JP4504204B2 - 接続要素を有する高周波チップパッケージ - Google Patents
接続要素を有する高周波チップパッケージ Download PDFInfo
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- JP4504204B2 JP4504204B2 JP2004569225A JP2004569225A JP4504204B2 JP 4504204 B2 JP4504204 B2 JP 4504204B2 JP 2004569225 A JP2004569225 A JP 2004569225A JP 2004569225 A JP2004569225 A JP 2004569225A JP 4504204 B2 JP4504204 B2 JP 4504204B2
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US44967303P | 2003-02-25 | 2003-02-25 | |
US46217003P | 2003-04-11 | 2003-04-11 | |
PCT/US2003/041132 WO2004080134A2 (fr) | 2003-02-25 | 2003-12-24 | Boitiers de puces hf a elements de connexion |
Publications (3)
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JP2006514438A JP2006514438A (ja) | 2006-04-27 |
JP2006514438A5 JP2006514438A5 (fr) | 2007-02-15 |
JP4504204B2 true JP4504204B2 (ja) | 2010-07-14 |
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JP2004569225A Expired - Fee Related JP4504204B2 (ja) | 2003-02-25 | 2003-12-24 | 接続要素を有する高周波チップパッケージ |
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JP (1) | JP4504204B2 (fr) |
AU (1) | AU2003299866A1 (fr) |
WO (1) | WO2004080134A2 (fr) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8021976B2 (en) | 2002-10-15 | 2011-09-20 | Megica Corporation | Method of wire bonding over active area of a semiconductor circuit |
US7498196B2 (en) | 2001-03-30 | 2009-03-03 | Megica Corporation | Structure and manufacturing method of chip scale package |
KR100770684B1 (ko) * | 2006-05-18 | 2007-10-29 | 삼성전기주식회사 | 카메라 모듈 패키지 |
JP5154262B2 (ja) | 2008-02-26 | 2013-02-27 | 太陽誘電株式会社 | 電子部品 |
EP2347440A1 (fr) | 2008-11-19 | 2011-07-27 | Nxp B.V. | Module antenne radio en ondes millimétriques |
US8304887B2 (en) * | 2009-12-10 | 2012-11-06 | Texas Instruments Incorporated | Module package with embedded substrate and leadframe |
JP5749468B2 (ja) * | 2010-09-24 | 2015-07-15 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 回路装置およびその製造方法 |
US8928153B2 (en) | 2011-04-21 | 2015-01-06 | Tessera, Inc. | Flip-chip, face-up and face-down centerbond memory wirebond assemblies |
US9013033B2 (en) | 2011-04-21 | 2015-04-21 | Tessera, Inc. | Multiple die face-down stacking for two or more die |
US8952516B2 (en) | 2011-04-21 | 2015-02-10 | Tessera, Inc. | Multiple die stacking for two or more die |
US8633576B2 (en) | 2011-04-21 | 2014-01-21 | Tessera, Inc. | Stacked chip-on-board module with edge connector |
KR101388857B1 (ko) * | 2012-06-29 | 2014-04-23 | 삼성전기주식회사 | 반도체 패키지 및 반도체 패키지 제조 방법 |
JP6318084B2 (ja) * | 2014-12-17 | 2018-04-25 | 新光電気工業株式会社 | 半導体装置及びその製造方法 |
US10725150B2 (en) | 2014-12-23 | 2020-07-28 | Infineon Technologies Ag | System and method for radar |
US20160306034A1 (en) * | 2014-12-23 | 2016-10-20 | Infineon Technologies Ag | RF System with an RFIC and Antenna System |
US10317512B2 (en) | 2014-12-23 | 2019-06-11 | Infineon Technologies Ag | RF system with an RFIC and antenna system |
JP6620989B2 (ja) * | 2015-05-25 | 2019-12-18 | パナソニックIpマネジメント株式会社 | 電子部品パッケージ |
JP2018107394A (ja) * | 2016-12-28 | 2018-07-05 | 新光電気工業株式会社 | 配線基板及び電子部品装置とそれらの製造方法 |
US10741507B2 (en) | 2017-02-10 | 2020-08-11 | Microchip Technology Incorporated | Grounding techniques for backside-biased semiconductor dice and related devices, systems and methods |
WO2024034278A1 (fr) * | 2022-08-10 | 2024-02-15 | 株式会社村田製作所 | Module de circuit |
WO2024084556A1 (fr) * | 2022-10-18 | 2024-04-25 | 三菱電機株式会社 | Boîtier de semi-conducteur haute fréquence |
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JPS6484650A (en) * | 1987-09-26 | 1989-03-29 | Nippon Telegraph & Telephone | Pin grid array semiconductor device |
JPH05275599A (ja) * | 1992-03-25 | 1993-10-22 | Matsushita Electric Ind Co Ltd | 電子部品および電子部品の製造方法 |
JP2721093B2 (ja) * | 1992-07-21 | 1998-03-04 | 三菱電機株式会社 | 半導体装置 |
US5473190A (en) * | 1993-12-14 | 1995-12-05 | Intel Corporation | Tab tape |
JPH0888313A (ja) * | 1994-09-14 | 1996-04-02 | Oki Electric Ind Co Ltd | 樹脂封止型半導体装置 |
JPH1065087A (ja) * | 1996-08-21 | 1998-03-06 | Oki Electric Ind Co Ltd | モジュールi/oリード構造 |
US5895972A (en) * | 1996-12-31 | 1999-04-20 | Intel Corporation | Method and apparatus for cooling the backside of a semiconductor device using an infrared transparent heat slug |
JP3194906B2 (ja) * | 1998-04-28 | 2001-08-06 | アルス精密株式会社 | 半導体パッケージの製造方法、及びこれにより製造される半導体パッケージ |
JP4142170B2 (ja) * | 1998-09-25 | 2008-08-27 | 新電元工業株式会社 | 電気装置 |
JP3565319B2 (ja) * | 1999-04-14 | 2004-09-15 | シャープ株式会社 | 半導体装置及びその製造方法 |
JP2000340732A (ja) * | 1999-05-27 | 2000-12-08 | Sony Corp | 半導体装置用リードフレーム及びこれを用いた半導体装置 |
-
2003
- 2003-12-24 AU AU2003299866A patent/AU2003299866A1/en not_active Abandoned
- 2003-12-24 JP JP2004569225A patent/JP4504204B2/ja not_active Expired - Fee Related
- 2003-12-24 WO PCT/US2003/041132 patent/WO2004080134A2/fr active Application Filing
Also Published As
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JP2006514438A (ja) | 2006-04-27 |
AU2003299866A1 (en) | 2004-09-28 |
AU2003299866A8 (en) | 2004-09-28 |
WO2004080134A2 (fr) | 2004-09-16 |
WO2004080134A3 (fr) | 2005-01-27 |
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