FR2874127B1 - Boitier miniature hyperfrequence pour montage en surface et procede de fabrication du boitier - Google Patents

Boitier miniature hyperfrequence pour montage en surface et procede de fabrication du boitier

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Publication number
FR2874127B1
FR2874127B1 FR0408588A FR0408588A FR2874127B1 FR 2874127 B1 FR2874127 B1 FR 2874127B1 FR 0408588 A FR0408588 A FR 0408588A FR 0408588 A FR0408588 A FR 0408588A FR 2874127 B1 FR2874127 B1 FR 2874127B1
Authority
FR
France
Prior art keywords
chip
package
miniature
active
rear surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR0408588A
Other languages
English (en)
Other versions
FR2874127A1 (fr
Inventor
Alexandre Bessemoulin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
United Monolithic Semiconductors SAS
Original Assignee
United Monolithic Semiconductors SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Monolithic Semiconductors SAS filed Critical United Monolithic Semiconductors SAS
Priority to FR0408588A priority Critical patent/FR2874127B1/fr
Priority to PCT/EP2005/053733 priority patent/WO2006013197A1/fr
Publication of FR2874127A1 publication Critical patent/FR2874127A1/fr
Application granted granted Critical
Publication of FR2874127B1 publication Critical patent/FR2874127B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01049—Indium [In]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
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    • H01L2924/14—Integrated circuits
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H01L2924/141—Analog devices
    • H01L2924/1423—Monolithic Microwave Integrated Circuit [MMIC]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
FR0408588A 2004-08-03 2004-08-03 Boitier miniature hyperfrequence pour montage en surface et procede de fabrication du boitier Active FR2874127B1 (fr)

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FR0408588A FR2874127B1 (fr) 2004-08-03 2004-08-03 Boitier miniature hyperfrequence pour montage en surface et procede de fabrication du boitier
PCT/EP2005/053733 WO2006013197A1 (fr) 2004-08-03 2005-08-01 Boitier miniature hyperfrequence pour montage en surface et procede de fabrication du boitier

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FR2665574B1 (fr) * 1990-08-03 1997-05-30 Thomson Composants Microondes Procede d'interconnexion entre un circuit integre et un circuit support, et circuit integre adapte a ce procede.
US5353498A (en) * 1993-02-08 1994-10-11 General Electric Company Method for fabricating an integrated circuit module
US5447871A (en) * 1993-03-05 1995-09-05 Goldstein; Edward F. Electrically conductive interconnection through a body of semiconductor material
DE707741T1 (de) * 1994-05-05 1996-11-28 Siliconix Inc Oberflächenmontage und flip-chip-technologie
JP3033576B1 (ja) * 1999-02-18 2000-04-17 日本電気株式会社 半導体装置及び半導体装置の製造方法
JP2001217354A (ja) * 2000-02-07 2001-08-10 Rohm Co Ltd 半導体チップの実装構造、および半導体装置
JP3456462B2 (ja) * 2000-02-28 2003-10-14 日本電気株式会社 半導体装置及びその製造方法
US6392290B1 (en) * 2000-04-07 2002-05-21 Siliconix Incorporated Vertical structure for semiconductor wafer-level chip scale packages
US6577013B1 (en) * 2000-09-05 2003-06-10 Amkor Technology, Inc. Chip size semiconductor packages with stacked dies
JP3405456B2 (ja) * 2000-09-11 2003-05-12 沖電気工業株式会社 半導体装置，半導体装置の製造方法，スタック型半導体装置及びスタック型半導体装置の製造方法
DE10161043B4 (de) * 2001-12-12 2005-12-15 Infineon Technologies Ag Chipanordnung
US6908784B1 (en) * 2002-03-06 2005-06-21 Micron Technology, Inc. Method for fabricating encapsulated semiconductor components
JP3831287B2 (ja) * 2002-04-08 2006-10-11 株式会社日立製作所 半導体装置の製造方法
TWI227050B (en) * 2002-10-11 2005-01-21 Sanyo Electric Co Semiconductor device and method for manufacturing the same
JP3908146B2 (ja) * 2002-10-28 2007-04-25 シャープ株式会社 半導体装置及び積層型半導体装置
JP4145301B2 (ja) * 2003-01-15 2008-09-03 富士通株式会社 半導体装置及び三次元実装半導体装置

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WO2006013197A1 (fr) 2006-02-09

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