WO2004080134A3 - Boitiers de puces hf a elements de connexion - Google Patents

Boitiers de puces hf a elements de connexion Download PDF

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Publication number
WO2004080134A3
WO2004080134A3 PCT/US2003/041132 US0341132W WO2004080134A3 WO 2004080134 A3 WO2004080134 A3 WO 2004080134A3 US 0341132 W US0341132 W US 0341132W WO 2004080134 A3 WO2004080134 A3 WO 2004080134A3
Authority
WO
WIPO (PCT)
Prior art keywords
leads
connecting element
circuit board
frequency chip
assembly
Prior art date
Application number
PCT/US2003/041132
Other languages
English (en)
Other versions
WO2004080134A2 (fr
Inventor
Masud Beroz
Michael Warner
Lee Smith
Glenn Urbish
Teck-Gyu Kang
Jae M Park
Yoichi Kubota
Original Assignee
Tessera Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tessera Inc filed Critical Tessera Inc
Priority to JP2004569225A priority Critical patent/JP4504204B2/ja
Priority to AU2003299866A priority patent/AU2003299866A1/en
Publication of WO2004080134A2 publication Critical patent/WO2004080134A2/fr
Publication of WO2004080134A3 publication Critical patent/WO2004080134A3/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

L'invention concerne un boîtier de puces HF assemblé comme suit: élément de connexion du type carte de circuits imprimés (52) ou bande de circuits flexible (72, 84) à puces avec élément de plan inférieur (20) du type réseau de conducteurs ayant une grande plaque à conductivité thermique (22) et des conducteurs (40, 42) protubérants, vers le haut depuis le plan de la plaque. A l'assemblage, les surfaces arrière (78) des puces (72) sur le côté inférieur de l'élément de connexion (52) viennent à proximité du conducteur thermique (22) mettant en relation les traces conductrices (60) sur l'élément connecteur et les conducteurs. L'ensemble résultant est encapsulé, laissant les bornes exposées aux extrémités inférieures (45) des conducteurs. On peut monter cet ensemble en surface sur une carte de circuits imprimés (102). Les conducteurs (40, 42) assurent des connexions robustes entre l'élément de connexion (52) et la carte de circuits imprimés (102).
PCT/US2003/041132 2003-02-25 2003-12-24 Boitiers de puces hf a elements de connexion WO2004080134A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004569225A JP4504204B2 (ja) 2003-02-25 2003-12-24 接続要素を有する高周波チップパッケージ
AU2003299866A AU2003299866A1 (en) 2003-02-25 2003-12-24 High frequency chip packages with connecting elements

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US44967303P 2003-02-25 2003-02-25
US60/449,673 2003-02-25
US46217003P 2003-04-11 2003-04-11
US60/462,170 2003-04-11

Publications (2)

Publication Number Publication Date
WO2004080134A2 WO2004080134A2 (fr) 2004-09-16
WO2004080134A3 true WO2004080134A3 (fr) 2005-01-27

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Country Status (3)

Country Link
JP (1) JP4504204B2 (fr)
AU (1) AU2003299866A1 (fr)
WO (1) WO2004080134A2 (fr)

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US9018774B2 (en) 2001-03-30 2015-04-28 Qualcomm Incorporated Chip package
US9142527B2 (en) 2002-10-15 2015-09-22 Qualcomm Incorporated Method of wire bonding over active area of a semiconductor circuit

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JP5154262B2 (ja) 2008-02-26 2013-02-27 太陽誘電株式会社 電子部品
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US8304887B2 (en) * 2009-12-10 2012-11-06 Texas Instruments Incorporated Module package with embedded substrate and leadframe
JP5749468B2 (ja) * 2010-09-24 2015-07-15 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 回路装置およびその製造方法
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US8952516B2 (en) 2011-04-21 2015-02-10 Tessera, Inc. Multiple die stacking for two or more die
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US9013033B2 (en) 2011-04-21 2015-04-21 Tessera, Inc. Multiple die face-down stacking for two or more die
KR101388857B1 (ko) * 2012-06-29 2014-04-23 삼성전기주식회사 반도체 패키지 및 반도체 패키지 제조 방법
JP6318084B2 (ja) * 2014-12-17 2018-04-25 新光電気工業株式会社 半導体装置及びその製造方法
US10725150B2 (en) 2014-12-23 2020-07-28 Infineon Technologies Ag System and method for radar
US10317512B2 (en) 2014-12-23 2019-06-11 Infineon Technologies Ag RF system with an RFIC and antenna system
US20160306034A1 (en) * 2014-12-23 2016-10-20 Infineon Technologies Ag RF System with an RFIC and Antenna System
JP6620989B2 (ja) * 2015-05-25 2019-12-18 パナソニックＩｐマネジメント株式会社 電子部品パッケージ
JP2018107394A (ja) * 2016-12-28 2018-07-05 新光電気工業株式会社 配線基板及び電子部品装置とそれらの製造方法
WO2018148444A1 (fr) * 2017-02-10 2018-08-16 Behrooz Mehr Techniques de mise à la masse pour dés semi-conducteurs à polarisation arrière et dispositifs, systèmes et procédés associés
WO2024034278A1 (fr) * 2022-08-10 2024-02-15 株式会社村田製作所 Module de circuit
WO2024084556A1 (fr) * 2022-10-18 2024-04-25 三菱電機株式会社 Boîtier de semi-conducteur haute fréquence

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US9018774B2 (en) 2001-03-30 2015-04-28 Qualcomm Incorporated Chip package
US9142527B2 (en) 2002-10-15 2015-09-22 Qualcomm Incorporated Method of wire bonding over active area of a semiconductor circuit

Also Published As

Publication number Publication date
AU2003299866A1 (en) 2004-09-28
WO2004080134A2 (fr) 2004-09-16
AU2003299866A8 (en) 2004-09-28
JP4504204B2 (ja) 2010-07-14
JP2006514438A (ja) 2006-04-27

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