹脂之後, 於上述配線母基板背面之配線表面上形成突起電極(凸塊電 1283457 植)°選擇絕緣性樹脂層之厚度以將半導體裝置之厚度製造 於〇·5 mm以下。 若依據上述(1)之手段,則(a)晶圓之主面可由保護膠帶所 被覆。因而,在處理晶圓時晶圓之主面就不易被污染、或 損傷。又’保護膠帶不僅可保護晶圓之主面亦可成為強度 構件。結果,在處理晶圓時就不易發生破裂、缺陷。此在 依背面磨光而變得更薄的晶圓中就更有效果。 (b)由於晶圓主面係由保護膠帶所保護,所以依切割刀進 仃切斷時,不僅可防止表面污染,而且經切斷之邊緣或半 導體元件部之表面不易損傷。結果,不易發生半導體元件 又破裂、缺陷,且可提高半導體元件之品質及製造良率。 (0由於在切割後,半導體元件亦可利用保護膠帶來保護 主面,所以可防止表面污染或受傷。又,由於保護膠帶可 成為強度構件,所以即使在拾取時因頂起針之頂起、或因 吸具爻真空吸附保持、搬運及晶片固定方面,半導體元件 亦不易損傷。 (d)由於在形成絕緣性樹脂層後,係將配線母基板與樹脂 層-起切斷所以可同時製造多量的半導體$置,且可減低 半導體裝置之製造成本。 _ 匕⑷由於半導體元件係形成⑽心以下,所以藉由減薄樹 脂層,即可將所製造的半導體裝置之厚度薄型化狀5咖 以下。 實施方式 外 乂下,係參照圖式詳細說明本發明之實施形態。另 1283457 在說月發明之實施形態用的全圖+,具有同一功能者將附 1己相同^件符號,並省略其重覆說明。 (實施形態1) 蝴圖1至圖I4係關於本發明之一實施形態(實施形態υ之半導 體裝置之製造方法的示意圖。圖丨係本實施形態丨之半導體 裝置的模式剖視圖,圖2至圖丨*係關於本實施形態1之半導 體裝置之製造方法的示意圖。 圖1係依本實施形態丨之半導體裝置之製造方法所製造的 半導體裝置1之模式剖視圖。 如圖1所示,本實施形態丨之半導體裝置丨,係包含有由配 線基板構造所構成的基板2;固定於該基板2之主面(圖中上 面)上的半導體元件3 ;連接半導體元件3表面之未圖示的電 極與形成於基板2之主面上之未圖示的配線之導電性金屬線 4;被覆半導體裝置1及金屬線4等且由設於基板2之主面上 的絕緣性樹脂所構成的密封體5 ;以及設於基板2之背面的 凸塊電極(突起電極)6。凸塊電極6係形成於設在基板2背面 之未圖示的配線上。基板2之周面及密封體5之周面由於成 為以切割刀所切斷的面,所以基板2及密封體5之各周面係 母一各周面分別位於同'一面上。 基板2係成為ΙΟΟαπι左右的厚度,半導體元件3係成為1〇〇 左右的厚度,密封體5之厚度係成為200 /z m左右的厚 度’始自凸塊電極6之基板2背面的突出長度係成*1〇〇#m 左右,半導體裝置1係成為〇·5 mm以下的薄型。 如圖2之流程圖所示,該種的半導體裝置1,係在準備晶 12 1283457 圓之後,經過貼附保護膠帶(S101)、背面磨光(s〗〇2)、貼附 切割膠帶(SW3)、切劉(S1〇4)、晶片接合⑻〇5)、剝離保護 膠帶(去除·· S106)、打線接合(S107)、形成樹脂層(si〇8)、 形成凸塊電極(S109)、個片切斷(S110)之各步驟而製造成為 最終製品者。 其次,沿著上述各步驟說明半導體裝置之製造方法。最 初,準備半導體母基板(晶圓)3a及配線母基板“。 _圖3所不,上述晶圓3a,雖未圖示,但是其係呈圓形, 同時其_邵分被切斷成直線狀而成方向識別用的面(OF?)。 又,沿著該OFF以縱橫方式整齊㈣形成有 該半導體元件部係成為矩形之半導體元件的部分,且形成 有指定的電路又,在該半導體元件部之主面(圖中為 上面)上,雖未圖示但有露出電極。晶圓2a,係例如成為75〇 的厚度,且形成8叶的直徑。圖3所示的虛線係依背面研 磨(背面磨光)所進行的最終研磨位置。 2万面’上返配線母基板2a,係如圖7及圖8所示以俯 =,包含有周緣之框體部u、及框體部u内側之一群 却八4成㈣。製品形成部12係製造ι個半導體裝置⑽ U齊::圖8所示’係在配線母基板2a之主面上以縱橫方 但是在其主面及成為主:中’雖有省略, .,. 成為面又相反面的背面上設有配線,同 時表裡艾配線係w畜云 .、、 只穿配線母基板2a之導體來電連 接。其王面係固定有半導 塊電極I、 等把兀件的面,而背面係形成有凸 ^外㈣極端子的面。配線母基板2a,係由破璃 -13- 1283457 環氧樹脂基板等的樹脂配線基板所構成。 其次,如_3所示,在上述晶圓从主面全區上貼附保護 膠帶15(S101 :參照圖3)。保護膠㈣,係呈透明俾於在切··‘ 割時可看到晶圓3a之主面的切割線等。χ,保護膠帶15係、·· · 對半導體裝置《各製程中的熱具有十分抗熱的耐熱性膠帶 (耐熱溫度200°C左右)。又,保護膠帶15之一面係成為可黏 接的黏著膠帶。再者,保護膠帶15,係成為丨⑻^㈤左右的 、 厚度,且具有強度構件之作用。保護膠帶15,例如由聚醯 亞胺樹脂膠帶所構成。 — 另外,保護膠帶15,亦可使用耐熱性之紫外線照射硬化 』膠▼。孩情況,係在晶圓3a之主面貼附紫外線照射硬化 型膠帶’當要去除時對紫外線照射硬化型膠帶照射紫外線 以使黏接部分硬化並使黏接性劣化。之後,使該紫外線照 射硬化型膠帶去除(剝離)。 由於晶圓3a之主面係由保護膠帶15所被覆,所以在處理 晶圓時晶圓3a之主面不易受到污染、或受傷。又保護㈣ # 15不僅保護晶圓3a之主面且亦成為強度構件。結果,在處 理晶圓時不易發生破裂、缺陷。 八’入,研磨(¾面磨光:BG)晶圓之背面俾使厚度a爪 ; 之晶圓成為⑽麵之厚度(議)β即使在該背面磨光中強·‘ 度不夠的晶圓3a亦可藉由保護膠帶15來補強。該補強係在 依寿面磨光而變得更薄的晶圓中更有效果。 其次’如圖4所示’將晶圓3a介以其背面而貼附在常用的 切割膠帶16上(S103)。切割膠帶16係將其外周部分張設在支 -14- 1283457 持框17上。之後’如圖5所示,以切割刀i8將晶圓3啡縱俨 切斷(切割:S104)。利用切割刀18所進行的切斷,係在界 h中以縱橫方式整齊排列形成的半導體元件部之邊界^ 切斷。亦即,切割係以格子狀進行。該情況,係在朝第二 方向依序切斷之後’朝與該第一方向正交的第二方 進行切斷以結束格子狀之切斷。 在該切割中,切斷係設為切割膠帶16之中途深度。因 而’依切斷而分離的各半導體元件3係呈貼附在切割膠㈣ 上所支持的狀態。 在該切割中’雖然保護膠帶15亦被切斷,但是由於 係以保持貼附之狀態進行,所以半導體元件3之主面保 護膠帶㈣護。X ’依切割刀18進行切斷時,不僅可防 止晶圓3a及依切斷而形成之半導體元件3的表面受冷染,且 已切斷之邊緣或半導體元件3之表面不易受到損傷,不易發 生丰導體7°件3〈破裂、缺陷,而可提高半導體S件之品質 及製造良率。 負 在該切割之後,由切劃膠帶16支持的半導體元件3亦可利 用保護膠帶15來保護其表面(主面)。 其次,以每次拾取一個切割膠帶16上之半導體元件 送固定在配線母基板^各製品形成部12的半 足邵上u片接合:綱。圖8及圖7係顯示在配 固 之主面上固定(搭幻具有保護膠帶15之半導體 = 的俯視圖及剖視圖。 ^ ^ 又,圖6⑷〜⑷係顯示拾取切刻膠帶“上之半導體元件3 -15 - 1283457 之狀態的模式圖。亦即,如圖6(a)所示,自切割膠㈣之上 方使真空吸附型之吸具2GT降至指定的半導體元件3之正上 方,並使四角錐凹陷面所播占 丨曰甸所構成的保持面接近半導體元 3(參照圖6(b))。 其次’使位於上述吸具20之正下方的複數個頂起針。上 升,並使之貫穿切割膠帶16以將半導體元件3往上推。使其 與之連動’並使吸具2〇進行真空吸引動作以使吸具之四 角錐凹陷面真空吸附保持半導體元件3(參照圖㈣。之 後,吸具20係將半導體元件3搬運至指定部位(參昭圖 6⑷)。 、吸具20’係依序將半導體元件3搬運至上述配線母基板^ 之各製品形成部12的半導體元件固定部上,並以事先供至 半導體元件固定部與半導體元件3之間的接合材料予以、固 定。 、於該固定時,由於半導體元件3之主面的周緣係由吸具2〇 之四角錐凹陷面之各傾斜的面所支持’所以半導體元件罐 常有靠近吸具20之中心的作用β因而,半導體元件3之固定 位置可對應於配線母基板2心及具2G之停止位置而正確決 定。又,由於吸具20係以四角雖凹陷面來捕捉半導體元件 3,所以使吸具2G與配㈣基板2a之主面作平行振動即可固 足半導體元件3。導體元件3之^係利用銀糊等之糊 材、金與錫之合金層或是金與以合金層等所進行的固 定。 另外,由於頂起針2丨很細,相形成Μ切曲或損傷 -16- 1283457 之方式分別沿著導件22而上下動的構造。 又,圖8中半導體元件3周圍之實線及虛線係後述的切斷 線’而圍住半導體元件3之該等線所圍之四角形區域係製品 形成部12。亦可沿著上述實線及虛線而事先設置v溝槽等, 以在將配線母基板2a個片化成每一製品形成部12時,可簡 單進行切斷。 其’入’去除(剥離)固定於配線母基板2 a之主面上的半導體 元件3表面之保護膠帶15(31〇6)。圖9係例示去除保護膠帶15 的手段。 如圖9(a)所示,第一保護膠帶去除手段,係將從膠帶捲出 捲筒30解開出並捲繞在膠帶捲繞捲筒31上的黏著膠帶32, 按壓在保護膠帶15上,該保護膠帶15係貼附在固定於配線 母基板2a之主面的半導體元件3之主面上,使黏著膠帶32黏 接保護膠帶15,之後,藉由使黏著膠帶32自半導體元件3相 對地離開即可從半導體元件3拆除保護膠帶丨5。 具體而T ’使移動輥33如箭號所示地以加壓狀態接觸自 膠帶捲出捲筒30解開出的黏著膠帶32之背面,並使該移動 輥33如箭號(細線及粗線所示的箭號)所示地邊旋轉移動而邊 將黏著膠帶32按壓在半導體元件3上之保護膠帶丨5上以使保 護膠帶15黏接在黏著膠帶32上,藉以自半導體元件3之主面 剥離保護膠帶1 5。 將膠帶捲出捲筒30與膠帶捲繞捲筒31配置成配線母基板 2a之長度以上,藉由自解開出之黏著膠帶32之上方邊使細 長的移動輥33,從配線母基板2a之左端朝向右端旋轉而邊 •17- 1283457 移動,即可使被覆各半導體元件3之主面的保護膠 黏會膠帶32之背面,且藉由使配線母基板2a下降指定古. 即可剝離貼附在半導體元件3上的保護膠帶15。θ疋阿度 在該剝離手段中’事錢黏著膠帶32之黏接力大於 體元件靖保護膠帶15的黏接力,並使保護膠帶⑸付著在黏 著膠帶32上以將保護膠帶15自半導體元件3剝離。
如圖9⑻所示,第二保護膠帶去除手段,係在準備具有與 配線母基板2a之各製品形成部12上的半導體元件3_應的 真空吸引噴嘴35之真空吸引治具36之後,將真空吸引噴嘴 35之前端對各半導體元件3上之保護膠帶15重覆如箭號⑽ 示地真空吸引並利用真空吸引噴嘴35保持保護膠帶15。之 後’使真空吸引治具36自配線母基板2a如箭號38所示地離 開以將保護膠帶15自半導體元件3之主面剝離(去除)。
在該剝離手段中,事先使真空吸引噴嘴35的真空吸引力 大於半導體元件3對保護膠帶15之黏接力,使真空吸引噴嘴 35吸引保護膠帶15以將保護膠帶15自半導體元件3剝離。 如圖9(c)所示,第三保護膠帶去除手段,係在固定於配線 母基板2a上之全部的半導體元件3之主面側的保護膠帶15 上,黏接1片黏著膠帶40,之後藉由使黏著膠帶4〇遠離配線 母基板2 a(半導體元件3)以將保護膠帶15自半導體元件3剥離 去除。亦即,事先使黏著膠帶40之黏接力大於半導體元件3 對保護膠帶15之黏接力’使保護膠帶丨5附著在黏著膠帶4〇 上以將保護膠帶15自半導體元件3剝離。 在使用紫外線照射硬化型膠帶以作為保護膠帶的情況, -18- 1283457 當將保護膠帶自半導體元件剝離時,使紫外線照射在保護 膠帶上使黏接力變弱之後進行保護膠帶之剝離。該剝離, 當然可使用上述三個剝離手段。 其次,利用導線性金屬線4來連接半導體元件3之未圖示 的電極與配線母基板2a之未圖示的配線(打線接合:si〇7)。 圖11及圖10係以金屬線4連接配線母基板以之配線與半導體 元件3之電極的模式俯視圖與模式剖視圖。 其次,在配線母基板2a之主面上形成絕緣性樹脂層“俾 於被覆半導m元件3及金屬線4(樹脂層形成:§ 1〇8)。圖η及 圖12係顯示在配線母基板2a之主面上形成絕緣性樹脂層兄 之狀態的配線母基板2a之模式剖視圖及模式俯視圖。 絕緣性樹脂層5a,係由轉移鑄模法之單面模所形成。絕 緣性樹脂層5a,係例如由環氧樹脂所形成。此時,選擇絕 緣性樹脂層5a之厚度以將半導體裝置丨之厚度形成在〇 5mm 以下。 其次,在配線母基板2a之背面形成凸塊電極(突起電 極)6(參照圖14 : S109)。凸塊電極6係形成於配線母基板2a 背面之未圖示的配線(電極)上。 其次,如圖14所示在配線母基板2a之主面上貼附支持框 44上所貼附的支持體(黏著膠帶)45,同時利用切割刀46沿著 製品形成邵之邊界,且自配線母基板2a並經過絕緣性樹脂 層5a而切斷至支持體45之中途深度為止並將各製品形成部 個片化以形成半導體裝置1 (S11 〇)。被分離的半導體裝置1係 呈貼附在支持體45上的狀態。因此,藉由將各半導體裝置1 1283457 自支持體45拆除(剝離)即可製造複數個如圖丨所示的 裝置1。 守把 由半導體裝置1之四角形狀所構成的基板2之各周面、及 對應該各周面的密封體5之各周面,由㈣利用切割刀來切 斷配線母基板2a及絕緣性樹脂層53所以係分別成為位於同 一平面的平坦面。 若依據本實施形態!則有如下效果。 (1) 晶圓3a之主面係由保護膠帶15所被覆。因而,在處理 :日圓時晶圓3a之主面就不易被污染、或損傷。χ,保護膠 π 15不僅可保護晶圓3a之主面亦可成為強度構件。結果, 在處理晶圓時就不易發生破裂、缺陷。此在依背面磨光而 •夂知更薄的晶圓3 a中就更有效果。 (2) 由於晶圓主面係由保護膠帶15所保護,所以依切割刀 8進行切斷時,不僅可防止表面污染,而且經切斷之邊緣 或半導體元件部之表面不易損傷。結果,不易發生半導體 兀件3之破裂、缺陷,且可提高半導體元件3之品質及製造 良率。 (3) 由於在切割步驟中,上述晶圓3a係形成與切割膠帶16 由保護膠帶15隔著的構造,且在該狀態下進行切割者,所 以不易因切割而發生半導體元件3之破裂缺陷(小碎片),同 寺半導組元件3不易翹曲。亦即,由於主面係由保護膠帶μ 所保護,且拾取貼附在切割膠帶16上的半導體元件3並固定 在配線母基板2a上,所以不易發生半導體元件3之破裂缺 陷,而可提高製造良車。 -20- 1283457 (4) 由於係利用透明的保護膠帶15來被覆晶圓从主面, 所以容易目視切割晶圓3a時的切割線,且可提高切割之作 業效率及切割良率。 · (5) 由於㈣後,半導體元件3亦可利用保護膠帶15來保護.· 主面,所以可防止表面污染或受傷。又,由則呆護膠帶15 可成為強度構件’所以即使在拾取時因頂起針以頂起、 或因吸具20之真空吸附保持、搬運及晶片固定方面,半導 體元件3亦不易損傷。 ⑹由於在形成絕緣性樹脂層5禮,係將配線母基板㈣ · 樹脂層-起切斷所以可同時製造多量的半導體裝置卜且可 減低半導體裝置1之製造成本。 ⑺由於半導體7^3係形成1〇()心以下,所以藉由減薄 樹脂層’即可將所製造的半導體裝们之厚度薄型化至05 mm以下。 、上雖係根據實施形態具體說明依本發明人所開發完成 的發明,但是本發明並非被限定於上述實施形態,只要$ 4 離八要曰之範圍内當然可作各種的變更。在實施形態 中’雖係就製品形成部上搭載單一半導體元件的例子加以 說明γ但是亦可適用於搭載複數個半導體元件的構成。 : 若為要,亦可搭載晶片電容器或晶片電阻器等的被動 : 零件。 另外雖係形成在基板背面設置凸塊電極的構造,但是 外部電極端子亦可為此外的構成。 (發明效果) -21 · 1283457
的效果,則可如下所述。 示之發明中作為其代表者所得 、缺陷所以可提高半導體裝 ⑴由於可防止薄晶圓之破裂、缺陷所以 置之製造良率。
減低半導體裝置之製造成本。 圖式簡單說明 <製造及半導體元件之搭載等 元件之破裂、缺陷發生所以可
實施形態(實施形態1)的半導體裝 置之製造方法所製造的半導體裝置之剖視圖。 圖2係顯示本實施形態1之半導體裝置之製造方法的流程 圖3係顯示在本實施形態1之半導體裝置之製造方法中, 於主面貼附保護膠帶之狀態的晶圓模式圖。 圖4係顯示在本實施形態丨之半導體裝置之製造方法中, 將經背面磨光之晶圓貼附於切割膠帶上之狀態的晶圓模式 _ 圖5係顯示在本實施形態1之半導體裝置之製造方法中, 將晶圓以切割刀進行切割之狀態的晶圓模式圖。 圖6(a)〜6(d)係顯示在本實施形態1之半導體裝置之製造方 去中’自切割膠帶拾取半導體元件並對配線母基板進行晶 片接合之狀態的模式圖。 圖7係顯示在本實施形態1之半導體裝置之製造方法中, 於配線母基板上整齊排列配置搭載半導體元件之狀態的模 -22- 1283457 式剖視圖。 裝置之製造方法中, 導體元件之狀態的模 圖8係顯示在本實施形態1之半導體 於配線母基板上整齊排列配置搭載半 式俯·視圖。
體裝置之製造方 予以去除之方法 的模式圖。 圖10係顯示在本實施形態1之半導體裝置之 利用金屬、在連接配線母基板之配線與半導體 之製造方法中, 體元件之電極之 狀態的模式剖視圖。 圖11係顯示在本實施形態1之半導體裝置之製造方法中, 利用金屬線連接配線母基板之配線與铸體元件之電極之 狀態的模式俯視圖。 圖12係顯不在本實施形態1之半導體裝置之製造方法中,
於配線母基板主面上形成絕緣性樹脂層之狀態的配線母基 板之模式剖視圖。 I 圖13係顯不在本實施形態1之半導體裝置之製造方法中, 於配線母基板主面上形成絕緣性樹脂層之狀態的配線母基 板之模式俯視圖。 t 圖14係顯示在本實施形態1之半導體裝置之製造方法中,: 切斷配線母基板與絕緣性樹脂層之狀態的模式剖視圖。 圖15係顯示早於本發明而先行檢討之半導體裝置的模式 剖視圖。 圖16係顯示早於本發明而先行檢討之半導體裝置之製造 -23- 1283457 法的流程圖。 式代表符號說明 1 半導體裝置 2 基板 2a 配線母基板 3 半導體元件 3a 半導體母基板(晶圓 4 金屬線 5 密封體 5a 絕緣性樹脂層 6 凸塊電極(突起電極) 11 框體部 12 製品形成部 15 保護膠帶 16 切割膠帶 17 支持框體 18 切割刀 20 吸具 21 頂起針
22 導件 30 膠帶捲出捲筒 31 膠帶捲繞捲筒 32 黏著膠帶 33 移動輥 -24- 1283457
35 真空吸引喷嘴 36 真空吸引治具 37、 38 箭號 40 黏著膠帶 45 支持體 46 切割刀 60 半導體裝置 61 基板 62 半導體元件 63 金屬線 64 密封體 65 凸塊電極(突起電極)
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Claims (1)
1283癌减! 04240號專利申請案 中文申請專利範圍替換本(95年2月)拾、申請專利範園: q修正 補充 m I Φ 9 本 案 修 後 是 否 變 更 康 實 質 内 容 Ο 一種半導體裝置之製造方法,特微^认^3 來製造半導體裝置,該步驟包含^徵在於利用以下步驟 分別準備半導體元件以縱 上的半導體母基板及製品 卩幻艰成於王面 & /成邵以縱橫方式整齊排列形 成於王面上的配線母基板; 在上述半導體母基板之主面全區上貼附保護膠帶; 將上述半導體母基板之背面去除指定厚度; 將上述半導體母基板介 /考面而貼附在切割膠帶上; 以保護膠帶覆蓋上述半導髀 | 卞子母基板疋主面,利用切割 刀沿著上述半導體元件乏彳喜w 仵《邊界,且自上述半導體母基板 之主面開始切斷至上述切割膠帶之中途深度為止以形成 複數個半導體元件; 、每次拾取-個上述切割膠帶上的上述半導體元件並將 之固定在上述各製品形成部上; 去除貼附在上述各半導體元件之主面上的上述保護膠 帶;
在上述各製品形成部上利用導電性之金屬線來連接上 述半導體元件之電極與上述配線母基板之配線; 以被覆上述半導體元件及上述金屬線的方式在上述配 線母基板之主面上形成絕緣性樹脂層; 在形成上述絕緣性樹脂層之後,在上述配線母基板背 面之配線上形成突起電極; 將上述半導體母基板介以上述絕緣性樹脂層之主面而 83779-950224.doc 1283457 貼附支持體; 利用切割刀沿著上述製品形成部之邊界,且自上述配 線母基板開始並經過上述絕緣性樹脂層而切斷至上述支 持to <中途深度為止以形成複數個半導體裝置;以及 從上述支持體分離各半導體裝置。 2。如申請專利範圍第丨項之半導體裝置之製造方法,其中 上述保護膠帶係一耐熱性且透明的黏著膠帶。 3·如申請專利範圍第i項之半導體裝置之製造方法,其中 上述保遵膠帶係一耐熱性之紫外線照射硬化型膠帶,其 係貼附在上述半導體母基板上,於去除前照射紫外線以 使黏著邵分硬化並使黏著性劣化者。 4.如申請專利g圍第1項之半導體裝置之製造方法,其中 將上述半導體母基板之背面去除指定厚度以形成厚度 1 〇 〇从m前後以下之厚度的半導體母基板。 5·如申清專利範圍第i項之半導體裝置之製造方法,其中 上述切割膠帶上之上述半導體元件的拾取,係利用從上 述切割膠帶之下方朝向上述半導體元件頂起的複數個頂 起針所進行的上述半導體元件之頂起、及對上述被頂起 的半導體元件進行真空吸附保持的真空吸附型吸 者。 6·如申請專利範圍第5項之半導體裝置之製造方法,其中 上述吸具係在吸附面上具有四角錐凹陷面的角錐吸且, 利用上述四角錐凹陷面來保持上述半導體元件,且:用 孩四角錐凹陷面來決定上述半導體元件之固定位置。 83779-950224.doc -2 - 1283457 7.如申請專利範圍第i項之半導體裝置之製造方法,其中 在貼附於上述各半導體元件之主面的上述保護膠帶上黏 接黏著膠帶之後,藉由使上述黏著膠帶遠離上述半導體 元件以將上述保護膠帶自上述半導體元件去除^ S 8’如申請專利範圍第7項之半導體裝置之製造方法,其中 在將自膠帶捲出捲軸解開出並捲繞在膠帶捲繞捲轴1的 黏著膠帶按壓在上述保護膠帶上以使黏著膠帶黏接上述 保護膠帶之後,使上述黏著膠帶自上述半導體元件相對 地離開以從上述半導體元件拆除上述保護膠帶。 9.如申請專利範圍第8項之半導體裝置之製造方法,其中 使自上述膠帶捲出捲#解開出的1述黏著膠帶之背面接 $移動輥,並邊使該移動輥旋轉移動而邊將上述黏著膠 帶按壓在上述半導體元件上以使上述保護膠帶黏接在上 述黏著膠帶上。 10·如申請專利範圍第7項之半導體裝置之製造方法,其中 在準備具有與上述配線母基板之各製品形成部上的上述 半導體7L件相對應的真空吸引噴嘴之真空吸引治具之 後,將上述真空吸引噴嘴之前端重覆真空吸引於上述各 半導fa元件上之上述保護膠帶上並利用上述真空吸引噴 嘴保持上述保護膠帶之後,使上述真空吸引治具自上述 配線母基板離開以去除上述保護膠帶。 Π·如申請專利範圍第i項之半導體裝置之製造方法,其中 選擇上述絕緣性樹脂層之厚度以製造厚度在〇 5111111以下 的半導體裝置。 83779-950224.doc 1283457 12.如申請專利範圍第1項之半導體裝置之製造方法,其中 在上述各製品形成部上固定複數個半導體元件。 83779-950224.doc 4-
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